VNQ860SP13TR-E [STMICROELECTRONICS]
Quad channel high side driver; 四通道高端驱动器
| 型号： | VNQ860SP13TR-E |
| 厂家： | 
ST |
| 描述： | Quad channel high side driver |
| 文件： | 总19页 (文件大小：401K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
VNQ860-E
VNQ860SP-E
Quad channel high side driver
Features
(1)
Type
RDS(on)
Iout
VCC
VNQ860-E
270 mΩ
0.25 A
36 V
VNQ860SP-E
1. Per each channel.
SO- 20
PowerSO-10TM
■ CMOS compatible I/Os
■ Undervoltage and overvoltage shut-down
■ Shorted load protection
Description
■ Thermal shut-down
The VNQ860-E, VNQ860SP-E are monolithic
devices made using STMicroelectronics VIPower
M0-3 technology, intended for driving any kind
load with one side connected to ground. Active
current limitation combined with thermal
shut-down and automatic restart protect the
device against overload. Device automatically
turns OFF in case of ground pin disconnection.
This device is especially suitable for industrial
applications in norms conformity with IEC 61131,
(Programmable controllers international
standard).
■ Very low stand-by current
■ Protection against loss of ground
Figure 1.
Block diagram
July 2008
Rev 3
1/19
www.st.com
19
Contents
VNQ860-E, VNQ860SP-E
Contents
1
Maximum rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pin connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Truth table and switching characteristics . . . . . . . . . . . . . . . . . . . . . . . . 7
Typical application schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
PowerSO-10™ thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Reverse polarity protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Order codes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
2
3
4
5
6
7
8
9
10
11
2/19
VNQ860-E, VNQ860SP-E
Maximum rating
1
Maximum rating
Table 1.
Symbol
Absolute maximum rating
Parameter
Value
Unit
SO-20 PowerSO-10
VCC
DC supply voltage
41
V
V
-VCC
Reverse DC supply voltage
-0.3
-200
-IGND DC reverse ground pin
mA
A
IOUT
-IOUT
IIN
DC output current
Internally limited
-2
Reverse DC output current
DC input current
A
10
mA
V
VIN
Input voltage range
-3/+VCC
+ VCC
ISTAT
VESD
Ptot
TJ
DC status voltage
V
Electrostatic discharge (R = 1.5 kW; C = 100 pF)
Power dissipation at Tc <= 25 °C
Junction operating temperature
Case operating temperature
Storage temperature
2000
V
16
90
W
°C
°C
°C
Internally limited
-40 to 150
Tc
Tstg
-55 to 150
Table 2.
Symbol
Thermal data
Parameter
Value
Unit
SO-20
PowerSO-10
RthJP
RthJA
RthJC
Thermal resistance junction-pins
Thermal resistance junction-ambient
Thermal resistance junction-case
Max
Max
Max
8
58
-
-
°C/W
°C/W
°C/W
52 (1)
37 (2)
1.4
1. When mounted on FR4 printed circuit board with 0.5 cm2 of copper area ( at least 35µ thick ) connected to
all VCC pins.
2. When mounted on FR4 printed circuit board with 6 cm2 of copper area ( at least 35µ thick ) connected to all
V
CC pins.
3/19
Pin connection
VNQ860-E, VNQ860SP-E
2
Pin connection
Figure 2.
Configuration diagram (top view) and suggested connections for unused
and n.c. pins
Table 3.
Pin connection
Connection / pin
Status
N.C.
Output
Input
Floating
X
X
X
X
X
To ground
Through 10 kΩ resistor
Figure 3.
Current and voltage conventions
4/19
VNQ860-E, VNQ860SP-E
Electrical characteristics
3
Electrical characteristics
(8 V < V < 36 V; -40 °C < T < 150 °C; unless otherwise specified)
CC
J
Table 4.
Power section
Parameter
Symbol
Test conditions
Min
Typ Max Unit
Operating supply
voltage
VCC
5.5
36
V
Undervoltage shut-
down
VUSD
VOV
3
4
5.5
48
V
V
Overvoltage shut-down
36
42
On state resistance
(per channel)
IOUT = 0.25 A; TJ = 25 °C;
IOUT = 0.25 A;
270
540
RON
mΩ
OFF state; VCC = 24 V;
TC = 25 °C
70
5
120
10
µΑ
mA
IS
Supply current
Output current
ON state ( all channels ON )
VCC - VSTAT = VIN
VGND = 24 V;
=
ILGND
1
mA
VOUT = 0 V
OFF state output
current
IL(OFF)
IOUTleak
IOUTleak
VIN = VOUT = 0 V
VIN = VGND = 0 V;
0
10
µΑ
µΑ
µΑ
OFF state output
leakage current
240
100
VCC = VOUT = 24 V; TA = 25 °C
VIN = VGND = 0 V; VCC = 24 V;
VOUT = 10 V; TA = 25 °C
OFF state output
leakage current
Table 5.
Symbol
Switching ( V = 24 V)
CC
Parameter
Test conditions
Min
Typ Max Unit
RL = 96 from VIN rising edge to
VOUT = 2.4 V
Turn-on delay time of
Output current
t(ON)
10
µs
RL = 96 from VIN rising edge to
VOUT = 21.6 V
Turn-off delay time of
Output current
t(OFF)
40
µs
RL = 96 from VOUT = 2.4 V to
19.2 V
(dVOUT/dt)on Turn-on voltage slope
(dVOUT/dt)off Turn-off voltage slope
0.75
0.25
V/µs
V/µs
RL = 96 from VOUT = 21.6 V to
2.4 V
5/19
Electrical characteristics
VNQ860-E, VNQ860SP-E
Table 6.
Symbol
Protections (per channel)
Parameter
Test conditions
Min
Typ
Max
Unit
Ilim
Current limitation
0.35
7
0.7
15
1.1
A
T(hyst)
Thermal hysteresis
°C
Thermal shut-down
temperature
TTSD
TR
150
135
175
200
°C
°C
V
Reset temperature
Turn-offoutputclamp
voltage
VCC
-
VCC
-
VCC
47
-
Vdemag
IOUT = 0.25 A, VCC = 24 V
59
52
Table 7.
Symbol
Logical input (per channel)
Parameter
Test conditions
Min
Typ
Max
Unit
VIL
IIL
Low level input voltage
1.25
V
Low level input current VIN = 1.25 V
1
µΑ
High level input
voltage
VIH
IIH
3.25
V
µΑ
V
High level input
current
VIN = 3.25 V
10
Input hysteresis
voltage
VI(HYST)
0.5
IIN
Input current
VIN = VCC = 36 V
200
1
µΑ
VOL
I/O output votage
IIN = 5 mA ( Fault condition )
V
Table 8.
Symbol
Status pin
Parameter
Test conditions
Min
Typ
Max
Unit
Status low output
voltage
VSTAT
ILSTAT
CSTAT
I
STAT = 5 mA ( Fault condition )
1
V
Status leakage
current
Normal operation;
STAT = VCC = 36 V
10
µΑ
V
Status pin input
capacitance
Normal operation;
VSTAT = 5 V
100
pF
Table 9.
Symbol
V
- output diode
Parameter
CC
Test conditions
Min
Typ
Max
Unit
VF
Forwardon voltage -IOUT = 0.3 A; TJ = 150 °C
1
V
6/19
VNQ860-E, VNQ860SP-E
Truth table and switching characteristics
4
Truth table and switching characteristics
Table 10. Truth table
Conditions
MCOUTn
I/On
OUTPUTn
STATUS
L
L
L
H
H
Normal operation
H
H
H
L
L
L
H
H
Current limitation
Overtemperature
Undervoltage
H
H
X
L
L
L
L
X
X
H
Driven low
L
L
L
L
X
X
H
H
L
L
L
L
H
H
Overvoltage
H
H
Figure 4.
Switching characteristics
7/19
Typical application schematic
VNQ860-E, VNQ860SP-E
5
Typical application schematic
Figure 5.
Typical application schematic
8/19
VNQ860-E, VNQ860SP-E
Waveforms
6
Waveforms
Figure 6.
Waveforms
9/19
PowerSO-10™ thermal data
VNQ860-E, VNQ860SP-E
7
PowerSO-10™ thermal data
Figure 7.
PowerSO-10™ PC board
Figure 8.
R
vs PBC copper area in open box free air condition
thJA
10/19
VNQ860-E, VNQ860SP-E
Reverse polarity protection
8
Reverse polarity protection
A schematic solution to protect the IC against a reverse polarity condition is proposed.
This schematic is effective with any type of load connected to the outputs of the IC.
The RGND resistor value can be selected according to the following conditions to be met:
1.
2.
R
R
≤ 600 mV / (I in ON state max).
S
GND
GND
≥ (-V ) / (-I
)
CC
GND
where -IGND is the DC reverse ground pin current and can be found in the absolute
maximum rating section of the device datasheet.
The power dissipation associated to R
during reverse polarity condition is:
GNG
2
PD = (-V ) /R
CC
GND
This resistor can be shared by several different ICs. In such case I value on formula (1) is
S
the sum of the maximum ON-state currents of the different devices.
Please note that if the microprocessor ground and the device ground are separated then the
voltage drop across the R
(given by I in ON state max * R
) produce a difference
GND
S
GND
between the generated input level and the IC input signal level. This voltage drop will vary
depending on how many devices are ON in the case of several high side switches sharing
the same R
.
GND
Figure 9. Reverse polarity protection
+ Vcc
Statusi
Inputi
Outputi
GND
Load
RGND
(Optional)
11/19
Package mechanical data
VNQ860-E, VNQ860SP-E
9
Package mechanical data
®
In order to meet environmental requirements, ST offers these devices in ECOPACK
packages. These packages have a lead-free second level interconnect. The category of
second Level Interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
Table 11. PowerSO-10™ mechanical data
mm
Typ
inch
Typ
Dim.
Min
Max
Min
Max
A
A1
B
3.35
0.00
0.40
0.35
9.40
7.40
9.30
7.20
7.20
6.10
5.90
3.65
0.10
0.60
0.55
9.60
7.60
9.50
7.40
7.60
6.35
6.10
0.132
0.000
0.016
0.013
0.370
0.291
0.366
0.283
0.283
0.240
0.232
0.144
0.004
0.024
0.022
0.378
0.300
0.374
0.291
0.300
0.250
0.240
c
D
D1
E
E1
E2
E3
E4
e
1.27
0.050
F
1.25
1.35
0.049
0.543
0.053
0.567
H
13.80
14.40
h
0.50
1.70
0.002
0.067
L
1.20
0°
1.80
8°
0.047
0.071
q
a
12/19
VNQ860-E, VNQ860SP-E
Figure 10. PowerSO-10™ package dimensions
Package mechanical data
Figure 11. PowerSO-10™ suggested pad and tube shipment (no suffix)
13/19
Package mechanical data
Figure 12. Tape and reel shipment (suffix “TR“)
VNQ860-E, VNQ860SP-E
14/19
VNQ860-E, VNQ860SP-E
Package mechanical data
Figure 13. PowerSO-20 mechanical data and package dimensions
mm
inch
DIM.
MIN. TYP. MAX. MIN.
TYP. MAX.
0.142
0.012
0.130
0.004
0.021
0.013
0.630
0.386
0.570
0.050
0.450
0.437
0.114
0.244
0.004
0.626
0.043
0.043
OUTLINE AND
MECHANICAL DATA
A
a1
a2
a3
b
3.6
0.1
0.3
3.3
0.1
0.004
0
0.000
Weight: 1.9gr
0.4
0.53 0.016
0.32 0.009
c
0.23
15.8
9.4
D (1)
16
0.622
0.370
D1 (2
)
9.8
E
13.9
14.5 0.547
e
1.27
e3
11.43
E1 (1) 10.9
E2
11.1 0.429
2.9
E3
G
H
h
5.8
0
6.2
0.1
0.228
0.000
15.5
15.9 0.610
1.1
JEDEC MO-166
L
0.8
1.1
8˚(typ.)
8˚(max. )
0.031
N
S
T
10
0.394
(1) “D and E1” do not include mold flash or protusions.
- Mold flash or protusions shall not exceed 0.15mm (0.006”)
- Critical dimensions: “E”, “G” and “a3”.
PowerSO-20
(2) For subcontractors, the limit is the one quoted in jedec MO-166
R
N
N
a2
A
c
a1
b
e
DETAIL B
DETAIL A
e3
E
DETAIL A
H
lead
D
slug
a3
DETAIL B
20
11
0.35
Gage Plane
- C -
SEATING PLANE
S
L
G
C
BOTTOM VIEW
(COPLANARITY)
E2
E1
T
E3
1
1
0
D1
PSO20MEC
h x 45˚
0056635 I
15/19
Package mechanical data
Figure 14. SO-20 tube shipment ( no suffix )
VNQ860-E, VNQ860SP-E
Figure 15. Tape and reel shipment ( suffix “13TR“)
16/19
VNQ860-E, VNQ860SP-E
Order codes
10
Order codes
Table 12. Order codes
Order codes
Package
Packaging
VNQ860
VNQ860SP
SO-20
PowerSO-10™
SO-20
Tube
VNQ86013TR-E
VNQ860SP13TR-E
Tape and reel
PowerSO-10™
17/19
Revision history
VNQ860-E, VNQ860SP-E
11
Revision history
Table 13. Document revision history
Date
Revision
Changes
14-Jul-2005
7-Nov-2005
07-Jul-2008
1
2
3
Updates , new template
Few updates
Added Section 8 on page 11
18/19
VNQ860-E, VNQ860SP-E
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