TN805-X00B-TR [STMICROELECTRONICS]
8A SCRS; 8A可控硅
| 型号： | TN805-X00B-TR |
| 厂家： | 
ST |
| 描述： | 8A SCRS |
| 文件： | 总10页 (文件大小：126K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TN8, TS8 and TYNx08 Series
®
8A SCRS
SENSITIVE & STANDARD
Table 1: Main Features
Symbol
A
Value
Unit
IT(RMS)
8
A
G
K
VDRM/VRRM
IGT
600 to 1000
0.2 to 15
V
A
mA
A
K
A
G
DESCRIPTION
K
A
Available either in sensitive (TS8) or standard
(TN8 / TYN) gate triggering levels, the 8A SCR
series is suitable to fit all modes of control, found
in applications such as overvoltage crowbar
protection, motor control circuits in power tools
and kitchen aids, inrush current limiting circuits,
capacitive discharge ignition and voltage
regulation circuits...
G
DPAK
(TN8-B / TS8-B)
IPAK
(TN8-H / TS8-H)
A
A
K
K
A
G
A
Available in through-hole or surface-mount
packages, they provide an optimized performance
in a limited space area.
G
TO-220AB
(TS8-T)
TO-220AB
(TYNx08RG)
Table 2: Order Codes
Part Numbers
TN805-x00B
Marking
TN805x00
TN805x00
TN805x00
TN815x00
TN815x00
TN815x00
TS820x00
TS820x00
TS820x00
TS820x00T
TYNx08
TN805-x00B-TR
TN805-x00H
TN815-x00B
TN815-x00B-TR
TN815-x00H
TS820-x00B
TS820-x00B-TR
TS820-x00H
TS820-x00T
TYNx08RG
February 2006
REV. 5
1/10
TN8, TS8 and TYNx08 Series
Table 3: Absolute Ratings (limiting values)
Value
Symbol
IT(RMS)
IT(AV)
Parameter
Unit
TS8/TN8 TYN08
Tc = 110°C
Tc = 110°C
RMS on-state current (180° conduction angle)
Average on-state current (180° conduction angle)
8
5
A
A
tp = 8.3 ms
73
70
100
95
Non repetitive surge peak on-
state current
ITSM
Tj = 25°C
A
tp = 10 ms
²
²
A2S
A/µs
tp = 10 ms
Tj = 25°C
24.5
45
I t
I t Value for fusing
Critical rate of rise of on-state
current IG = 2 x IGT , tr ≤ 100 ns
Tj = 125°C
dI/dt
F = 60 Hz
50
IGM
tp = 20 µs
Tj = 125°C
Tj = 125°C
Peak gate current
4
1
A
PG(AV)
Average gate power dissipation
W
Tstg
Tj
- 40 to + 150
- 40 to + 125
Storage junction temperature range
Operating junction temperature range
°C
V
VRGM
Maximum peak reverse gate voltage (for TN8 & TYN08 only)
5
Tables 4: Electrical Characteristics (Tj = 25°C, unless otherwise specified)
SENSITIVE
Symbol
■
Test Conditions
TS820
200
0.8
0.1
8
Unit
µA
V
IGT
VGT
VGD
VRG
IH
MAX.
MAX.
MIN.
VD = 12 V
RL = 140 Ω
VD = VDRM RL = 3.3 kΩ RGK = 220 Ω Tj = 125°C
IRG = 10 µA
V
MIN.
V
IT = 50 mA RGK = 1 kΩ
MAX.
MAX.
MIN.
5
mA
mA
V/µs
V
IL
IG = 1 mA RGK = 1 kΩ
6
VD = 65 % VDRM RGK = 220 Ω
ITM = 16 A tp = 380 µs
Threshold voltage
Tj = 125°C
Tj = 25°C
Tj = 125°C
Tj = 125°C
Tj = 25°C
Tj = 125°C
dV/dt
VTM
Vt0
5
MAX.
MAX.
MAX.
1.6
0.85
46
5
V
Rd
Dynamic resistance
mΩ
µA
mA
IDRM
IRRM
VDRM = VRRM
RGK = 220 Ω
MAX.
1
2/10
TN8, TS8 and TYNx08 Series
■
STANDARD
Symbol
Test Conditions
TN805 TN815 TYNx08
Unit
MIN.
MAX.
MAX.
0.5
5
2
2
IGT
mA
VD = 12 V
RL = 33 Ω
15
1.3
15
VGT
VGD
IH
V
V
VD = VDRM RL = 3.3 kΩ
IT = 100 mA Gate open
IG = 1.2 IGT
Tj = 125°C
MIN.
MAX.
MAX.
MIN.
0.2
40
25
30
50
30
70
mA
mA
V/µs
V
IL
50
VD = 67 % VDRM Gate open Tj =125°C
dV/dt
VTM
Vt0
150
1.6
0.85
46
150
ITM = 16 A tp = 380 µs
Threshold voltage
Tj = 25°C
Tj = 125°C
Tj = 125°C
Tj = 25°C
Tj = 125°C
MAX.
MAX.
MAX.
V
Rd
Dynamic resistance
mΩ
µA
mA
5
IDRM
IRRM
VDRM = VRRM
MAX.
2
Table 6: Thermal resistance
Symbol
Parameter
Value Unit
Rth(j-c)
Junction to case (D.C.)
20
°C/W
²
DPAK
70
100
60
S = 0.5 cm
Rth(j-a)
Junction to ambient (D.C.)
°C/W
IPAK
TO-220AB
S = Copper surface under tab.
Figure 1: Maximum average power dissipation
versus average on-state current
Figure 2: Average and D.C. on-state current
versus case temperature
P(W)
I (A)
T(AV)
8
10.0
9.0
8.0
7.0
6.0
5.0
4.0
3.0
2.0
1.0
0.0
D.C.
α = 180°
7
6
5
4
3
2
1
0
α = 180°
360°
α
T
(°C)
case
I (A)
T(AV)
0
25
50
75
100
125
0
1
2
3
4
5
6
3/10
TN8, TS8 and TYNx08 Series
Figure 3: Average and D.C. on-state current
versus ambient temperature (device mounted
on FR4 with recommended pad layout) (DPAK)
Figure 4: Relative variation of thermal
impedance junction to case versus pulse
duration
I (A)
T(AV)
K=[Z
/R
]
th(j-c) th(j-c)
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
1.0
0.5
D.C.
α = 180°
0.2
0.1
t (s)
p
T
(°C)
amb
1E-3
1E-2
1E-1
1E+0
0
25
50
75
100
125
Figure 5: Relative variation of thermal
impedance junction to ambient versus pulse
duration (recommended pad layout, FR4 PC
board for DPAK)
Figure 6: Relative variation of gate trigger
current and holding current versus junction
temperature for TS8 series
K=[Z
/R
]
th(j-a) th(j-a)
I
,I ,I [T ] / I ,I ,I [T =25°C]
GT H L j GT H L j
1.00
0.10
0.01
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
IGT
DPAK
IH & IL
RGK = 1kΩ
TO-220AB / IPAK
T (°C)
j
t (s)
p
-40
-20
0
20
40
60
80
100
120
140
1E-2
1E-1
1E+0
1E+1
1E+2
5E+2
Figure 7: Relative variation of gate trigger
current and holding current versus junction
temperature for TN8 & TYN08 series
Figure 8: Relative variation of holding current
versus gate-cathode resistance (typical
values) for TS8 series
I [R ] / I [R =1kΩ]
H
GK
H
GK
I
,I ,I [T ] / I ,I ,I [T =25°C]
GT
H
L
j
GT
H
L
j
6.0
5.5
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
2.4
2.2
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
Tj = 25°C
IGT
IH & IL
T (°C)
j
R
(kΩ)
GK
-40
-20
0
20
40
60
80
100
120
140
1E-2
1E-1
1E+0
1E+1
4/10
TN8, TS8 and TYNx08 Series
Figure 9: Relative variation of dV/dt immunity
versus gate-cathode resistance (typical
values) for TS8 series
Figure 10: Relative variation of dV/dt immunity
versus gate-cathode capacitance (typical
values) for TS8 series
dV/dt[R ] / dV/dt[R =220Ω]
dV/dt[C ] / dV/dt[R =220Ω]
GK GK
GK
GK
10.00
1.00
0.10
0.01
15.0
12.5
10.0
7.5
Tj = 125°C
VD = 0.67 x VDRM
VD = 0.67 x VDRM
Tj = 125°C
RGK = 220Ω
5.0
2.5
R
(kΩ)
GK
C (nF)
GK
0.0
0
20
40
60
80
100 120 140 160 180 200 220
0
200
400
600
800 1000 1200 1400 1600 1800 2000
Figure 11: Surge peak on-state current versus
number of cycles
Figure 12: Non-repetitive surge peak on-state
current for a sinusoidal pulse with width
tp < 10 ms, and corresponding values of I²t
I
(A)
TSM
I
(A), I2t (A2s)
TSM
100
90
80
70
60
50
40
30
20
10
0
1000
100
10
Tj initial = 25°C
tp=10ms
One cycle
TYN08
ITSM
TYN08
Non repetitive
Tj initial=25°C
dI/dt limitation
TN8 / TS8
TN8 / TS8
TYN08
Repetitive
TC=110°C
I2t
TN8 / TS8
Number of cycles
t (ms)
p
1
10
100
1000
0.01
0.10
1.00
10.00
Figure 13: On-state characteristics (maximum
values)
Figure 14: Thermal resistance junction to
ambient versus copper surface under tab
(epoxy printed circuit board FR4, copper
thickness: 35µm) (DPAK)
R
(°C/W)
th(j-a)
I
(A)
TM
100
80
60
40
20
0
50.0
10.0
Tj max.:
Vt0=0.85V
Rd=46mΩ
Tj=max
1.0
0.1
Tj=25°C
S(cm²)
V
(V)
TM
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
0
2
4
6
8
10
12
14
16
18
20
5/10
TN8, TS8 and TYNx08 Series
Figure 17: Ordering Information Scheme (TN8 series)
TN 8 05 - 600 B (-TR)
Standard SCR series
Current
8 = 8A
Sensitivity
05 = 5mA
15 = 15mA
Voltage
600 = 600V
800 = 800V
Package
B = DPAK
H = IPAK
Packing mode
Blanck = Tube
-TR = Tape & Reel
Figure 18: Ordering Information Scheme (TS8 series)
TS 8 20 - 600 B (-TR)
Sensitive SCR series
Current
8 = 8A
Sensitivity
20 = 200µA
Voltage
600 = 600V
700 = 700V
Package
B = DPAK
H = IPAK
T = TO-220AB
Packing mode
Blanck = Tube
-TR = Tape & Reel
Figure 19: Ordering Information Scheme (TYN08 series)
TYN
6
08 RG
Standard SCR series
Voltage
6 = 600V
8 = 800V
10 = 100V
Current
8 = 8A
Packing mode
RG = Tube
6/10
TN8, TS8 and TYNx08 Series
Table 7: Product Selector
Part Numbers
Voltage (xxx)
700 V 800 V
Sensitivity
Package
600 V
1000 V
TN805-xxxB
TN805-xxxH
TN815-xxxB
TN815-xxxH
TS820-xxxB
TS820-xxxH
TS820-xxxT
TYNx08RG
X
X
X
X
X
5 mA
5 mA
DPAK
IPAK
X
X
X
X
X
X
X
15 mA
15 mA
0.2 mA
0.2 mA
0.2 mA
15 mA
DPAK
IPAK
X
X
X
DPAK
IPAK
TO-220AB
TO-220AB
X
X
Figure 20: DPAK Package Mechanical Data
DIMENSIONS
REF.
Millimeters
Inches
Min.
2.20
0.90
0.03
0.64
5.20
0.45
0.48
6.00
6.40
4.40
9.35
Max
2.40
1.10
0.23
0.90
5.40
0.60
0.60
6.20
6.60
4.60
10.10
Min.
Max.
0.094
0.043
0.009
0.035
0.212
0.023
0.023
0.244
0.259
0.181
0.397
E
A
A
A1
A2
B
B2
C
C2
D
E
0.086
0.035
0.001
0.025
0.204
0.017
0.018
0.236
0.251
0.173
0.368
B2
C2
L2
D
R
H
L4
A1
R
B
G
C
G
H
A2
0.60 MIN.
L2
L4
V2
0.80 typ.
0.031 typ.
0.60
0°
1.00
8°
0.023
0°
0.039
8°
V2
Figure 21: DPAK Foot Print Dimensions
(in millimeters)
1.6
6.7
3
3
2.3
2.3
6.7
1.6
7/10
TN8, TS8 and TYNx08 Series
Figure 22: IPAK Package Mechanical Data
DIMENSIONS
Millimeters Inches
Min. Typ. Max. Min. Typ. Max.
REF.
A
A1
A3
B
B2
B3
B5
C
2.20
0.90
0.70
0.64
5.20
2.40 0.086
1.10 0.035
1.30 0.027
0.90 0.025
5.40 0.204
0.95
0.094
0.043
0.051
0.035
0.212
0.037
A
E
C2
B2
L2
0.30
0.035
D
0.45
0.48
6
0.60 0.017
0.60 0.019
6.20 0.236
6.60 0.252
0.023
0.023
0.244
0.260
C2
D
E
H
B3
L1
L
6.40
A1
B
e
G
H
L
L1
L2
V1
2.28
0.090
0.634
V1
4.40
4.60 0.173
0.181
16.10
B5
C
e
9
0.8
9.40 0.354
1.20 0.031
1
0.370
0.047
A3
G
0.80
10°
0.031 0.039
10°
Figure 23: TO-220AB Package Mechanical Data
DIMENSIONS
REF.
Millimeters
Inches
Min.
Max.
4.60
1.32
2.72
0.70
0.88
1.70
1.70
5.15
2.70
10.40
Min.
Max.
0.181
0.051
0.107
0.027
0.034
0.066
0.066
0.202
0.106
0.409
A
C
4.40
1.23
2.40
0.49
0.61
1.14
1.14
4.95
2.40
10
0.173
0.048
0.094
0.019
0.024
0.044
0.044
0.194
0.094
0.393
A
H2
Dia
C
D
E
L5
L7
F
L6
L4
F1
F2
G
L2
F2
F1
D
L9
G1
H2
L2
L4
L5
L6
L7
L9
M
16.4 typ.
0.645 typ.
F
13
14
0.511
0.104
0.600
0.244
0.137
0.551
0.116
0.620
0.259
0.154
M
2.65
15.25
6.20
3.50
2.95
15.75
6.60
3.93
G1
E
G
2.6 typ.
0.102 typ.
Diam.
3.75
3.85
0.147
0.151
8/10
TN8, TS8 and TYNx08 Series
DIMENSIONS
Figure 24: TO-220AB Package Mechanical Data
REF.
Millimeters
Inches
Min. Typ. Max. Min. Typ. Max.
C
B
A
a1
15.20
15.90 0.598
0.625
Ø I
b2
3.75
0.147
L
a2 13.00
14.00 0.511
10.40 0.393
0.88 0.024
1.32 0.048
4.60 0.173
0.70 0.019
2.72 0.094
2.70 0.094
6.60 0.244
3.85 0.147
0.551
0.409
0.034
0.051
0.181
0.027
0.107
0.106
0.259
0.151
F
B
b1
b2
C
c1
c2
e
10.00
0.61
1.23
4.40
0.49
2.40
2.40
6.20
3.75
A
I4
l3
l2
c2
a1
a2
F
ØI
M
c1
b1
I4 15.80 16.40 16.80 0.622 0.646 0.661
e
L
2.65
1.14
1.14
2.95 0.104
1.70 0.044
1.70 0.044
0.116
0.066
0.066
l2
l3
M
2.60
0.102
In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These
packages have a Lead-free second level interconnect . The category of second level interconnect is
marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The
maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an
ST trademark. ECOPACK specifications are available at: www.st.com.
Table 8: Ordering Information
Ordering type
TN805-x00B
TN805-x00B-TR
TN805-x00H
TN815-x00B
TN815-x00B-TR
TN815-x00H
TS820-x00B
Marking
TN805x00
TN805x00
TN805x00
TN815x00
TN815x00
TN815x00
TS820x00
TS820x00
TS820x00
TS820x00T
TYNx08
Package
DPAK
DPAK
IPAK
DPAK
DPAK
IPAK
DPAK
DPAK
Weight Base qty Delivery mode
0.3 g
0.3 g
0.4 g
0.3 g
0.3 g
0.4 g
0.3 g
0.3 g
0.4 g
2.3 g
2.3 g
75
2500
75
75
2500
75
75
2500
75
50
50
Tube
Tape & reel
Tube
Tube
Tape & reel
Tube
Tube
Tape & reel
Tube
TS820-x00B-TR
TS820-x00H
TS820-x00T
IPAK
TO-220AB
TO-220AB
Tube
Tube
TYNx08RG
Note: x = voltage
Table 9: Revision History
Date
Revision
Description of Changes
Apr-2002
4A
Last update.
TO-220AB delivery mode changed from bulk to tube.
ECOPACK statement added.
13-Feb-2006
5
9/10
TN8, TS8 and TYNx08 Series
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10/10
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