TDA7705_10 [STMICROELECTRONICS]

Highly integrated tuner for AM/FM car radio; 高度集成的调谐器AM / FM汽车收音机
TDA7705_10
型号: TDA7705_10
厂家: ST    ST
描述:

Highly integrated tuner for AM/FM car radio
高度集成的调谐器AM / FM汽车收音机

文件: 总42页 (文件大小:402K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
TDA7705  
Highly integrated tuner for AM/FM car radio  
Features  
Fully integrated VCO for world tuning  
High performance PLL for fast RDS system  
AM/FM mixers with high image rejection  
Integrated AM-LNA and AM-PINDIODE  
Automatic self alignment for preselection and  
image rejection  
Digital IF signal processing, high performance  
LQFP64  
and drift-free  
Integrated IF-filters with high selectivity, high  
dynamic range and adaptive bandwidth control  
RDS demodulation with group and block  
synchronization  
It contains mixers and IF amplifiers for AM and  
FM, fully integrated VCO and PLL synthesizer,  
IF-processing including adaptive bandwidth  
control, stereo decoder and RDS decoder on a  
single chip.  
High performance stereodecoder with  
noiseblanker  
2
I C/SPI bus controlled  
Single 5 V supply  
LQFP64 package  
The utilization of digital signal processing results  
in numerous advantages against today's tuners:  
very low number of external components, very  
small space occupation and easy application,  
very high selectivity due to digital filters, high  
flexibility by software control and automatic  
alignment.  
Description  
The TDA7705 highly integrated tuner (HIT) is a  
new generation of high performance tuners for  
carradio applications.  
Table 1.  
Device summary  
Order code  
Package  
Packing  
TDA7705  
LQFP64 (10x10x1.4mm)  
LQFP64 (10x10x1.4mm)  
Tray  
TDA7705TR  
Tape and reel  
March 2010  
Doc ID 15938 Rev 8  
1/42  
www.st.com  
1
Contents  
TDA7705  
Contents  
1
Block diagram and pins description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6  
1.1  
1.2  
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6  
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7  
2
Function description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10  
2.1  
2.2  
2.3  
2.4  
2.5  
2.6  
2.7  
2.8  
2.9  
FM - mixers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10  
FM - AGC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10  
AM - LNA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10  
AM - AGC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10  
AM - mixers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10  
IF A/D converters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11  
Audio D/A converters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11  
VCO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11  
PLL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11  
2.10 Crystal oscillator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11  
2.11 DSP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11  
2.12 IO interface pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12  
2.13 Serial interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12  
2.13.1 Serial interface choice / boot mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12  
2
2.13.2 I C bus protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13  
2.13.3 SPI bus protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14  
3
Electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16  
3.1  
3.2  
3.3  
3.4  
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16  
Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16  
General key parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16  
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17  
3.4.1  
3.4.2  
3.4.3  
3.4.4  
3.4.5  
FM - section . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17  
AM - section . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18  
VCO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19  
Phase locked loop . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19  
Tuning DAC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19  
2/42  
Doc ID 15938 Rev 8  
TDA7705  
Contents  
3.4.6  
3.4.7  
3.4.8  
3.4.9  
IF ADC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19  
Audio DAC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20  
IO interface pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20  
2
I C interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21  
3.4.10 SPI interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22  
3.4.11 Warning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22  
3.5  
Overall system performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23  
3.5.1  
3.5.2  
3.5.3  
3.5.4  
3.5.5  
FM overall system performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23  
AM MW overall system performance . . . . . . . . . . . . . . . . . . . . . . . . . . . 25  
AM LW overall system performance . . . . . . . . . . . . . . . . . . . . . . . . . . . 27  
AM SW overall system performance . . . . . . . . . . . . . . . . . . . . . . . . . . . 28  
WX overall system performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29  
4
5
Front-end processing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30  
Weak signal processing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33  
5.1  
FM IF-processing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33  
5.1.1  
5.1.2  
5.1.3  
5.1.4  
5.1.5  
5.1.6  
Dynamic channel selection filter (DISS) . . . . . . . . . . . . . . . . . . . . . . . . 33  
Soft mute . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33  
Adjacent channel mute . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34  
Stereo blend- . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34  
High cut control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35  
Stereo decoder . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36  
5.2  
AM IF-processing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36  
5.2.1  
5.2.2  
5.2.3  
Channel selection filter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36  
Soft mute . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36  
High cut control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37  
6
Application schematics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38  
6.1  
6.2  
Basic application schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38  
Application schematic example with SPI-bus and tuned preselection . . . 39  
7
8
Package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40  
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41  
Doc ID 15938 Rev 8  
3/42  
List of tables  
TDA7705  
List of tables  
Table 1.  
Table 2.  
Table 3.  
Table 4.  
Table 5.  
Table 6.  
Table 7.  
Table 8.  
Device summary. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1  
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7  
Boot mode pin configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13  
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16  
Thermal data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16  
General key parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16  
FM - section . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17  
AM - section . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18  
VCO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19  
Phase locked loop . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19  
Tuning DAC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19  
IF ADC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19  
Audio DAC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20  
IO interface pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20  
Table 9.  
Table 10.  
Table 11.  
Table 12.  
Table 13.  
Table 14.  
Table 15.  
Table 16.  
Table 17.  
Table 18.  
Table 19.  
Table 20.  
Table 21.  
Table 22.  
Table 23.  
Table 24.  
Table 25.  
Table 26.  
Table 27.  
Table 28.  
Table 29.  
Table 30.  
Table 31.  
Table 32.  
Table 33.  
Table 34.  
Table 35.  
Table 36.  
2
I C interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21  
SPI interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22  
FM overall system performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23  
AM MW overall system performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25  
AM LW overall system performance. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27  
AM SW overall system performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28  
WX overall system performance. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29  
Register 0x00 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30  
Register 0x01 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31  
Register 0x02 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31  
Register 0x05 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32  
Dynamic channel selection filter (DISS) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33  
Soft mute . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33  
Adjacent channel mute . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34  
Stereo blend . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34  
High cut control. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35  
De-emphasis filter. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36  
Stereo decoder . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36  
Channel selection filter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36  
Soft mute . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36  
High cut control. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37  
Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41  
4/42  
Doc ID 15938 Rev 8  
TDA7705  
List of figures  
List of figures  
Figure 1.  
Figure 2.  
Figure 3.  
Figure 4.  
Figure 5.  
Figure 6.  
Figure 7.  
Figure 8.  
Figure 9.  
Functional block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6  
Pin connection (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7  
2
I C "write" sequence. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13  
2
I C "read" sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14  
SPI modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15  
SPI "write" sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15  
SPI "read" sequence. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15  
2
I C bus timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21  
SPI bus timing diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22  
Figure 10. FM input set-up. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23  
Figure 11. AM MW input set up . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25  
Figure 12. AM LW input set-up . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27  
Figure 13. AM SW input set-up . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28  
Figure 14. WX input set-up . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29  
2
Figure 15. FM wide-band application / I C control. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38  
Figure 16. Example of FM tuned (narrow-band) application / SPI control . . . . . . . . . . . . . . . . . . . . . . 39  
Figure 17. LQFP64 (10x10x1.4mm) mechanical data and package dimensions. . . . . . . . . . . . . . . . . 40  
Doc ID 15938 Rev 8  
5/42  
Block diagram and pins description  
TDA7705  
1
Block diagram and pins description  
1.1  
Block diagram  
Figure 1.  
Functional block diagram  
SUM  
6/42  
Doc ID 15938 Rev 8  
TDA7705  
Block diagram and pins description  
1.2  
Pin description  
Figure 2.  
Pin connection (top view)  
64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49  
1
2
3
4
5
6
7
8
9
LFI  
PLLTEST  
DAC  
48  
47  
46  
45  
44  
43  
42  
41  
40  
39  
38  
37  
36  
35  
34  
33  
GND-1V2  
VDD-1V2  
TEST  
TCAGCFM  
FMMIX1dec  
FMMIX1in  
FMMIX2in  
GND-RF  
FMPINDRV  
VCC-RF  
RSTN  
MODE  
GPIO0  
GPIO1  
GPIO2  
GPIO3  
RDSINT  
VDD-1V2  
SCL/CLK  
SDA/MOSI  
SPI_MISO  
SPI_CS  
GND-3V3  
10  
11  
12  
13  
14  
TCAM  
AMPINDRV  
PINDdec  
PINDin  
GND-LNA  
LNAin  
15  
16  
17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32  
AC00418  
Table 2.  
Pin #  
Pin description  
Pin name  
Function  
1
2
LF1  
PLL loopfilter output  
PLLTEST  
DAC  
PLL test output / GPO  
FM tuning DAC output  
FM AGC time constant  
FM mixer decoupling  
3
4
TCAGCFM  
FMMIX1dec  
FMIX1in  
FMIX2in  
GND-RF  
FMPINDRV  
VCC-RF  
TCAM  
5
6
FM mixer input 1  
7
FM mixer input 2  
8
RF Ground  
9
FM AGC PIN diode driver  
5V supply for RF section  
AM AGC time constant  
AM AGC external PIN diode driver  
AM AGC internal PIN diode decoupling  
AM AGC internal PIN diode input  
AM LNA and internal PIN diode GND  
AM LNA input  
10  
11  
12  
13  
14  
15  
16  
AMPINDRV  
PINDdec  
PINDin  
GND-LNA  
LNAin  
Doc ID 15938 Rev 8  
7/42  
Block diagram and pins description  
TDA7705  
Table 2.  
Pin #  
Pin description (continued)  
Pin name  
LNAdec  
Function  
17  
18  
19  
20  
21  
22  
23  
24  
25  
26  
27  
28  
29  
30  
31  
32  
33  
34  
35  
36  
37  
38  
39  
40  
41  
42  
43  
44  
45  
46  
47  
48  
49  
50  
51  
AM LNA decoupling  
AM LNA output first stage  
AM LNA input 2nd stage  
AM LNA output  
LNAout  
LNAin2  
LNAout2  
LNAdec2  
AMMIXin2  
AMMIXin1  
AMMIXdec  
GND-IF  
AM LNA decoupling 2nd stage  
AM mixer input 2  
AM mixer input 1  
AM mixer decoupling  
IF and Vref GND  
VREF165  
VREFdec  
GND-DIG  
VCC-DIG  
VCCreg1V2  
REG1V2  
VDD-3V3  
GND-3V3  
SPI_CS  
1.65V reference voltage decoupling  
3.3V reference voltage decoupling  
Digital GND  
5V supply for digital logic  
VCC of 1.2V regulator  
1.2V regulator output  
3.3V VDD output / decoupling  
3.3V VDD GND  
SPI chip select  
SPI_MISO  
SPI Data output  
SDA / SPI_MOSI I2C bus data / SPI data input  
SCL / SPI_CLK I2C bus Clock / SPI clock  
VDD-1V2  
RDSINT  
GPIO3  
1.2V DSP supply  
RDS interrupt  
Reserved  
GPIO2  
Reserved  
GPIO 1  
GPIO 0  
MODE  
Reserved  
Reserved  
For debug purpose only, connected to GND  
Reset pin (active low)  
Test input  
RSTN  
TEST  
VDD-1V2  
GND-1V2  
VCC-DAC  
OSCout  
OSCin  
1.2V DSP supply  
Digital GND for 1.2V VDD  
5V supply of audio DAC  
Xtal osc output  
Xtal osc input  
8/42  
Doc ID 15938 Rev 8  
TDA7705  
Block diagram and pins description  
Function  
Table 2.  
Pin #  
Pin description (continued)  
Pin name  
52  
53  
54  
55  
56  
57  
58  
59  
60  
61  
62  
63  
64  
GND-DAC  
DACoutL  
DACoutR  
GND-IFADC  
LIFrefL  
Audio DAC GND  
Audio output left  
Audio output right  
IF ADC GND  
IF ADC reference low  
IF ADC reference high  
5V supply of IF ADC  
5V supply of PLL  
PLL GND  
LIFrefH  
VCC-IFADC  
VCC-PLL  
GND-PLL  
VCO-dec  
LFref  
VCO decoupling  
Loopfilter reference  
5V supply of VCO  
VCO GND  
VCC-VCO  
GND-VCO  
Doc ID 15938 Rev 8  
9/42  
Function description  
TDA7705  
2
Function description  
2.1  
FM - mixers  
The image-rejection mixer has two FM inputs, selectable through software. These inputs  
feed stages with different gains, noise figures, and IIP3. They are optimized for best  
performance in case of a passive tuned prestage and for a passive fixed bandpass without  
tuning for low-cost application respectively.  
The second input offers also the possibility of an easy addition of a weather-band  
preselection filter.  
The input frequency is downconverted to low IF with high image rejection.  
The tuned application is supported by an 8-bit tuning DAC. The alignment of the DAC is  
performed automatically.  
2.2  
FM - AGC  
The programmable RFAGC senses the mixer input whereas the IFAGC senses the IFADC  
input to avoid overload.  
The PIN diode driver is able to drive external PIN diodes with a current value as high as  
15mA.  
The time constant of the FM-AGC is defined by an external capacitor.  
2.3  
2.4  
AM - LNA  
The AM-LNA is integrated with low noise and high IIP2 and IIP3. The gain of the LNA is  
controlled by the AGC. The maximum gain is set with an external resistor, typically 26 dB  
with 1 kΩ.  
AM - AGC  
The programmable AM-RF-AGC senses the mixer inputs and controls the internal PIN diode  
and LNA gain.  
First the LNA gain is reduced by about 10dB, then the PIN diodes are activated to attenuate  
the signal.  
The time constant of the AM-AGC is defined with an external capacitor and programmable  
internal currents.  
2.5  
AM - mixers  
The image-rejection mixer has two AM inputs selectable via software. It easily supports low-  
cost applications for extended frequency bands like SW, DRM.  
The input frequency is converted to low IF with high image rejection.  
10/42  
Doc ID 15938 Rev 8  
TDA7705  
Function description  
2.6  
IF A/D converters  
A high performance IQ-IFADC converts the IF-signal to digital IF for subsequent digital  
signal processing.  
2.7  
2.8  
Audio D/A converters  
A stereo DAC provides the left / right audio signals after IF-processing and stereodecoding  
by the DSP.  
VCO  
The VCO is fully integrated without any external tuning component. It covers all FM  
frequency bands including EU, US , Japan, EastEU, Weatherband and AM-bands including  
LW, MW, SW.  
2.9  
PLL  
The high speed tuning PLL is able to settle within about 300 µs for fast RDS applications.  
The frequency step can be as low as 5 kHz in FM and 500 Hz in AM.  
2.10  
2.11  
Crystal oscillator  
The device works with a 37.05 MHz fundamental tone crystal, and can be used also with a  
rd  
3
overtone 37.05 MHz crystal.  
DSP  
The DSP and its hardware accelerators perform all the digital signal processing. The main  
program is fixed in ROM. Control parameters are copied in RAM and are accessible and  
modifiable there, thus allowing parametric performance optimization.  
It performs:  
digital down-conversion of IF  
bandwidth selection with variable controlled bandwidth  
FM and AM noiseblanking  
FM/AM demodulation with softmute, high-cut, weak signal processing and quality  
detection  
FM stereo decoding with stereo blend  
RDS demodulation including error correction and block synchronization with generation  
of an RDS interrupt for the main µP  
Autonomous control of RDS-AF tests  
Self alignment of preselection tuning  
Doc ID 15938 Rev 8  
11/42  
Function description  
TDA7705  
2.12  
IO interface pins  
The TDA7705 has the following IO pins:  
PLLTEST  
SPI_CS  
pin 2  
general purpose output  
pin 34  
serial communication with µP  
serial communication with µP  
serial communication with µP  
serial communication with µP  
serial communication with µP  
reset pin driven by µP  
SPI_MISO pin 35  
SDA/MOSI pin 36  
SCL/CLK  
RDSINT  
RSTN  
pin 37  
pin 39  
pin 45  
The pins labeled GPIO0, 1, 2 and 3 (pins 43 to 40) are reserved.  
The pin PLLTEST output voltage can be freely programmed via software and be used to  
drive switches if needed by the application.  
All the inputs are voltage-tolerant up to 3.5 V . The outputs can drive currents up to 0.5 mA  
from the internal 3.3 V supply line.  
2.13  
Serial interface  
2
The device is controlled with a standard I C bus or SPI interface.  
Through the serial bus the processing parameters can be modifed and the signal quality  
parameters and the RDS information can be read out.  
The operation of the device is handled through high level commands sent by the main car-  
radio µP through the serial interface, which allow to simplify the operations carried out in the  
main µP. The high level commands include among others:  
set frequency (which allows to avoid computing the PLL divider factors);  
start seek (the seek operation can be carried out by the TDA7705 in a completely  
autonomous fashion);  
RDS seek/search (jumps to AF and quality measurements are automatically  
sequenced).  
2.13.1  
Serial interface choice / boot mode  
The device can communicate with the main µP with two different standard serial protocols:  
2
SPI and I C. The configuration is chosen by setting the proper value (0V or 3.3V) at pins 35  
and 39 and it is latched (e.g. made effective) when the RSTN line transitions from low to  
high (when RSTN is low, the IC is in reset mode).  
The voltage level forced to pins 35 and 39 must be released to start the system operation a  
suitable time after the RSTN line has gone high.  
The list of configurations is shown in the following table:  
12/42  
Doc ID 15938 Rev 8  
TDA7705  
Table 3.  
Function description  
SPI  
Boot mode pin configuration  
I2C (addr. 0 x C2)  
Configuration:  
I2C (addr. 0 x C8)  
Pin  
RDSINT  
at reset  
operation  
at reset  
operation  
at reset  
operation  
0
RDS interrupt  
out  
0
RDS interrupt  
out  
1
RDS interrupt  
out  
39  
37  
36  
35  
34  
in  
in  
in  
I2C SCL  
in  
I2C SCL  
in  
SPI CLK  
in  
SCL  
SDA  
x
x
x
x
x
x
I2C SDA  
in/out  
I2C SDA  
in/out  
SPI MOSI  
in  
0
1
1
SPI MISO  
out  
(SPI_MISO)  
-
-
-
-
in  
in  
in  
SPI SS  
in  
(SPI_CS)  
2
x
x
x
If I C serial bus is chosen as means of communication with the controlling device, two chip  
addresses are possible: 0xC2/C3 or 0xC8/C9, depending on the initial configuration of pins  
35 and 39.  
The status of pins 35 and 39 during the reset phase can be set to:  
high, through external <10 kΩ resistors tied to 3.3V (pin 32), or  
low, by not forcing any voltage on them from outside, as 50 kohm internal pull-down  
resistors are present on said pins.  
To make sure the boot mode is correctly latched up at start-up, it is advisable to keep the  
RSTN line low until the IC supply pins have reached their steady state, and then for an  
additional time T  
(see Section 3.4.8).  
reset  
2
2.13.2  
I C bus protocol  
2
I C requires two signals: clock (SCL) and data (SDA - bidirectional). The protocol requires  
an acknowledge after any 8-bit transmission.  
A "write" communication example is shown in the figure below, for an unspecified number of  
data bytes (see the relevant technical documentation for frame structure description):  
2
Figure 3.  
I C "write" sequence  
SDA  
SCL  
a7  
a6  
a0  
d7  
d6  
d0  
clk1  
clk2  
clk8  
clk9  
clk1  
clk2  
clk8  
clk9  
START  
address  
ACK  
data  
ACK  
STOP  
Doc ID 15938 Rev 8  
13/42  
Function description  
The sequence consists of the following phases:  
TDA7705  
START: SDA line transitioning from H to L with SCL fixed H. This signifies a new  
transmission is starting;  
data latching: on the rising SCL edge. The SDA line can transition only when SCL is  
low (otherwise its transitions are interpreted as either a START or a STOP transition);  
th  
ACKnowledge: on the 9 SCL pulse the µP keeps the SDA line H, and the TDA7705  
pulls it down if communication has been successful. Lack of the acknowledge pulse  
generation from the TDA7705 means that the communication has failed;  
a chip address byte must be sent at the beginning of the transmission. The value can  
be C2 or C8 (according to the mode chosen at start-up during boot) for "write";  
as many data bytes as needed can follow the address before the communication is  
terminated. See the next section for details on the frame format;  
STOP: SDA line transitioning from L to H with SCL H. This signifies the end of the  
transmission.  
Red lines represent transmissions from the TDA7705 to the µP.  
A "read" communication example is shown in the figure below, for an unspecified number of  
data bytes (see later on for frame structure decription):  
2
Figure 4.  
I C "read" sequence  
SDA  
SCL  
a7  
a6  
a0  
d7  
d6  
d0  
clk1  
clk2  
clk8  
clk9  
clk1  
clk2  
clk8  
clk9  
START  
address  
ACK  
data  
ACK  
STOP  
The sequence is very similar to the "write" one and has the same constraints for start, stop,  
data latching. The differences follow:  
a chip address must always be sent by the µP to the TDA7705; the address must be C3  
(if C2 had been selected at boot) or C9 (if C8 had been selected at boot);  
a header is transmitted after the chip address (the same happens for "write") before  
data are transferred from the TDA7705 to the µP. See the relevant technical  
documentation for details on the frame format;  
when data are transmitted from the TDA7705 to the µP, the µP keeps the SDA line H;  
the ACKnowledge pulse is generated by the µP for those data bytes that are sent by the  
TDA7705 to the µP. Failure of the µP to generate an ACK pulse on the 9 CLK pulse  
th  
has the same effect on the TDA7705 as a STOP.  
The max. clock speed is 500 kbit/s.  
2.13.3  
SPI bus protocol  
SPI requires four signals: clock (CLK), master output/slave input (MOSI - for communication  
from the µP to the TDA7705), master input/slave output (MISO - for communication from the  
TDA7705 to the µP), chip select (CS). CLK is generated by the master device and is used  
for synchronization. MOSI and MISO are the data lines. The CS line is unique for each  
device in an SPI bus. The µP pulls low the TDA7705 CS line to select it for communication.  
The protocol does not foresee any transmission acknowledgement.  
The SPI protocol has four possible modes of operation as far as data latching is concerned:  
14/42  
Doc ID 15938 Rev 8  
TDA7705  
Function description  
Figure 5.  
SPI modes  
In the case of the TDA7705, the data are latched on the clock's rising edge, with CPOL = 1  
and CPHA = 1 (mode 3 in the figure above). According to the specification of this mode, the  
polarity of the CLK line when no communication is taking place is high.  
A "write" communication example is shown in the figure below, for an unspecified number of  
bits (see the relevant technical documentation for frame structure description):  
Figure 6.  
SPI "write" sequence  
CS  
CLK  
MOSI  
MSB  
...  
...  
...  
...  
...  
...  
...  
...  
...  
...  
LSB  
The start condition is signaled by the CS line going low, and the stop condition by the CS  
line going high. It is not allowed to toggle the CS line while the communication is going on.  
A "read" communication example is shown in the figure below, for an unspecified number of  
bits (see the relevant technical documentation for frame structure description ):  
Figure 7.  
SPI "read" sequence  
CS  
CLK  
MOSI  
MISO  
MSB  
...  
...  
...  
...  
LSB  
MSB  
...  
...  
...  
...  
LSB  
The red line is controlled by the TDA7705, whereas the black lines are controlled by the µP.  
Doc ID 15938 Rev 8  
15/42  
Electrical specifications  
TDA7705  
3
Electrical specifications  
3.1  
Absolute maximum ratings  
Table 4.  
Symbol  
Absolute maximum ratings  
Parameter  
Supply voltage  
Test condition  
Min  
Typ  
Max  
Units  
VCC  
Tstg  
-
-
-
5.5  
V
Storage temperature  
-
-55  
-
150  
°C  
Human body model  
Charged device model  
Charged device model, corner pins  
Machine model  
2000  
450  
750  
150  
VESD  
ESD withstand voltage  
V
3.2  
Thermal data  
Table 5.  
Symbol  
Thermal data  
Parameter  
Test condition  
LQFP64 10x10, double-layer JEDEC PCB  
Value  
Units  
Thermal resistance  
junction-to-ambient  
RTh j-amb  
55  
°C/W  
3.3  
General key parameters  
Table 6.  
Symbol  
General key parameters  
Parameter  
Test condition  
Min  
Typ  
Max  
Units  
VCC  
ICC  
5 V supply voltage  
-
-
-
4.7  
-
5
5.25  
295  
85  
V
mA  
°C  
V
Supply current @ 5 V  
Ambient temperature range  
220  
Tamb  
-40  
2
-
-
VVCCREG12 VCCREG12 supply voltage  
see note(1)  
-
when supplied externally  
see note (2)  
Digital core 1.2V supply  
voltage  
V1V2  
1.08  
1.2  
-
1.32  
120  
135  
150  
V
V1V2 = 1.08 V  
see note (2)  
-
-
-
mA  
mA  
mA  
Digital core 1.2 V supply  
current  
V1V2 = 1.2 V  
see note (2)  
I1V2  
80  
-
V1V2 = 1.32 V  
see note (2)  
1. In the typical application supplied from 5V with a series resistor.  
2. When the 1.2 V supply is applied externally, and not using the internal 1.2 V regulator.  
16/42  
Doc ID 15938 Rev 8  
TDA7705  
Electrical specifications  
3.4  
Electrical characteristics  
V
= 4.7 V to 5.25 V; T  
= -40 °C to +85 °C; unless otherwise specified.  
CC  
amb  
3.4.1  
FM - section  
Table 7.  
Symbol  
FM - section  
Parameter  
Test condition  
Min  
Typ  
Max  
Units  
FM IMR mixer  
Rin  
Input resistance  
-
90  
-
130  
2.5  
170  
3.1  
kΩ  
Mix 1, Rsource = 1.5 kΩ,  
noiseless  
Vnoise  
Input noise voltage  
nV/Hz  
Mix 2, Rsource = 800 Ω,  
noiseless  
-
2
2.5  
-
Mix 1  
122  
118  
125  
121  
dBµV  
dBµV  
up to Vin/tone = 90 dBµV  
Mix 2  
IIP3  
3
rd order intercept point  
up to Vin/tone = 85 dBµV  
FM AGC  
Mix 1, min setting  
Mix 1, max setting  
Mix 2, min setting  
Mix 2, max setting  
-
-
87  
93  
85  
91  
2
-
RFAGC threshold, referred to  
mixer input;  
-
-
dBµV  
-
-
RF level  
RFAGC-Thr  
-
-
Threshold steps  
-
-
dB  
dB  
Threshold error  
@ Tamb = 27 °C  
-1.5  
1.5  
Threshold temperature drift  
-
0.016  
81  
-
dB/K  
Mix 1, min setting  
-
-
IFAGC threshold, referred to  
mixer input; at tuned  
frequency  
Mix 1, max setting  
-
85  
-
-
dBµV  
Mix 2, min setting  
-
77  
RF level  
IFAGC-Thr  
Mix 2, max setting  
-
-
81  
-
Threshold steps  
-
2
-
dB  
dB  
Threshold error  
@ Tamb = 27 °C  
-1.5  
1.5  
-
Threshold temperature drift  
Pin diode source current  
Pin diode sink current  
-
0.016  
dB/K  
mA  
µA  
-
-
@ Tamb = 27 °C; see note(1)  
12  
3
-
-
-
-
20  
Pin diode source current in  
constant current mode  
-
@ Tamb = 27 °C; see note(1)  
0.4  
-
-
mA  
1. The current is generated by a PTAT (Proportional To Absolute Temperature) source, and has therefore a temperature  
dependency described by: ΔI/Io = ΔT/To, with Io being the current at ambient temperature (25 °C) and To the ambient  
temperature (25°C) expressed in Kelvin, that is 298 K.  
Doc ID 15938 Rev 8  
17/42  
Electrical specifications  
TDA7705  
Units  
3.4.2  
AM - section  
Table 8.  
Symbol  
AM - section  
Parameter  
Test condition  
Min  
Typ  
Max  
AM IMR Mixer  
Rin  
Input resistance  
-
20  
-
30  
45  
-
kΩ  
Vout_max  
Max. output voltage  
Input noise voltage  
without clipping  
126  
dBµV  
Mix 1, Rsource = 1 kΩ,  
noiseless  
-
-
8.5  
8.5  
129  
12  
12  
-
VN,in  
nV/Hz  
Mix 2, Rsource = 1 kΩ,  
noiseless  
Mix 1,2  
IIP3  
IIP2  
3
rd order intercept point  
126  
dBµV  
dBµV  
dB  
up to Vin/tone = 90 dBµV  
Mix1 1,2  
2nd order intercept point  
-
158  
-
up to Vin/tone = 90 dBµV  
N=2,3,4,5,6  
N=7,9  
-
-
100  
85  
-
-
LO hsupp LO harmonic suppression  
AM LNA  
Max Gain, Rext = 1 kΩ  
21  
-
25  
12  
28  
-
Gain  
Voltage gain  
dB  
Min Gain (AGC controlled)  
Rin  
Cin  
Input resistance  
Input capacitance  
Input noise voltage  
-
-
1000  
20  
kΩ  
pF  
-
-
VN,in  
IIP3  
IIP2  
-
-
1.0  
1.4  
nV/Hz  
dBµV  
dBµV  
3
2
rd order intercept point  
nd order intercept point  
@ maximum LNA gain  
@ maximum LNA gain  
-
125  
143  
-
-
-
AM PIN diode  
Full attenuation,  
Csource = 80 pF, f=1 MHz  
IIP2  
2nd order intercept point  
-
140  
-
dBµV  
Rmin  
Cin  
Minimum resistance  
Input capacitance  
-
-
-
50  
12  
80  
-
Ω
High ohmic  
pF  
AM AGC  
Mix 1,2 min setting  
-
-
87  
93  
1
-
-
Referred to mixer input  
RF level  
AGC-Thr  
dBµV  
dB  
Mix 1,2 max setting  
Threshold steps  
-
-
-
Thr-steps Threshold error  
Threshold temperature drift  
@ Tamb = 27 °C  
-2.5  
-3  
2
-
2.5  
3
-
-
-
-
Pin diode source current  
Pin diode sink current  
@ Tamb = 27 °C; see note(1)  
-
10  
50  
mA  
µA  
-
15  
35  
Pin diode source current in  
constant current mode  
-
@ Tamb = 27 °C; see note(1)  
1.5  
2.5  
3.5  
mA  
1. The current is generated by a PTAT (Proportional To Absolute Temperature) source, and has therefore a temperature  
dependency described by: ΔI/Io = ΔT/To, with Io being the current at ambient temperature (25 °C) and To the ambient  
temperature (25 °C) expressed in Kelvin, that is 298 K.  
18/42  
Doc ID 15938 Rev 8  
TDA7705  
Electrical specifications  
3.4.3  
VCO  
Table 9.  
Symbol  
VCO  
Parameter  
Test condition  
Min  
Typ  
Max  
Units  
FVCO  
Frequency range VCO  
-
1100  
1550  
MHz  
Locked VCO;  
values referred @ 100MHz  
@ 100 Hz  
PN  
Phase noise of LO  
-
-
-100  
-115  
-115  
-
-
dBc/Hz  
Hz  
@ 1 kHz  
@ 10 kHz  
FM reception, deemphasis  
50µs, faudio = 20 Hz...20 kHz  
dev  
Deviation error (rms)  
5
3.4.4  
Phase locked loop  
Table 10. Phase locked loop  
Symbol  
Parameter  
Settling time FM  
Test condition  
Min  
Typ  
Max  
Units  
Tsettle  
Δf < 10 kHz  
-
-
-
300  
5
-
-
-
µs  
kHz  
Hz  
FM step  
AM step  
FM frequency step  
AM frequency step  
-
-
500  
3.4.5  
Tuning DAC  
Table 11. Tuning DAC  
Symbol  
Parameter  
Test condition  
Min  
Typ  
Max  
Units  
Res  
Voutmin  
Voutmax  
Rout  
Resolution  
8 bit  
-
-
-
18  
-
0.7  
-
mV  
V
Min output voltage  
Max ouput voltage  
Output impdedance  
Diff. Non linearity  
Conversion time  
0.6  
-
-
-
-
VCC-0.2 VCC-0.1  
V
1.5  
2.5  
-
3.5  
0.5  
-
kΩ  
LSB  
µs  
DNL  
-
-
Tconv  
20  
3.4.6  
IF ADC  
Table 12. IF ADC  
Symbol  
Parameter  
Test condition  
BW = 200 kHz  
Min  
Typ  
Max  
Units  
DRFM  
Dynamic range in FM  
-
90  
-
dB  
mixer 1  
mixer 2  
1.1  
0.7  
1.9  
1.2  
VN,in FM  
Input noise referred to mixer input  
-
nV/Hz  
DRAM  
Dynamic range in AM  
BW = 4 kHz  
-
-
-
103  
6.9  
-
dB  
VN,in AM  
Input noise referred to mixer input  
12  
nV/Hz  
Doc ID 15938 Rev 8  
19/42  
Electrical specifications  
TDA7705  
Units  
3.4.7  
Audio DAC  
Table 13. Audio DAC  
Symbol  
Parameter  
Test condition  
Full scale  
Min  
Typ  
Max  
Vout  
BW  
Max. output voltage  
Bandwidth  
-
1
-
-
Vrms  
KHz  
Ω
1dB attenuation  
-
15  
Rout  
Output resistance  
Output noise  
Distortion  
-
600  
750  
60  
900  
95  
VN, out  
THD  
-
-
-
µVrms  
%
-6 dBFS  
0.03  
0.04  
3.4.8  
IO interface pins  
Table 14. IO interface pins  
Symbol  
Parameter  
Test condition  
out = 500 µA  
Min  
Typ  
Max  
Units  
High level output voltage (all  
IOs except GPO pin 2)  
-
I
2.9  
3.2  
-
V
GPIOs source current (all IOs Total sourced current by all  
in source mode except pin 2) GPIOs  
-
-
-
-
-
1.25  
0.3  
mA  
V
Low level output voltage (all  
Iout = -1 mA  
0.1  
IOs except GPO pin 2)  
-
-
-
Input voltage range  
-
-
-
0
2.0  
-
-
-
-
3.5  
-
V
V
V
High level input voltage  
Low level input voltage  
0.8  
Minimum time during which  
pin RSTN must be low so as  
to reset the device  
T
Reset time  
10  
-
-
µs  
reset  
Minimum time during which  
the voltage applied at pins 25  
and 39 must be kept in order  
to latch the correct boot mode  
(serial bus configuration)  
Boot mode configuration latch  
time  
Tlatch  
10  
-
-
µs  
GPO PLLTEST (pin 2) max  
source current  
-
-
-
-
-
-
-
1
mA  
mA  
GPO PLLTEST (pin 2) max  
sink current  
-1  
GPO PLLTEST (pin 2)  
minimum high level output  
voltage  
-
Iout = 1 mA  
2.8  
-
3.1  
0.1  
-
V
V
GPO PLLTEST (pin 2)  
maximum high level output  
voltage  
I
out = 1 mA  
0.3  
20/42  
Doc ID 15938 Rev 8  
TDA7705  
Electrical specifications  
2
3.4.9  
I C interface  
2
The following parameters apply to the serial bus communication when I C protocol has  
been selected at start-up. For the other electrical characteristics of the pins, Section 3.4.8  
applies. The parameters of the following table are defined as in Figure 8.  
2
Table 15. I C interface  
Symbol  
Parameter  
SCL Clock frequency  
Min  
Max  
Units  
fSCL  
tAA  
-
500  
-
kHz  
µs  
SCL low to SDA data valid  
0.3  
time the bus must be kept free before a new  
transmisison  
tbuf  
1.3  
-
µs  
tHD-STA  
tLOW  
START condition hold time  
Clock low period  
0.6  
1.3  
0.6  
0.1  
0
-
-
µs  
µs  
µs  
µs  
µs  
µs  
µs  
µs  
µs  
µs  
tHIGH  
tSU-SDA  
tHD-DAT  
tSU-DAT  
tR  
Clock high period  
-
START condition setup time  
Data input hold time  
Data input setup time  
SDA & SCL rise time  
SDA & SCL fall time  
Stop condition setup time  
Data out time  
-
0.9  
-
0.1  
-
0.3  
0.3  
-
tF  
-
tSU-STOP  
tDH  
0.6  
-
0.3  
2
Figure 8.  
I C bus timing diagram  
t
t
t
t
F
HIGH  
R
LOW  
SCL  
t
t
SU-STA  
HD-DAT  
t
SU-STOP  
t
SU-DAT  
t
HD-SDA  
SDA IN  
t
t
t
buf  
AA  
DH  
SDA OUT  
D95AU378A  
Doc ID 15938 Rev 8  
21/42  
Electrical specifications  
TDA7705  
3.4.10  
SPI interface  
The following parameters apply to the serial bus communication when SPI protocol has  
been selected at start-up. For the other electrical characteristics of the pins, Section 3.4.8  
applies.  
Table 16. SPI interface  
Symbol  
Parameter  
Min  
Max  
Unit  
fSCK  
tSU  
tH  
Clock frequency  
Data setup time  
Data hold time  
SCK high time  
SCK low time  
Input rise time  
Input fall time  
-
4.0  
-
MHz  
ns  
ns  
ns  
ns  
µs  
µs  
ns  
ns  
ns  
ns  
ns  
ns  
25  
25  
50  
50  
-
-
tWH  
tWL  
tRI  
-
-
2
2
50  
-
tFI  
-
tV  
Output valid from clock low  
Output hold time  
Output disable time  
CS high time  
-
tHO  
tDIS  
tCS  
tCSS  
tCSH  
25  
25  
-
25  
25  
25  
CS setup time  
-
CS hold time  
-
Figure 9.  
SPI bus timing diagram  
t
CS  
V
IH  
SPI_SS  
V
IL  
t
t
CSH  
CSS  
V
V
IH  
t
t
WL  
SPI_CLK  
WH  
t
IL  
t
H
SU  
V
IH  
VALID IN  
SPI_MOSI  
V
IL  
t
RI  
FI  
t
t
V
t
t
HO  
DIS  
V
OH  
HI-Z  
HI-Z  
SPI_MISO  
V
OL  
3.4.11  
Warning  
When the TDA7705 is not powered on, the internal ESD protection diodes pull-down keep  
2
2
the I C/SPI lines connected to ground. This implies that the I C/SPI bus connected to the  
TDA7705 may not be used to drive other devices when the TDA7705 is powered off.  
22/42  
Doc ID 15938 Rev 8  
TDA7705  
Electrical specifications  
3.5  
Overall system performance  
All measurements obtained with application of Figure 16 (FM tuned application / SPI  
control) unless otherwise specified.  
3.5.1  
FM overall system performance  
Antenna level equivalence: 0 dBµV = 1 µV  
(Antenna terminal voltage with 50 Ω source).  
rms  
Figure 10. FM input set-up  
A
50Ω  
50Ω  
PCB  
UNDER  
TEST  
50Ω  
Vrf  
Vrf  
Vrf  
+ 6dB  
+ 6dB  
Input level referred to signal generator loaded with 50 Ω (V , node 'A'); no antenna dummy;  
rf  
AM input not connected. F = 98.1 MHz, V = 60 dBµV, mono modulation, f = 40 kHz,  
rf  
rf  
dev  
f
= 1 kHz. De-emphasis = 50 µs. Unless otherwise specified  
audio  
Table 17. FM overall system performance  
Parameter  
Test condition  
Min  
Typ  
Max  
Units  
(can be modified by the user)  
Tuning range FM Eu  
Tuning step FM Eu  
Tuning range FM US  
Tuning step FM US  
Tuning range FM Jp  
Tuning step FM Jp  
Tuning range FM EEu  
87.5  
-
100  
-
108  
MHz  
kHz  
(automatic FE alignment  
available)  
(can be modified by the user)  
-
87.5  
-
-
107.9  
-
(can be modified by the user)  
MHz  
kHz  
(automatic FE alignment  
available)  
(can be modified by the user)  
(can be modified by the user)  
200  
-
76  
-
90  
-
MHz  
kHz  
(automatic FE alignment  
available)  
(can be modified by the user)  
(can be modified by the user)  
100  
-
65  
74  
MHz  
(automatic FE alignment not  
available)  
Tuning step FM EEu  
Sensitivity  
(can be modified by the user)  
S/N =26dB  
-
-
100  
-7  
-
kHz  
-4  
dBµV  
@ 10 dBµV, no highcut, DISS  
BW = #3  
S/N  
-
55  
75  
81  
73  
-
-
-
-
dB  
dB  
dB  
dB  
@ 60 dBµV, mono  
72  
78  
70  
@ 60 dBµV,  
Deviation = 75 kHz, mono  
Ultimate S/N  
@ 60 dBµV, stereo  
Doc ID 15938 Rev 8  
23/42  
Electrical specifications  
Table 17. FM overall system performance (continued)  
TDA7705  
Units  
Parameter  
Test condition  
Deviation= 75 kHz  
Min  
Typ  
Max  
Distortion  
-
-
0.05  
140  
-
-
%
Max deviation  
THD=3%  
kHz  
ΔF=100kHz, SINAD=30dB  
desired 40 dBµV, dev=40kHz,  
400Hz  
undesired. dev=40kHz, 1KHz  
Adjacent channel selectivity  
Alternate channel selectivity  
-
-
-
-
25  
63  
94  
88  
-
-
-
-
dB  
dB  
ΔF=200 kHz, SINAD=30 dB  
desired 40 dB µV,  
dev=40kHz, 400 Hz  
undesired. dev=40kHz, 1kHz  
Desired = 10 dBµV  
SINAD = 30 dB  
Max. strong signal interferer  
Max. strong signal interferer  
dBµV  
dBµV  
Undesired ΔF = 5 MHz  
dev = 40 kHz, 1 kHz  
Desired = 10 dBµV  
SINAD = 30 dB  
no preselection (“wide-band”)  
application  
Undesired ΔF = 5 MHz  
dev = 40 kHz, 1 kHz  
Desired = 40 dBµV,  
dev = 40 kHz, 400 Hz,  
SINAD = 30 dB  
Undesired1 = 400 kHz,  
dev = 40 kHz, 1 kHz  
-
-
-
103  
106  
103  
-
-
-
dBµV  
dBµV  
dBµV  
Undesired2 = 800 kHz, no  
mod  
3 signal performance(1)  
Desired = 40 dBµV,  
dev = 40 kHz, 400 Hz,  
SINAD = 30 dB  
Undesired1 = 1 MHz,  
dev=40kHz, 1 kHz  
Undesired2= 2MHz, no mod  
Desired = 40 dBµV,  
dev = 40 kHz, 400 Hz,  
SINAD = 30 dB  
Undesired1 = 400 kHz,  
dev = 40 kHz, 1 kHz  
3 signal performance(1)  
Undesired2 = 800 kHz, no  
mod  
no preselection (“wide-band”)  
application  
Desired = 40 dBµV,  
dev=40kHz, 400 Hz,  
SINAD=30 dB  
-
-
104  
70  
-
-
dBµV  
dB  
Undesired1 = 1 MHz,  
dev=40kHz, 1 kHz  
Undesired2= 2MHz, no mod  
AM suppression  
m =30 %  
24/42  
Doc ID 15938 Rev 8  
TDA7705  
Electrical specifications  
Table 17. FM overall system performance (continued)  
Parameter  
Image rejection  
Test condition  
Min  
Typ  
Max  
Units  
-
-
80  
-
dB  
-0.33  
-0.27  
@40 dBµV  
Logarithmic field strength  
indicator  
(equiv.  
to 37  
(equiv.  
to 43  
-0.3  
--  
read “FM_Smeter_log”  
dBµV)  
dBµV)  
1. Signal levels referred to combiner output.  
3.5.2  
AM MW overall system performance  
Antenna level equivalence: 0 dBµV = 1 µV  
.
rms  
Figure 11. AM MW input set up  
15pF  
A
50Ω  
30Ω  
PCB  
UNDER  
TEST  
50Ω  
68pF  
Vrf  
Vrf  
+ 6dB  
Level referred to SG output before antenna dummy (V , node 'A'); capacitive dummy  
rf  
15pF+68pF, FM input not connected. F = 999 kHz (1000 kHz for US), V =74 dBµV,  
rf  
rf  
mod = 30%, f  
=400 Hz, unless otherwise specified.  
audio  
Table 18. AM MW overall system performance  
Parameter  
Test condition  
Min  
Typ  
Max  
Units  
Tuning range MW Eu/Jp  
Tuning step MW Eu/Jp  
Tuning range MW US  
Tuning step MW US  
Sensitivity  
(can be modified by the user)  
(can be modified by the user)  
(can be modified by the user)  
(can be modified by the user)  
S/N = 20 dB  
531  
-
1629  
kHz  
kHz  
kHz  
kHz  
dBµV  
dB  
-
530  
-
9
-
-
1710  
10  
27  
66  
-
30  
-
-
Ultimate S/N  
@ 80 dBµV  
63  
Ref.=74 dBµV  
AGC F.O.M.  
50  
-
62  
0.1  
42  
65  
-
dB  
%
-10dB drop point  
Distortion  
m = 80 %  
ΔF=9 kHz, SINAD = 26 dB  
undesired. m=30%, 1 kHz  
Adjacent channel selectivity  
-
-
dB  
ΔF=18 kHz, SINAD=26 dB  
undesired. m=30%, 1kHz  
Alternate channel selectivity  
-
50  
-
dB  
Doc ID 15938 Rev 8  
25/42  
Electrical specifications  
Table 18. AM MW overall system performance (continued)  
TDA7705  
Parameter  
Test condition  
Min  
Typ  
Max  
Units  
ΔF= 40 kHz  
desired = 40 dBµV  
-
15  
-
dB  
undesired = 100 dBµV,  
m= 30%, 1 kHz  
Strong signal interferer  
SNR  
ΔF= 400kHz  
desired=40 dBµV  
17  
-
-
4
4
-
-
-
dB  
dB  
dB  
dB  
undesired=100 dBµV,  
m=30%, 1kHz  
ΔF= 40 kHz  
desired=40 dBµV  
undesired=110 dBµV,  
m=30%, 1 kHz  
Strong signal interferer  
suppression  
ΔF= 400kHz  
desired=40 dBµV  
-
-
undesired=110 dBµV,  
m=30%, 1kHz  
ΔF= 40kHz  
desired=80 dBµV  
-
10  
10  
undesired=100 dBµV,  
m=30%, 1kHz  
Strong signal interferer  
cross-modulation  
ΔF= 400kHz  
desired=80 dBµV  
-
-
dB  
dB  
-
undesired=100 dBµV,  
m=30%, 1kHz  
Image rejection  
-
-
80  
-
0.50  
0.43  
@60 dBµV  
Logarithmic field strength  
indicator  
(equiv.  
to 57  
(equiv.  
to 63  
0.47  
read “AM_Smeter_log”  
dBµV)  
dBµV)  
26/42  
Doc ID 15938 Rev 8  
TDA7705  
Electrical specifications  
3.5.3  
AM LW overall system performance  
Antenna level equivalence: 0 dBµV = 1 µV  
rms  
Figure 12. AM LW input set-up  
15pF  
A
50Ω  
30Ω  
PCB  
UNDER  
TEST  
50Ω  
68pF  
Vrf  
Vrf  
+ 6dB  
Level referred to SG output before antenna dummy (V , node 'A'); capacitive dummy  
rf  
15pF+68pF; FM input not connected. F = 216 kHz, V =74 dBµV, mod = 30 %,  
rf  
rf  
f
= 400 Hz, unless otherwise specified.  
audio  
Table 19. AM LW overall system performance  
Parameter Test condition  
Tuning range LW  
Min  
Typ  
Max  
Units  
(can be modified by the user)  
(can be modified by the user)  
S/N =20 dB  
144  
-
288  
kHz  
kHz  
dBµV  
dB  
Tuning step LW  
Sensitivity  
-
-
1
-
33  
-
30  
66  
Ultimate S/N  
@ 80 dBµV  
63  
Ref.=74 dBµV  
AGC F.O.M.  
50  
62  
65  
dB  
-10dB drop point  
Distortion  
m = 80 %  
-
-
-
0.1  
80  
-
-
%
Image rejection  
dB  
Doc ID 15938 Rev 8  
27/42  
Electrical specifications  
TDA7705  
3.5.4  
AM SW overall system performance  
Antenna level equivalence: 0dBµV = 1µV  
rms  
Figure 13. AM SW input set-up  
15pF  
A
50Ω  
30Ω  
PCB  
UNDER  
TEST  
50Ω  
68pF  
Vrf  
Vrf  
+ 6dB  
Level referred to SG output before antenna dummy (V , node 'A'); capacitive dummy  
rf  
15pF+68pF; FM input not connected. F = 6000 kHz, V =74 dBµV, mod = 30 %,  
rf  
rf  
f
= 400 Hz, unless otherwise specified.  
audio  
Table 20. AM SW overall system performance  
Parameter Test condition  
Tuning range LW  
Min  
Typ  
Max  
Units  
(can be modified by the user)  
(can be modified by the user)  
S/N =20dB  
2300  
-
30000  
kHz  
kHz  
dBµV  
dB  
Tuning step LW  
Sensitivity  
-
-
1
-
32  
-
29  
66  
62  
0.3  
80  
Ultimate S/N  
AGC F.O.M.  
Distortion  
@ 80 dBµV  
63  
50  
-
Ref.=74 dBµV -10dB drop point  
m = 80 %  
65  
-
dB  
%
Image rejection  
-
-
-
dB  
28/42  
Doc ID 15938 Rev 8  
TDA7705  
Electrical specifications  
3.5.5  
WX overall system performance  
Antenna level equivalence: 0 dBµV = 1 µV  
(Antenna terminal voltage with 50Ω source).  
rms  
Figure 14. WX input set-up  
A
50Ω  
50Ω  
PCB  
UNDER  
TEST  
50Ω  
Vrf  
Vrf  
Vrf  
+ 6dB  
+ 6dB  
Input level referred to signal generator loaded with 50 Ω (V , node 'A'); no antenna dummy;  
rf  
AM input not connected. F =162.475 MHz, V = 60 dBµV, mono modulation, f = 3 kHz,  
rf  
rf  
dev  
f
=400 Hz. De-emphasis = 75 µs. Application: WX using mixer input 2, in conjunction  
audio  
with FM narrow-band. Unless otherwise specified.  
Table 21. WX overall system performance  
Parameter  
Sensitivity  
Test condition  
S/N = 26 dB  
Min  
Typ  
Max  
Units  
-
-
-
-
-7  
81  
-
-
-
-
dBµV  
dB  
Ultimate S/N  
Distortion  
@ 60 dBµV  
Deviation= 4.5 kHz  
THD = 3 %  
0.8  
%
Max deviation  
> 5 kHz  
kHz  
ΔF= 25 kHz, SINAD = 30 dB  
desired 40 dBµV,  
dev =2.0 kHz, 400 Hz  
undesired. dev= 3 kHz, 1 kHz  
Adjacent channel Selectivity  
Alternate Channel Selectivity  
-
-
70  
70  
-
-
dB  
dB  
ΔF=50kHz, SINAD=30dB  
desired 40 dBµV,  
dev=2.0kHz, 400Hz  
undesired. dev=2.0kHz, 1kHz  
Doc ID 15938 Rev 8  
29/42  
Front-end processing  
TDA7705  
4
Front-end processing  
All the parameters in this section refer to the programmability of the FE part of the device  
(registers). The part of the registers that are not described here have either fixed values or  
values written by the tuner drivers, and are described in the proper technical documentation.  
Table 22. Register 0x00  
Register number  
Register definition  
MSB  
LSB  
23 22 21 20 19 18 17 16 15 14 13 12 11 10  
9
8
7
6
5
4
3
2
1
0
AM mixer input selector  
0
1
1 input #1  
0 input #2  
AM PIN diode  
0
1
internal  
external  
AM AGC mode  
LNA and PIN diode  
PIN diode only  
AM AGC time constant  
slow (125 ms with 1 µF)  
medium (25 ms with 1 µF)  
fast (5 ms with 1 µF)  
AM AGC threshold @ mixin  
90 dBµV  
0
1
0
0
1
0
1
1
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
91 dBµV  
92 dBµV  
93 dBµV  
90 dBµV  
89 dBµV  
88 dBµV  
87 dBµV  
AM AGC attack time constant  
normal  
0
1
fast  
30/42  
Doc ID 15938 Rev 8  
TDA7705  
Front-end processing  
Register definition  
Table 23. Register 0x01  
Register number  
MSB  
LSB  
23 22 21 20 19 18 17 16 15 14 13 12 11 10  
9
8
7
6
5
4
3
2
1
0
FM mixer input selector  
input #1  
0
1
1
0
1
0
0
1
input #2  
FM mixer gain  
high  
0
1
low  
FM AGC time constant  
normal  
0
1
fast  
FM AGC output mode  
normal  
0
0
1
0
1
0
constant 15 mA  
constant 1 mA  
Table 24. Register 0x02  
Register number  
Register definition  
MSB  
LSB  
23 22 21 20 19 18 17 16 15 14 13 12 11 10  
9
8
7
6
5
4
3
2
1
0
FM RF AGC threshold @  
mixin  
0
0
1
1
0 87 dBµV  
1 89 dBµV  
0 91 dBµV  
1 93 dBµV  
FM iF AGC threshold @  
IFADC in  
0
0
1
0
1
0
120 dBµV  
122 dBµV  
124 dBµV  
Tuning DAC enable  
0
1
off  
on  
(1)  
Tuning DAC programming  
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
0
1
… … … … … … … …  
510  
511  
1
1
1
1
1
1
1
1
1
1
1
1
1
0
1
1
1. Normally handled by tuner drivers.  
Doc ID 15938 Rev 8  
31/42  
Front-end processing  
TDA7705  
Table 25. Register 0x05  
Register number  
Register definition  
MSB  
LSB  
23 22 21 20 19 18 17 16 15 14 13 12 11 10  
9
8
7
6
5
4
3
2
1
0
PLLTEST output status  
0 low  
1 high  
32/42  
Doc ID 15938 Rev 8  
TDA7705  
Weak signal processing  
5
Weak signal processing  
All the parameters in this section refer to the programmability of the DSP part of the device.  
The typical values are those set by default parameters (start-up without parametric change  
from main µP); the max and the min values refer to the programmability range. The values  
are referred to the typical application (Figure 16: Example of FM tuned (narrow-band)  
application / SPI control). Wherever the possible values are a discrete set, all the possible  
programmable values are displayed.  
5.1  
FM IF-processing  
5.1.1  
Dynamic channel selection filter (DISS)  
Table 26. Dynamic channel selection filter (DISS)  
(discrete set)  
Symbol  
Parameter  
IF filter #6  
Test condition  
Min  
Typ  
Max  
Units  
-
-
-
-
-
-
-
150  
110  
80  
-
-
-
-
-
-
-
kHz  
kHz  
kHz  
kHz  
kHz  
kHz  
kHz  
IF filter #5  
IF filter #4  
DISS BW IF filter #3  
IF filter #2  
response: - 3dB  
60  
45  
IF filter #1  
35  
IF filter #0  
25  
5.1.2  
Soft mute  
Table 27. Soft mute  
(continuous set)  
Symbol  
Parameter  
Test condition  
audio atten = 1 dB  
Min  
Typ  
Max  
Units  
SMsp  
Start point vs. field strength  
End point vs. field strength  
read “FM_softmute”  
0
6
20  
dBµV  
no adjacent channel present  
audio atten = SMd + 1 dB  
read “FM_softmute”  
SMep  
SMd  
-6  
-6  
10  
dBµV  
no adjacent channel present  
Depth  
-
-30  
0.1  
-15  
0
dB  
Hz  
Field strength LPF cut-off  
SMtauatt frequency for soft mute  
activation  
-
100  
4000  
Field strength LPF cut-off  
SMtaurel frequency for soft mute  
release  
-
0.1  
1
4000  
Hz  
Doc ID 15938 Rev 8  
33/42  
Weak signal processing  
TDA7705  
5.1.3  
Adjacent channel mute  
Table 28. Adjacent channel mute  
(continuous set)  
Symbol  
Parameter  
Test condition  
Min  
Typ  
Max  
Units  
ACMd  
Depth  
SMd  
0
0
dB  
5.1.4  
Stereo blend-  
Table 29. Stereo blend  
(continuous set)  
Symbol  
Parameter  
Test condition  
Min  
Typ  
Max  
Units  
field strength = 80 dBµV, pilot  
deviation = 6.75 kHz  
MaxSep  
Maximum stereo separation  
Start point vs. field strength  
0
40  
50  
dB  
separation = MaxSep - 1 dB  
no multipath present  
SBFSsp  
SBFSep  
20  
20  
50  
30  
60  
60  
dBµV  
dBµV  
separation = 1 dB  
End point vs. field strength  
Field strength-related  
no multipath present  
Vrf step-like variation from  
20 dBµV to 80 dBµV  
SBFStM2S transition time from mono to  
stereo  
0.001  
0.001  
3
20  
20  
s
s
Field strength-related  
SBFStS2M transition time from stereo to  
mono  
Vrf step-like variation from  
80 dBµV to 20 dBµV  
0.5  
separation = MaxSep - 1 dB  
equivalent 19 kHz AM  
modulation depth;  
SBMPsp Start point vs. multipath  
SBMPep End point vs. multipath  
5
5
10  
30  
80  
80  
%
%
field strength = 80 dBµV  
separation = 1 dB  
equivalent 19 kHz AM  
modulation depth;  
field strength = 80 dBµV  
Multipath -related transition  
SBMPtM2S  
Vrf step-like variation from  
20 dBµV to 80 dBµV  
0.001  
0.001  
1
20  
20  
s
s
time from mono to stereo  
Multipath -related transition  
SBMPtS2M  
Vrf step-like variation from  
80 dBµV to 20 dBµV  
0.001  
time from stereo to mono  
Threshold on pilot tone  
Pil ThrM2S Pilot detector stereo threshold deviation for mono-stereo  
transition  
0.8  
-
2.74  
0.01  
7
-
kHz  
kHz  
Difference in pil. det.  
Pilot detector threshold  
hysteresis  
deviation threshold for stereo  
to mono transition compared  
to PilThrM2S  
Pil ThrHyst  
34/42  
Doc ID 15938 Rev 8  
TDA7705  
Weak signal processing  
5.1.5  
High cut control  
Table 30. High cut control  
(continuous set)  
Symbol  
Parameter  
Test condition  
Min  
Typ  
Max  
Units  
minimum RF level for widest  
HC filter (filter # 7)  
HCFSsp  
Start point vs. field strength  
0
50  
50  
dBµV  
no multipath present  
maximum RF level for  
narrowest HC filter (filter # 0)  
HCFSep  
End point vs. field strength  
Field strength-related  
0
30  
40  
dBµV  
no multipath present  
Vrf step-like variation from  
60 dBµV to 10 dBµV  
(1)  
HCFStW2N transition time from wide to  
narrow band  
-
Field strength-related  
HCFStN2W transition time from narrow to  
wide band  
Vrf step-like variation from  
0 dBµV to 60 dBµV  
(1)  
14  
10  
100  
s
minimum RF level for widest  
HC filter (filter # 7)  
HCMPsp Start point vs. multipath  
HCMPep End point vs. multipath  
equivalent 19 kHz AM  
modulation depth;  
5
150 (2)  
%
%
field strength = 80 dBµV  
maximum RF level for  
narrowest HC filter (filter # 0)  
equivalent 19 kHz AM  
modulation depth;  
5
30  
150 (2)  
field strength = 80 dBµV  
Multipath -related transition  
HCMPtN2W time from narrow to wide  
band  
Vrf step-like variation from  
20 dBµV to 80 dBµV  
0.001  
0.001  
0.001  
0.001  
14  
20  
20  
18  
s
s
Multipath -related transition  
HCMPtW2N  
Vrf step-like variation from  
80 dBµV to 20 dBµV  
time from wide to narrow  
Filter #7, -3 dB response  
frequency, input signal with  
pre-emphasis  
Maximum cut-off frequency of  
HCmaxBW  
HCmin  
BW  
kHz  
high cut filter bank  
Filter #0, -3 dB response  
frequency, input signal with  
pre-emphasis  
Minimum cut-off frequency of  
HCminBW  
HCma  
xBW  
0.1  
-
3
kHz  
-
high cut filter bank  
HCnumFilt Number of discrete HC filters  
-
8 (3)  
-
1. Depends only on field strength filter time constant.  
2. Means that 100% equivalent 19 kHz AM modulation depth will not achieve full band narrowing.  
3. Intermediate filters (#6 - #1) cut-off frequencies exponentially spaced between HCmaxBW and HCminBW.  
Doc ID 15938 Rev 8  
35/42  
Weak signal processing  
TDA7705  
Table 31. De-emphasis filter  
(continuous set)  
Symbol  
Parameter  
Test condition  
Min  
Typ  
Max  
Units  
De-emphasis time constant 1  
De-emphasis time constant 2  
-
-
-
-
50  
75  
-
-
DEtc  
µs  
5.1.6  
Stereo decoder  
Table 32. Stereo decoder  
Symbol  
Parameter  
Test condition  
Min  
Typ  
Max  
Units  
PilSup  
Pilot signal suppression  
Pilot 9%, 19 kHz, ref=40 kHz  
f = 38 kHz  
-
-
-
-
60  
70  
70  
80  
-
-
-
-
dB  
dB  
dB  
dB  
SubcSup Subcarrier suppression  
f = 57 kHz  
f = 76 kHz  
5.2  
AM IF-processing  
5.2.1  
Channel selection filter  
Table 33. Channel selection filter  
Symbol Parameter  
CSF BW Channel selection filter BW  
Test condition  
Min  
Typ  
Max  
Units  
response: - 3dB  
-
3.7  
-
kHz  
5.2.2  
Soft mute  
Table 34. Soft mute  
(continuous set)  
Symbol  
Parameter  
Test condition  
Min  
Typ  
Max  
Units  
audio atten = 1 dB  
SMsp  
Start point vs. field strength  
End point vs. field strength  
read “FM_softmute”  
0
25  
40  
dBµV  
no adjacent channel present  
audio atten = SMd + 1 dB  
read “FM_softmute”  
SMep  
SMd  
0
0
30  
dBµV  
no adjacent channel present  
Depth  
-
-40  
-24  
0.1  
0
dB  
s
Transition time for field  
SMtauatt strength-dependent soft mute  
activation  
-
0.001  
10  
Transition time for field  
SMtaurel strength-dependent soft mute  
release  
-
0.001  
3
10  
s
36/42  
Doc ID 15938 Rev 8  
TDA7705  
Weak signal processing  
5.2.3  
High cut control  
Table 35. High cut control  
(continuous set)  
Symbol  
Parameter  
Test condition  
Min  
Typ  
Max  
Units  
minimum RF level for widest  
HC filter (filter # 7)  
HCFSsp  
Start point vs. field strength  
0
40  
50  
dBµV  
no multipath present  
maximum RF level for  
narrowest HC filter (filter # 0)  
HCFSep  
End point vs. field strength  
Field strength-related  
0
30  
0.2  
10  
14  
50  
20  
20  
18  
dBµV  
s
no multipath present  
Vrf step-like variation from  
60 dBµV to 10 dBµV  
HCFStW2N transition time from wide to  
narrow band  
0.001  
0.001  
Field strength-related  
HCFStN2W transition time from narrow to  
wide band  
Vrf step-like variation from  
0 dBµV to 60 dBµV  
s
Filter #7, -3 dB response  
frequency, input signal with  
pre-emphasis  
Maximum cut-off frequency of  
HCmaxBW  
HCmin  
BW  
kHz  
high cut filter bank  
Filter #0, -3 dB response  
frequency, input signal with  
pre-emphasis  
Minimum cut-off frequency of  
HCminBW  
HCma  
xBW  
1
-
3
8
kHz  
-
high cut filter bank  
HCnumFilt Number of discrete HC filters  
-
Doc ID 15938 Rev 8  
37/42  
Application schematics  
TDA7705  
6
Application schematics  
6.1  
Basic application schematic  
2
Figure 15. FM wide-band application / I C control  
1 u F  
1 0 n F  
2 7 1 / 2 W  
V C C - D A C  
4 9  
V D D - 3 V 3  
3 2  
O S C o u t  
R E G - 1 V 2  
3 1  
5 0  
4 7 0 n F  
O S C i n  
5 1  
V C C R E G 1 2  
3 0  
G N D - D A C  
V C C - D I G  
1 0 0 n F  
2 9  
5 2  
D A C o u t L  
G N D - D I G  
2 8  
D A C O U T _ L  
5 3  
1 u F  
1 u F  
D A C o u t R  
V R E F d e c  
D A C O U T _ R  
5 4  
2 7  
G N D - I F A D C  
V R E F 1 6 5  
2 6  
5 5  
L I F r e f L  
5 6  
G N D - I F  
2 5  
6 8 p F  
L I F r e f H  
A M M I X d e c  
2 4  
1 0 0 n F  
5 7  
V C C - I F A D C  
A M M I X i n 1  
1 K  
2 3  
5 8  
V C C - P L L  
5 9  
A M M I X i n 2  
2 2  
6 8 u H  
G N D - P L L  
L N A d e c 2  
1 0 0 n F  
2 1  
6 0  
V C O d e c  
6 1  
L N A o u t 2  
2 0  
L F r e f  
L N A i n 2  
1 9  
6 2  
V C C - V C O  
6 3  
L N A o u t  
1 8  
G N D - V C O  
L N A d e c  
1 7  
6 4  
T O K O  
2 - 1 F 0 R 2 2 Q 2 L L  
1. Note: components marked with a * are being considered for replacement with resistors, pending  
optimization test results.  
38/42  
Doc ID 15938 Rev 8  
TDA7705  
Application schematics  
6.2  
Application schematic example with SPI-bus and tuned  
preselection  
Figure 16. Example of FM tuned (narrow-band) application / SPI control  
1 u F  
1 0 n F  
2 7 1 / 2 W  
V C C - D A C  
O S C o u t  
V D D - 3 V 3  
3 2  
R E G - 1 V 2  
3 1  
V C C R E G 1 2  
3 0  
V C C - D I G  
2 9  
4 9  
5 0  
5 1  
5 2  
5 3  
5 4  
5 5  
5 6  
5 7  
5 8  
5 9  
6 0  
6 1  
6 2  
6 3  
6 4  
4 7 0 n F  
O S C i n  
G N D - D A C  
1 0 0 n F  
D A C o u t L  
D A C o u t R  
G N D - D I G  
2 8  
V R E F d e c  
2 7  
V R E F 1 6 5  
2 6  
G N D - I F  
2 5  
D A C O U T _ L  
D A C O U T _ R  
1 u F  
1 u F  
G N D - I F A D C  
L I F r e f L  
L I F r e f H  
V C C - I F A D C  
V C C - P L L  
A M M I X d e c  
2 4  
1 0 0 n F  
6 8 p F  
A M M I X i n 1  
1
1 K  
2 3  
A M M I X i n 2  
2 2  
L N A d e c 2  
2 1  
L N A o u t 2  
2 0  
L N A i n 2  
1 9  
L N A o u t  
1 8  
L N A d e c  
1 7  
6 8 u H  
G N D - P L L  
V C O d e c  
1 0 0 n F  
L F r e f  
V C C - V C O  
G N D - V C O  
1 0 n F  
C 2 8  
6 8 6 K R  
2
K V 1 7 7 0  
D 3  
1
- 1 0 0 0 1 0 1 E 5 5 8 C N  
T O K L O 6  
1 2 p F  
C 2 3  
1 5 p F C 3 1  
1 K 5  
2
1
E 1  
K P 2 3 1  
K P 2 3 1 1 E  
1
2
2 2 0  
1. Note: components marked with a * are being considered for replacement with resistors, pending  
optimization test results.  
Doc ID 15938 Rev 8  
39/42  
Package information  
TDA7705  
7
Package information  
In order to meet environmental requirements, ST offers these devices in different grades of  
®
®
ECOPACK packages, depending on their level of environmental compliance. ECOPACK  
specifications, grade definitions and product status are available at: www.st.com.  
®
ECOPACK is an ST trademark.  
Figure 17. LQFP64 (10x10x1.4mm) mechanical data and package dimensions  
mm  
inch  
DIM.  
OUTLINE AND  
MECHANICAL DATA  
MIN. TYP. MAX. MIN.  
TYP. MAX.  
0.063  
A
A1  
A2  
B
1.60  
0.05  
1.35  
0.17  
0.09  
0.15 0.002  
0.006  
1.40  
0.22  
1.45 0.053 0.055 0.057  
0.27 0.0066 0.0086 0.0106  
C
0.20 0.0035  
0.0079  
D
11.80 12.00 12.20 0.464 0.472 0.480  
9.80 10.00 10.20 0.386 0.394 0.401  
D1  
D3  
e
7.50  
0.50  
0.295  
0.0197  
E
11.80 12.00 12.20 0.464 0.472 0.480  
9.80 10.00 10.20 0.386 0.394 0.401  
E1  
E3  
L
7.50  
0.60  
1.00  
0.295  
0.75 0.0177 0.0236 0.0295  
0.0393  
0.45  
L1  
K
LQFP64 (10 x 10 x 1.4mm)  
0˚ (min.), 3.5˚ (min.), 7˚(max.)  
0.080  
ccc  
0.0031  
D
D1  
D3  
A
A2  
A1  
48  
33  
32  
49  
0.08mm ccc  
Seating Plane  
17  
16  
64  
1
C
e
K
TQFP64  
0051434 F  
40/42  
Doc ID 15938 Rev 8  
TDA7705  
Revision history  
8
Revision history  
Table 36. Document revision history  
Date  
Revision  
Changes  
31-Jul-2007  
01-Aug-2008  
1
2
Initial release.  
Full update datasheet.  
Document status promoted from preliminary data to datasheet.  
Updated Table 1: Device summary on page 1.  
Updated Section 3: Electrical specifications on page 16.  
Updated Section 4: Front-end processing on page 30.  
Updated Section 5: Weak signal processing on page 33.  
Updated Section 6: Application schematics on page 38.  
08-May-2009  
3
Updated Table 5: Thermal data on page 16.  
09-Jun-2009  
01-Jul-2009  
4
5
Updated the value of “Adjacent channel selectivity” parameter in the  
Table 17: FM overall system performance.  
Updated Figure 17: LQFP64 (10x10x1.4mm) mechanical data and  
package dimensions on page 40.  
Modified Table 1: Device summary on page 1  
Modified Table 5: Thermal data on page 16.  
13-Jan-2010  
6
Modified Section 3.5.5: WX overall system performance on page 29.  
Modified Section 7: Package information on page 40.  
Minor text changes in Section 2.13.  
Modified min. value of “tHD-DAT” parameter in Table 15: I2C interface  
on page 21.  
29-Jan-2010  
22-Mar-2010  
7
8
Added Section 3.4.11: Warning on page 22.  
Doc ID 15938 Rev 8  
41/42  
TDA7705  
Please Read Carefully:  
Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the  
right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any  
time, without notice.  
All ST products are sold pursuant to ST’s terms and conditions of sale.  
Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no  
liability whatsoever relating to the choice, selection or use of the ST products and services described herein.  
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this  
document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products  
or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such  
third party products or services or any intellectual property contained therein.  
UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED  
WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED  
WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS  
OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.  
UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT  
RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING  
APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY,  
DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE  
GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK.  
Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void  
any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any  
liability of ST.  
ST and the ST logo are trademarks or registered trademarks of ST in various countries.  
Information in this document supersedes and replaces all information previously supplied.  
The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.  
© 2010 STMicroelectronics - All rights reserved  
STMicroelectronics group of companies  
Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan -  
Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America  
www.st.com  
42/42  
Doc ID 15938 Rev 8  

相关型号:

TDA7718B

3 band car audio processor
STMICROELECTR

TDA7718BTR

3 band car audio processor
STMICROELECTR

TDA7718N

3 band car audio processor
STMICROELECTR

TDA7719

3 band car audio processor
STMICROELECTR

TDA7719TR

3 band car audio processor
STMICROELECTR

TDA7730B

SINGLE CHIP RDS DEMODULATOR + FILTER
STMICROELECTR

TDA7801

Digital input quad power amplifier with built-in diagnostics features
STMICROELECTR

TDA7801H

Digital input quad power amplifier with built-in diagnostics features
STMICROELECTR

TDA7801PD

Digital input quad power amplifier with built-in diagnostics features
STMICROELECTR

TDA7801PDTR

Digital input (I2S), quad BTL output power amplifier with full I<sup>2</sup>C diagnostics
STMICROELECTR

TDA7801SM

Digital input quad power amplifier with built-in diagnostics features
STMICROELECTR

TDA7802

power amplifiers moving to the green zone
ETC