T850 [STMICROELECTRONICS]
D2PAK封装的8A Snubberless™三端双向可控硅;![T850](http://pdffile.icpdf.com/pdf1/p00167/img/icpdf/T835_933799_icpdf.jpg)
型号: | T850 |
厂家: | ![]() |
描述: | D2PAK封装的8A Snubberless™三端双向可控硅 可控硅 |
文件: | 总12页 (文件大小:149K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
![](http://public.icpdf.com/style/img/ads.jpg)
BTA08, BTB08
T810, T835
Snubberless™, logic level and standard 8 A Triacs
A2
Features
■ On-state rms current, I
8 A
T(RMS)
G
■ Repetitive peak off-state voltage, V
/V
DRM RRM
A1
600 to 800 V
A2
A2
■ Triggering gate current, I
5 to 50 mA
GT (Q1)
A1
A2
G
Description
A1
A2
G
D2PAK
(T8-G)
Available either in through-hole or surface-mount
packages, the BTA08, BTB08 and T8 triac series
is suitable for general purpose AC switching. They
can be used as an ON/OFF function in
IPAK
(T8-H)
A2
applications such as static relays, heating
regulation, induction motor starting circuits... or
for phase control operation in light dimmers,
motor speed controllers,...
A1
A2
G
DPAK
(T8-B)
The snubberless versions (BTA/BTB...W and T8
series) are specially recommended for use on
inductive loads, thanks to their high commutation
performances.
A2
Logic level versions are designed to interface
directly with low power drivers such as
microcontrollers.
A1
A2
A1
A2
G
G
TO-220AB Insulated
(BTA08)
TO-220AB
(BTB08)
By using an internal ceramic pad, the BTA series
provides voltage insulated tab (rated at 2500
V
) complying with UL standards (file ref.:
RMS
E81734).
March 2010
Doc ID 7472 Rev 7
1/12
www.st.com
12
Characteristics
BTA08, BTB08 and T8 Series
1
Characteristics
Table 1.
Symbol
Absolute maximum ratings
Parameter
Value
Unit
IPAK/D2PAK/DPAK/
TO-220AB
Tc = 110 °C
IT(RMS) On-state rms current (full sine wave)
8
A
TO-220AB Ins.
F = 50 Hz
Tc = 100 °C
t = 20 ms
80
84
36
Non repetitive surge peak on-state current
(full cycle, Tj initial = 25 °C)
ITSM
A
F = 60 Hz
t = 16.7 ms
²
²
²
I t
I t value for fusing
tp = 10 ms
A s
Critical rate of rise of on-state current IG = 2
dI/dt
x IGT
tr ≤ 100 ns
,
F = 120 Hz
tp = 20 µs
Tj = 125 °C
50
A/µs
IGM
Peak gate current
Tj = 125 °C
Tj = 125 °C
4
1
A
PG(AV) Average gate power dissipation
W
Tstg
Tj
Storage junction temperature range
Operating junction temperature range
- 40 to + 150
- 40 to + 125
°C
Table 2.
Symbol
Electrical characteristics (T = 25 °C, unless otherwise specified)
Snubberless and logic level (3 quadrants)
j
T8
BTA08 / BTB08
Test conditions
Quadrant
Unit
T810 T835 TW
SW
CW BW
(1)
IGT
I - II - III
I - II - III
MAX.
MAX.
10
35
5
10
35
50
mA
V
VD = 12 V RL = 30 Ω
VGT
VGD
1.3
0.2
VD = VDRM RL = 3.3 kΩ
Tj = 125 °C
I - II - III
MIN.
V
(2)
IH
IT = 100 mA
MAX.
15
25
30
35
50
60
10
10
15
15
25
30
35
50
60
50
70
80
mA
I - III
II
IL
IG = 1.2 IGT
MAX.
MIN.
mA
VD = 67 %VDRM gate open
Tj = 125 °C
dV/dt (2)
40
400
20
40
400 1000
V/µs
(dV/dt)c = 0.1 V/µs Tj = 125 °C
(dV/dt)c = 10 V/µs Tj = 125 °C
5.4
2.8
-
-
-
3.5
5.4
-
-
-
-
(dI/dt)c
MIN.
1.5 2.98
A/ms
(2)
Without snubber
Tj = 125 °C
4.5
-
-
4.5
7
2/12
Doc ID 7472 Rev 7
BTA08, BTB08 and T8 Series
Characteristics
Table 3.
Symbol
Standard (4 quadrants)
Test conditions
BTA08 / BTB08
Quadrant
Unit
C
B
I - II - III
IV
25
50
50
100
(1)
IGT
MAX.
mA
VD = 12 V, RL = 33 Ω
VGT
VGD
ALL
ALL
MAX.
MIN.
1.3
0.2
V
V
VD = VDRM, RL = 3.3 kΩ, Tj = 125 °C
(2)
IH
IT = 500 mA
MAX.
25
40
50
50
mA
I - III - IV
II
IL
IG = 1.2 IGT
MAX.
mA
80
100
400
dV/dt (2) VD = 67 %VDRM gate open
(dV/dt)c
Tj = 125 °C
MIN.
MIN.
200
V/µs
V/µs
(dI/dt)c = 5.3 A/ms
Tj = 125 °C
5
10
(2)
Table 4.
Symbol
Static characteristics
Test conditions
Value
Unit
(1)
VTM
ITM = 11 A, tp = 380 µs
Threshold voltage
Tj = 25 °C
MAX.
MAX.
MAX.
1.55
0.85
50
5
V
V
(2)
Vt0
Tj = 125 °C
Tj = 125 °C
Tj = 25 °C
Tj = 125 °C
(2)
Rd
Dynamic resistance
mΩ
µA
mA
IDRM
IRRM
VDRM = VRRM
MAX.
1
1. minimum IGT is guaranted at 5% of IGT max.
2. for both polarities of A2 referenced to A1.
Table 5.
Symbol
Thermal resistance
Parameter
Value
Unit
IPAK / D2PAK / DPAK / TO-220AB
TO-220AB Insulated
D2PAK
1.6
2.5
45
Rth(j-c) Junction to case (AC)
Rth(j-a) Junction to ambient
°C/W
²
S = 1 cm
²
S = 0.5 cm DPAK
TO-220AB / TO-220AB Insulated
70
°C/W
60
IPAK
100
S = Copper surface under tab.
Doc ID 7472 Rev 7
3/12
Characteristics
BTA08, BTB08 and T8 Series
Figure 1.
Maximum power dissipation versus Figure 2.
rms on-state current (full cycle)
On-state rms current versus case
temperature (full cycle)
P(W)
I (A)
T(RMS)
10
10
9
9
8
7
6
5
4
3
2
1
0
BTB / T8
8
7
BTA
6
5
4
3
2
1
I (A)
T(RMS)
T (°C)
C
0
0
25
50
75
100
125
0
1
2
3
4
5
6
7
8
Figure 3.
On-state rms current versus
ambient temperature (full cycle)
Figure 4.
Relative variation of thermal
impedance versus pulse
duration
I
(A)
T(RMS)
K=[Z /R
]
th th
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
1E+0
1E-1
1E-2
1E-3
printed circuit board FR4, copper thickness: 35 µm
Z
th(j-c)
D2PAK
DPAK/IPAK
(S=1CM2)
Z
th(j-a)
TO-220AB/D2PAK
Z
th(j-a)
DPAK
(S=0.5CM2)
t (s)
p
T (°C)
C
1E-3
1E-2
1E-1
1E+0
1E+1
1E+2
5E+2
0
25
50
75
100
125
Figure 5.
On-state characteristics
(maximum values)
Figure 6.
Surge peak on-state current
versus number of cycles
I
(A)
TM
I (A)
TSM
100
90
80
70
60
50
40
30
20
10
0
Tj max.
Vto = 0.85V
Rd = 50 mΩ
Tj = Tj max.
t=20ms
One cycle
Non repetitive
Tj initial=25°C
10
Tj = 25°C.
Repetitive
TC=110°C
V
(V)
TM
Number of cycles
1
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
1
10
100
1000
4/12
Doc ID 7472 Rev 7
BTA08, BTB08 and T8 Series
Characteristics
Figure 7.
Non-repetitive surge peak on-state
current for a sinusoidal
Figure 8.
Relative variation of gate trigger
current
I
,I ,I [T ] / I ,I ,I [T =25°C]
H L j GT H L j
I
(A), I2t (A2s)
GT
TSM
2.5
2.0
1.5
1.0
0.5
0.0
1000
100
Tj initial=25°C
holding current and latching current
versus junction temperature (typical values)
IGT
dI/dt limitation:
50A/µs
ITSM
360°
IH & IL
I2t
α
pulse with width tp < 10 ms and corresponding value of I2t
T (°C)
j
t (ms)
p
10
-40
-20
0
20
40
60
80
100
120
140
0.01
0.10
1.00
10.00
Figure 9.
Relative variation of critical rate of Figure 10. Relative variation of critical rate of
decrease of main current versus
(dV/dt)c (typical values)
decrease of main current versus
(dV/dt)c (typical values)
(dI/dt)c [(dV/dt)c] / Specified (dI/dt)c
(dI/dt)c [(dV/dt)c] / Specified (dI/dt)c
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
2.2
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
Standard types
Snubberless and Logic level types
TW
C
T835/CW/BW
B
T810/SW
(dV/dt)c (V/µs)
(dV/dt)c (V/µs)
0.1
1.0
10.0
100.0
0.1
1.0
10.0
100.0
Figure 11. Relative variation of critical rate of Figure 12. DPAK and D2PAK thermal resistance
decrease of main current versus
junction temperature
junction to ambient versus copper
surface under tab
R
(°C/W)
th(j-a)
(dI/dt)c [T ] / (dI/dt)c [T specified]
j
j
100
90
80
70
60
50
40
30
20
10
0
6
5
4
3
2
printed circuit board FR4, copper thickness: 35 µm
DPAK
D2PAK
1
S(cm²)
T (°C)
j
0
0
25
50
75
100
125
0
4
8
12
16
20
24
28
32
36
40
Doc ID 7472 Rev 7
5/12
Package information
BTA08, BTB08 and T8 Series
2
Package information
●
●
Epoxy meets UL94, V0
Lead-free packages
In order to meet environmental requirements, ST offers these devices in different grades of
®
®
ECOPACK packages, depending on their level of environmental compliance. ECOPACK
specifications, grade definitions and product status are available at: www.st.com.
®
ECOPACK is an ST trademark.
2
Table 6.
D PAK dimensions
Dimensions
Millimeters
Min. Typ. Max. Min. Typ. Max.
Ref.
Inches
A
4.30
4.60 0.169
2.69 0.098
0.23 0.001
0.93 0.027
0.181
0.106
0.009
0.037
A
A1 2.49
A2 0.03
E
C2
L2
B
0.70
B2 1.25 1.40
0.45
C2 1.21
D
0.048 0.055
L
C
0.60 0.017
1.36 0.047
9.35 0.352
10.28 0.393
5.28 0.192
15.85 0.590
1.40 0.050
1.75 0.055
0.024
0.054
0.368
0.405
0.208
0.624
0.055
0.069
L3
A1
B2
B
R
C
D
E
G
L
8.95
10.00
4.88
G
A2
2mm min.
FLAT ZONE
15.00
L2 1.27
L3 1.40
R
V2
0.40
0.016
V2
0°
8°
0°
8°
Figure 13. Footprint (dimensions in mm)
16.90
10.30
5.08
1.30
3.70
8.90
6/12
Doc ID 7472 Rev 7
BTA08, BTB08 and T8 Series
Package information
Dimensions
Table 7.
DPAK dimensions
Ref.
Millimeters
Inches
Min.
Max.
Min.
Max.
A
A1
A2
B
2.20
0.90
0.03
0.64
5.20
0.45
0.48
6.00
6.40
4.40
9.35
2.40
1.10
0.23
0.90
5.40
0.60
0.60
6.20
6.60
4.60
10.10
0.086
0.035
0.001
0.025
0.204
0.017
0.018
0.236
0.251
0.173
0.368
0.094
0.043
0.009
0.035
0.212
0.023
0.023
0.244
0.259
0.181
0.397
E
A
B2
C2
L2
B2
C
D
R
H
L4
C2
D
A1
R
B
G
C
E
A2
G
0.60 MIN.
H
V2
L2
L4
V2
0.80 typ.
0.031 typ.
0.60
0°
1.00
8°
0.023
0°
0.039
8°
Figure 14. Footprint (dimensions in mm)
1.6
6.7
3
3
2.3
6.7
2.3
1.6
Doc ID 7472 Rev 7
7/12
Package information
Table 8.
BTA08, BTB08 and T8 Series
Dimensions
IPAK dimensions
Ref.
Millimeters
Inches
Min. Typ. Max. Min. Typ. Max.
A
2.20
2.40 0.086
1.10 0.035
1.30 0.027
0.90 0.025
5.40 0.204
0.95
0.094
0.043
0.051
0.035
0.212
0.037
A1 0.90
A3 0.70
B
0.64
A
E
B2 5.20
C2
B2
B3
B5
L2
0.30
0.035
D
C
0.45
0.60 0.017
0.60 0.019
6.20 0.236
6.60 0.252
0.023
0.023
0.244
0.260
C2 0.48
H
B3
L1
L
D
E
6
A1
B
V1
6.40
e
2.28
0.090
0.634
B5
C
e
G
H
4.40
4.60 0.173
0.181
A3
G
16.10
L
9
9.40 0.354
1.20 0.031
1
0.370
0.047
L1
L2
V1
0.8
0.80
10°
0.031 0.039
10°
8/12
Doc ID 7472 Rev 7
BTA08, BTB08 and T8 Series
Package information
TO-220AB (NIns. and Ins. 20-up) dimensions
Dimensions
Millimeters
Min. Typ. Max. Min. Typ. Max.
Ref.
Inches
A
15.20
15.90 0.598
0.625
a1
3.75
0.147
C
B
a2 13.00
10.00
14.00 0.511
10.40 0.393
0.88 0.024
1.32 0.048
4.60 0.173
0.70 0.019
2.72 0.094
2.70 0.094
6.60 0.244
3.85 0.147
0.551
0.409
0.034
0.051
0.181
0.027
0.107
0.106
0.259
0.151
Ø I
b2
B
L
F
b1 0.61
b2 1.23
A
I4
C
4.40
l3
l2
c1 0.49
c2 2.40
c2
a1
a2
e
F
2.40
6.20
M
c1
b1
ØI 3.75
e
I4 15.80 16.40 16.80 0.622 0.646 0.661
L
2.65
1.14
1.14
2.95 0.104
1.70 0.044
1.70 0.044
0.116
0.066
0.066
l2
l3
M
2.60
0.102
Doc ID 7472 Rev 7
9/12
Ordering information
BTA08, BTB08 and T8 Series
3
Ordering information
Figure 15. Ordering information scheme (BTA08 and BTB08 series)
BT
A 08 - 600 BW (RG)
Triac series
Insulation
A = insulated
B = non insulated
Current
08 = 8A
Voltage
600 = 600V
800 = 800V
Sensitivity and type
B = 50mA Standard
C = 25mA Standard
SW = 10mA Logic Level
BW = 50mA Snubberless
CW = 35mA Snubberless
TW = 5mA Logic Level
Packing mode
RG = Tube
Figure 16. Ordering information scheme (T8 series)
T
8 10 - 600 B (-TR)
Triac series
Current
8 = 8A
Sensitivity
10 = 10 mA
35 = 35 mA
Voltage
600 = 600 V
800 = 800 V
Package
B = DPAK
H = IPAK
G = D2PAK
R = I2PAK
Packing mode
Blanck = Tube
-TR = Tape and reel
Table 9.
Product Selector
Voltage (xxx)
Part Number
Sensitivity
Type
Package
600 V
800 V
BTA/BTB08-xxxB
BTA/BTB08-xxxBW
BTA/BTB08-xxxC
BTA/BTB08-xxxCW
BTA/BTB08-xxxSW
BTA/BTB08-xxxTW
T810-xxxG
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
50 mA
50 mA
25 mA
35 mA
10 mA
5 mA
Standard
TO-220AB
Snubberless TO-220AB
Standard TO-220AB
Snubberless TO-220AB
Logic level
Logic Level
Logic Level
Logic Level
Snubberless
Snubberless
Snubberless
TO-220AB
TO-220AB
D2PAK
IPAK
10 mA
10 mA
35 mA
35 mA
35 mA
T810-xxxH
T835-xxxB
DPAK
D2PAK
T835-xxxG
T835-xxxH
IPAK
BTB: non insulated TO-220AB package
10/12
Doc ID 7472 Rev 7
BTA08, BTB08 and T8 Series
Ordering information
4
Ordering information
Table 10. Ordering information
Order code
Marking
Package
Weight Base qty Delivery mode
BTA/BTB08-xxxyzRG
T8yy-xxxG
BTA/BTB08-xxxyz
T8yyxx
TO-220AB
2.3 g
1.5 g
50
50
Tube
Tube
D2PAK
T8yy-xxxG-TR
T8yy-xxxB
T8yyxx
1000
75
Tape and reel
Tube
T8yyxx
DPAK
IPAK
0.3 g
0.4 g
T8yy-xxxB-TR
T8yy-xxxH
T8yyxx
2500
75
Tape and reel
Tube
T8yyxx
xxx = voltage, yy = sensitivity, z = type
5
Revision history
Table 11. Document revision history
Date
Revision
Changes
Apr-2002
5A
Last update.
TO-220AB delivery mode changed from bulk to tube.
ECOPACK statement added.
13-Feb-2006
10-Mar-2010
6
7
Updated ECOPACK statement and Figure 16.
Doc ID 7472 Rev 7
11/12
BTA08, BTB08 and T8 Series
Please Read Carefully:
Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the
right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any
time, without notice.
All ST products are sold pursuant to ST’s terms and conditions of sale.
Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no
liability whatsoever relating to the choice, selection or use of the ST products and services described herein.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this
document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products
or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such
third party products or services or any intellectual property contained therein.
UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED
WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED
WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS
OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.
UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT
RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING
APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY,
DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE
GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK.
Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void
any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any
liability of ST.
ST and the ST logo are trademarks or registered trademarks of ST in various countries.
Information in this document supersedes and replaces all information previously supplied.
The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.
© 2010 STMicroelectronics - All rights reserved
STMicroelectronics group of companies
Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan -
Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America
www.st.com
12/12
Doc ID 7472 Rev 7
相关型号:
©2020 ICPDF网 联系我们和版权申明