Z0410XE [STMICROELECTRONICS]

STANDARD TRIACS; 标准双向可控硅
Z0410XE
型号: Z0410XE
厂家: ST    ST
描述:

STANDARD TRIACS
标准双向可控硅

可控硅 三端双向交流开关
文件: 总6页 (文件大小:104K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
www.DataSheet4U.com  
Z0410xE/F  
STANDARD TRIACS  
FEATURES  
IT(RMS) = 4A  
VDRM = 400V to 800V  
I
GT 25mA  
A1  
A2  
A1  
A2  
G
G
DESCRIPTION  
TO202-1  
TO202-2  
The Z0410xE/F series of triacs uses a high  
performance TOP GLASS PNPN technology.  
These parts are intended for general purpose  
switching and phase control applications.  
(Plastic)  
(Plastic)  
Z0410xE  
Z0410xF  
ABSOLUTE RATINGS (limiting values)  
Symbol  
Parameter  
Z0410xE/F Tc= 75 °C  
Value  
Unit  
IT(RMS)  
RMS on-state current  
4
0.95  
22  
20  
2
A
(360° conductionangle)  
Z0410xF  
Ta= 25 °C  
tp = 8.3 ms  
tp = 10 ms  
tp = 10 ms  
Non repetitivesurge peak on-state current  
ITSM  
A
(Tj initial = 25°C )  
I2t  
I2t Value for fusing  
A2s  
dI/dt  
Critical rate of rise of on-state current  
Repetitive  
F = 50 Hz  
10  
A/µs  
IG = 50 mA  
diG /dt = 0.1 A/µs.  
Non  
Repetitive  
50  
Tstg  
Tj  
Storage and operating junction temperature range  
- 40, + 150  
- 40, + 125  
°C  
°C  
Tl  
Maximum lead temperature for soldering during 10s at  
4.5mm from case  
260  
Voltage  
Symbol  
Parameter  
Unit  
D
M
S
N
Repetitive peak off-state voltage  
Tj = 125°C  
VDRM  
VRRM  
400  
600  
700  
800  
V
January 1995  
1/6  
Z0410xE/F  
THERMAL RESISTANCES  
Symbol  
Parameter  
Value  
80  
Unit  
Rth(j-a)  
Junction to ambient  
Z0410xE  
Z0410xF  
°C/W  
100  
10  
Junction to case for D.C  
Junction to case for A.C 360°conduction angle (F=50Hz)  
Rth(j-c)  
Rth(j-c)  
°C/W  
°C/W  
7.5  
GATE CHARACTERISTICS (maximum values)  
PG (AV)= 0.2 W PGM = 3 W (tp = 20 µs)  
IGM = 1.2 A (tp = 20 µs)  
ELECTRICAL CHARACTERISTICS  
Sensitivity  
Symbol  
Test Conditions  
Quadrant  
Unit  
10  
25  
1.5  
0.2  
2
IGT  
VGT  
VGD  
tgt  
VD=12V (DC) RL=33Ω  
VD=12V (DC) RL=33Ω  
VD=VDRM RL=3.3kΩ  
Tj= 25°C  
Tj= 25°C  
I-II-III-IV MAX  
I-II-III-IV MAX  
mA  
V
Tj= 125°C I-II-III-IV  
MIN  
TYP  
V
VD=VDRM IG = 40mA  
IT = 5.5A  
dIG/dt = 0.5A/µs  
Tj= 25°C  
I-II-III-IV  
µs  
IH *  
IL  
IT= 50 mA Gate open  
IG= 1.2 IGT  
Tj= 25°C  
Tj= 25°C  
MAX  
TYP  
TYP  
MAX  
MAX  
MAX  
MIN  
TYP  
MIN  
25  
25  
50  
2
mA  
mA  
I-III-IV  
II  
VTM  
*
ITM= 5.5A tp= 380µs  
Tj= 25°C  
Tj= 25°C  
Tj= 110°C  
Tj= 110°C  
V
IDRM  
IRRM  
VD = VDRM  
VR = VRRM  
5
µA  
200  
200  
400  
5
dV/dt *  
VD=67%VDRM  
Gate open  
V/µs  
V/µs  
(dI/dt)c = 1.8 A/ms  
(dV/dt)c *  
Tj= 110°C  
* Foreither polarity of electrode A2 voltage with reference to electrode A1  
ORDERING INFORMATION  
Z 04 10 M E  
PACKAGES :  
E=TO202-1 F=TO202-2  
TRIAC TOP GLASS  
CURRENT  
VOLTAGE  
SENSITIVITY  
2/6  
Z0410xE/F  
Fig.1 : Maximum RMS power dissipation versus  
RMS on-state current.  
Fig.2 : Correlation betweenmaximum RMS power  
dissipation and maximum allowable temperature  
(Tamb and Tcase) for different thermal resistances  
heatsink + contact (TO202-1).  
Tcase (oC)  
P (W)  
P(W)  
7
7
180 O  
Rth = 0 o C/W  
180o  
-75  
5o C/W  
10o C/W  
15o C/W  
=
6
5
4
3
2
1
0
6
5
4
3
2
1
0
o
-85  
=
120  
-95  
=
90o  
=
60o  
-105  
-115  
-125  
=
30o  
I
(A)  
Tamb (oC)  
T(RMS)  
0
1
2
3
4
0
20  
40  
60  
80  
100  
120  
140  
Fig.3 : Maximum RMS power dissipation versus  
RMS on-state current.  
Fig.4 : Correlation betweenmaximum RMS power  
dissipation and maximum allowable temperature  
(Tamb and Tcase) (TO202-2).  
P(W)  
Tcase (oC)  
P (W)  
7
180 O  
7
=
180o  
-75  
6
5
4
3
2
1
0
6
Rth(j-c)  
o
=
120  
-85  
5
4
3
2
1
0
=
90o  
-95  
=
60o  
-105  
-115  
-125  
=
30o  
I
(A)  
Rth(j-a)  
60  
T(RMS)  
Tamb (oC)  
20 40  
0
1
2
3
4
0
80  
100  
120  
140  
Fig.5 : RMSon-state current versuscase tempera-  
ture (TO202-1).  
Fig.6 : RMS on-statecurrent versus case tempera-  
ture (TO202-2).  
I
(A)  
I
(A)  
T(RMS)  
T(RMS)  
5
4
3
2
1
0
1
0.8  
0.6  
0.4  
0.2  
0
= 180o  
= 180o  
Tcase(oC)  
10 20 30 40 50 60 70 80 90 100 110 120130  
Tamb(oC)  
0
0
10 20 30 40 50 60 70 80 90 100 110 120 130  
3/6  
Z0410xE/F  
Fig.6 : Relative variation of thermal impedance  
versus pulse duration (TO202-1).  
Fig.7 : Relative variation of thermal impedance  
junction to ambient versus pulse duration  
(TO202-2).  
Zth/Rth  
1.00  
Zth(j-a)/Rth(j-a)  
1.00  
Zth(j-c)  
Zth(j-a)  
0.10  
0.10  
tp(s)  
1E+2 5E+2  
tp(s)  
1E+2 5E+2  
0.01  
1E-3  
0.01  
1E-3  
1E-2  
1E-1  
1E+0  
1E+1  
1E-2  
1E-1  
1E+0  
1E+1  
Fig.9 : Relative variation of gate trigger current and  
holding current versus junction temperature.  
Fig.10 : Non repetitivesurge peak on-state current  
versus number of cycles.  
Igt[Tj]  
Ih[Tj]  
I
(A)  
TSM  
Igt[Tj=25 o C] Ih[Tj=25 oC]  
20  
15  
10  
5
2.6  
2.4  
2.2  
2.0  
Tj initial = 25oC  
Igt  
1.8  
1.6  
1.4  
1.2  
1.0  
Ih  
0.8  
0.6  
0.4  
Number of cycles  
10  
Tj(oC)  
0
-40 -20  
0
20  
40  
60  
80 100 120 140  
1
100  
1000  
Fig.11 : Non repetitive surge peak on-state cur-  
rent for a sinusoidal pulse with width : tp 10ms,  
and correspondingvalue of I2t.  
Fig.12 : On-state characteristics (maximum val-  
ues).  
2
2
I
(A). I t (A s)  
I
(A)  
TSM  
TM  
100  
10  
1
100  
10  
1
Tj initial = 25oC  
Tj initial  
25oC  
I
TSM  
Tj max  
Tj max  
Vto =0.98V  
Rt =0.180  
2
I t  
V
(V)  
tp (ms)  
TM  
0.1  
0
0.5  
1
1.5  
2
2.5  
3
3.5  
4
4.5  
1
10  
4/6  
Z0410xE/F  
PACKAGE MECHANICAL DATA  
TO202-1 (Plastic)  
DIMENSIONS  
Millimeters Inches  
Typ. Min. Max. Typ. Min. Max.  
REF.  
A
B
C
D
F
G
H
I
10.1  
0.398  
A
H
G
13.7  
7.3  
0.540  
0.287  
0.413  
J
I
10.5  
B
1.5  
3.16 3.20  
5.3  
0.059  
0.124 0.126  
0.209  
3.2  
0.126  
0.020  
C
0.51  
M
O
P
F
D
J
1.5  
4.5  
0.059  
0.177  
N1  
N
M
N
N1 2.54  
0.100  
O
P
1.4  
0.7  
0.055  
0.028  
Marking : type number  
Weight : 1.4 g  
5/6  
Z0410xE/F  
PACKAGE MECHANICAL DATA  
TO202-2 (Plastic)  
DIMENSIONS  
Millimeters Inches  
Typ. Min. Max. Typ. Min. Max.  
REF.  
A
B
C
D
E
F
10.1  
0.398  
A
H
1.2  
7.3  
0.047  
0.287  
0.413  
0.290  
E
J
B
10.5  
7.4  
C
1.5  
5.3  
0.059  
0.209  
M
O
P
H
J
0.51  
1.5  
0.020  
0.059  
0.177  
F
D
M
N
4.5  
N1  
N
N1 2.54  
0.100  
O
P
1.4  
0.7  
0.055  
0.028  
Marking : type number  
Weight : 1.0 g  
Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsability for the  
consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No  
license is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specifications mentioned  
in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied.  
SGS-THOMSON Microelectronics products are not authorized foruse as critical components in life support devices or systems without express  
written approval of SGS-THOMSON Microelectronics.  
1995 SGS-THOMSON Microelectronics - All rights reserved.  
SGS-THOMSON Microelectronics GROUP OF COMPANIES  
Australia - Brazil - France - Germany - Hong Kong - Italy - Japan - Korea - Malaysia - Malta - Morocco - The Netherlands  
Singapore - Spain - Sweden - Switzerland - Taiwan - Thailand - United Kingdom - U.S.A.  
6/6  

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