STR910FAM32X6 [STMICROELECTRONICS]

ARM966E-S⑩ 16/32-Bit Flash MCU with Ethernet, USB, CAN, AC motor control, 4 timers, ADC, RTC, DMA; ARM966E - S⑩ 16位/ 32位闪存单片机,以太网, USB , CAN ,交流电机控制, 4个定时器, ADC , RTC , DMA
STR910FAM32X6
型号: STR910FAM32X6
厂家: ST    ST
描述:

ARM966E-S⑩ 16/32-Bit Flash MCU with Ethernet, USB, CAN, AC motor control, 4 timers, ADC, RTC, DMA
ARM966E - S⑩ 16位/ 32位闪存单片机,以太网, USB , CAN ,交流电机控制, 4个定时器, ADC , RTC , DMA

闪存 微控制器和处理器 外围集成电路 电机 PC 以太网 时钟
文件: 总78页 (文件大小:1473K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
STR91xFA  
ARM966E-S™ 16/32-Bit Flash MCU with Ethernet, USB, CAN,  
AC motor control, 4 timers, ADC, RTC, DMA  
PRELIMINARY DATA  
Features  
16/32-bit 96 MHz ARM9E based MCU  
– ARM966E-S RISC core: Harvard archi-  
tecture, 5-stage pipeline, Tightly-Coupled  
Memories (SRAM and Flash)  
LQFP80 12 x12mm  
LQFP128 14 x 14mm  
– STR91xFA implementation of core adds  
high-speed burst Flash memory interface,  
instruction prefetch queue, branch cache  
LFBGA144 10 x 10 x 1.7  
– Up to 96 MIPS directly from Flash memory  
– Single-cycle DSP instructions are supported  
– Binary compatible with 16/32-bit ARM7 code  
Dual burst Flash memories, 32-bits wide  
10 Communication interfaces  
– 10/100 Ethernet MAC with DMA and MII port  
– USB Full-speed (12 Mbps) slave device  
– CAN interface (2.0B Active)  
– 3 16550-style UARTs with IrDA protocol  
– 2 Fast I C™, 400 kHz  
– 256KB/512KB Main Flash, 32KB 2nd Flash  
– Sequential Burst operation up to 96 MHz  
– 100K min erase cycles, 20 yr min retention  
SRAM, 32-bits wide  
2
– 2 channels for SPI™, SSI™, or Microwire™  
– 64K or 96K bytes, optional battery backup  
9 programmable DMA channels  
External Memory Interface (EMI)  
– 8- or 16-bit data  
– Up to 24-bit addressing  
– Static Async modes for LQFP128 packages  
– Additional Burst Synchronous modes for  
LFBGA144 packages  
– One for Ethernet, 8 programmable channels  
Clock, reset, and supply management  
Two supplies required. Core: 1.8 V +/-10%,  
I/O: 2.7 to 3.6 V  
– Internal oscillator operating with external  
4-25 MHz crystal  
– Internal PLL up to 96MHz  
– Real-time clock provides calendar functions,  
tamper detection, and wake-up functions  
Up to 80 I/O pins (muxed with interfaces)  
– 5 V tolerant, 16 have high sink current  
(8 mA)  
– Bit-wise manipulation of pins within a port  
16-bit standard timers (TIM)  
– Reset Supervisor monitors voltage supplies,  
watchdog timer, wake-up unit, ext. reset  
– 4 timers each with 2 input capture, 2 output  
compare, PWM and pulse count modes  
3-Phase induction motor controller (IMC)  
– Brown-out monitor for early warning interrupt  
– Run, Idle, and Sleep Mode as low as 50 uA  
Operating temperature -40 to +85°C  
– 3 pairs of PWM outputs, adjustable centers  
– Emergency stop, dead-time gen, tach input  
JTAG interface with boundary scan  
Vectored interrupt controller (VIC)  
– 32 IRQ vectors, 30 intr pins, any can be FIQ  
– Branch cache minimizes interrupt latency  
8-channel, 10-bit A/D converter (ADC)  
– ARM EmbeddedICE® RT for debugging  
– In-System Programming (ISP) of Flash  
Embedded trace module (ARM ETM9)  
– 0 to 3.6V range, 0.7 usec conversion  
– DMA capability  
– Hi-speed instruction tracing, 9-pin interface  
May 2007  
Rev 1  
1/78  
This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without noticwew. w.st.com  
78  
STR91xFA  
Contents  
1
2
Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6  
Functional overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7  
2.1  
2.2  
2.3  
2.4  
System-in-a-Package (SiP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7  
Package choice . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7  
ARM966E-S CPU core . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7  
Burst Flash memory interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7  
2.4.1 Pre-Fetch Queue (PFQ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7  
2.4.2 Branch Cache (BC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8  
2.4.3 Management of literals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8  
2.5  
SRAM (64K or 96K Bytes) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10  
2.5.1 Arbitration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10  
2.5.2 Battery backup . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10  
2.6  
2.7  
DMA data movement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10  
Non-volatile memories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10  
2.7.1 Primary Flash memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11  
2.7.2 Secondary Flash memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11  
2.8  
2.9  
One-time-programmable (OTP) memory . . . . . . . . . . . . . . . . . . . . . . . . . . . 11  
2.8.1 Product ID and revision level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11  
Vectored interrupt controller (VIC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12  
2.9.1 FIQ handling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12  
2.9.2 IRQ handling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12  
2.9.3 Interrupt sources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13  
2.10 Clock control unit (CCU) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14  
2.10.1 Master clock sources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14  
2.10.2 Reference clock (RCLK) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15  
2.10.3 AHB clock (HCLK) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15  
2.10.4 APB clock (PCLK) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15  
2.10.5 Flash memory interface clock (FMICLK) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15  
2.10.6 Baud rate clock (BRCLK) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16  
2.10.7 External memory interface bus clock (BCLK) . . . . . . . . . . . . . . . . . . . . . . . . 16  
2.10.8 USB interface clock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16  
2.10.9 Ethernet MAC clock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16  
2/78  
STR91xFA  
2.10.10 External RTC calibration clock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16  
2.10.11 Operation example . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16  
2.11 Flexible power management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17  
2.11.1 Run mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17  
2.11.2 Idle mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17  
2.11.3 Sleep mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18  
2.12 Voltage supplies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18  
2.12.1 Independent A/D converter supply and reference voltage . . . . . . . . . . . . . . . 18  
2.12.2 Battery supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18  
2.13 System supervisor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19  
2.13.1 Supply voltage brownout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19  
2.13.2 Supply voltage dropout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19  
2.13.3 Watchdog timer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19  
2.13.4 External RESET_INn pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20  
2.13.5 Power-up . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20  
2.13.6 JTAG debug command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20  
2.13.7 Tamper detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20  
2.14 Real-time clock (RTC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20  
2.15 JTAG interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21  
2.15.1 In-system-programming . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22  
2.15.2 Boundary scan . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22  
2.15.3 CPU debug . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22  
2.15.4 JTAG security bit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23  
2.16 Embedded trace module (ARM ETM9, v. r2p2) . . . . . . . . . . . . . . . . . . . . . . 23  
2.17 Ethernet MAC interface with DMA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24  
2.18 USB 2.0 slave device interface with DMA . . . . . . . . . . . . . . . . . . . . . . . . . . . 24  
2.18.1 Packet buffer interface (PBI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25  
2.18.2 DMA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25  
2.18.3 Suspend mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25  
2.19 CAN 2.0B interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25  
2.20 UART interfaces with DMA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26  
2.20.1 DMA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26  
2.21 I2C interfaces with DMA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27  
2.21.1 DMA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27  
2.22 SSP interfaces (SPI, SSI, and Microwire) with DMA . . . . . . . . . . . . . . . . . . . 27  
2.22.1 DMA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28  
3/78  
STR91xFA  
2.23 General purpose I/O . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28  
2.24 A/D converter (ADC) with DMA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29  
2.24.1 DMA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29  
2.25 Standard timers (TIM) with DMA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29  
2.25.1 DMA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30  
2.26 Three-phase induction motor controller (IMC) . . . . . . . . . . . . . . . . . . . . . . . 30  
2.27 External memory interface (EMI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30  
Related documentation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34  
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35  
3
4
4.1  
4.2  
LFBGA144 ball connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37  
Default pin functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38  
5
Memory mapping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44  
5.1  
5.2  
5.3  
5.4  
Buffered and non-buffered writes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44  
System (AHB) and peripheral (APB) buses . . . . . . . . . . . . . . . . . . . . . . . . . 44  
SRAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44  
Two independent Flash memories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45  
5.4.1 Default configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45  
5.4.2 Optional configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45  
6
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48  
6.1  
6.2  
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48  
Operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49  
6.2.1 Operating conditions at power-up / power-down . . . . . . . . . . . . . . . . . . . . . . 49  
LVD electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50  
6.3.1 LVD delay timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50  
DC electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51  
6.3  
6.4  
6.5  
6.6  
6.7  
6.8  
6.9  
AC electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52  
RESET_INn and power-on-reset characteristics . . . . . . . . . . . . . . . . . . . . . 54  
Main oscillator electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54  
RTC oscillator electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54  
PLL electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55  
6.10 SRAM characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55  
4/78  
STR91xFA  
6.11 Flash memory characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56  
6.12 EMC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57  
6.12.1 Functional EMS (Electro Magnetic Susceptibility) . . . . . . . . . . . . . . . . . . . . . 57  
6.12.2 Electro Magnetic Interference (EMI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57  
6.12.3 Absolute Maximum Ratings (Electrical Sensitivity) . . . . . . . . . . . . . . . . . . . . 58  
6.12.4 Electro-Static Discharge (ESD) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58  
6.12.5 Static and Dynamic Latch-Up . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58  
6.12.6 Designing hardened software to avoid noise problems . . . . . . . . . . . . . . . . . 58  
6.12.7 Electrical Sensitivities . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59  
6.13 External memory bus timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59  
6.14 ADC electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63  
6.15 Communication interface electrical characteristics . . . . . . . . . . . . . . . . . . . . 65  
6.15.1 10/100 Ethernet MAC electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . 65  
6.15.2 USB electrical interface characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67  
6.15.3 CAN interface electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67  
6.15.4 I2C electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68  
6.15.5 SPI electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69  
7
Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71  
7.1  
Thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74  
8
9
Ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75  
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77  
5/78  
Description  
STR91xFA  
1
Description  
STR91xFA is a series of ARM-powered microcontrollers which combines a 16/32-bit  
ARM966E-S RISC processor core, dual-bank Flash memory, large SRAM for data or code, and  
a rich peripheral set to form an ideal embedded controller for a wide variety of applications such  
as point-of-sale terminals, industrial automation, security and surveillance, vending machines,  
communication gateways, serial protocol conversion, and medical equipment. The ARM966E-S  
core can perform single-cycle DSP instructions, good for speech processing, audio algorithms,  
and low-end imaging.  
This datasheet provides STR91xFA ordering information, functional overview, mechanical  
information, and electrical device characteristics.  
For complete information on STR91xFA memory, registers, and peripherals, please refer to the  
STR91xFA Reference Manual.  
For information on programming the STR91xFA Flash memory please refer to the STR9 Flash  
Programming Reference Manual  
For information on the ARM966E-S core, please refer to the ARM966E-S Rev. 2 Technical  
Reference Manual.  
Table 1.  
Features  
Device summary  
STR910FA  
STR911FA  
STR912FA  
M32X6 W32X6 Z32H6 M42X6 M44X6 W42X6 W44X6 W34X6 W42X6 W44X6 Z42H6 Z44H6  
Flash  
Kbytes  
RAM -  
Kbytes  
Peripheral  
functions  
256  
+32  
256  
+32  
512  
+32  
256  
+32  
512  
+32  
512  
+32  
256  
+32  
512  
+32  
256  
+32  
512  
+32  
64  
96  
64  
96  
CAN,  
40 I/Os  
CAN, EMI,  
80 I/Os  
USB, CAN,  
40 I/Os  
USB, CAN,  
EMI, 80 I/Os  
Ethernet, USB, CAN,  
EMI,80 I/Os  
LQFP LQFP LFBGA  
80 128 144  
Packages  
LQFP80  
LQFP128  
LQFP128  
LFBGA144  
6/78  
STR91xFA  
Functional overview  
2
Functional overview  
2.1  
System-in-a-Package (SiP)  
The STR91xFA is a SiP device, comprised of two stacked die. One die is the ARM966E-S CPU  
with peripheral interfaces and analog functions, and the other die is the burst Flash. The two die  
are connected to each other by a custom high-speed 32-bit burst memory interface and a serial  
JTAG test/programming interface.  
2.2  
2.3  
Package choice  
STR91xFA devices are available in 128-pin (14 x 14 mm) 80-pin (12 x 12 mm) LQFP and  
LFBGA144 (10 x 10 mm) packages. Refer to the Table 1 on page 6 and to Table 35 on page 75  
for a list of available peripherals for each of the package choices.  
ARM966E-S CPU core  
The ARM966E-S core inherently has separate instruction and data memory interfaces (Harvard  
architecture), allowing the CPU to simultaneously fetch an instruction, and read or write a data  
item through two Tightly-Coupled Memory (TCM) interfaces as shown in Figure 1. The result is  
streamlined CPU Load and Store operations and a significant reduction in cycle count per  
instruction. In addition to this, a 5-stage pipeline is used to increase the amount of operational  
parallelism, giving the most performance out of each clock cycle.  
Ten DSP-enhanced instruction extensions are supported by this core, including single-cycle  
execution of 32x16 Multiply-Accumulate, saturating addition/subtraction, and count leading-  
zeros.  
®
The ARM966E-S core is binary compatible with 32-bit ARM7 code and 16-bit Thumb code.  
2.4  
Burst Flash memory interface  
A Burst Flash memory interface (Figure 1) has been integrated into the Instruction TCM  
(I-TCM) path of the ARM966E-S core. Also in this path is an 8-instruction Pre-Fetch Queue  
(PFQ) and a 15-entry Branch Cache (BC), enabling the ARM966E-S core to perform up to 96  
MIPS while executing code directly from Flash memory. This architecture provides high  
performance levels without a costly instruction SRAM, instruction cache, or external SDRAM.  
Eliminating the instruction cache also means interrupt latency is reduced and code execution  
becomes more deterministic.  
2.4.1 Pre-Fetch Queue (PFQ)  
As the CPU core accesses sequential instructions through the I-TCM, the PFQ always looks  
ahead and will pre-fetch instructions, taking advantage any idle bus cycles due to variable  
length instructions. The PFQ will fetch 32-bits at a time from the Burst Flash memory at a rate  
of up to 96 MHz.  
7/78  
Functional overview  
STR91xFA  
2.4.2 Branch Cache (BC)  
When instruction addresses are not sequential, such as a program branch situation, the PFQ  
would have to flush and reload which would cause the CPU to stall if no BC were present.  
Before reloading, the PFQ checks the BC to see if it contains the desired target branch  
address. The BC contains up to fifteen of the most recently taken branch addresses and the  
first eight instructions associated with each of these branches. This check is extremely fast,  
checking all fifteen BC entries simultaneously for a branch address match (cache hit). If there is  
a hit, the BC rapidly supplies the instruction and reduces the CPU stall. This gives the PFQ time  
to start pre-fetching again while the CPU consumes these eight instructions from the BC. The  
advantage here is that program loops (very common with embedded control applications) run  
very fast if the address of the loops are contained in the BC.  
In addition, there is a 16th branch cache entry that is dedicated to the Vectored Interrupt  
Controller (VIC) to further reduce interrupt latency by eliminating the stall latency typically  
imposed by fetching the instruction that reads the interrupt vector address from the VIC.  
2.4.3 Management of literals  
Typical ARM architecture and compilers do not place literals (data constants) sequentially in  
Flash memory with the instructions that use them, but instead the literals are placed at some  
other address which looks like a program branch from the PFQ’s point of view. The STR91xFA  
implementation of the ARM966E-S core has special circuitry to prevent flushing the PFQ when  
literals are encountered in program flow to keep performance at a maximum.  
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STR91xFA  
Functional overview  
Figure 1. STR91xFA block diagram  
Stacked Burst Flash Memory Die  
JTAG ISP  
STR91xA  
1.8V  
GND  
CORE SUPPLY, VDD  
CORE GND, VSS  
I/O SUPPLY, VDDQ  
I/O GND, VSSQ  
Main Flash 256K,  
or 512K Bytes  
2nd Flash  
32K Bytes  
Burst Interface  
3.0 or 3.3V  
GND  
BACKUP  
SUPPLY  
64K or 96K  
Byte  
SRAM  
Burst Interface  
VBATT  
Pre-Fetch Que  
and Branch  
Cache  
RTC  
Arbiter  
Instruction  
TCM  
Interface  
JTAG  
ARM966E-S  
RISC CPU Core  
Data TCM  
Interface  
JTAG  
Debug  
and  
ETM  
Control Logic / BIU and Write Buffer  
AMBA / AHBAInterface  
ETM  
32.768 kHz  
XTAL  
Real Time Clock  
Wake Up  
Programmable Vectored  
d  
Interrupt Controllers  
(4) 16-bit Timers,  
CAPCOM, PWM  
Motor Control,  
3-ph Induction  
4 MHz to 25  
MHz XTAL  
PLL, Power Management,  
and Supervisory Reset  
AHB  
to  
APB  
(3) UART w/ IrDA  
(2) I2C  
External Memory  
Interface (EMI)***,  
Muxed Address/Data  
EMI Ctrl  
16  
32  
48  
(80) GPIO****  
Programmable DMA  
Controller (8 ch.)  
Request  
from  
(2) SPI  
UART,  
I2C,  
SPI,  
CAN 2.0B  
USB* Full Speed, 10  
Endpoints with FIFOs  
USB Bus  
Timers,  
Ext Req  
ADC  
8 Channel 10-bit  
ADC  
AVDD  
To Ethernet  
PHY (MII) **  
Ethernet**  
MAC, 10/100  
Dedicated  
DMA  
Watchdog Tmr  
AVREF*  
AVSS  
* USB not available on STR910  
** Ethernet MAC not available on STR910 and STR911  
*** EMI not available on LQFP80  
**** Only 40 GPIOs on LQFP80  
9/78  
Functional overview  
STR91xFA  
2.5  
SRAM (64K or 96K Bytes)  
A 32-bit wide SRAM resides on the CPU’s Data TCM (D-TCM) interface, providing single-cycle  
data accesses. As shown in Figure 1, the D-TCM shares SRAM access with the Advanced  
High-performance Bus (AHB). Sharing is controlled by simple arbitration logic to allow the DMA  
unit on the AHB to also access to the SRAM.  
2.5.1 Arbitration  
Zero-wait state access occurs for either the D-TCM or the AHB when only one of the two is  
requesting SRAM. When both request SRAM simultaneously, access is granted on an  
interleaved basis so neither requestor is starved, granting one 32-bit word transfer to each  
requestor before relinquishing SRAM to the other. When neither the D-TCM or the AHB are  
requesting SRAM, the arbiter leaves access granted to the most recent user (if D-TCM was last  
to use SRAM then the D-TCM will not have to arbitrate to get access next time).  
The CPU may execute code from SRAM through the AHB. There are no wait states as long as  
the D-TCM is not contending for SRAM access and the AHB is not sharing bandwidth with  
peripheral traffic. The ARM966E-S CPU core has a small pre-fetch queue built into this  
instruction path through the AHB to look ahead and fetch instructions during idle bus cycles.  
2.5.2 Battery backup  
When a battery is connected to the designated battery backup pin (VBATT), SRAM contents  
are automatically preserved when the normal operating voltage on VDD pins is lost or sags  
below threshold. Automatic switchover to SRAM can be disabled by firmware if it is desired that  
the battery will power only the RTC and not the SRAM during standby.  
2.6  
DMA data movement  
DMA channels on the Advanced High-performance Bus (AHB) take full advantage of the  
separate data path provided by the Harvard architecture, moving data rapidly and largely  
independent of the instruction path. There are two DMA units, one is dedicated to move data  
between the Ethernet interface and SRAM, the other DMA unit has eight programmable  
channels with 16 request signals to service other peripherals and interfaces (USB, SSP, I2C,  
ADC, UART, Timers, EMI, and external request pins). Both single word and burst DMA transfers  
are supported. Memory-to-memory transfers are supported in addition to memory-peripheral  
transfers. DMA access to SRAM is shared with D-TCM accesses, and arbitration is described  
in Section 2.5.1. Efficient DMA transfers are managed by firmware using linked list descriptor  
tables. Of the 16 DMA request signals, two are assigned to external inputs. The DMA unit can  
move data between external devices and resources inside the STR91xFA through the EMI bus.  
2.7  
Non-volatile memories  
There are two independent 32-bit wide Burst Flash memories enabling true read-while-write  
operation. The Flash memories are single-voltage erase/program with 20 year minimum data  
retention and 100K minimum erase cycles. The primary Flash memory is much larger than the  
secondary Flash.  
Both Flash memories are blank when devices are shipped from ST. The CPU can boot only  
from Flash memory (configurable selection of which Flash bank).  
10/78  
STR91xFA  
Functional overview  
Flash memories are programmed half-word (16 bits) at a time, but are erased by sector or by  
full array.  
2.7.1 Primary Flash memory  
Using the STR91xFA device configuration software tool and 3rd party Integrated Developer  
Environments, it is possible to specify that the primary Flash memory is the default memory  
from which the CPU boots at reset, or otherwise specify that the secondary Flash memory is  
the default boot memory. This choice of boot memory is non-volatile and stored in a location  
that can be programmed and changed only by JTAG In-System Programming. See Section 5:  
Memory mapping, for more detail.  
The primary Flash memory has equal length 64K byte sectors. Devices with 256 Kbytes of  
primary Flash have four sectors and 512K devices have eight sectors.  
2.7.2 Secondary Flash memory  
The smaller of the two Flash memories can be used to implement a bootloader, capable of  
storing code to perform robust In-Application Programming (IAP) of the primary Flash memory.  
The CPU executes code from the secondary Flash, while updating code in the primary Flash  
memory. New code for the primary Flash memory can be downloaded over any of the  
interfaces on the STR91xFA (USB, Ethernet, CAN, UART, etc.)  
Additionally, the Secondary Flash memory may also be used to store small data sets by  
emulating EEPROM though firmware, eliminating the need for external EEPROM memories.  
This raises the data security level because passcodes and other sensitive information can be  
securely locked inside the STR91xFA device.  
The secondary Flash memory is 32 Kbytes and has four equal length sectors of 8 Kbytes each.  
Both the primary Flash memory and the secondary Flash memory can be programmed with  
code and/or data using the JTAG In-System Programming (ISP) channel, totally independent of  
the CPU. This is excellent for iterative code development and for manufacturing.  
2.8  
One-time-programmable (OTP) memory  
There are 32 bytes of OTP memory ideally suited for serial numbers, security keys, factory  
calibration constants, or other permanent data constants. These OTP data bytes can be  
programmed only one time through either the JTAG interface or by the CPU, and these bytes  
can never be altered afterwards. As an option, a “lock bit” can be set by the JTAG interface or  
the CPU which will block any further writing to the this OTP area. The “lock bit” itself is also  
OTP. If the OTP array is unlocked, it is always possible to go back and write to an OTP byte  
location that has not been previously written, but it is never possible to change an OTP byte  
location if any one bit of that particular byte has been written before. The last two OTP bytes are  
reserved for the STR91xFA product ID and revision level.  
2.8.1 Product ID and revision level  
OTP bytes 31 and 30 are programmed at ST factory before shipment and may be read by  
firmware to determine the STR91xFA product type and silicon revision so it can optionally take  
action based on the silicon on which it is running. Byte 31 contains the the major family  
identifier of "9" (for STR9) in the high-nibble location, and the minor family identifier in the low-  
nibble location. Today the low-nibble contains "1", but future family members may have other  
11/78  
Functional overview  
STR91xFA  
values indicating memory size or other differentiating features. Byte 30 contains the silicon  
revision level indicator. See Table 2 for values related to the two revisions of STR9 production  
devices. See the Errata Sheet documents for STR91xF and STR91xFA for details of external  
identification of silicon revisions.  
Table 2.  
Product ID and revision level values  
Production salestype  
Silicon revision  
OTP byte 31  
OTP byte 30  
STR91xFxxxxx  
STR91xFAxxxxx  
Rev D  
Rev G  
91h  
91h  
03h  
20h  
2.9  
Vectored interrupt controller (VIC)  
Interrupt management in the STR91xFA is implemented from daisy-chaining two standard ARM  
VIC units. This combined VIC has 32 prioritized interrupt request channels and generates two  
interrupt output signals to the CPU. The output signals are FIQ and IRQ, with FIQ having higher  
priority.  
2.9.1 FIQ handling  
FIQ (Fast Interrupt reQuest) is the only non-vectored interrupt and the CPU can execute an  
Interrupt Service Routine (ISR) directly without having to determine/prioritize the interrupt  
source, minimizing ISR latency. Typically only one interrupt source is assigned to FIQ. An FIQ  
interrupt has its own set of banked registers to minimize the time to make a context switch. Any  
of the 32 interrupt request input signals coming into the VIC can be assigned to FIQ.  
2.9.2 IRQ handling  
IRQ is a vectored interrupt and is the logical OR of all 32 interrupt request signals coming into  
the 32 IRQ channels. Priority of individual vectored interrupt requests is determined by  
hardware (IRQ channel Intr 0 is highest priority, IRQ channel Intr 31 is lowest).  
However, inside the same VIC (primary or secondary VIC), CPU firmware may re-assign  
individual interrupt sources to individual hardware IRQ channels, meaning that firmware can  
effectively change interrupt priority levels as needed within the same VIC (from priority 0 to  
priority 16).  
Note:  
Note: VIC0 (primary VIC) interrupts always have higher priority than VIC1 (secondary VIC)  
interrupts  
When the IRQ signal is activated by an interrupt request, VIC hardware will resolve the IRQ  
interrupt priority, then the ISR reads the VIC to determine both the interrupt source and the  
vector address to jump to the service code.  
The STR91xFA has a feature to reduce ISR response time for IRQ interrupts. Typically, it  
requires two memory accesses to read the interrupt vector address from the VIC, but the  
STR91xFA reduces this to a single access by adding a 16th entry in the instruction branch  
cache, dedicated for interrupts. This 16th cache entry always holds the instruction that reads  
the interrupt vector address from the VIC, eliminating one of the memory accesses typically  
required in traditional ARM implementations.  
12/78  
STR91xFA  
Functional overview  
2.9.3 Interrupt sources  
The 32 interrupt request signals coming into the VIC on 32 IRQ channels are from various  
sources; 5 from a wake-up unit and the remaining 27 come from internal sources on the  
STR91xFA such as on-chip peripherals, see Table 3. Optionally, firmware may force an  
interrupt on any IRQ channel.  
One of the 5 interrupt requests generated by the wake-up unit (IRQ25 in Table 3) is derived  
from the logical OR of all 32 inputs to the wake-up unit. Any of these 32 inputs may be used to  
wake up the CPU and cause an interrupt. These 32 inputs consist of 30 external interrupts on  
selected and enabled GPIO pins, plus the RTC interrupt, and the USB Resume interrupt.  
Each of 4 remaining interrupt requests generated by the wake-up unit (IRQ26 in Table 3) are  
derived from groupings of 8 interrupt sources. One group is from GPIO pins P3.2 to P3.7 plus  
the RTC interrupt and the USB Resume interrupt; the next group is from pins P5.0 to P5.7; the  
next group is from pins P6.0 to P6.7; and last the group is from pins P7.0 to P7.7. This allows  
individual pins to be assigned directly to vectored IRQ interrupts or one pin assigned directly to  
the non-vectored FIQ interrupt.  
Table 3.  
VIC IRQ Channels  
IRQ Channel  
hardware  
priority  
VIC input  
channel  
Logic Block  
Interrupt Source  
0 (high priority)  
VIC0.0  
VIC0.1  
VIC0.2  
VIC0.3  
VIC0.4  
VIC0.5  
VIC0.6  
VIC0.7  
VIC0.8  
VIC0.9  
VIC0.10  
WatchDog  
CPU Firmware  
CPU Core  
CPU Core  
TIM Timer 0  
TIM Timer 1  
TIM Timer 2  
TIM Timer 3  
USB  
Timeout in WDT mode, Terminal Count in Counter Mode  
Firmware generated interrupt  
1
2
Debug Receive Command  
3
Debug Transmit Command  
4
Logic OR of ICI0_0, ICI0_1, OCI0_0, OCI0_1, Timer overflow  
Logic OR of ICI1_0, ICI1_1, OCI1_0, OCI1_1, Timer overflow  
Logic OR of ICI2_0, ICI2_1, OCI2_0, OCI2_1, Timer overflow  
Logic OR of ICI3_0, ICI3_1, OCI3_0, OCI3_1, Timer overflow  
Logic OR of high priority USB interrupts  
5
6
7
8
9
USB  
Logic OR of low priority USB interrupts  
10  
CCU  
Logic OR of all interrupts from Clock Control Unit  
Logic OR of Ethernet MAC interrupts via its own dedicated  
DMA channel.  
11  
12  
VIC0.11  
VIC0.12  
Ethernet MAC  
DMA  
Logic OR of interrupts from each of the 8 individual DMA  
channels  
13  
14  
15  
16  
17  
18  
VIC0.13  
VIC0.14  
VIC0.15  
VIC1.0  
VIC1.1  
VIC1.2  
CAN  
IMC  
Logic OR of all CAN interface interrupt sources  
Logic OR of 8 Induction Motor Control Unit interrupts  
End of AtoD conversion interrupt  
ADC  
UART0  
UART1  
UART2  
Logic OR of 5 interrupts from UART channel 0  
Logic OR of 5 interrupts from UART channel 1  
Logic OR of 5 interrupts from UART channel 2  
Logic OR of transmit, receive, and error interrupts of I2C  
channel 0  
19  
20  
VIC1.3  
VIC1.4  
I2C0  
I2C1  
Logic OR of transmit, receive, and error interrupts of I2C  
channel 1  
21  
22  
23  
24  
VIC1.5  
VIC1.6  
VIC1.7  
VIC1.8  
SSP0  
SSP1  
Logic OR of all interrupts from SSP channel 0  
Logic OR of all interrupts from SSP channel 1  
LVD warning interrupt  
BROWNOUT  
RTC  
Logic OR of Alarm, Tamper, or Periodic Timer interrupts  
13/78  
Functional overview  
STR91xFA  
Table 3.  
VIC IRQ Channels  
IRQ Channel  
hardware  
priority  
VIC input  
channel  
Logic Block  
Interrupt Source  
Logic OR of all 32 inputs of Wake-Up unit (30 pins, RTC, and  
USB Resume)  
25  
26  
VIC1.9  
Wake-Up (all)  
Logic OR of 8 interrupt sources: RTC, USB Resume, pins  
P3.2 to P3.7  
VIC1.10  
Wake-up Group 0  
27  
28  
29  
30  
VIC1.11  
VIC1.12  
VIC1.13  
VIC1.14  
Wake-up Group 1 Logic OR of 8 interrupts from pins P5.0 to P5.7  
Wake-up Group 2 Logic OR of 8 interrupts from pins P6.0 to P6.7  
Wake-up Group 3 Logic OR of 8 interrupts from pins P7.0 to P7.7  
USB  
USB Bus Resume Wake-up (also input to wake-up unit)  
Special use of interrupts from Prefetch Queue and Branch  
Cache  
31 (low priority)  
VIC1.15  
PFQ-BC  
2.10 Clock control unit (CCU)  
The CCU generates a master clock of frequency f  
. From this master clock the CCU also  
MSTR  
generates individually scaled and gated clock sources to each of the following functional blocks  
within the STR91xFA.  
CPU, f  
CPUCLK  
Advanced High-performance Bus (AHB), f  
HCLK  
Advanced Peripheral Bus (APB), f  
PCLK  
Flash Memory Interface (FMI), f  
FMICLK  
External Memory Interface (EMI), f  
BCLK  
BAUD  
UART Baud Rate Generators, f  
USB, f  
USB  
2.10.1 Master clock sources  
The master clock in the CCU (f  
) is derived from one of three clock input sources. Under  
MSTR  
firmware control, the CPU can switch between the three CCU inputs without introducing any  
glitches on the master clock output. Inputs to the CCU are:  
Main Oscillator (f  
). The source for the main oscillator input is a 4 to 25 MHz external  
OSC  
crystal connected to STR91xFA pins X1_CPU and X2_CPU, or an external oscillator  
device connected to pin X1_CPU.  
PLL (f ). The PLL takes the 4 to 25 MHz oscillator clock as input and generates a master  
PLL  
clock output up to 96 MHz (programmable). By default, at power-up the master clock is  
sourced from the main oscillator until the PLL is ready (locked) and then the CPU may  
switch to the PLL source under firmware control. The CPU can switch back to the main  
oscillator source at any time and turn off the PLL for low-power operation. The PLL is  
always turned off in Sleep mode.  
RTC (f  
). A 32.768 kHz external crystal can be connected to pins X1_RTC and  
RTC  
X2_RTC, or an external oscillator connected to pin X1_RTC to constantly run the real-time  
clock unit. This 32.768 kHz clock source can also be used as an input to the CCU to run  
the CPU in slow clock mode for reduced power.  
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STR91xFA  
Functional overview  
As an option, there are a number of peripherals that do not have to receive a clock sourced  
from the CCU. The USB interface can receive an external clock on pin P2.7, TIM timers TIM0/  
TIM1 can receive an external clock on pin P2.4, and timers TIM2/TIM3 on pin P2.5.  
Figure 2. Clock control  
32.768 kHz  
25MHz  
RTCSEL  
PHYSEL  
JRTCLK  
EMI_BCLK  
1/2  
MII_PHYCLK  
HCLK  
PCLK  
RCLK  
AHB DIV  
X1_CPU  
X1_CPU  
f
MSTR  
f
Main  
OSC  
PLL  
RCLK  
DIV  
4-25MHz  
PLL  
(1,2,4)  
f
OSC  
APB DIV)  
(1,2,4,8)  
(1,2,4,8,16,1024)  
Master CLK  
32.768 kHz  
X1_RTC  
X2_RTC  
RTC  
OSC  
f
RTC  
FMICLK  
1/2  
Timer 0 & 1  
CPUCLK  
EXTCLK_T0T1  
External clock  
BRCLK  
Timer 2 & 3  
To UART  
1/2  
1/2  
EXTCLK_T2T3  
USB_CLK48M  
External clock  
USBCLK  
To USB  
48MHz  
2.10.2 Reference clock (RCLK)  
The main clock (f  
) can be divided to operate at a slower frequency reference clock (RCLK)  
MSTR  
for the ARM core and all the peripherals. The RCLK provides the divided clock for the ARM  
core, and feeds the dividers for the AHB, APB, External Memory Interface, and FMI units.  
2.10.3 AHB clock (HCLK)  
The RCLK can be divided by 1, 2 or 4 to generate the AHB clock. The AHB clock is the bus  
clock for the AHB bus and all bus transfers are synchronized to this clock. The maximum HCLK  
frequency is 96 MHz.  
2.10.4 APB clock (PCLK)  
The RCLK can be divided by 1, 2, 4 or 8 to generate the APB clock. The APB clock is the bus  
clock for the APB bus and all bus transfers are synchronized to this clock. Many of the  
peripherals that are connected to the AHB bus also use the PCLK as the source for external  
bus data transfers. The maximum PCLK frequency is 48 MHz.  
2.10.5 Flash memory interface clock (FMICLK)  
The FMICLK clock is an internal clock derived from RCLK, defaulting to RCLK frequency at  
power up. The clock can be optionally divided by 2. The FMICLK determines the bus bandwidth  
15/78  
Functional overview  
STR91xFA  
between the ARM core and the Flash memory. Typically, codes in the Flash memory can be  
fetched one word per FMICLK clock in burst mode. The maximum FMICLK frequency is  
96MHz.  
2.10.6 Baud rate clock (BRCLK)  
The baud rate clock is an internal clock derived from f  
that is used by the three on-chip  
MSTR  
UART peripherals for baudrate generation. The frequency can be optionally divided by 2.  
2.10.7 External memory interface bus clock (BCLK)  
The BCLK is an internal clock that controls the EMI bus. All EMI bus signals are synchronized  
to the BCLK. The BCLK is derived from the HCLK and the frequency can be configured to be  
the same or half that of the HCLK. Refer to Table 12 on page 53 for the maximum BCLK  
frequency (f  
). The BCLK clock is available on the LFBGA package as an output pin.  
BCLK  
2.10.8 USB interface clock  
Special consideration regarding the USB interface: The clock to the USB interface must operate  
at 48 MHz and comes from one of three sources, selected under firmware control:  
CCU master clock output of 48 MHz.  
CCU master clock output of 96 MHz. An optional divided-by-two circuit is available to  
produce 48 MHz for the USB while the CPU system runs at 96MHz.  
STR91xFA pin P2.7. An external 48 MHz oscillator connected to pin P2.7 can directly  
source the USB while the CCU master clock can run at some frequency other than 48 or  
96 MHz.  
2.10.9 Ethernet MAC clock  
Special consideration regarding the Ethernet MAC: The external Ethernet PHY interface device  
requires it’s own 25 MHz clock source. This clock can come from one of two sources:  
A 25 MHz clock signal coming from a dedicated output pin (P5.2) of the STR91xFA. In this  
case, the STR91xFA must use a 25 MHz signal on its main oscillator input in order to pass  
this 25 MHz clock back out to the PHY device through pin P5.2. The advantage here is that  
an inexpensive 25 MHz crystal may be used to source a clock to both the STR91xFA and  
the external PHY device.  
An external 25 MHz oscillator connected directly to the external PHY interface device. In  
this case, the STR91xFA can operate independent of 25 MHz.  
2.10.10 External RTC calibration clock  
The RTC_CLK can be enabled as an output on the JRTCK pin. The RTC_CLK is used for RTC  
oscillator calibration. The RTC_CLK is active in Sleep mode and can be used as a system wake  
up control clock.  
2.10.11 Operation example  
As an example of CCU operation, a 25 MHz crystal can be connected to the main oscillator  
input on pins X1_CPU and X2_CPU, a 32.768 kHz crystal connected to pins X1_RTC and  
X2_RTC, and the clock input of an external Ethernet PHY device is connected to STR91xFA  
output pin P5.2. In this case, the CCU can run the CPU at 96 MHz from PLL, the USB interface  
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STR91xFA  
Functional overview  
at 48 MHz, and the Ethernet interface at 25 MHz. The RTC is always running in the background  
at 32.768 kHz, and the CPU can go to very low power mode dynamically by running from  
32.768 kHz and shutting off peripheral clocks and the PLL as needed.  
2.11 Flexible power management  
The STR91xFA offers configurable and flexible power management control that allows the user  
to choose the best power option to fit the application. Power consumption can be dynamically  
managed by firmware and hardware to match the system’s requirements. Power management  
is provided via clock control to the CPU and individual peripherals.  
Clocks to the CPU and peripherals can be individually divided and gated off as needed. In  
addition to individual clock divisors, the CCU master clock source going to the CPU, AHB, APB,  
EMI, and FMI can be divided dynamically by as much as 1024 for low power operation.  
Additionally, the CCU may switch its input to the 32.768 kHz RTC clock at any time for low  
power.  
The STR91xFA supports the following three global power control modes:  
Run Mode: All clocks are on with option to gate individual clocks off via clock mask  
registers.  
Idle Mode: CPU and FMI clocks are off until an interrupt, reset, or wake-up occurs. Pre-  
configured clock mask registers selectively allow individual peripheral clocks to continue  
run during Idle Mode.  
Sleep Mode: All clocks off except RTC clock. Wake up unit remains powered, PLL is  
forced off.  
A special mode is used when JTAG debug is active which never gates off any clocks even if the  
CPU enters Idle or Sleep mode.  
2.11.1 Run mode  
This is the default mode after any reset occurs. Firmware can gate off or scale any individual  
clock. Also available is a special Interrupt Mode which allows the CPU to automatically run full  
speed during an interrupt service and return back to the selected CPU clock divisor rate when  
the interrupt has been serviced. The advantage here is that the CPU can run at a very low  
frequency to conserve power until a periodic wake-up event or an asynchronous interrupt  
occurs at which time the CPU runs full speed immediately.  
2.11.2 Idle mode  
In this mode the CPU suspends code execution and the CPU and FMI clocks are turned off  
immediately after firmware sets the Idle Bit. Various peripherals continue to run based on the  
settings of the mask registers that exist just prior to entering Idle Mode. There are 3 ways to exit  
Idle Mode and return to Run Mode:  
Any reset (external reset pin, watchdog, low-voltage, power-up, JTAG debug command)  
Any interrupt (external, internal peripheral, RTC alarm or interval)  
Input from wake-up unit on GPIO pins  
Note:  
It is possible to remain in Idle Mode for the majority of the time and the RTC can be  
programmed to periodically wake up to perform a brief task or check status.  
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Functional overview  
STR91xFA  
2.11.3 Sleep mode  
In this mode all clock circuits except the RTC are turned off and main oscillator input pins  
X1_CPU and X2_CPU are disabled. The RTC clock is required for the CPU to exit Sleep Mode.  
The entire chip is quiescent (except for RTC and wake-up circuitry). There are three means to  
exit Sleep Mode and re-start the system:  
Some resets (external reset pin, low-voltage, power-up, JTAG debug command)  
RTC alarm  
Input from wake-up unit  
2.12 Voltage supplies  
The STR91xFA requires two separate operating voltage supplies. The CPU and memories  
operate from a 1.65V to 2.0V on the VDD pins, and the I/O ring operates at 2.7V to 3.6V on the  
VDDQ pins.  
2.12.1 Independent A/D converter supply and reference voltage  
The ADC unit on 128-pin and 144-ball packages has an isolated analog voltage supply input at  
pin AVDD to accept a very clean voltage source, independent of the digital voltage supplies.  
Additionally, an isolated analog supply ground connection is provided on pin AVSS only on 128-  
pin and 144-ball packages for further ADC supply isolation. On 80-pin packages, the analog  
voltage supply is shared with the ADC reference voltage pin (as described next), and the  
analog ground is shared with the digital ground at a single point in the STR91xFA device on pin  
AVSS_VSSQ.  
A separate external analog reference voltage input for the ADC unit is available on 128-pin and  
144-ball packages at the AVREF pin for better accuracy on low voltage inputs. For 80-pin  
packages, the ADC reference voltage is tied internally to the ADC unit supply voltage at pin  
AVREF_AVDD, meaning the ADC reference voltage is fixed to the ADC unit supply voltage.  
See Table 7: Operating conditions, for restrictions to the relative voltage levels of VDDQ, AVDD,  
AVREF, and AVREF_AVDD.  
2.12.2 Battery supply  
An optional stand-by voltage from a battery or other source may be connected to pin VBATT to  
retain the contents of SRAM in the event of a loss of the V supply. The SRAM will  
DD  
automatically switch its supply from the internal V source to the VBATT pin when the voltage  
DD  
of V drops below that of VBATT.  
DD  
The VBATT pin also supplies power to the RTC unit, allowing the RTC to function even when  
the main digital supplies (V and V  
) are switched off. By configuring the RTC register, it is  
DD  
DDQ  
possible to select whether or not to power from VBATT only the RTC unit, or power the RTC unit  
and the SRAM when the STR91xFA device is powered off.  
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STR91xFA  
Functional overview  
2.13 System supervisor  
The STR91xFA monitors several system and environmental inputs and will generate a global  
reset, a system reset, or an interrupt based on the nature of the input and configurable settings.  
A global reset clears all functions on the STR91xFA, a system reset will clear all but the Clock  
Control Unit (CCU) settings and the system status register. At any time, firmware may reset  
individual on-chip peripherals. System supervisor inputs include:  
GR: CPU voltage supply (V ) drop out or brown out  
DD  
GR: I/O voltage supply (V  
GR: Power-Up condition  
) drop out or brown out  
DDQ  
SR: Watchdog timer timeout  
SR: External reset pin (RESET_INn)  
SR: JTAG debug reset command  
Note:  
GR: means the input causes Global Reset, SR: means the input causes System Reset  
The CPU may read a status register after a reset event to determine if the reset was caused by  
a watchdog timer timeout or a voltage supply drop out. This status register is cleared only by a  
power up reset.  
2.13.1 Supply voltage brownout  
Each operating voltage source (V and V  
) is monitored separately by the Low Voltage  
DDQ  
DD  
Detect (LVD) circuitry. The LVD will generate an early warning interrupt to the CPU when  
voltage sags on either V or V voltage inputs. This is an advantage for battery powered  
DD  
DDQ  
applications because the system can perform an orderly shutdown before the batteries become  
too weak. The voltage trip point to cause a brown out interrupt is typically 0.25V above the LVD  
dropout thresholds that cause a reset.  
CPU firmware may prevent all brown-out interrupts by writing to interrupt mask registers at run-  
time.  
2.13.2 Supply voltage dropout  
LVD circuitry will always cause a global reset if the CPU’s V source drops below it’s fixed  
DD  
threshold of 1.4V.  
However, the LVD trigger threshold to cause a global reset for the I/O ring’s V  
source is set  
DDQ  
to one of two different levels, depending if V  
will be operated in the range of 2.7V to 3.3V, or  
DDQ  
3.0V to 3.6V. If V  
operation is at 2.7V to 3.3V, the LVD dropout trigger threshold is 2.4V. If  
DDQ  
V
operation is 3.0V and 3.6V, the LVD threshold is 2.7V. The choice of trigger level is made  
DDQ  
by STR91xFA device configuration software from STMicroelectronics or IDE from 3rd parties,  
and is programmed into the STR91xFA device along with other configurable items through the  
JTAG interface when the Flash memory is programmed.  
CPU firmware may prevent some LVD resets if desired by writing a control register at run-time.  
Firmware may also disable the LVD completely for lowest-power operation when an external  
LVD device is being used.  
2.13.3 Watchdog timer  
The STR91xFA has a 16-bit down-counter (not one of the four TIM timers) that can be used as  
a watchdog timer or as a general purpose free-running timer/counter. The clock source is the  
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Functional overview  
STR91xFA  
peripheral clock from the APB, and an 8-bit clock pre-scaler is available. When enabled by  
firmware as a watchdog, this timer will cause a system reset if firmware fails to periodically  
reload this timer before the terminal count of 0x0000 occurs, ensuring firmware sanity. The  
watchdog function is off by default after a reset and must be enabled by firmware.  
2.13.4 External RESET_INn pin  
This input signal is active-low with hystereses (V  
). Other open-drain, active-low system  
RHYS  
reset signals on the circuit board (such as closure to ground from a push-button) may be  
connected directly to the RESET_INn pin, but an external pull-up resistor to V  
present as there is no internal pullup on the RESET_INn pin.  
must be  
DDQ  
A valid active-low input signal of t  
duration on the RESET_INn pin will cause a system  
RINMIN  
reset within the STR91xFA. There is also a RESET_OUTn pin on the STR91xFA that can drive  
other system components on the circuit board. RESET_OUTn is active-low and has the same  
timing of the Power-On-Reset (POR) shown next, t  
.
POR  
2.13.5 Power-up  
The LVD circuitry will always generate a global reset when the STR91xFA powers up, meaning  
internal reset is active until V and V are both above the LVD thresholds. This POR  
DDQ  
DD  
condition has a duration of t  
, after which the CPU will fetch its first instruction from address  
POR  
0x0000.0000 in Flash memory. It is not possible for the CPU to boot from any other source  
other than Flash memory.  
2.13.6 JTAG debug command  
When the STR91xFA is in JTAG debug mode, an external device which controls the JTAG  
interface can command a system reset to the STR91xFA over the JTAG channel.  
2.13.7 Tamper detection  
On 128-pin and 144-ball STR91xFA devices only, there is a tamper detect input pin,  
TAMPER_IN, used to detect and record the time of a tamper event on the end product such as  
malicious opening of an enclosure, unwanted opening of a panel, etc. The activation mode of  
the tamper pin is programmable to one of two modes. One is Normally Closed/Tamper Open,  
the other mode will detect when a signal on the tamper input pin is driven from low-to-high, or  
high-to-low depending on firmware configuration. Once a tamper event occurs, the RTC time  
(millisecond resolution) and the date are recorded in the RTC unit. Simultaneously, the SRAM  
standby voltage source will be cut off to invalidate all SRAM contents. Tamper detection control  
and status logic are part of the RTC unit.  
2.14 Real-time clock (RTC)  
The RTC combines the functions of a complete time-of-day clock (millisecond resolution) with  
an alarm programmable up to one month, a 9999-year calender with leap-year support,  
periodic interrupt generation from 1 to 512 Hz, tamper detection (described in Section 2.13.7),  
and an optional clock calibration output on the JRTCK pin. The time is in 24 hour mode, and  
time/calendar values are stored in binary-coded decimal format.  
The RTC also provides a self-isolation mode that is automatically activated during power down.  
This feature allows the RTC to continue operation when V  
and V are absent, as long as  
DDQ  
DD  
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STR91xFA  
Functional overview  
an alternate power source, such as a battery, is connected to the VBATT input pin. The current  
drawn by the RTC unit on the VBATT pin is very low in this standby mode, I  
.
RTC_STBY  
2.15 JTAG interface  
An IEEE-1149.1 JTAG interface on the STR91xFA provides In-System-Programming (ISP) of  
all memory, boundary scan testing of pins, and the capability to debug the CPU.  
STR91xFA devices are shipped from ST with blank Flash memories. The CPU can only boot  
from Flash memory (selection of which Flash bank is programmable). Firmware must be initially  
programmed through JTAG into one of these Flash memories before the STR91xFA is used.  
Six pins are used on this JTAG serial interface. The five signals JTDI, JTDO, JTMS, JTCK, and  
JTRSTn are all standard JTAG signals complying with the IEEE-1149.1 specification. The sixth  
signal, JRTCK (Return TCK), is an output from the STR91xFA and it is used to pace the JTCK  
clock signal coming in from the external JTAG test equipment for debugging. The frequency of  
the JTCK clock signal coming from the JTAG test equipment must be at least 10 times less than  
the ARM966E-S CPU core operating frequency (f  
). To ensure this, the signal JRTCK is  
CPUCLK  
output from the STR91xFA and is input to the external JTAG test equipment to hold off  
transitions of JTCK until the CPU core is ready, meaning that the JTAG equipment cannot send  
the next rising edge of JTCK until the equipment receives a rising edge of JRTCK from the  
STR91xFA. The JTAG test equipment must be able to interpret the signal JRTCK and perform  
this adaptive clocking function. If it is known that the CPU clock will always be at least ten times  
faster than the incoming JTCK clock signal, then the JRTCK signal is not needed.  
The two die inside the STR91xFA (CPU die and Flash memory die) are internally daisy-chained  
on the JTAG bus, see Figure 3 on page 22. The CPU die has two JTAG Test Access Ports  
(TAPs), one for boundary scan functions and one for ARM CPU debug. The Flash memory die  
has one TAP for program/erase of non-volatile memory. Because these three TAPs are daisy-  
chained, only one TAP will converse on the JTAG bus at any given time while the other two  
TAPs are in BYPASS mode. The TAP positioning order within this JTAG chain is the boundary  
scan TAP first, followed by the ARM debug TAP, followed by the Flash TAP. All three TAP  
controllers are reset simultaneously by one of two methods:  
A chip-level global reset, caused only by a Power-On-Reset (POR) or a Low Voltage  
Detect (LVD).  
A reset command issued by the external JTAG test equipment. This can be the assertion  
of the JTAG JTRSTn input pin on the STR91xFA or a JTAG reset command shifted into the  
STR91xFA serially.  
This means that chip-level system resets from watchdog time-out or the assertion of  
RESET_INn pin do not affect the operation of any JTAG TAP controller. Only global resets  
effect the TAPs.  
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Functional overview  
STR91xFA  
Figure 3. JTAG chaining inside the STR91xFA  
STR91xx  
BURST FLASH  
MEMORY DIE  
MAIN FLASH  
SECONDARY FLASH  
JTAG  
Instruction  
register length  
is 8 bits  
JTAG TAP CONTROLLER #3  
TDI  
TDO  
TMS TCK TRST  
JTDO  
JTRSTn  
JTCK  
JTMS  
JTDI  
ARM966ES DIE  
JRTCK  
JTAG  
Instruction  
TMS TCK TRST  
TDO  
TMS  
TDO  
TDI  
TDI  
TRST TCK  
register length:  
5 bits for TAP #1  
4 bits for TAP #2  
JTAG TAP CONTROLLER #1  
JTAG TAP CONTROLLER #2  
BOUNDARY SCAN  
CPU DEBUG  
2.15.1 In-system-programming  
The JTAG interface is used to program or erase all memory areas of the STR91xFA device. The  
pin RESET_INn must be asserted during ISP to prevent the CPU from fetching invalid  
instructions while the Flash memories are being programmed.  
Note that the 32 bytes of OTP memory locations cannot be erased by any means once  
programmed by JTAG ISP or the CPU.  
2.15.2 Boundary scan  
Standard JTAG boundary scan testing compliant with IEEE-1149.1 is available on the majority  
of pins of the STR91xFA for circuit board test during manufacture of the end product.  
STR91xFA pins that are not serviced by boundary scan are the following:  
JTAG pins JTCK, JTMS, JTDI, JTDO, JTRSTn, JRTCK  
Oscillator input pins X1_CPU, X2_CPU, X1_RTC, X2_RTC  
Tamper detect input pin TAMPER_IN (128-pin and 144-pin packages only)  
2.15.3 CPU debug  
The ARM966E-S CPU core has standard ARM EmbeddedICE-RT logic, allowing the  
STR91xFA to be debugged through the JTAG interface. This provides advanced debugging  
features making it easier to develop application firmware, operating systems, and the hardware  
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STR91xFA  
Functional overview  
itself. Debugging requires that an external host computer, running debug software, is connected  
to the STR91xFA target system via hardware which converts the stream of debug data and  
commands from the host system’s protocol (USB, Ethernet, etc.) to the JTAG EmbeddedICE-  
RT protocol on the STR91xFA. These protocol converters are commercially available and  
operate with debugging software tools.  
The CPU may be forced into a Debug State by a breakpoint (code fetch), a watchpoint (data  
access), or an external debug request over the JTAG channel, at which time the CPU core and  
memory system are effectively stopped and isolated from the rest of the system. This is known  
as Halt Mode and allows the internal state of the CPU core, memory, and peripherals to be  
examined and manipulated. Typical debug functions are supported such as run, halt, and  
single-step. The EmbeddedICE-RT logic supports two hardware compare units. Each can be  
configured to be either a watchpoint or a breakpoint. Breakpoints can also be data-dependent.  
Debugging (with some limitations) may also occur through the JTAG interface while the CPU is  
running full speed, known as Monitor Mode. In this case, a breakpoint or watchpoint will not  
force a Debug State and halt the CPU, but instead will cause an exception which can be tracked  
by the external host computer running monitor software. Data can be sent and received over  
the JTAG channel without affecting normal instruction execution. Time critical code, such as  
Interrupt Service Routines may be debugged real-time using Monitor Mode.  
2.15.4 JTAG security bit  
This is a non-volatile bit (Flash memory based), which when set will not allow the JTAG  
debugger or JTAG programmer to read the Flash memory contents.  
Using JTAG ISP, this bit is typically programmed during manufacture of the end product to  
prevent unwanted future access to firmware intellectual property. The JTAG Security Bit can be  
cleared only by a JTAG “Full Chip Erase” command, making the STR91xFA device blank and  
ready for programming again. The CPU can read the status of the JTAG Security Bit, but it may  
not change the bit value.  
2.16 Embedded trace module (ARM ETM9, v. r2p2)  
The ETM9 interface provides greater visibility of instruction and data flow happening inside the  
CPU core by streaming compressed data at a very high rate from the STR91xFA though a  
small number of ETM9 pins to an external Trace Port Analyzer (TPA) device. The TPA is  
connected to a host computer using USB, Ethernet, or other high-speed channel. Real-time  
instruction flow and data activity can be recorded and later formatted and displayed on the host  
computer running debugger software, and this software is typically integrated with the debug  
software used for EmbeddedICE-RT functions such as single-step, breakpoints, etc. Tracing  
may be triggered and filtered by many sources, such as instruction address comparators, data  
watchpoints, context ID comparators, and counters. State sequencing of up to three triggers is  
also provided. TPA hardware is commercially available and operates with debugging software  
tools.  
The ETM9 interface is nine pins total, four of which are data lines, and all pins can be used for  
GPIO after tracing is no longer needed. The ETM9 interface is used in conjunction with the  
JTAG interface for trace configuration. When tracing begins, the ETM9 engine compresses the  
data by various means before broadcasting data at high speed to the TPA over the four data  
lines. The most common ETM9 compression technique is to only output address information  
when the CPU branches to a location that cannot be inferred from the source code. This means  
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Functional overview  
STR91xFA  
the host computer must have a static image of the code being executed for decompressing the  
ETM9 data. Because of this, self-modified code cannot be traced.  
2.17 Ethernet MAC interface with DMA  
STR91xFA devices in 128-pin and 144-ball packages provide an IEEE-802.3-2002 compliant  
Media Access Controller (MAC) for Ethernet LAN communications through an industry  
standard Medium Independent Interface (MII). The STR91xFA requires an external Ethernet  
physical interface device (PHY) to connect to the physical LAN bus (twisted-pair, fiber, etc.).  
The PHY is connected to the STR91xFA MII port using as many as 18 signals (see pins which  
have signal names MII_* in Table 5).  
The MAC corresponds to the OSI Data Link layer and the PHY corresponds to the OSI Physical  
layer. The STR91xFA MAC is responsible for:  
Data encapsulation, including frame assembly before transmission, and frame parsing/  
error detection during and after reception.  
Media access control, including initiation of frame transmission and recover from  
transmission failure.  
The STR91xFA MAC includes the following features:  
Supports 10 and 100 Mbps rates  
Tagged MAC frame support (VLAN support)  
Half duplex (CSMA/CD) and full duplex operation  
MAC control sublayer (control frames) support  
32-bit CRC generation and removal  
Several address filtering modes for physical and multicast address (multicast and group  
addresses)  
32-bit status code for each transmitted or received frame  
Internal FIFOs to buffer transmit and receive frames. Transmit FIFO depth is 4 words (32  
bits each), and the receive FIFO is 16 words deep.  
A 32-bit burst DMA channel residing on the AHB is dedicated to the Ethernet MAC for high-  
speed data transfers, side-stepping the CPU for minimal CPU impact during transfers. This  
DMA channel includes the following features:  
Direct SRAM to MAC transfers of transmit frames with the related status, by descriptor  
chain  
Direct MAC to SRAM transfers of receive frames with the related status, by descriptor  
chain  
Open and Closed descriptor chain management  
2.18 USB 2.0 slave device interface with DMA  
The STR91xFA provides a USB slave controller that implements both the OSI Physical and  
Data Link layers for direct bus connection by an external USB host on pins USBDP and  
USBPN. The USB interface detects token packets, handles data transmission and reception,  
and processes handshake packets as required by the USB 2.0 standard.  
The USB slave interface includes the following features:  
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STR91xFA  
Functional overview  
Supports USB low and full-speed transfers (12 Mbps), certified to comply with the USB 2.0  
specification  
Supports isochronous, bulk, control, and interrupt endpoints  
Configurable number of endpoints allowing a mixture of up to 20 single-buffered  
monodirectional endpoints or up to 10 double-buffered bidirectional endpoints  
Dedicated, dual-port 2 Kbyte USB Packet Buffer SRAM. One port of the SRAM is  
connected by a Packet Buffer Interface (PBI) on the USB side, and the CPU connects to  
the other SRAM port.  
CRC generation and checking  
NRZI encoding-decoding and bit stuffing  
USB suspend resume operations  
2.18.1 Packet buffer interface (PBI)  
The PBI manages a set of buffers inside the 2 Kbyte Packet Buffer, both for transmission and  
reception. The PBI will choose the proper buffer according to requests coming from the USB  
Serial Interface Engine (SIE) and locate it in the Packet SRAM according to addresses pointed  
by endpoint registers. The PBI will also auto-increment the address after each exchanged byte  
until the end of packet, keeping track of the number of exchanged bytes and preventing buffer  
overrun. Special support is provided by the PBI for isochronous and bulk transfers,  
implementing double-buffer usage which ensures there is always an available buffer for a USB  
packet while the CPU uses a different buffer.  
2.18.2 DMA  
A programmable DMA channel may be assigned by CPU firmware to service the USB interface  
for fast and direct transfers between the USB bus and SRAM with little CPU involvement. This  
DMA channel includes the following features:  
Direct USB Packet Buffer SRAM to system SRAM transfers of receive packets, by  
descriptor chain for bulk or isochronous endpoints.  
Direct system SRAM to USB Packet Buffer SRAM transfers of transmit packets, by  
descriptor chain for bulk or isochronous endpoints.  
Linked-list descriptor chain support for multiple USB packets  
2.18.3 Suspend mode  
CPU firmware may place the USB interface in a low-power suspend mode when required, and  
the USB interface will automatically wake up asynchronously upon detecting activity on the  
USB pins.  
2.19 CAN 2.0B interface  
The STR91xFA provides a CAN interface complying with CAN protocol version 2.0 parts A and  
B. An external CAN transceiver device connected to pins CAN_RX and CAN_TX is required for  
connection to the physical CAN bus.  
The CAN interface manages up to 32 Message Objects and Identifier Masks using a Message  
SRAM and a Message Handler. The Message Handler takes care of low-level CAN bus activity  
such as acceptance filtering, transfer of messages between the CAN bus and the Message  
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Functional overview  
STR91xFA  
SRAM, handling of transmission requests, and interrupt generation. The CPU has access to  
the Message SRAM via the Message Handler using a set of 38 control registers.  
The follow features are supported by the CAN interface:  
Bitrates up to 1 Mbps  
Disable Automatic Retransmission mode for Time Triggered CAN applications  
32 Message Objects  
Each Message Object has its own Identifier Mask  
Programmable FIFO mode  
Programmable loopback mode for self-test operation  
The CAN interface is not supported by DMA.  
2.20 UART interfaces with DMA  
The STR91xFA supports three independent UART serial interfaces, designated UART0,  
UART1, and UART2. Each interface is very similar to the industry-standard 16C550 UART  
device. All three UART channels support IrDA encoding/decoding, requiring only an external  
LED transceiver to pins UARTx_RX and UARTx_Tx for communication. One UART channel  
(UART0) supports full modem control signals.  
UART interfaces include the following features:  
Maximum baud rate of 1.5 Mbps  
Separate FIFOs for transmit and receive, each 16 deep, each FIFO can be disabled by  
firmware if desired  
Programmable FIFO trigger levels between 1/8 and 7/8  
Programmable baud rate generator based on CCU master clock, or CCU master clock  
divided by two  
Programmable serial data lengths of 5, 6, 7, or 8 bits with start bit and 1 or 2 stop bits  
Programmable selection of even, odd, or no-parity bit generation and detection  
False start-bit detection  
Line break generation and detection  
Support of IrDA SIR ENDEC functions for data rates of up to 115.2K bps  
IrDA bit duration selection of 3/16 or low-power (1.14 to 2.23 µsec)  
Channel UART0 supports modem control functions CTS, DCD, DSR, RTS, DTR, and RI  
For your reference, only two standard 16550 UART features are not supported, 1.5 stop bits  
and independent receive clock.  
2.20.1 DMA  
A programmable DMA channel may be assigned by CPU firmware to service channels UART0  
and UART1 for fast and direct transfers between the UART bus and SRAM with little CPU  
involvement. Both DMA single-transfers and DMA burst-transfers are supported for transmit  
and receive. Burst transfers require that UART FIFOs are enabled.  
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STR91xFA  
Functional overview  
2.21 I2C interfaces with DMA  
The STR91xFA supports two independent I2C serial interfaces, designated I2C0, and I2C1.  
Each interface allows direct connection to an I2C bus as either a bus master or bus slave  
device (firmware configurable). I2C is a two-wire communication channel, having a bi-  
directional data signal and a single-directional clock signal based on open-drain line drivers,  
requiring external pull-up resistors.  
Byte-wide data is transferred between a Master device and a Slave device on two wires. More  
than one bus Master is allowed, but only one Master may control the bus at any given time.  
Data is not lost when another Master requests the use of a busy bus because I2C supports  
collision detection and arbitration. More than one Slave device may be present on the bus, each  
having a unique address. The bus Master initiates all data movement and generates the clock  
that permits the transfer. Once a transfer is initiated by the Master, any device that is addressed  
is considered a Slave. Automatic clock synchronization allows I2C devices with different bit  
rates to communicate on the same physical bus. A single device can play the role of Master or  
Slave, or a single device can be a Slave only. A Master or Slave device has the ability to  
suspend data transfers if the device needs more time to transmit or receive data.  
Each I2C interface on the STR91xFA has the following features:  
Programmable clock supports various rates up to I2C Standard rate (100 KHz) or Fast rate  
(400 KHz).  
Serial I/O Engine (SIOE) takes care of serial/parallel conversion; bus arbitration; clock  
generation and synchronization; and handshaking  
Multi-master capability  
7-bit or 10-bit addressing  
2.21.1 DMA  
A programmable DMA channel may be assigned by CPU firmware to service each I2C channel  
for fast and direct transfers between the I2C bus and SRAM with little CPU involvement. Both  
DMA single-transfers and DMA burst-transfers are supported for transmit and receive.  
2.22 SSP interfaces (SPI, SSI, and Microwire) with DMA  
The STR91xFA supports two independent Synchronous Serial Port (SSP) interfaces,  
designated SSP0, and SSP1. Primary use of each interface is for supporting the industry  
standard Serial Peripheral Interface (SPI) protocol, but also supporting the similar Synchronous  
Serial Interface (SSI) and Microwire communication protocols.  
SPI is a three or four wire synchronous serial communication channel, capable of full-duplex  
operation. In three-wire configuration, there is a clock signal, and two data signals (one data  
signal from Master to Slave, the other from Slave to Master). In four-wire configuration, an  
additional Slave Select signal is output from Master and received by Slave.  
The SPI clock signal is a gated clock generated from the Master and regulates the flow of data  
bits. The Master may transmit at a variety of baud rates, up to 24 MHz  
In multi-Slave operation, no more than one Slave device can transmit data at any given time.  
Slave selection is accomplished when a Slave’s “Slave Select” input is permanently grounded  
or asserted active-low by a Master device. Slave devices that are not selected do not interfere  
with SPI activities. Slave devices ignore the clock signals and keep their data output pins in  
27/78  
Functional overview  
STR91xFA  
high-impedance state when not selected. The STR91xFA supports SPI multi-Master operation  
because it provides collision detection.  
Each SSP interface on the STR91xFA has the following features:  
Full-duplex, three or four-wire synchronous transfers  
Master or Slave operation  
Programmable clock bit rate with prescaler, up to 24 MHz for Master mode and 4 MHz for  
Slave mode  
Separate transmit and receive FIFOs, each 16-bits wide and 8 locations deep  
Programmable data frame size from 4 to 16 bits  
Programmable clock and phase polarity  
Specifically for Microwire protocol:  
Half-duplex transfers using 8-bit control message  
Specifically for SSI protocol:  
Full-duplex four-wire synchronous transfer  
Transmit data pin tri-stateable when not transmitting  
2.22.1 DMA  
A programmable DMA channel may be assigned by CPU firmware to service each SSP  
channel for fast and direct transfers between the SSP bus and SRAM with little CPU  
involvement. Both DMA single-transfers and DMA burst-transfers are supported for transmit  
and receive. Burst transfers require that FIFOs are enabled.  
2.23 General purpose I/O  
There are up to 80 GPIO pins available on 10 I/O ports for 128-pin and 144-ball devices, and up  
to 40 GPIO pins on 5 I/O ports for 80-pin devices. Each and every GPIO pin by default (during  
and just after a reset condition) is in high-impedance input mode, and some GPIO pins are  
additionally routed to certain peripheral function inputs. CPU firmware may initialize GPIO pins  
to have alternate input or output functions as listed in Table 5. At any time, the logic state of any  
GPIO pin may be read by firmware as a GPIO input, regardless of its reassigned input or output  
function.  
Bit masking is available on each port, meaning firmware may selectively read or write individual  
port pins, without disturbing other pins on the same port during a write.  
Firmware may designate each GPIO pin to have open-drain or push-pull characteristics.  
All GPIO pins are 5V tolerant, meaning in they can drive a voltage level up to V  
safely driven by a voltage up to 5.5V.  
, and can be  
DDQ  
There are no internal pull-up or pull-down resistors on GPIO pins. As such, it is recommended  
to ground, or pull up to V with a 100Kresistor, all unused GPIO pins to minimize power  
DDQ  
consumption and noise generation.  
28/78  
STR91xFA  
Functional overview  
2.24 A/D converter (ADC) with DMA  
The STR91xFA provides an eight-channel, 10-bit successive approximation analog-to-digital  
converter. The ADC input pins are multiplexed with other functions on Port 4 as shown in  
Table 5. Following are the major ADC features:  
Fast conversion time, as low as 0.7 usec  
Accuracy. Integral and differential non-linearity are typically within 4 conversion counts.  
0 to 3.6V input range. External reference voltage input pin (AVREF) available on 128-pin  
packages for better accuracy on low-voltage inputs. See Table 7: Operating conditions, for  
restrictions to the relative voltage levels of VDDQ, AVDD, AVREF, and AVREF_AVDD.  
CPU Firmware may convert one ADC input channel at a time, or it has the option to set the  
ADC to automatically scan and convert all eight ADC input channels sequentially before  
signalling an end-of-conversion  
Automatic continuous conversion mode is available for any number of designated ADC  
input channels  
Analog watchdog mode provides automatic monitoring of any ADC input, comparing it  
against two programmable voltage threshold values. The ADC unit will set a flag or it will  
interrupt the CPU if the input voltage rises above the higher threshold, or drops below the  
lower threshold.  
The ADC unit goes to stand-by mode (very low-current consumption) after any reset event.  
CPU firmware may also command the ADC unit to stand-by mode at any time.  
ADC conversion can be started or triggered by software command as well as triggers from  
Timer/Counter (TIM), Motor Controller and input from external pin.  
2.24.1 DMA  
A programmable DMA channel may be assigned by CPU firmware to service each ADC  
conversion result for fast DMA single-transfer.  
2.25 Standard timers (TIM) with DMA  
The STR91xFA has four independent, free-running 16-bit timer/counter modules designated  
TIM0, TIM1, TIM2, and TIM3. Each general purpose timer/counter can be configured by  
firmware for a variety of tasks including; pulse width and frequency measurement (input  
capture), generation of waveforms (output compare and PWM), event counting, delay timing,  
and up/down counting.  
Each of the four timer units have the following features:  
16-bit free running timer/counter  
Internal timer/counter clock source from a programmable 8-bit prescale of the CCU PCLK  
clock output  
Optional external timer/counter clock source from pin P2.4 shared by TIM0/TIM1, and pin  
P2.5 shared by TIM2/TIM3. Frequency of these external clocks must be at least 4 times  
less the frequency of the internal CCU PCLK clock output.  
Two dedicated 16-bit Input Capture registers for measuring up to two input signals. Input  
Capture has programmable selection of input signal edge detection  
Two dedicated 16-bit Output Compare registers for generation up to two output signals  
PWM output generation with 16-bit resolution of both pulse width and frequency  
29/78  
Functional overview  
STR91xFA  
One pulse generation in response to an external event  
A dedicated interrupt to the CPU with five interrupt flags  
The OCF1 flag (Output Compare 1) from the timer can be configured to trigger an ADC  
conversion  
2.25.1 DMA  
A programmable DMA channel may be assigned by CPU firmware to service each timer/  
counter module TIM0 and TIM1 for fast and direct single transfers.  
2.26 Three-phase induction motor controller (IMC)  
The STR91xFA provides an integrated controller for variable speed motor control applications.  
Six PWM outputs are generated on high current drive pins P6.0 to P6.5 for controlling a three-  
phase AC induction motor drive circuit assembly. Rotor speed feedback is provided by  
capturing a tachometer input signal on pin P6.6, and an asynchronous hardware emergency  
stop input is available on pin P6.7 to stop the motor immediately if needed, independently of  
firmware.  
The IMC unit has the following features:  
Three PWM outputs generated using a 10 or 16-bit PWM counter, one for each phase U,  
V, W. Complimentary PWM outputs are also generated for each phase.  
Choice of classic or zero-centered PWM generation modes  
10 or 16-bit PWM counter clock is supplied through a programmable 8-bit prescaler of the  
APB clock.  
Programmable 6 or 10-bit dead-time generator to add delay to each of the three  
complimentary PWM outputs  
8-bit repetition counter  
Automatic rotor speed measurement with 16-bit resolution. Schmitt trigger tachometer  
input with programmable edge detection  
Hardware asynchronous emergency stop input  
A dedicated interrupt to CPU with eight flags  
Enhanced Motor stop output polarity configuration  
Double update option when PWM counter reaches the max and min values in Zero-  
centered mode  
Locking feature to prevent some control register bits from being advertently modified  
Trigger output to start an ADC conversion  
2.27 External memory interface (EMI)  
STR91xFA devices in 128-pin and 144-ball packages offer an external memory bus for  
connecting external parallel peripherals and memories. The EMI bus resides on ports 7, 8, and  
9 and operates with either an 8 or 16-bit data path. The configuration of 8 or 16 bit mode is  
specified by CPU firmware writing to configuration registers at run-time. If the application does  
not use the EMI bus, then these port pins may be used for general purpose I/O as shown in  
Table 5.  
30/78  
STR91xFA  
Functional overview  
The EMI has the following features:  
Supports static asynchronous memory access cycles, including page mode for non-mux  
operation. The bus control signals include:  
EMI_RDn - read signal, x8 or x16 mode  
EMI_BWR_WRLn - write signal in x8 mode and write low byte signal in x16 mode  
EMI_WRHn - write high byte signal in x16 mode  
EMI_ALE - address latch signal for x8 or x16 mux bus mode with programmable  
polarity  
Four configurable memory regions, each with a chip select output (EMI_CS0n ...  
EMI_CS3n)  
Programmable wait states per memory region for both write and read operations  
16-bit multiplexed data mode (Figure 4): 16 bits of data and 16 bits of low-order address  
are multiplexed together on ports 8 and 9, while port 7 contains eight more high-order  
address signals. The output signal on pin EMI_ALE is used to demultiplex the signals on  
ports 8 and 9, and the polarity of EMI_ALE is programmable. The output signals on pins  
EMI_BWR_WRLn and EMI_WRHn are the write strobes for the low and high data bytes  
respectively. The output signal EMI_RDn is the read strobe for both the low and high data  
bytes.  
8-bit multiplexed data mode: This is a variant of the 16-bit multiplexed mode. Although  
this mode can provide 24 bits of address and 8 bits of data, it does require an external  
latch device on Port 8. However, this mode is most efficient when connecting devices that  
only require 8 bits of address on an 8-bit multiplexed address/data bus, and have simple  
read, write, and latch inputs as shown in Figure 5  
To use all 24 address bits, the following applies: 8 bits of lowest-order data and 8 bits of  
lowest-order address are multiplexed on port 8. On port 9, 8-bits of mid-order address are  
multiplexed with 8 bits of data, but these 8 data values are always at logic zero on this port  
during a write operation, and these 8 data bits are ignored during a read operation. An  
external latch device (such as a ‘373 latch) is needed to de-multiplex the mid-order 8  
address bits that are generated on port 8. Port 7 outputs the 8 highest-order address  
signals directly (not multiplexed). The output signal on pin EMI_ALE is used to demultiplex  
the signals on ports 8 and 9, and the polarity of EMI_ALE is programmable. The output  
signal on pin EMI_BWR_WRLn is the data write strobe, and the output on pin EMI_RDn is  
the data read strobe.  
8-bit non-multiplexed data mode (Figure 6): Eight bits of data are on port 8, while 16 bits  
of address are output on ports 7 and 9. The output signal on pin EMI_BWR_BWLn is the  
data write strobe and the output on pin EMI_RDn is the data read strobe.  
Burst Mode Support (LFBGA package only): The EMI bus supports synchronized burst  
read and write bus cycle in multiplexed and non-multiplexed mode. The additional EMI  
signals in the LFBGA package that support the burst mode are:  
EMI_BCLK -the bus clock output. The EMI_BCLK has the same frequency or half of  
that of the HCLK and can be disabled by the user  
EMI_WAITn - the not ready or wait input signal for synchronous access  
EMI_BAAn - burst address advance or burst enable signal  
EMI_WEn - write enable signal  
EMI_UBn, EMI_LBn - upper byte and lower byte enable signals. These two signals  
share the same pins as the EMI_WRLn and EMI_WRHn and are user configurable  
through the EMI register.  
31/78  
Functional overview  
STR91xFA  
By defining the bus parameters such as burst length, burst type, read and write timings in  
the EMI control registers, the EMI bus is able to interface to standard burst memory  
devices. The burst timing specification and waveform will be provided in the next data  
sheet release  
Figure 4. EMI 16-bit multiplexed connection example  
STR91xx  
16-BIT  
DEVICE  
EMI_CS3n  
EMI_CS2n  
EMI_CS1n  
EMI_CS0n  
CHIP_SELECT  
EMI_WRHn  
WRITE_HIGH_BYTE  
WRITE_LOW_BYTE  
EMI_BWR_WRLn  
EMI_RDn  
READ  
EMI_ALE  
ADDR_LATCH  
P7.7  
P7.6  
P7.5  
P7.4  
P7.3  
P7.2  
P7.1  
P7.0  
EMI_A23  
EMI_A22  
EMI_A21  
EMI_A20  
EMI_A19  
EMI_A18  
EMI_A17  
EMI_A16  
A23  
A22  
A21  
A20  
A19  
A18  
A17  
A16  
P9.7  
P9.6  
P9.5  
P9.4  
P9.3  
P9.2  
P9.1  
P9.0  
EMI_AD15  
EMI_AD14  
EMI_AD13  
EMI_AD12  
EMI_AD11  
EMI_AD10  
EMI_AD9  
EMI_AD8  
AD15  
AD14  
AD13  
AD12  
AD11  
AD10  
AD9  
AD8  
P8.7  
P8.6  
P8.5  
P8.4  
P8.3  
P8.2  
P8.1  
P8.0  
EMI_AD7  
EMI_AD6  
EMI_AD5  
EMI_AD4  
EMI_AD3  
EMI_AD2  
EMI_AD1  
EMI_AD0  
AD7  
AD6  
AD5  
AD4  
AD3  
AD2  
AD1  
AD0  
Figure 5. EMI 8-bit multiplexed connection example  
STR91xx  
8-BIT  
DEVICE  
EMI_CS3n  
EMI_CS2n  
EMI_CS1n  
EMI_CS0n  
CHIP_SELECT  
EMI_BWR_WRLn  
EMI_RDn  
EMI_ALE  
WRITE  
READ  
ADDR_LATCH  
P8.7  
EMI_AD7  
P8.6  
AD7  
AD6  
AD5  
AD4  
AD3  
AD2  
AD1  
AD0  
EMI_AD6  
P8.5  
EMI_AD5  
P8.4  
EMI_AD4  
P8.3  
EMI_AD3  
P8.2  
EMI_AD2  
P8.1  
EMI_AD1  
P8.0  
EMI_AD0  
32/78  
STR91xFA  
Functional overview  
Figure 6. EMI 8-bit non-multiplexed connection example  
STR91xx  
8-BIT  
DEVICE  
EMI_CS3n  
EMI_CS2n  
EMI_CS1n  
EMI_CS0n  
CHIP_SELECT  
EMI_BWR_WRLn  
EMI_RDn  
WRITE  
READ  
P9.7  
P9.6  
P9.5  
P9.4  
P9.3  
P9.2  
P9.1  
P9.0  
EMI_A15  
EMI_A14  
EMI_A13  
EMI_A12  
EMI_A11  
EMI_A10  
EMI_A9  
A15  
A14  
A13  
A12  
A11  
A10  
A9  
EMI_A8  
A8  
P7.7  
P7.6  
P7.5  
P7.4  
P7.3  
P7.2  
P7.1  
P7.0  
EMI_A7  
EMI_A6  
EMI_A5  
EMI_A4  
EMI_A3  
EMI_A2  
EMI_A1  
EMI_A0  
A7  
A6  
A5  
A4  
A3  
A2  
A1  
A0  
P8.7  
P8.6  
P8.5  
P8.4  
P8.3  
P8.2  
P8.1  
P8.0  
EMI_D7  
EMI_D6  
EMI_D5  
EMI_D4  
EMI_D3  
EMI_D2  
EMI_D1  
EMI_D0  
D7  
D6  
D5  
D4  
D3  
D2  
D1  
D0  
33/78  
Related documentation  
STR91xFA  
3
Related documentation  
Available from www.arm.com:  
ARM966E-S Rev 2 Technical Reference Manual  
Available from www.st.com:  
STR91xFA Reference Manual  
STR9 Flash Programming Manual (PM0020)  
The above is a selected list only, a full list STR91xFA application notes can be viewed at  
http://www.st.com.  
34/78  
STR91xFA  
Pin description  
4
Pin description  
Figure 7. STR91xFAM 80-pin package pinout  
P4.3  
P4.2  
P4.1  
1
2
3
4
5
6
7
8
9
60 USBDP (1)  
59 USBDN (1)  
58 P6.7  
P4.0  
57 P6.6  
VSS_VSSQ  
VDDQ  
P2.0  
56 RESET_INn  
55 VSSQ  
54 VDDQ  
53 P6.5  
P2.1  
P5.0  
52 P6.4  
VSS 10  
VDD 11  
P5.1 12  
P6.2 13  
P6.3 14  
VDDQ 15  
VSSQ 16  
P5.2 17  
P5.3 18  
P6.0 19  
P6.1 20  
STR91xFAM  
80-pin LQFP  
51 VSS  
50 VDD  
49 P5.7  
48 P5.6  
47 P5.5  
46 VDDQ  
45 VSSQ  
44 P5.4  
43 P3.7  
42 P3.6  
41 P3.5  
1) NU (Not Used) on STR910FAM devices. Pin 59 is not connected, pin 60 must be pulled up by a 1.5Kohm resistor to VDDQ.  
2) No USBCLK function on STR910FAM devices.  
35/78  
Pin description  
STR91xFA  
Figure 8. STR91xFAW 128-pin package pinout  
96  
95  
94  
93  
92  
91  
90  
89  
88  
87  
86  
85  
84  
83  
82  
81  
80  
79  
78  
77  
76  
75  
74  
73  
72  
71  
70  
69  
68  
67  
66  
65  
USBDP (1)  
USBDN (1)  
MII_MDIO (1)  
P6.7  
P6.6  
TAMPER_IN  
P0.7  
RESET_INn  
P0.6  
VSSQ  
VDDQ  
P0.5  
P6.5  
P6.4  
VSS  
VDD  
P5.7  
P5.6  
P0.4  
P5.5  
P4.2  
P4.1  
P4.0  
AVSS  
P7.0  
P7.1  
1
2
3
4
5
6
7
8
P7.2  
VSSQ  
VDDQ  
P2.0  
P2.1  
P5.0  
P7.3  
P7.4  
P7.5  
VSS  
VDD  
P5.1  
P6.2  
P6.3  
9
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
26  
27  
28  
29  
30  
31  
32  
STR91xFAW  
128-pin LQFP  
P0.3  
EMI_BWR_WRLn  
EMI_WRHn  
VDDQ  
VSSQ  
(3) PHYCLK_P5.2  
P8.0  
EMI_RDn  
EMI_ALE  
VDDQ  
VSSQ  
P0.2  
P5.4  
P0.1  
P3.7  
P0.0  
P5.3  
P8.1  
P6.0  
P8.2  
P6.1  
P8.3  
P3.6  
P3.5  
1) NU (Not Used) on STR910FAW devices. Pin 95 is not connected, pin 96 must be pulled up by a 1.5Kohm resistor to VDDQ.  
2) No USBCLK function on STR910FAW devices.  
3) No PHYCLK function on STR910FAW devices.  
36/78  
STR91xFA  
Pin description  
4.1  
LFBGA144 ball connections  
In Table 4. balls labelled NC are no connect balls. These NC balls are reserved for future  
devices and should NOT be connected to ground or any other signal. There are total of 9  
NC (no connection) balls.  
Balls H1 and G4 are assigned as EMI bus write signals (EMI_BWR_WRLn and  
EMI_WRHn). These two balls can also be configured by the user as EMI low or high byte  
select signals (EMI_LBn and EMI_UBn).  
The PLLGND (B8) and PLLVDDQ (C9) balls can be connected to VSSQ and VDDQ.  
Table 4.  
STR91x LFBGA144 Ball Connections  
A
B
C
D
E
F
G
H
J
K
L
M
EMI_WRH  
n
PHYCLK_  
P4.2  
P7.2  
NC  
P7.0  
VDDQ  
P7.3  
P7.4  
VDDQ  
P8.0  
P2.2  
1
(3)  
P5.2  
(EMI_UBn)  
AVREF  
AVDD  
P4.1  
P4.3  
P4.0  
P7.1  
NC  
P2.0  
P2.1  
NC  
P6.2  
P6.3  
P5.3  
P8.2  
P6.1  
P8.3  
P2.3  
VSSQ  
P8.4  
P8.6  
2
3
AVSS  
VSS  
P8.1  
VBATT  
EMI_BWR_  
WRLn  
P4.6  
P4.5  
P4.4  
VSSQ  
P5.0  
VDD  
P6.0  
P8.5  
VSSQ  
P2.4  
X2_RTC  
4
(EMI_LBn)  
P7.7  
VDDQ  
JTDO  
VSSQ  
JTDI  
P4.7  
P1.7  
P7.5  
P7.6  
NC  
VSSQ  
VSS  
P9.4  
P2.5  
P9.3  
P8.7  
P9.2  
VDDQ  
VDD  
X1_RTC  
P9.0  
5
6
JTMS  
P5.1  
P2.6  
USBCLK_  
7
8
P1.5  
P1.4  
PLLVSSQ  
P1.2  
NC  
P1.3  
VDD  
JRSTn  
VDDQ  
VSS  
JTCK  
P6.6  
P1.6  
VSSQ  
VDDQ  
NC  
P6.5  
P6.4  
NC  
VDDQ  
EMI_BAAn  
P5.6  
VSSQ  
P3.3  
P3.0  
P9.1  
EMI_BCLK  
P9.6  
(2)  
P2.7  
EMI_WAIT  
n
VSSQ  
P9.5  
P3.4  
P3.5  
RESET_  
OUTn  
PLLVDDQ  
P1.1  
EMI_RDn  
EMI_ALE  
P9.7  
P0.1  
9
TAMPER_  
IN  
(1)  
X1_CPU  
P1.0  
VSS  
P0.4  
P3.1  
10  
USBDN  
MII_MDIO  
(1)  
(1)  
11  
12  
X2_CPU  
JRTCK  
P0.7  
P0.6  
NC  
P0.5  
NC  
VDD  
P5.7  
P5.5  
P0.3  
P0.2  
P5.4  
P3.7  
P0.0  
P3.2  
P3.6  
USBDP  
EMI_WEn  
RESET_INn  
P6.7  
VDDQ  
VSSQ  
1) NU (Not Used) on STR910FAW devices. D10 is not connected, C11 must be pulled up by a 1.5 kOhm resistor to VDDQ.  
2) No USBCLK function on STR910FAW devices.  
3) No PHYCLK function on STR910FAW devices.  
37/78  
Pin description  
STR91xFA  
4.2  
Default pin functions  
During and just after reset, all pins on ports 0-9 default to high-impedance input mode until  
CPU firmware assigns other functions to the pins. This initial input mode routes all pins on ports  
0-9 to be read as GPIO inputs as shown in the “Default Pin Function” column of Table 5.  
Simultaneously, certain port pin signals are also routed to other functional inputs as shown in  
the “Default Input Function” column of Table 5, and these pin input functions will remain until  
CPU firmware makes other assignments. At any time, even after the CPU assigns pins to  
alternate functions, the CPU may always read the state of any pin on ports 0-9 as a GPIO input.  
CPU firmware may assign alternate functions to port pins as shown in columns “Alternate Input  
1” or “Alternate Output 1, 2, 3” of Table 5 by writing to control registers at run-time.  
Notes for Table 5:  
Notes:1 STMicroelectronics advises to ground, or pull up to V  
using a 100 Kresistor, all unused  
DDQ  
pins on port 0 - 9 to reduce noise susceptibility, noise generation, and minimize power  
consumption. There are no internal or programmable pull-up resistors on ports 0-9.  
2 All pins on ports 0 - 9 are 5V tolerant  
3 Pins on ports 0,1,2,4,5,7,8,9 have 4 mA drive and 4mA sink. Ports 3 and 6 have 8 mA drive and  
8 mA sink.  
4 For 8-bit non-muxed EMI operation: Port 8 is eight bits of data, ports 7 and 9 are 16 bits of  
address.  
5 For 16-bit muxed EMI operation: Ports 8 and 9 are 16 bits of muxed address and data bits, port  
7 is up to eight additional bits of high-order address  
6 Signal polarity is programmable for interrupt request inputs, EMI_ALE, timer input capture  
inputs and output compare/PWM outputs, motor control tach and emergency stop inputs, and  
motor control phase outputs.  
7 HiZ = High Impedance, V = Voltage Source, G = Ground, I/O = Input/Output  
8 STR910FA devices do not support USB. On these devices USBDP and USBDN signals are  
"Not Used" (USBDN is not connected, USBDP must be pulled up by a 1.5K ohm resistor to  
VDDQ), and all functions named “USB" are not available.  
9 STR910FA 128-pin and 144-ball devices do not support Ethernet. On these devices PHYCLK  
and all functions named “MII*" are not available.  
Table 5.  
Device pin description  
Pkg  
Alternate functions  
Default Pin Default Input  
Pin Name  
Alternate  
Input 1  
Alternate  
Output 1  
Alternate  
Output 2  
Alternate  
Output 3  
Function  
Function  
GPIO_0.0,  
MII_TX_CLK,  
GPIO_0.0,  
GP Output  
I2C0_CLKIN, I2C  
I2C0_CLKOUT,I2C ETM_PCK0, ETM  
-
-
-
-
-
67 L11  
69 K10  
71 J11  
76 H12  
78 H10  
P0.0  
P0.1  
P0.2  
P0.3  
P0.4  
I/O  
I/O  
I/O  
I/O  
I/O  
clock in  
clock out  
Packet  
GP Input, HiZ  
PHY Xmit clock  
GPIO_0.1,  
I2C0_DIN,  
GPIO_0.1,  
GP Output  
I2C0_DOUT,  
I2C data out  
ETM_PCK1, ETM  
-
Packet  
GP Input, HiZ  
I2C data in  
GPIO_0.2,  
MII_RXD0,  
GPIO_0.2,  
GP Output  
I2C1_CLKIN, I2C  
I2C1_CLKOUT,I2C ETM_PCK2, ETM  
clock in  
clock out  
Packet  
GP Input, HiZ  
PHY Rx data0  
GPIO_0.3,  
MII_RXD1,  
I2C1_DIN,  
I2C data in  
GPIO_0.3,  
GP Output  
I2C1_DOUT,  
I2C data out  
ETM_PCK3, ETM  
Packet  
GP Input, HiZ  
PHY Rx data  
GPIO_0.4,  
MII_RXD2,  
TIM0_ICAP1,  
Input Capture  
GPIO_0.4,  
GP Output  
EMI_CS0n,  
ETM_PSTAT0,  
GP Input, HiZ  
PHY Rx data  
EMI Chip Select  
ETM pipe status  
38/78  
STR91xFA  
Pin description  
Pkg  
Alternate functions  
Default Pin Default Input  
Pin Name  
Alternate  
Input 1  
Alternate  
Output 1  
Alternate  
Output 2  
Alternate  
Output 3  
Function  
Function  
GPIO_0.5,  
GP Input, HiZ  
GPIO_0.6,  
MII_RXD3,  
PHY Rx data  
MII_RX_CLK,  
PHY Rx clock  
MII_RX_DV,  
TIM0_ICAP2,  
Input Capture  
TIM2_ICAP1,  
Input Capture  
TIM2_ICAP2,  
Input Capture  
GPIO_0.5,  
GP Output  
GPIO_0.6,  
GP Output  
GPIO_0.7,  
GP Output  
EMI_CS1n,  
EMI Chip Select  
EMI_CS2n,  
ETM_PSTAT1,  
ETM pipe status  
ETM_PSTAT2,  
ETM pipe status  
ETM_TRSYNC,  
ETM trace sync  
-
-
-
85 F11  
88 E11  
90 B12  
P0.5  
P0.6  
P0.7  
I/O  
I/O  
I/O  
GP Input, HiZ  
GPIO_0.7,  
EMI Chip Select  
EMI_CS3n,  
GP Input, HiZ  
PHY data valid  
EMI Chip Select  
GPIO_1.0,  
MII_RX_ER,  
PHY rcv error  
ETM_EXTRIG,  
ETM ext. trigger  
GPIO_1.0,  
GP Output  
UART1_TX,  
SSP1_SCLK,  
-
-
-
-
-
-
-
-
98 B10  
99 C10  
101 B9  
106 C8  
109 B7  
110 A7  
114 F7  
116 D6  
P1.0  
P1.1  
P1.2  
P1.3  
P1.4  
P1.5  
P1.6  
P1.7  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
GP Input, HiZ  
UART xmit data  
SSP mstr clk out  
GPIO_1.1,  
UART1_RX,  
GPIO_1.1,  
GP Output  
MII_TXD0,  
SSP1_MOSI,  
-
-
-
-
GP Input, HiZ  
UART rcv data  
MAC Tx data  
SSP mstr dat out  
GPIO_1.2,  
SSP1_MISO,  
GPIO_1.2,  
GP Output  
MII_TXD1,  
UART0_TX,  
GP Input, HiZ  
SSP mstr data in  
MAC Tx data  
UART xmit data  
GPIO_1.3,  
UART2_RX,  
GPIO_1.3,  
GP Output  
MII_TXD2,  
SSP1_NSS,  
GP Input, HiZ  
UART rcv data  
MAC Tx data  
SSP mstr sel out  
GPIO_1.4,  
GPIO_1.4,  
GP Output  
MII_TXD3,  
I2C0_CLKIN, I2C  
I2C0_CLKOUT,  
I2C clock out  
clock in  
GP Input, HiZ  
MAC Tx data  
GPIO_1.5,  
MII_COL,  
CAN_RX,  
GPIO_1.5,  
GP Output  
UART2_TX,  
ETM_TRCLK,  
GP Input, HiZ  
PHY collision  
CAN rcv data  
UART xmit data  
ETM trace clock  
GPIO_1.6,  
MII_CRS,  
I2C0_DIN,  
GPIO_1.6,  
GP Output  
CAN_TX,  
I2C0_DOUT,  
I2C data out  
GP Input, HiZ  
PHY carrier sns  
I2C data in  
CAN Tx data  
GPIO_1.7,  
ETM_EXTRIG,  
ETM ext. trigger  
GPIO_1.7,  
GP Output  
MII_MDC,  
ETM_TRCLK,  
-
GP Input, HiZ  
MAC mgt dat ck  
ETM trace clock  
GPIO_2.0,  
GP Input, HiZ  
GPIO_2.1,  
UART0_CTS,  
Clear To Send  
UART0_DSR,  
Data Set Ready  
UART0_DCD,  
Dat Carrier Det  
UART0_RI,  
GPIO_2.0,  
GP Output  
GPIO_2.1,  
GP Output  
GPIO_2.2,  
GP Output  
GPIO_2.3,  
GP Output  
GPIO_2.4,  
GP Output  
GPIO_2.5,  
GP Output  
GPIO_2.6,  
GP Output  
GPIO_2.7,  
GP Output  
I2C0_CLKIN, I2C  
I2C0_CLKOUT,I2C ETM_PCK0, ETM  
7
8
10 E2  
11 E3  
P2.0  
P2.1  
P2.2  
P2.3  
P2.4  
P2.5  
P2.6  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
clock in  
clock out  
Packet  
I2C0_DIN,  
I2C0_DOUT,  
I2C data out  
ETM_PCK1, ETM  
Packet  
GP Input, HiZ  
GPIO_2.2,  
I2C data in  
I2C1_CLKIN, I2C  
I2C1_CLKOUT,I2C ETM_PCK2, ETM  
21 33 M1  
22 35 K3  
23 37 L4  
29 45 J5  
32 53 G6  
33 54 L7  
clock in  
clock out  
Packet  
GP Input, HiZ  
GPIO_2.3,  
I2C1_DIN,  
I2C data in  
I2C1_DOUT,  
I2C data out  
ETM_PCK3, ETM  
Packet  
GP Input, HiZ  
GPIO_2.4,  
Ring Indicator  
SSP0_SCLK,  
SSP slv clk in  
SSP0_MOSI,  
SSP slv dat in  
SSP0_MISO,  
SSP mstr data in  
SSP0_NSS,  
SSP0_SCLK,  
SSP mstr clk out  
SSP0_MOSI,  
ETM_PSTAT0,  
ETM pipe status  
ETM_PSTAT1,  
EXTCLK_T0T1Ex  
t clk timer0/1  
GP Input, HiZ  
GPIO_2.5,  
EXTCLK_T2T3Ex  
t clk timer2/3  
GP Input, HiZ  
GPIO_2.6,  
SSP mstr dat out ETM pipe status  
SSP0_MISO,  
SSP slv data out  
SSP0_NSS,  
ETM_PSTAT2,  
ETM pipe status  
ETM_TRSYNC,  
ETM trace sync  
-
GP Input, HiZ  
GPIO_2.7,  
USBCLK  
_P2.7  
USB_CLK48M,  
48MHz to USB  
GP Input, HiZ  
SSP slv sel in  
SSP mstr sel out  
GPIO_3.0,  
GP Input, HiZ  
GPIO_3.1,  
DMA_RQST0,  
Ext DMA requst  
DMA_RQST1,  
Ext DMA requst  
EXINT2,  
UART0_RxD,  
UART rcv data  
UART2_RxD,  
UART rcv data  
UART1_RxD,  
UART rcv data  
GPIO_3.0,  
GP Output  
GPIO_3.1,  
GP Output  
GPIO_3.2,  
GP Output  
UART2_TX,  
UART xmit data  
UART0_TX,  
TIM0_OCMP1,  
Out comp/PWM  
34 55 K7  
37 59 M10  
38 60 M11  
39 61 J8  
40 63 L9  
41 65 L10  
P3.0  
P3.1  
P3.2  
P3.3  
P3.4  
P3.5  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
TIM1_OCMP1,  
Out comp/PWM  
GP Input, HiZ  
GPIO_3.2,  
UART xmit data  
CAN_TX,  
UART0_DTR,  
GP Input, HiZ  
External Intr  
CAN Tx data  
Data Trmnl Rdy  
GPIO_3.3,  
EXINT3,  
CAN_RX,  
GPIO_3.3,  
GP Output  
UART1_TX,  
UART0_RTS,  
GP Input, HiZ  
External Intr  
CAN rcv data  
UART xmit data  
Ready To Send  
GPIO_3.4,  
EXINT4,  
SSP1_SCLK,  
SSP slv clk in  
GPIO_3.4,  
GP Output  
SSP1_SCLK,  
UART0_TX,  
GP Input, HiZ  
External Intr  
SSP mstr clk out  
UART xmit data  
GPIO_3.5,  
EXINT5,  
SSP1_MISO,  
GPIO_3.5,  
GP Output  
SSP1_MISO,  
UART2_TX,  
GP Input, HiZ  
External Intr  
SSP mstr data in  
SSP slv data out  
UART xmit data  
39/78  
Pin description  
STR91xFA  
Pkg  
Alternate functions  
Default Pin Default Input  
Pin Name  
Alternate  
Input 1  
Alternate  
Output 1  
Alternate  
Output 2  
Alternate  
Output 3  
Function  
Function  
GPIO_3.6,  
GP Input, HiZ  
GPIO_3.7,  
EXINT6,  
External Intr  
EXINT7,  
SSP1_MOSI,  
SSP slv dat in  
SSP1_NSS,  
GPIO_3.6,  
GP Output  
GPIO_3.7,  
GP Output  
SSP1_MOSI,  
SSP mstr dat out  
SSP1_NSS,  
CAN_TX,  
42 66 M12  
43 68 K11  
P3.6  
P3.7  
I/O  
I/O  
CAN Tx data  
TIM1_OCMP1,  
Out comp/PWM  
GP Input, HiZ  
External Intr  
SSP slv select in  
SSP mstr sel out  
GPIO_4.0,  
ADC0,  
TIM0_ICAP1,  
Input Capture  
GPIO_4.0,  
GP Output  
TIM0_OCMP1, Out ETM_PCK0, ETM  
comp/PWM Packet  
4
3
2
1
3
2
1
C2  
B2  
A1  
P4.0  
P4.1  
P4.2  
P4.3  
P4.4  
P4.5  
P4.6  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
GP Input, HiZ  
ADC input chnl  
GPIO_4.1,  
ADC1,  
TIM0_ICAP2,  
Input Capture  
GPIO_4.1,  
GP Output  
TIM0_OCMP2, Out ETM_PCK1, ETM  
comp Packet  
GP Input, HiZ  
ADC input chnl  
GPIO_4.2,  
ADC2,  
TIM1_ICAP1,  
Input Capture  
GPIO_4.2,  
GP Output  
TIM1_OCMP1, Out ETM_PCK2, ETM  
comp/PWM Packet  
GP Input, HiZ  
ADC input chnl  
GPIO_4.3,  
ADC3,  
TIM1_ICAP2,  
Input Capture  
GPIO_4.3,  
GP Output  
TIM1_OCMP2, Out ETM_PCK3, ETM  
128 B3  
comp  
Packet  
GP Input, HiZ  
ADC input chnl  
GPIO_4.4,  
ADC4,  
TIM2_ICAP1,  
Input Capture  
GPIO_4.4,  
GP Output  
ETM_PSTAT0,  
TIM2_OCMP1, Out  
80 127 C4  
79 126 B4  
78 125 A4  
comp/PWM  
GP Input, HiZ  
ADC input chnl  
ETM pipe status  
GPIO_4.5,  
ADC5,  
TIM2_ICAP2,  
Input Capture  
GPIO_4.5,  
GP Output  
ETM_PSTAT1,  
TIM2_OCMP2, Out  
comp  
GP Input, HiZ  
ADC input chnl  
ETM pipe status  
GPIO_4.6,  
ADC6,  
TIM3_ICAP1,  
Input Capture  
GPIO_4.6,  
GP Output  
ETM_PSTAT2,  
TIM3_OCMP1, Out  
comp/PWM  
GP Input, HiZ  
ADC input chnl  
ETM pipe status  
ADC7,  
GPIO_4.7,  
TIM3_ICAP2,  
Input Capture  
GPIO_4.7,  
GP Output  
ETM_TRSYNC,  
ETM trace sync  
TIM3_OCMP2, Out  
77 124 D5  
P4.7  
I/O  
ADC input chnl /  
ADC Ext. trigger  
comp  
GP Input, HiZ  
GPIO_5.0,  
GP Input, HiZ  
GPIO_5.1,  
EXINT8,  
External Intr  
EXINT9,  
CAN_RX,  
CAN rcv data  
UART0_RxD,  
UART rcv data  
UART2_RxD,  
UART rcv data  
ETM_EXTRIG,  
ETM ext. trigger  
SSP0_SCLK,  
SSP slv clk in  
SSP0_MOSI,  
SSP slv dat in  
SSP0_MISO,  
SSP mstr dat in  
SSP0_NSS,  
GPIO_5.0,  
GP Output  
GPIO_5.1,  
GP Output  
GPIO_5.2,  
GP Output  
GPIO_5.3,  
GP Output  
GPIO_5.4,  
GP Output  
GPIO_5.5,  
GP Output  
GPIO_5.6,  
GP Output  
GPIO_5.7,  
GP Output  
ETM_TRCLK,  
ETM trace clock  
CAN_TX,  
UART0_TX,  
UART xmit data  
UART2_TX,  
9
12 E4  
P5.0  
P5.1  
I/0  
I/0  
12 18 F6  
17 25 K1  
18 27 H2  
44 70 J12  
47 77 H11  
48 79 H9  
49 80 G12  
GP Input, HiZ  
GPIO_5.2,  
External Intr  
EXINT10,  
CAN Tx data  
UART xmit data  
PHYCLK  
_P5.2  
MII_PHYCLK,  
25Mhz to PHY  
TIM3_OCMP1,  
Out comp/PWM  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
GP Input, HiZ  
GPIO_5.3,  
External Intr  
EXINT11,  
MII_TX_EN,  
MAC xmit enbl  
SSP0_SCLK,  
SSP mstr clk out  
SSP0_MOSI,  
TIM2_OCMP1,  
Out comp/PWM  
P5.3  
P5.4  
P5.5  
P5.6  
P5.7  
GP Input, HiZ  
GPIO_5.4,  
External Intr  
EXINT12,  
EMI_CS0n,  
EMI Chip Select  
EMI_CS1n,  
GP Input, HiZ  
GPIO_5.5,  
External Intr  
EXINT13,  
GP Input, HiZ  
GPIO_5.6,  
External Intr  
EXINT14,  
SSP mstr dat out EMI Chip Select  
SSP0_MISO,  
SSP slv data out  
SSP0_NSS,  
EMI_CS2n,  
EMI Chip Select  
EMI_CS3n,  
GP Input, HiZ  
GPIO_5.7,  
External Intr  
EXINT15,  
GP Input, HiZ  
External Intr  
SSP slv select in  
SSP mstr sel out  
EMI Chip Select  
GPIO_6.0,  
EXINT16,  
TIM0_ICAP1,  
Input Capture  
GPIO_6.0,  
GP Output  
MC_UH,  
TIM0_OCMP1, Out  
19 29 H4  
20 31 J3  
13 19 G2  
14 20 G3  
52 83 G8  
53 84 G7  
P6.0  
P6.1  
P6.2  
P6.3  
P6.4  
P6.5  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
comp/PWM  
GP Input, HiZ  
External Intr  
IMC phase U hi  
GPIO_6.1,  
EXINT17,  
TIM0_ICAP2,  
Input Capture  
GPIO_6.1,  
GP Output  
MC_UL,  
TIM0_OCMP2, Out  
comp  
GP Input, HiZ  
External Intr  
IMC phase U lo  
GPIO_6.2,  
EXINT18,  
TIM1_ICAP1,  
Input Capture  
GPIO_6.2,  
GP Output  
MC_VH,  
TIM1_OCMP1, Out  
comp/PWM  
GP Input, HiZ  
External Intr  
IMC phase V hi  
GPIO_6.3,  
GP Input, HiZ  
GPIO_6.4,  
EXINT19,  
External Intr  
EXINT20,  
TIM1_ICAP2,  
Input Capture  
TIM2_ICAP1,  
Input Capture  
TIM2_ICAP2,  
Input Capture  
GPIO_6.3,  
GP Output  
GPIO_6.4,  
GP Output  
GPIO_6.5,  
GP Output  
MC_VL,  
IMC phase V lo  
MC_WH,  
TIM1_OCMP2, Out  
comp  
TIM2_OCMP1, Out  
comp/PWM  
GP Input, HiZ  
GPIO_6.5,  
External Intr  
EXINT21,  
IMC phase W hi  
MC_WL,  
TIM2_OCMP2, Out  
comp  
GP Input, HiZ  
External Intr  
IMC phase W lo  
40/78  
STR91xFA  
Pin description  
Pkg  
Alternate functions  
Default Pin Default Input  
Pin Name  
Alternate  
Input 1  
Alternate  
Output 1  
Alternate  
Output 2  
Alternate  
Output 3  
Function  
Function  
GPIO_6.6,  
GP Input, HiZ  
GPIO_6.7,  
EXINT22_TRIG,  
Ext Intr & Tach  
UART0_RxD,  
UART rcv data  
GPIO_6.6,  
GP Output  
GPIO_6.7,  
GP Output  
ETM_TRCLK,  
ETM trace clock  
UART0_TX,  
TIM3_OCMP1, Out  
57 92 E9  
58 93 D12  
P6.6  
P6.7  
I/O  
I/O  
comp/PWM  
EXINT23_STOP, ETM_EXTRIG,  
Ext Intr & Estop ETM ext. trigger  
TIM3_OCMP2, Out  
comp  
GP Input, HiZ  
UART xmit data  
GPIO_7.0,  
EXINT24,  
TIM0_ICAP1,  
Input Capture  
GPIO_7.0,  
GP Output  
8b) EMI_A0,  
ETM_PCK0, ETM  
-
-
-
-
-
-
-
-
5
6
7
D1  
D2  
B1  
P7.0  
P7.1  
P7.2  
P7.3  
P7.4  
P7.5  
P7.6  
P7.7  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
Packet  
GP Input, HiZ  
External Intr  
16b) EMI_A16  
GPIO_7.1,  
EXINT25,  
TIM0_ICAP2,  
Input Capture  
GPIO_7.1,  
GP Output  
8b) EMI_A1,  
ETM_PCK1, ETM  
Packet  
GP Input, HiZ  
External Intr  
16b) EMI_A17  
GPIO_7.2,  
EXINT26,  
TIM2_ICAP1,  
Input Capture  
GPIO_7.2,  
GP Output  
8b) EMI_A2,  
ETM_PCK2, ETM  
Packet  
GP Input, HiZ  
External Intr  
16b) EMI_A18  
GPIO_7.3,  
EXINT27,  
TIM2_ICAP2,  
Input Capture  
GPIO_7.3,  
GP Output  
8b) EMI_A3,  
ETM_PCK3, ETM  
13 F1  
14 G1  
15 E5  
118 E6  
119 A5  
Packet  
GP Input, HiZ  
External Intr  
16b) EMI_A19  
GPIO_7.4,  
EXINT28,  
UART0_RxD,  
UART rcv data  
GPIO_7.4,  
GP Output  
8b) EMI_A4,  
EMI_CS3n,  
GP Input, HiZ  
External Intr  
16b) EMI_A20  
EMI Chip Select  
GPIO_7.5,  
EXINT29,  
ETM_EXTRIG,  
ETM ext. trigger  
GPIO_7.5,  
GP Output  
8b) EMI_A5,  
EMI_CS2n,  
GP Input, HiZ  
External Intr  
16b) EMI_A21  
EMI Chip Select  
GPIO_7.6,  
EXINT30,  
TIM3_ICAP1,  
Input Capture  
GPIO_7.6,  
GP Output  
8b) EMI_A6,  
EMI_CS1n,  
GP Input, HiZ  
External Intr  
16b) EMI_A22  
EMI Chip Select  
GPIO_7.7,  
EXINT31,  
TIM3_ICAP2,  
Input Capture  
GPIO_7.7,  
GP Output  
EMI_CS0n,  
16b) EMI_A23,  
8b) EMI_A7  
GP Input, HiZ  
External Intr  
EMI chip select  
GPIO_8.0,  
GP Input, HiZ  
GPIO_8.1,  
GPIO_8.0,  
GP Output  
GPIO_8.1,  
GP Output  
GPIO_8.2,  
GP Output  
GPIO_8.3,  
GP Output  
GPIO_8.4,  
GP Output  
GPIO_8.5,  
GP Output  
GPIO_8.6,  
GP Output  
GPIO_8.7,  
GP Output  
8b) EMI_D0,  
16b) EMI_AD0  
8b) EMI_D1,  
16b) EMI_AD1  
8b) EMI_D2,  
16b) EMI_AD2  
8b) EMI_D3,  
16b) EMI_AD3  
8b) EMI_D4,  
16b) EMI_AD4  
8b) EMI_D5,  
16b) EMI_AD5  
8b) EMI_D6,  
16b) EMI_AD6  
8b) EMI_D7,  
16b) EMI_AD7  
-
-
-
-
-
-
-
-
26 L1  
28 H3  
30 J2  
32 K2  
34 L3  
36 J4  
38 M2  
44 K5  
P8.0  
P8.1  
P8.2  
P8.3  
P8.4  
P8.5  
P8.6  
P8.7  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
GP Input, HiZ  
GPIO_8.2,  
GP Input, HiZ  
GPIO_8.3,  
GP Input, HiZ  
GPIO_8.4,  
GP Input, HiZ  
GPIO_8.5,  
GP Input, HiZ  
GPIO_8.6,  
GP Input, HiZ  
GPIO_8.7,  
GP Input, HiZ  
GPIO_9.0,  
GP Input, HiZ  
GPIO_9.1,  
GPIO_9.0,  
GP Output  
GPIO_9.1,  
GP Output  
GPIO_9.2,  
GP Output  
GPIO_9.3,  
GP Output  
8b) EMI_A8  
16b) EMI_AD8  
8b) EMI_A9,  
-
-
-
-
-
-
-
46 M6  
47 M7  
50 K6  
51 J6  
52 H6  
58 L8  
62 M9  
P9.0  
P9.1  
P9.2  
P9.3  
P9.4  
P9.5  
P9.6  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
GP Input, HiZ  
GPIO_9.2,  
16b) EMI_AD9  
8b) EMI_A10,  
16b)EMI_AD10  
8b) EMI_A11,  
16b)EMI_AD11  
GP Input, HiZ  
GPIO_9.3,  
GP Input, HiZ  
GPIO_9.4,  
GPIO_9.4,  
GP Output  
8b) EMI_A12,  
GP Input, HiZ  
16b)EMI_AD12  
GPIO_9.5,  
GPIO_9.5,  
GP Output  
8b) EMI_A13,  
GP Input, HiZ  
16b)EMI_AD13  
GPIO_9.6,  
GPIO_9.6,  
GP Output  
8b) EMI_A14,  
GP Input, HiZ  
16b)EMI_AD14  
41/78  
Pin description  
STR91xFA  
Pkg  
Alternate functions  
Default Pin Default Input  
Pin Name  
Alternate  
Input 1  
Alternate  
Output 1  
Alternate  
Output 2  
Alternate  
Output 3  
Function  
Function  
GPIO_9.7,  
GPIO_9.7,  
GP Output  
8b) EMI_A15,  
-
-
64 K9  
P9.7  
I/O  
-
-
-
GP Input, HiZ  
16b)EMI_AD15  
EMI byte write  
strobe (8 bit  
mode) or low  
byte write strobe  
(16 bit mode)  
EMI_BWR  
_WRLn  
21 G4  
O
N/A  
N/A  
Can also be  
configured as  
EMI_LBn in  
BGA package  
EMI high byte  
write strobe (16-  
bit mode)  
-
22 H1 EMI_WRHn  
74 J10 EMI_ALE  
O
Can also be  
configured as  
EMI_UBn in  
BGA package  
EMI address  
latch enable  
(mux mode)  
-
-
-
O
O
O
N/A  
N/A  
N/A  
75 J9  
EMI_RDn  
EMI read strobe  
EMI Burst  
address  
advance  
-
-
H8 EMI_BAAn  
K8 EMI_WAITn  
EMI Wait input  
for burst mode  
device  
-
I
N/A  
-
-
-
-
M8 EMI_BCLK  
A12 EMI_WEn  
TAMPER  
O
O
EMI bus clock  
N/A  
N/A  
EMI write enable  
Tamper  
detection input  
-
91 E10  
I
N/A  
_IN  
MAC/PHY  
-
94 D11 MII_MDIO I/O management  
N/A  
data line  
USB data (-) bus  
59 95 D10  
60 96 C11  
56 89 C12  
USBDN  
USBDP  
I/O  
I/O  
I
N/A  
N/A  
N/A  
connect  
USB data (+)  
bus connect  
RESET  
_INn  
External reset  
input  
Global or  
System reset  
output  
RESET  
_OUTn  
62 100 A9  
O
N/A  
CPU oscillator or  
crystal input  
65 104 A10 X1_CPU  
64 103 A11 X2_CPU  
I
N/A  
N/A  
CPU crystal  
connection  
O
RTC oscillator or  
crystal input  
(32.768 kHz)  
27 42 M5  
26 41 M4  
61 97 B11  
X1_RTC  
X2_RTC  
JRTCK  
I
N/A  
N/A  
N/A  
RTC crystal  
connection  
O
O
JTAG return  
clock or RTC  
clock  
JTAG TAP  
67 107 D8  
68 108 E8  
JTRSTn  
JTCK  
I
I
N/A  
N/A  
controller reset  
JTAG clock  
42/78  
STR91xFA  
Pin description  
Pkg  
Alternate functions  
Default Pin Default Input  
Pin Name  
Alternate  
Input 1  
Alternate  
Output 1  
Alternate  
Output 2  
Alternate  
Output 3  
Function  
Function  
JTAG mode  
select  
69 111 A6  
JTMS  
I
N/A  
72 115 C6  
73 117 B6  
JTDI  
I
JTAG data in  
N/A  
N/A  
JTDO  
O
JTAG data out  
ADC analog  
voltage source,  
2.7V - 3.6V  
-
-
122 A3  
AVDD  
AVSS  
V
G
G
V
N/A  
N/A  
N/A  
N/A  
ADC analog  
ground  
4
-
C3  
-
Commonground  
point for digital I/  
O & analog ADC  
AVSS  
_VSSQ  
5
-
ADC reference  
voltage input  
123 A2  
AVREF  
Combined ADC  
ref voltage and  
ADC analog  
AVREF  
_AVDD  
76  
-
-
V
N/A  
N/A  
voltage source,  
2.7V - 3.6V  
Standby voltage  
input for RTC  
and SRAM  
backup  
24 39 M3  
VBATT  
V
6
9
E1  
15 23 J1  
36 57  
VDDQ  
VDDQ  
VDDQ  
VDDQ  
VDDQ  
VDDQ  
VDDQ  
VDDQ  
VDDQ  
VSSQ  
VSSQ  
VSSQ  
VSSQ  
VSSQ  
VSSQ  
VSSQ  
VSSQ  
VSSQ  
VDD  
V
V
V
V
V
V
V
V
V
G
G
G
G
G
G
G
G
G
V
V
V
V
G
G
G
G
-
46 73 K12  
54 86 B5  
28 43 L5  
63 102 H7  
74 120 D9  
V Source for  
I/O and USB.  
2.7V to 3.6V  
N/A  
-
-
-
F9  
L2  
8
16 24 K4  
35 56 C5  
-
-
D4  
Digital Ground  
for  
!/O and USB  
45 72 G5  
55 87 J7  
25 40 A8  
66 105 F8  
75 121 L12  
11 17 F4  
31 49 D7  
50 81 L6  
70 112 G11  
10 16 F3  
30 48 H5  
51 82 G10  
71 113 E7  
N/A  
N/A  
V Source for  
CPU.  
VDD  
VDD  
1.65V - 2.0V  
VDD  
VSS  
VSS  
Digital Ground  
for CPU  
N/A  
N/A  
VSS  
VSS  
V Source for  
PLL  
2.7 to 3.6 V  
-
-
-
-
C9 PLLVDDQ  
B8 PLLVSSQ  
V
Digital Ground  
for PLL  
G
43/78  
Memory mapping  
STR91xFA  
5
Memory mapping  
32  
The ARM966E-S CPU addresses a single linear address space of 4 giga-bytes (2 ) from  
address 0x0000.0000 to 0xFFFF.FFFF as shown in Figure 9. Upon reset the CPU boots from  
address 0x0000.0000, which is chip-select zero at address zero in the Flash Memory Interface  
(FMI).  
The Instruction TCM and Data TCM enable high-speed CPU operation without incurring any  
performance or power penalties associated with accessing the system buses (AHB and APB).  
I-TCM and D-TCM address ranges are shown at the bottom of the memory map in Figure 9.  
5.1  
Buffered and non-buffered writes  
The CPU makes use of write buffers on the AHB and the D-TCM to decouple the CPU from any  
wait states associated with a write operation. The user may choose to use write with buffers on  
the AHB by setting bit 3 in control register CP15 and selecting the appropriate AHB address  
range when writing. By default at reset, buffered writes are disabled (bit 3 of CP15 is clear) and  
all AHB writes are non-buffered until enabled. Figure 9 shows that most addressable items on  
the AHB are aliased at two address ranges, one for buffered writes and another for non-  
buffered writes. A buffered write will allow the CPU to continue program execution while the  
write-back is performed through a FIFO to the final destination on the AHB. If the FIFO is full,  
the CPU is stalled until FIFO space is available. A non-buffered write will impose an immediate  
delay to the CPU, but results in a direct write to the final AHB destination, ensuring data  
coherency. Read operations from AHB locations are always direct and never buffered.  
5.2  
System (AHB) and peripheral (APB) buses  
The CPU will access SRAM, higher-speed peripherals (USB, Ethernet, Programmable DMA),  
and the external bus (EMI) on the AHB at their respective base addresses indicated in Figure 9.  
Lower-speed peripherals reside on the APB and are accessed using two separate AHB-to-APB  
bridge units (APB0 and APB1). These bridge units are essentially address windows connecting  
the AHB to the APB. To access an individual APB peripheral, the CPU will place an address on  
the AHB bus equal to the base address of the appropriate bridge unit APB0 or APB1, plus the  
offset of the particular peripheral, plus the offset of the individual data location within the  
peripheral. Figure 9 shows the base addresses of bridge units APB0 and APB1, and also the  
base address of each APB peripheral. Please consult the STR91xFA Reference manual for the  
address of data locations within each individual peripheral.  
5.3  
SRAM  
The SRAM is aliased at three separate address ranges as shown in Figure 9. When the CPU  
accesses SRAM starting at 0x0400.0000, the SRAM appears on the D-TCM. When CPU  
access starts at 0x4000.0000, SRAM appears in the buffered AHB range. Beginning at CPU  
address 0x5000.0000, SRAM is in non-buffered AHB range. The SRAM size must be specified  
by CPU intitialization firmware writing to a control register after any reset condition. Default  
SRAM size is 32K bytes, with option to set to 64K bytes on STR91xFAx3x devices, and to 96K  
bytes on STR91xFAx4x devices.  
44/78  
STR91xFA  
Memory mapping  
When other AHB bus masters (such as a DMA controller) write to SRAM, their access is never  
buffered. Only the CPU can make use of buffered AHB writes.  
5.4  
Two independent Flash memories  
The STR91xFA has two independent Flash memories, the larger primary Flash and the small  
secondary Flash. It is possible for the CPU to erase/write to one of these Flash memories while  
simultaneously reading from the other.  
One or the other of these two Flash memories may reside at the “boot” address position of  
0x0000.0000 at power-up or at reset as shown in Figure 9. The default configuration is that the  
first sector of primary Flash memory is enabled and residing at the boot position, and the  
secondary Flash memory is disabled. This default condition may be optionally changed as  
described below.  
5.4.1 Default configuration  
When the primary Flash resides at boot position, typical CPU initialization firmware would set  
the start address and size of the main Flash memory, and go on to enable the secondary Flash,  
define it’s start address and size. Most commonly, firmware would place the secondary Flash  
start address at the location just after the end of the primary Flash memory. In this case, the  
primary Flash is used for code storage, and the smaller secondary flash can be used for data  
storage (EEPROM emulation).  
5.4.2 Optional configuration  
Using the STR91xFA device configuration software tool, or IDE from 3rd party, one can specify  
that the smaller secondary Flash memory is at the boot location at reset and the primary Flash  
is disabled. The selection of which Flash memory is at the boot location is programmed in a  
non-volatile Flash-based configuration bit during JTAG ISP. The boot selection choice will  
remain as the default until the bit is erased and re-written by the JTAG interface. The CPU  
cannot change this choice for boot Flash, only the JTAG interface has access.  
In this case where the secondary Flash defaults to the boot location upon reset, CPU firmware  
would typically initialize the Flash memories the following way. The secondary Flash start  
address and size is specified, then the primary Flash is enabled and its start address and size  
is specified. The primary Flash start address would typically be located just after the final  
address location of the secondary Flash. This configuration is particularly well-suited for In-  
Application-Programming (IAP). The CPU would boot from the secondary Flash memory,  
initialize the system, then check the contents of the primary Flash memory (by checksum or  
other means). If the contents of primary Flash is OK, then CPU execution continues from either  
Flash memory. If the main Flash contents are incorrect, the CPU, while executing code from the  
secondary Flash, can download new data from any STR91xFA communication channel and  
program into primary Flash memory. Application code then starts after the new contents of  
primary Flash are verified.  
45/78  
Memory mapping  
STR91xFA  
Notes for Figure 9: STR91xFA memory map on page 47:  
Notes:1 Either of the two Flash memories may be placed at CPU boot address 0x0000.0000. By default,  
the primary Flash memory is in boot position starting at CPU address 0x0000.0000 and the  
secondary Flash memory may be placed at a higher address following the end of the primary  
Flash memory. This default option may be changed using the STR91xx device configuration  
software, placing the secondary Flash memory at CPU boot location 0x0000.0000, and then  
the primary Flash memory may be placed at a higher address.  
2 The local SRAM (64KB or 96KB) is aliased in three address windows. A) At 0x0400.0000 the  
SRAM is accessible through the CPU’s D-TCM, at 0x4000.0000 the SRAM is accessible  
through the CPU’s AHB in buffered accesses, and at 0x5000.0000 the SRAM is accessible  
through the CPU’s AHB in non-buffered accesses. An AHB bus master other than the CPU can  
access SRAM in all three aliased windows, but these accesses are always non-buffered. The  
CPU is the only AHB master that can performed buffered writes.  
3 APB peripherals reside in two AHB-to-APB peripheral bridge address windows, APB0 and  
APB1. These peripherals are accessible with buffered AHB access if the CPU addresses them  
in the address range of 0x4800.0000 to 0x4FFF.FFFF, and non-buffered access in the address  
range of 0x5800.0000 to 0x5FFF.FFFF.  
4 Individual peripherals on the APB are accessed at the listed address offset plus the base  
address of the appropriate AHB-to-APB bridge.  
46/78  
STR91xFA  
Memory mapping  
Figure 9. STR91xFA memory map  
PERIPHERAL BUS  
MEMORY SPACE (4)  
APB BASE +  
OFFSET  
TOTAL 4 GB CPU  
MEMORY SPACE  
APB1+0x03FF.FFFF  
RESERVED  
I2C1  
APB1+0x0000.E000  
APB1+0x0000.D000  
APB1+0x0000.C000  
APB1+0x0000.B000  
APB1+0x0000.A000  
APB1+0x0000.9000  
APB1+0x0000.8000  
APB1+0x0000.7000  
APB1+0x0000.6000  
APB1+0x0000.5000  
APB1+0x0000.4000  
APB1+0x0000.3000  
APB1+0x0000.2000  
APB1+0x0000.1000  
APB1+0x0000.0000  
0xFFFF.FFFF  
4 KB  
4 KB  
4 KB  
4 KB  
4 KB  
VIC0  
RESERVED  
VIC1  
4 KB  
AHB  
NON-  
BUFFERED  
0xFFFF.F000  
0xFC01.0000  
0xFC00.0000  
I2C0  
WATCHDOG  
ADC  
64 KB  
CAN  
4 KB  
SSP1  
APB1,  
RESERVED  
AHB-  
4 KB  
SSP0  
to-APB  
Bridge  
4 KB  
UART2  
UART1  
UART0  
IMC  
0x8000.0000  
0x7C00.0000  
0x7800.0000  
0x7400.0000  
0x7000.0000  
0x6C00.0000  
0x6800.0000  
0x6400.0000  
0x6000.0000  
0x5C00.0000  
0x5800.0000  
0x5400.0000  
0x5000.0000  
0x4C00.0000  
0x4800.0000  
0x4400.0000  
0x4000.0000  
0x3C00.0000  
0x3800.0000  
0x3400.0000  
0x3000.0000  
0x2C00.0000  
0x2800.0000  
0x2400.0000  
0x2000.0000  
4 KB  
4 KB  
4 KB  
4 KB  
4 KB  
4 KB  
ENET  
8-CH DMA  
EMI  
64 MB  
64 MB  
64 MB  
64 MB  
64 MB  
64 MB  
64 MB  
64 MB  
64 MB  
64 MB  
64 MB  
64 MB  
64 MB  
64 MB  
64 MB  
64 MB  
64 MB  
64 MB  
64 MB  
64 MB  
64 MB  
64 MB  
64 MB  
64 MB  
AHB  
NON-  
BUFFERED  
SCU  
USB  
RTC  
ENET  
APB1 CONFIG  
8-CH DMA  
EMI  
AHB  
BUFFERED  
APB0+0x03FF.FFFF  
APB0+0x0001.0000  
APB0+0x0000.F000  
APB0+0x0000.E000  
APB0+0x0000.D000  
APB0+0x0000.C000  
APB0+0x0000.B000  
APB0+0x0000.A000  
APB0+0x0000.9000  
APB0+0x0000.8000  
APB0+0x0000.7000  
APB0+0x0000.6000  
APB0+0x0000.5000  
APB0+0x0000.4000  
APB0+0x0000.3000  
APB0+0x0000.2000  
APB0+0x0000.1000  
APB0+0x0000.0000  
USB  
RESERVED  
GPIO PORT P9  
GPIO PORT P8  
GPIO PORT P7  
GPIO PORT P6  
GPIO PORT P5  
GPIO PORT P4  
GPIO PORT P3  
GPIO PORT P2  
GPIO PORT P1  
GPIO PORT P0  
TIM3  
PERIPHERAL BUS,  
NON- BUFFERED  
ACCESS (3)  
4 KB  
4 KB  
4 KB  
4 KB  
4 KB  
4 KB  
APB1  
AHB  
NON-  
BUFFERED  
APB0  
FMI  
SRAM, AHB (2)  
APB1  
PERIPHERAL BUS,  
BUFFERED ACCESS (3)  
APB0  
AHB  
BUFFERED  
4 KB  
FMI  
APB0,  
AHB-  
4 KB  
SRAM, AHB (2)  
Ext. MEM, CS0  
Ext. MEM, CS1  
Ext. MEM, CS2  
Ext. MEM, CS3  
Ext. MEM, CS0  
Ext. MEM, CS1  
Ext. MEM, CS2  
Ext. MEM, CS3  
to-APB  
Bridge  
4 KB  
4 KB  
4 KB  
4 KB  
4 KB  
4 KB  
4 KB  
4 KB  
AHB  
NON-  
BUFFERED  
TIM2  
TIM1  
TIM0  
AHB  
BUFFERED  
WAKE-UP UNIT  
APB0 CONFIG  
Order of the two Flash memories is user defined.  
(1)  
SECONDARY  
FLASH (BANK 1),  
32KB  
RESERVED  
MAIN FLASH  
(BANK 0),  
256KB or 512KB  
MAIN FLASH  
(BANK 0),  
256KB or 512KB  
0x0800.0000  
0x0400.0000  
0x0000.0000  
SECONDARY  
FLASH (BANK 1),  
32KB  
SRAM, D-TCM (2)  
FLASH, I-TCM (1)  
Using 64 KB or 96  
KB  
Using 288 KB or 544  
0x0000.0000  
KB  
DEFAULT ORDER  
OPTIONAL ORDER  
47/78  
Electrical characteristics  
STR91xFA  
6
Electrical characteristics  
6.1  
Absolute maximum ratings  
This product contains devices to protect the inputs against damage due to high static voltages.  
However, it is advisable to take normal precautions to avoid application of any voltage higher  
than the specified maximum rated voltages. It is also recommended to ground any unused input  
pin to reduce power consumption and minimize noise.  
Table 6.  
Absolute maximum ratings  
Parameter  
Value  
Symbol  
Unit  
Min  
-0.3  
-0.3  
-0.3  
Max  
2.4  
VDD  
Voltage on VDD pin with respect to ground VSS  
Voltage on VDDQ pin with respect to ground VSS  
Voltage on VBATT pin with respect to ground VSS  
V
V
V
VDDQ  
VBATT  
AVDD  
4.0  
4.0  
Voltage on AVDD pin with respect to ground VSS  
(128-pin and 144-ball packages)  
-0.3  
-0.3  
-0.3  
-0.3  
4.0  
4.0  
4.0  
5.5  
V
V
V
V
AVREF  
Voltage on AVREF pin with respect to ground VSS  
(128-pin and 144-ball packages)  
AVREF_AVDD  
Voltage on AVREF_AVDD pin with respect to  
Ground VSS (80-pin package)  
Voltage on 5V tolerant pins with respect to ground  
VSS  
VIN  
Voltage on any other pin with respect to ground  
VSS  
-0.3  
-10  
4.0  
+10  
V
IOV  
Input current on any pin during overload condition  
mA  
mA  
ITDV  
Absolute sum of all input currents during overload  
condition  
|200|  
TST  
TJ  
Storage Temperature  
-55  
+150  
+125  
°C  
°C  
V
Junction Temperature  
ESD  
ESD Susceptibility (Human Body Model)  
2000  
Note:  
Stresses exceeding above listed recommended "Absolute Maximum Ratings" may cause  
permanent damage to the device. This is a stress rating only and functional operation of the  
device at these or any other conditions above those indicated in the operational sections of this  
specification is not implied. Exposure to absolute maximum rating conditions for extended  
periods may affect device reliability. During overload conditions (VIN>VDDQ or VIN<VSSQ) the  
voltage on pins with respect to ground (VSSQ) must not exceed the recommended values.  
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Electrical characteristics  
6.2  
Operating conditions  
Table 7.  
Operating conditions  
Parameter  
Value  
Test  
Conditions  
Symbol  
Unit  
Min  
1.65  
2.7  
Max  
2.0  
VDD  
Digital CPU supply voltage  
Digital I/O supply voltage  
V
V
VDDQ  
3.6  
SRAM backup and RTC supply  
voltage  
(1)  
2.5  
2.7  
3.6  
V
V
V
VBATT  
AVDD  
Analog ADC supply voltage  
(128-pin and 144-ball packages)  
VDDQ  
AVDD  
Analog ADC reference voltage  
(128-pin and 144-ball packages)  
AVREF  
2.65  
Combined analog ADC  
reference and ADC supply  
voltage (80-pin package)  
AVREF_AVDD  
TA  
Notes:1 The V  
VDDQ  
+85  
2.7  
-40  
V
C
Ambient temperature under bias  
pin should be connected to V  
if no battery is installed  
BATT  
DDQ  
2 AV  
must never exceed V  
DDQ  
REF  
6.2.1 Operating conditions at power-up / power-down  
Subject to general operating conditions for T .  
A
Table 8.  
Symbol  
Operating conditions at power-up / power-down  
Parameter  
Conditions  
Min(1)  
Typ  
Max(1)  
Unit  
10  
µs/V  
tVDD  
VDD rise time rate  
10  
ms/V  
1. Data guaranteed by characterization, not tested in production.  
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STR91xFA  
6.3  
LVD electrical characteristics  
V
= 2.7 - 3.6V, V = 1.65 - 2V, T = -40 / 85 °C unless otherwise specified.  
DD A  
DDQ  
Table 9.  
LVD Electrical Characteristics  
Value  
Test  
Conditions  
Symbol  
Parameter  
Unit  
Min  
1.43  
1.33  
Typ  
1.50  
1.40  
1.65  
2.45  
2.35  
2.65  
2.75  
2.65  
2.95  
Max  
1.58  
1.47  
V
V
V
V
DD_LVD+ (1.8V)  
DD_LVD- (1.8V)  
DD_BRN (1.8V)  
LVD threshold during VDD rise  
LVD threshold during VDD fall  
V
V
V
VDD brown out warning threshold  
DDQ_LVD+ (3.0V) LVD threshold during VDDQ rise  
(1)(2)  
(1)(2)  
(1)(2)  
(2)(3)  
(2)(3)  
(2)(3)  
2.32  
2.23  
2.57  
2.46  
V
VDDQ_LVD- (3.0V) LVD threshold during VDDQ fall  
DDQ_BRN (3.0V) VDDQ brown out warning threshold  
VDDQ_LVD+ (3.3V) LVD threshold during VDDQ rise  
DDQ_LVD- (3.3V) LVD threshold during VDDQ fall  
V
V
V
2.61  
2.52  
2.89  
2.78  
V
VDDQ_BRN (3.3V) VDDQ brown out warning threshold  
V
1. For VDDQ I/O voltage operating at 2.7 - 3.3V.  
2. Selection of VDDQ operation range is made using configuration software from ST, or IDE from 3rd parties. The default  
condition is VDDQ=2.7V - 3.3V.  
3. For VDDQ I/O voltage operating at 3.0 - 3.6V.  
6.3.1 LVD delay timing  
Case 1: When V  
reaches the V  
threshold after the first ~10 ms delay (introduced  
DDQ  
DDQ_LVD+  
by the VDD rising edge), a new ~10 ms delay starts before the release of RESET_OUTn. See  
Figure 10.  
Figure 10. LVD reset delay case 1  
VDDQ_LVD+  
VDD_LVD+  
VDD (green)  
VDDQ (red)  
RESET_OUTn (blue)  
~10 ms delay  
~10 ms delay  
Case 2: When V  
reaches the V  
threshold before the first ~10 ms delay  
DDQ  
DDQ_LVD+  
(introduced by the VDD rising edge), RESET_OUTn will be released immediately at the end of  
the delay. No new delay is introduced in this case. See Figure 11.  
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Electrical characteristics  
Figure 11. LVD reset delay case 2  
VDDQ_LVD+  
VDD_LVD+  
VDD (green)  
VDDQ (red)  
RESET_OUTn (blue)  
~10 ms delay  
6.4  
DC electrical characteristics  
V
= 2.7 - 3.6V, V = 1.65 - 2V, T = -40 / 85 °C unless otherwise specified.  
DD A  
DDQ  
Table 10. DC Electrical Characteristics  
Value  
Typ  
Symbol  
Parameter  
Test Conditions  
Unit  
Max  
Min  
2.0  
General inputs(1)  
(2)  
RESET and TCK inputs(1)  
VIH  
Input High Level  
0.8VDDQ  
VDDQ/2  
TAMPER_IN input(3)  
General inputs(1)  
V
0.8  
RESET and TCK inputs(1)  
TAMPER_IN input(3)  
VIL  
Input Low Level  
0.2VDDQ  
VDDQ/2  
Input Hysteresis  
Schmitt Trigger  
General inputs(4)  
VHYS  
0.4  
V
I/O ports 3 and 6:  
Output High Level  
High current pins  
VDDQ-0.7  
Push-Pull, I  
= 8mA  
OH  
I/O ports 0,1,2,4,5,7,8,9:  
Push-Pull, I = 4mA  
Output High Level  
Standard current pins  
VOH  
V
VDDQ-0.7  
OH  
Output High Level  
JTAG JTDO pin  
I
OH= -100 µA  
VDDQ-0.1  
I/O ports 3 and 6:  
Output Low Level  
High current pins  
0.4  
Push-Pull, I = 8mA  
OL  
Output Low Level  
I/O ports 0,1,2,4,5,7,8,9:  
VOL  
V
0.4  
0.1  
Push-Pull, I = 4mA  
OL  
Standard current pins  
Output Low Level  
JTAG JTDO pin  
I
OL=100 µA  
1. Guaranteed by characterization, not tested in production.  
2. Input pins are 5V tolerant, max input voltage is 5.5V  
3. Guaranteed by design, not tested in production.  
4. TAMPER_IN pin has no built-in hysteresis  
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STR91xFA  
6.5  
AC electrical characteristics  
V
= 2.7 - 3.6V, V = 1.65 - 2V, T = -40 / 85 °C unless otherwise specified.  
DD A  
DDQ  
Table 11. AC electrical characteristics  
Value  
Typ  
Symbol  
Parameter  
Test Conditions  
Unit  
Min  
Max  
Allperipherals  
on  
1.7  
1.3  
2.3  
1.6  
CPU_CLK =  
96 MHz  
mA/  
MHz  
IDDRUN  
Run Mode Current  
Allperipherals  
off  
(1)(2)(5)  
mA/  
MHz  
All peripherals on (2)(3)(5)  
All peripherals off(2)(4)(5)  
1.14  
0.45  
1.7  
IIDLE  
Idle Mode Current  
mA/  
MHz  
0.75  
LVD On (5)  
LVD Off (5)  
LVD On (4)  
55  
50  
7
825  
820  
TBD  
TBD  
0.9  
µA  
µA  
µA  
µA  
µA  
µA  
Sleep Mode Current,  
IDD  
ISLEEP(IDD)  
Sleep Mode Current,  
IDDQ  
ISLEEP(IDDQ)  
LVD Off (4)  
7
IRTC_STBY  
RTC Standby Current  
Measured on VBATT pin  
0.3  
5
ISRAM_STBY  
SRAM Standby Current Measured on VBATT pin  
85  
1. ARM core and peripherals active with all clocks on. Power can be conserved by turning off clocks to peripherals  
which are not required.  
2. mA/MHz data valid down to 10 MHz  
3. ARM core stopped and all peripheral clocks active.  
4. ARM core stopped and all peripheral clocks stopped.  
5. ARM core and all peripheral clocks stopped (with exception of RTC)  
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Electrical characteristics  
Figure 12. Sleep Mode current vs temperature with LVD on  
2000  
1800  
Max  
1600  
1400  
1200  
1000  
800  
Typical  
600  
400  
200  
0
40  
TEMP [°C]  
-40  
-20  
0
60  
80  
100  
20  
120  
Table 12. AC electrical characteristics  
Value  
Typ  
Symbol  
Parameter  
Test Conditions  
Unit  
Min  
Max  
fMSTR  
CCU Master Clk Output  
32.768  
96,000  
kHz  
Executing from  
SRAM  
96  
96  
MHz  
fCPUCLK  
CPU Core Frequency  
Executing from  
Flash  
MHz  
fPCLK  
fHCLK  
fOSC  
Peripheral Clock for APB  
Peripheral Clock for AHB  
Clock Input  
48  
96  
25  
MHz  
MHz  
MHz  
4
FMI Flash Bus clock (internal  
clock)  
fFMICLK  
96  
MHz  
fBCLK  
fRTC  
fEMAC  
fUSB  
External Memory Bus clock  
RTC Clock  
TBD  
MHz  
kHz  
32.768  
25  
EMAC PHY Clock  
USB Clock  
MHz  
MHz  
48  
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Electrical characteristics  
STR91xFA  
6.6  
RESET_INn and power-on-reset characteristics  
V
= 2.7 - 3.6V, V = 1.65 - 2V, T = -40 / 85 °C unless otherwise specified.  
DD A  
DDQ  
Table 13. RESET_INn and Power-On-Reset Characteristics  
Value  
Typ  
Symbol  
tRINMIN  
tPOR  
Parameter  
Test Conditions  
Unit  
Min(1)  
Max  
RESET_INn Valid Active Low  
100  
ns  
VDDQ,VDD ramp  
Power-On-Reset Condition  
duration  
10  
ms  
time is less than  
10ms  
RESET_OUT Duration  
(Watchdog reset)  
one  
PCLK  
tRSO  
ns  
1. Data based on bench measurements, not tested in production.  
6.7  
Main oscillator electrical characteristics  
V
= 2.7 - 3.6V, V = 1.65 - 2V, T = -40 / 85 °C unless otherwise specified.  
DD A  
DDQ  
Table 14. Main oscillator electrical characteristics  
Value  
Typ  
2
Symbol  
Parameter  
Test Conditions  
Unit  
Min  
Max  
(1)  
tSTUP(OSC)  
Oscillator Start-up Time  
3
mS  
Stable VDDQ  
1. Data characterized with quartz crystal, not tested in production.  
6.8  
RTC oscillator electrical characteristics  
V
= 2.7 - 3.6V, V = 1.65 - 2V, T = -40 / 85 °C unless otherwise specified.  
DD A  
DDQ  
Table 15. RTC oscillator electrical characteristics  
Value  
Typ  
Symbol  
Parameter  
Test Conditions  
Unit  
Min  
Max  
(2)1)  
Oscillator Start _voltage(1)  
Oscillator Start-up Time(1)  
LVD  
gM(RTC)  
V
S
Stable V  
DDQ  
tSTUP(RTC)  
1
1. Data based on bench measurements, not tested in production.  
2. Min oscillator start voltage is the same as low voltage detect level (2.4V or 2.7V) for VDDQ  
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Electrical characteristics  
Table 16. RTC crystal electrical characteristics  
Value  
Symbol  
Parameter  
Test Conditions  
Unit  
Min  
Typ  
Max  
fO  
Resonant frequency  
Series resistance  
Load capacitance  
32.768  
kHz  
kΩ  
pF  
RS  
CL  
40  
8
6.9  
PLL electrical characteristics  
V
= 2.7 - 3.6V, V = 1.65 - 2V, T = -40 / 85 °C unless otherwise specified.  
DD A  
DDQ  
Table 17. PLL Electrical Characteristics  
Value  
Typ  
Symbol  
Parameter  
Test Conditions  
Unit  
Min  
6.25  
4
Max  
96  
fPLL  
PLL Output Clock  
Clock Input  
MHz  
MHz  
µs  
fOSC  
25  
tLOCK  
PLL lock time  
300  
0.1  
1500  
PLL Jitter (peak to peak)(1)  
0.2  
ns  
tJITTER  
1. Data based on bench measurements, not tested in production  
6.10 SRAM characteristics  
Table 18. SRAM and hardware registers  
Symbol  
Parameter  
Conditions  
TA= 85°C  
Min  
Typ  
Max  
Unit  
Supply voltage for data retention(1)  
VDR  
1.1  
V
1. Guaranteed by characterization, not tested in production.  
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Electrical characteristics  
STR91xFA  
6.11 Flash memory characteristics  
V
= 2.7 - 3.6V, V = 1.65 - 2V, T = -40 / 85 °C unless otherwise specified.  
DD A  
DDQ  
Table 19. Flash memory program/erase characteristics  
Value  
Typ after  
100K W/E  
cycles2)  
Parameter  
Test Conditions  
Unit  
Max  
Typ2)  
Primary Bank  
(512 Kbytes)1)  
8
9
11.5  
6
s
s
Primary Bank  
(256 Kbytes)1)  
Bank erase  
4
4.5  
750  
Secondary Bank  
(32 Kbytes)  
700  
1300  
300  
3700  
1900  
250  
500  
950  
ms  
Of Primary Bank  
(64 Kbytes)  
1400  
320  
1800 ms  
450 ms  
Sector erase  
Bank program  
Of Secondary Bank  
(8 Kbytes)  
Primary Bank  
(512 Kbytes)1)  
4700  
2000  
260  
5100 ms  
2550 ms  
Primary Bank  
(256 Kbytes)1)  
Secondary Bank  
(32 Kbytes)  
320  
640  
ms  
ms  
Of Primary Bank  
(64 Kbytes)  
520  
Sector program  
Word program  
Of Secondary Bank  
(8 Kbytes)  
60  
8
62  
9
80  
11  
ms  
µs  
Half word (16 bits)  
Notes:1 STR91xFAxx4 devices have 512 Kbytes primary Flash, STR91xFAxx2 devices have 256  
Kbytes primary Flash  
2 V = 1.8V, V  
= 3.3V T = 25°C.  
, A  
DD  
DDQ  
3 Flash read access for synchronous addresses is 96 MHz maximum.  
4 Flash read access for asynchronous accesses requires 2 wait states when FMI clock is above  
66 MHz. See STR91xF Flash Programming Manual for more information.  
Table 20. Flash memory endurance  
Value  
Parameter  
Test Conditions  
Unit  
Min  
Typ  
Max  
Program/erase cycles  
Data retention  
Per word  
100K  
20  
cycles  
years  
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Electrical characteristics  
6.12 EMC characteristics  
Susceptibility tests are performed on a sample basis during product characterization.  
6.12.1 Functional EMS (Electro Magnetic Susceptibility)  
Based on a simple running application on the product (toggling 2 LEDs through I/O ports), the  
product is stressed by two electro magnetic events until a failure occurs (indicated by the  
LEDs).  
ESD: Electro-Static Discharge (positive and negative) is applied on all pins of the device  
until a functional disturbance occurs. This test conforms with the IEC 1000-4-2 standard.  
FTB: A Burst of Fast Transient voltage (positive and negative) is applied to V  
V
and  
DD, DDQ  
V
through a 100pF capacitor, until a functional disturbance occurs. This test conforms  
SS  
with the IEC 1000-4-4 standard.  
A device reset allows normal operations to be resumed.  
Table 21. EMS data  
Symbol  
Parameter  
Conditions  
Neg. Pos.  
-1(1) >2(1)  
Unit  
VDD=1.8V, VDDQ=3.3V,  
Voltage limits to be applied on  
any I/O pin to induce a functional TA=+25°C, fOSC CPUCLK  
disturbance  
VFESD  
/f  
=4  
=4  
MHz/96MHz PLL  
kV  
VDD=1.8V, VDDQ=3.3V,  
Fast transient voltage burst limits  
to be applied through 100pF on  
VDD and VDDQ pins to induce a  
TA=+25°C, fOSC CPUCLK  
MHz/96 MHz PLL  
conforms to IEC 1000-4-4  
/f  
-4(1)  
4(1)  
VFFTB  
functional disturbance  
1. Data based on characterization results, not tested in production.  
6.12.2 Electro Magnetic Interference (EMI)  
Based on a simple application running on the product (toggling 2 LEDs through the I/O ports),  
the product is monitored in terms of emission. This emission test is in line with the norm SAE J  
1752/3 which specifies the board and the loading of each pin.  
Table 22. EMI data  
Max vs.  
[fOSC/fCPUCLK  
Monitored  
Frequency Band  
]
Symbol  
Parameter  
Conditions  
Unit  
4 MHz/ 96 MHz  
VDDQ=3.3V, VDD=1.8V, 0.1MHz to 30 MHz  
10  
10  
22  
4
TA=+25°C,  
30 MHz to 130 MHz  
130 MHz to 1GHz  
SAE EMI Level  
dBµV  
SEMI  
Peak level  
LQFP128 package  
conforming to SAE J  
1752/3  
-
Notes:  
1. Data based on characterization results, not tested in production.  
2. BGA and LQFP devices have similar EMI characteristics.  
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Electrical characteristics  
STR91xFA  
6.12.3 Absolute Maximum Ratings (Electrical Sensitivity)  
Based on three different tests (ESD, LU and DLU) using specific measurement methods, the  
product is stressed in order to determine its performance in terms of electrical sensitivity. For  
more details, refer to the application note AN1181.  
6.12.4 Electro-Static Discharge (ESD)  
Electro-Static Discharges (3 positive then 3 negative pulses separated by 1 second) are  
applied to the pins of each sample according to each pin combination. The sample size  
depends on the number of supply pins in the device (3 parts*(n+1) supply pin). Two models can  
be simulated: Human Body Model and Charge Device Model. This test conforms to the  
JESD22-A114A/A115A standard.  
Table 23. ESD Absolute Maximum ratings  
Maximum  
Symbol  
Ratings  
Conditions  
Unit  
value 1)  
Electro-static discharge voltage  
(Human Body Model)  
VESD(HBM)  
VESD(CDM)  
+/-2000  
TA=+25°C  
V
Electro-static discharge voltage  
(Charge Device Model)  
1000  
Notes:  
1. Data based on characterization results, not tested in production.  
6.12.5 Static and Dynamic Latch-Up  
LU: 3 complementary static tests are required on 10 parts to assess the latch-up  
performance. A supply overvoltage (applied to each power supply pin) and a current  
injection (applied to each input, output and configurable I/O pin) are performed on each  
sample. This test conforms to the EIA/JESD 78 IC latch-up standard. For more details,  
refer to the application note AN1181.  
DLU: Electro-Static Discharges (one positive then one negative test) are applied to each  
pin of 3 samples when the micro is running to assess the latch-up performance in dynamic  
mode. Power supplies are set to the typical values, the oscillator is connected as near as  
possible to the pins of the micro and the component is put in reset mode. This test  
conforms to the IEC1000-4-2 and SAEJ1752/3 standards. For more details, refer to the  
application note AN1181.  
6.12.6 Designing hardened software to avoid noise problems  
EMC characterization and optimization are performed at component level with a typical  
application environment and simplified MCU software. It should be noted that good EMC  
performance is highly dependent on the user application and the software in particular.  
Therefore it is recommended that the user applies EMC software optimization and  
prequalification tests in relation with the EMC level requested for his application.  
Software recommendations:  
The software flowchart must include the management of runaway conditions such as:  
Corrupted program counter  
Unexpected reset  
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Electrical characteristics  
Critical Data corruption (control registers...)  
Prequalification trials:  
Most of the common failures (unexpected reset and program counter corruption) can be  
reproduced by manually forcing a low state on the RESET pin or the Oscillator pins for 1  
second.  
To complete these trials, ESD stress can be applied directly on the device, over the range of  
specification values. When unexpected behavior is detected, the software can be hardened to  
prevent unrecoverable errors occurring (see application note AN1015).  
6.12.7 Electrical Sensitivities  
Class 1)  
Symbol  
LU  
Parameter  
Static latch-up class  
Conditions  
TA=+25°C  
VDDQ=3.3V, VDD=1.8V,  
fOSC/fCPUCLK=4 MHz/96 MHz  
A
DLU  
Dynamic latch-up class  
A
Notes:  
1. Class description: A Class is an STMicroelectronics internal specification. All its limits are higher than the JEDEC  
specifications, that means when a device belongs to Class A it exceeds the JEDEC standard. B Class strictly covers all the  
JEDEC criteria (international standard).  
6.13 External memory bus timings  
V
= 2.7 - 3.6V, V = 1.65 - 2V, T = -40 / 85 °C, C = 30 pF unless otherwise specified.  
DD A L  
DDQ  
Table 24. EMI Bus Clock Period  
Symbol  
Parameter  
EMI Bus Clock period  
Value  
tBCLK  
1 /(fHCLK x EMI_ratio)  
Notes:1 The internal EMI Bus clock signal is available externally only on LFBGA144 packages (ball M8),  
and not available on LQFP packages.  
2 EMI_ratio =1/ 2 by default (can be programmed to be 1 by setting the proper bits in the  
SCU_CLKCNTR register)  
Table 25. EMI read operation  
Value  
Symbol  
Parameter  
Unit  
Min  
Max  
tRCR  
tRP  
Read to CSn inactive  
Read Pulse Width  
-1  
+1  
ns  
ns  
(WSTRD-WSTOEN+1) x  
(WSTRD-WSTOEN+1) x  
tBCLK + 1  
t
BCLK - 1  
tRDS  
tRDH  
tRAS  
tRAH  
tAW  
Read Data Setup Time  
Read Data Hold Time  
Read Address Setup Time  
Read Address Hold Time  
ALE pulse width  
4
0
ns  
ns  
ns  
ns  
ns  
(WSTOEN) x tBCLK- 1  
0
(WSTOEN) x tBCLK + 1  
(ALE_LENGTH) x tBCLK - 1 (ALE_LENGTH) x tBCLK + 1  
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STR91xFA  
Value  
Symbol  
Parameter  
Unit  
Min  
Max  
tAAH  
tAAS  
tBCLK/2 - 1  
tBCLK/2 + 1  
Address to ALE hold time  
Address to ALE setup time  
ns  
ns  
(ALE_LENGTH) x tBCLK - 1  
Notes:1 ALE_LENGTH = 1 by default (can be programmed to be 2 by setting the bits In the SCU_SCR0  
register)  
2 WSTRD = 1Fh by default (RD wait state time = WSTRD x t  
in the EMI_RCRx Register)  
, WSTRD can be programmed  
BCLK  
3 WSTOEN = 1 by default (RD assertion delay from chip select. WSTOEN can be programmed in  
the EMI_OECRx Register)  
Figure 13. Non-mux bus (8-bit) read timings  
EMI_CSx n  
tRCR  
EMI_A[15:0]  
Address  
tRAH  
tRDH  
EMI_D[7:0]  
EMI_RDn  
Data  
tRAS  
tRDS  
tRP  
Figure 14. Mux bus (16-bit) read timings  
EMI_CSx n  
EMI_A LE  
tAW  
tRCR  
EMI_A[23:16]  
Address  
tAAH  
tAAS  
tRAH  
tRDH  
EMI_AD[15:0]  
EMI_RDn  
Address  
tRAS  
Data  
tRDS  
tRP  
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Electrical characteristics  
Table 26. EMI write operation  
Value  
Test  
Conditions  
Symbol  
Parameter  
Unit  
Min  
Max  
(tBCLK/2) +1  
(WSTWR-WSTWEN + 1) x  
tWCR  
tWP  
(tBCLK/2) - 1  
WRn to CSn inactive  
Write Pulse Width  
ns  
ns  
(WSTWR-WSTWEN + 1) x  
t
BCLK - 1  
tBCLK + 1  
Write Data Setup  
Time  
(non-mux mode)  
(WSTWEN + 1/2) x tBCLK  
(WSTWEN - 1.5) x tBCLK  
ns  
ALE  
length=1  
WSTWEN>2  
tWDS  
Write Data Setup  
Time  
(mux mode )  
ALE  
length=2  
WSTWEN>3  
(WSTWEN - 2.5) x tBCLK  
(tBCLK/2) - 1  
Write Data Hold  
Time  
tWDH  
tWAS  
tWAH  
tAW  
(tBCLK/2) + 1  
ns  
ns  
ns  
ns  
(WSTWEN + 1/2) x  
tBCLK -1 4)  
(WSTWEN + 1/2) x  
tBCLK +1 4)  
Write Address Setup  
Time  
Write Address Hold  
Time  
tBCLK/2  
(ALE_LENGTH x tBCLK  
+1  
)
(ALE_LENGTH x tBCLK )-1  
ALE pulse width  
Address to ALE hold  
time  
tAAH  
tAAS  
(tBCLK/2) -1  
(tBCLK/2) + 1  
ns  
ns  
Address to ALE  
setup time  
(ALE_LENGTH x tBCLK)- 1  
Notes:1 ALE_LENGTH = 1 by default (can be programmed to be 2 by setting the bits In the SCU_SCR0  
register)  
2 WSTWR =1Fh by default (WR wait state time = WSTWR x t  
in the EMI_WCRx Register)  
, WSTWR can be programmed  
BCLK  
3 WSTWEN= 0 by default (WR assertion delay from chip select. WSTWEN can be programmed  
in the EMI_WECRx Register)  
4 When the CPU executes a 16-bit write to a x8 EMI bus, the second write cycle's address setup  
time is defined as t  
=(WSTWEN - ½) x t  
WAS  
BCLK  
61/78  
Electrical characteristics  
STR91xFA  
Figure 15. Non-Mux Bus (8-bit) write timings  
EMI_CSxn  
tWCR  
Address  
Data  
EMI_A[15:0]  
tWAH  
tWDH  
EMI_D[7:0]  
tWAS  
tWDS  
tWP  
EMI_BWR_WRLn  
Figure 16. Mux Bus (16-bit) Write Timings  
EMI_CSx n  
EMI_A LE  
tAW  
tWCR  
EMI_A[23:16]  
Address  
tAAH  
tAAS  
tWDS  
tWAH  
tWDH  
EMI_AD[15:0]  
Address  
tWAS  
Data  
EMI_WRLn  
EMI_WRHn  
tWP  
62/78  
STR91xFA  
Electrical characteristics  
6.14 ADC electrical characteristics  
V
= 2.7 - 3.6V, V = 1.65 - 2V, T = -40 / 85 °C unless otherwise specified.  
DD A  
DDQ  
Table 27. ADC electrical characteristics  
Value  
Typ  
Symbol  
Parameter  
Test Conditions  
Unit  
Max  
Min  
VAIN  
AVREF  
10  
Input Voltage Range  
Resolution  
0
V
Bits  
N
RES  
NCH  
Number of Input Channels  
ADC Clock Frequency  
POR bit set to Standby mode  
8
fADC  
25  
MHz  
ms  
µs  
tPOR(ADC)  
500  
Continuous mode(2)  
1*16/fADC  
0.66  
Continuous mode(2)  
fADC = 24 MHz  
µs  
µs  
µs  
Conversion Time(1)  
tCONV  
Single mode(3)  
2*16/fADC  
1.33  
3*16/fADC  
2
Single mode(3)  
fADC = 24 MHz  
,
Continuous mode (2)  
fADC = 24 MHz  
1500  
ksps  
TR  
Throughput Rate  
Single mode(3)  
fADC = 24 MHz  
500  
750  
ksps  
pF  
CIN  
ED  
Input Capacitance  
Differential Non-Linearity  
Integral Non-Linearity  
Offset Error  
5
1
(4) (5)  
(4)  
LSB(6)  
LSB  
LSB  
LSB  
LSB  
mA  
3
6
6
2
6
EL  
3
(4)  
EO  
EG  
ET  
3
(4)  
Gain Error  
0.5  
4
(4)  
Absolute Error  
IADC  
Power Consumption  
4.6  
1. Guaranteed by design, not tested in production.  
2. All sucessive conversions in continuous and scan modes.  
3. All single conversions and the first conversion in continuous and scan modes.  
4. Conditions: AVSS = 0 V, AVDD = 3.3 V fADC = 25 MHz.  
5. The A/D is monotonic, there are no missing codes.  
6. 1 LSB = (AVDD - AVSS)/1024  
63/78  
Electrical characteristics  
STR91xFA  
Figure 17. ADC conversion characteristics  
Digital Result  
(1) Example of an actual transfer curve  
(2) The ideal transfer curve  
(3) End point correlation line  
EG  
1023  
1022  
V
V  
DDA  
SSA  
1024  
1LSB  
= ----------------------------------------  
IDEAL  
1021  
ET=Total Unadjusted Error: maximum  
deviation between the actual and the ide-  
al transfer curves.  
EO=Offset Error: deviation between the  
first actual transition and the first ideal  
one.  
(2)  
ET  
(3)  
7
6
5
4
3
2
1
(1)  
EG=Gain Error: deviation between the  
last ideal transition and the last actual  
one.  
ED=Differential Linearity Error: maximum  
deviation between actual steps and the  
ideal one.  
EL=Integral Linearity Error: maximum  
deviation between any actual transition  
and the end point correlation line.  
EO  
EL  
ED  
1 LSBIDEAL  
V
(LSB  
)
in  
IDEAL  
0
1
2
3
4
5
6
7
1021 1022 1023 1024  
AVDD  
AVSS  
64/78  
STR91xFA  
Electrical characteristics  
6.15 Communication interface electrical characteristics  
6.15.1 10/100 Ethernet MAC electrical characteristics  
V
= 2.7 - 3.6V, V = 1.65 - 2V, T = -40 / 85 °C unless otherwise specified.  
DD A  
DDQ  
Ethernet MII Interface Timings  
Figure 18. MII_RX_CLK and MII_TX_CLK timing diagram  
3
MII_RX_TCLK, MII_TX_CLK  
2
4
4
1
Table 28. MII_RX_CLK and MII_TX_CLK timing table  
Value  
Symbol  
Parameter  
Symbol  
Unit  
Min  
40  
Max  
tc(CLK)  
tHIGH(CLK)  
LOW(CLK)  
tt(CLK)  
1
2
3
4
Cycle time  
ns  
Pulse duration HIGH  
Pulse duration LOW  
Transition time  
40%  
40%  
60%  
60%  
1
t
ns  
Figure 19. MDC timing diagram  
3
MDC  
2
4
4
1
Table 29. MDC timing table  
Value  
Symbol  
Parameter  
Symbol  
Unit  
Min  
266  
Max  
tc(MDC)  
tHIGH(MDC)  
LOW(MDC)  
tt(MDC)  
1
2
3
4
Cycle time  
ns  
Pulse duration HIGH  
Pulse duration LOW  
Transition time  
40%  
40%  
60%  
60%  
1
t
ns  
Ethernet MII management timings  
Figure 20. Ethernet MII management timing diagram  
MDC  
1
MDIO  
output  
2
3
MDIO  
input  
65/78  
Electrical characteristics  
STR91xFA  
Table 30. Ethernet MII management timing table  
Value  
Symbol  
Parameter  
Symbol  
Unit  
Min  
Max  
MDIO delay from rising  
edge of MDC  
tc(MDIO)  
1
2
3
2.83  
ns  
ns  
ns  
MDIO setup time to rising  
edge of MDC  
Tsu (MDIO)  
Th (MDIO)  
2.70  
MDIO hold time from rising  
edge of MDC  
-2.03  
Ethernet MII transmit timings  
Figure 21. Ethernet MII transmit timing diagram  
MII_TX_CLK  
2
1
3
MII_TX_EN  
4
5
6
MII_CRS  
8
MII_COL  
7
MII_TXD  
Table 31. Ethernet MII transmit timing table  
Value  
Symbol  
Parameter  
Symbol  
Unit  
Min  
Max  
MII_TX_CLK high to  
MII_TX_EN valid  
t
VAL(MII_TX_EN)  
1
2
3
4
5
6
7
8
4.20  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
MII_TX_CLK high to  
MII_TX_EN invalid  
T
inval(MII_TX_EN)  
4.86  
MII_CRS valid to  
MII_TX_CLK high  
Tsu(MII_CRS)  
Th(MII_CRS)  
Tsu(MII_COL)  
Th(MII_COL)  
0.61  
0.00  
0.81  
0.00  
MII_TX_CLK high to  
MII_CRS invalid  
MII_COL valid to  
MII_TX_CLK high  
MII_TX_CLK high to  
MII_COL invalid  
MII_TX_CLK high to  
MII_TXD valid  
t
VAL(MII_TXD)  
5.02  
5.02  
MII_TXCLK high to  
MII_TXD invalid  
Tinval(MII_TXD  
66/78  
STR91xFA  
Ethernet MII Receive timings  
Electrical characteristics  
Figure 22. Ethernet MII receive timing diagram  
MII_RX_CLK  
2
1
MII_RXD  
MII_RX_DV  
MII_RX_ER  
Figure 23. Ethernet MII receive timing table  
Value  
Symbol  
Parameter  
Symbol  
Unit  
Min  
Max  
MII_RXD valid to  
MII_RX_CLK high  
Tsu(MII_RXD)  
Th(MII_RXD)  
1
2
0.81  
ns  
ns  
MII_RX_CLK high to  
MII_RXD invalid  
0.00  
6.15.2 USB electrical interface characteristics  
USB 2.0 Compliant in Full Speed Mode  
6.15.3 CAN interface electrical characteristics  
Conforms to CAN 2.0B protocol specification  
67/78  
Electrical characteristics  
STR91xFA  
2
6.15.4 I C electrical characteristics  
V
= 2.7 - 3.6V, V = 1.65 - 2V, T = -40 / 85 °C unless otherwise specified.  
DD A  
DDQ  
2
Table 32. I C Electrical Characteristics  
Standard I2C  
Min Max  
Fast I2C  
Symbol  
Parameter  
Unit  
Min  
Max  
Bus free time between a STOP  
and START condition  
tBUF  
4.7  
4.0  
1.3  
0.6  
ms  
µs  
Hold time START condition.  
After this period, the first clock  
pulse is generated  
tHD:STA  
tLOW  
tHIGH  
LOW period of the SCL clock  
HIGH period of the SCL clock  
4.7  
4.0  
1.3  
0.6  
µs  
µs  
Set-up time for a repeated  
START condition  
tSU:STA  
4.7  
0.6  
µs  
tHD:DAT  
tSU:DAT  
Data hold time  
0
0
ns  
ns  
Data set-up time  
250  
100  
Rise time of both SDA and SCL  
signals  
tR  
20+0.1Cb  
1000  
300  
300  
300  
ns  
Fall time of both SDA and SCL  
signals  
tF  
20+0.1Cb  
0.6  
ns  
µs  
pF  
tSU:STO  
Cb  
Set-up time for STOP condition  
4.0  
Capacitive load for each bus  
line  
400  
400  
Notes:1 The device must internally provide a hold time of at least 300 ns for the SDA signal in order to  
bridge the undefined region of the falling edge of SCL  
2 The maximum hold time of the START condition has only to be met if the interface does not  
stretch the low period of SCL signal  
3 C = total capacitance of one bus line in pF  
b
68/78  
STR91xFA  
Electrical characteristics  
6.15.5 SPI electrical characteristics  
V
= 2.7 - 3.6V, V = 1.65 - 2V, T = -40 / 85 °C unless otherwise specified.  
DD A  
DDQ  
Table 33. SPI electrical characteristics  
Value  
Unit  
Symbol  
Parameter  
Test Conditions  
Typ  
Max  
Master  
24  
fSCLK  
SPI clock frequency  
MHz  
4
1/tc(SCLK)  
tr(SCLK)  
tf(SCLK)  
tsu(SS)  
Slave  
SPI clock rise and fall times  
50pF load  
0.1  
V/ns  
SS setup time  
SS hold time  
Slave  
1
1
th(SS)  
Slave  
Master  
Slave  
Master  
Slave  
Master  
Slave  
Slave  
tw(SCLKH)  
tw(SCLKL)  
SCLK high and low time  
Data input setup time  
Data input hold time  
1
5
6
tsu(MI)  
tsu(SI)  
th(MI)  
th(SI)  
tPCLK  
ta(SO)  
tdis(SO)  
tv(SO)  
th(SO)  
tv(MO)  
th(MO)  
Data output access time  
Data output disable time  
Data output valid time  
Data output hold time  
Data output valid time  
Data output hold time  
6
6
6
Slave  
Slave (after enable  
edge)  
0
0.25  
0.25  
Master (before capture  
edge)  
Figure 24. SPI slave timing diagram with CPHA=0  
NSS  
INPUT  
t
t
su(NSS)  
c(SCLK)  
t
h(NSS)  
CPHA=0  
CPOL=0  
CPHA=0  
CPOL=1  
t
t
w(SCLKH)  
w(SCLKL)  
t
t
t
t
dis(SO)  
a(SO)  
v(SO)  
h(SO)  
t
t
r(SCLK)  
f(SCLK)  
MISO  
OUTPUT  
INPUT  
MSB OUT  
BIT6 OUT  
LSB OUT  
t
t
h(SI)  
su(SI)  
MSB IN  
BIT1 IN  
LSB IN  
MOSI  
69/78  
Electrical characteristics  
STR91xFA  
Figure 25. SPI slave timing diagram with CPHA=1  
NSS INPUT  
tsu(NSS)  
tc(SCLK)  
th(NSS)  
CPHA=1  
CPOL=0  
CPHA=1  
CPOL=1  
tw(SCLKH)  
tw(SCLKL)  
ta(SO)  
tdis(SO)  
tv(SO)  
th(SO)  
tr(SCLK)  
tf(SCLK)  
MISO OUTPUT  
MSB OUT  
BIT6 OUT  
HZ  
LSB OUT  
tsu(SI)  
th(SI)  
MSB IN  
BIT1 IN  
LSB IN  
MOSI INPUT  
Figure 26. SPI master timing diagram  
NSS  
INPUT  
tc(SCLK)  
CPHA=0  
CPOL=0  
CPHA=0  
CPOL=1  
CPHA=1  
CPOL=0  
CPHA=1  
CPOL=1  
tw(SCLKH)  
tw(SCLKL)  
tr(SCLK)  
tf(SCLK)  
th(MI)  
tsu(MI)  
MISO INPUT  
MSB IN  
th(MO)  
BIT6 IN  
LSB IN  
tv(MO)  
LSB OUT  
MSB OUT  
BIT6 OUT  
MOSI OUTPUT  
70/78  
STR91xFA  
Package mechanical data  
7
Package mechanical data  
Figure 27. 80-Pin Low Profile Quad Flat Package  
inches1)  
mm  
SEATING  
PLANE  
Dim.  
Min Typ Max Min  
Typ  
Max  
C
A
1.60  
0.0630  
0.0059  
A1 0.05  
0.15 0.0020  
0.25 mm  
GAGE PLANE  
A2 1.35 1.40 1.45 0.0531 0.0551 0.0571  
b
c
0.17 0.22 0.27 0.0067 0.0087 0.0106  
0.09 0.20 0.0035 0.0079  
ccc  
C
D
D
14.00  
12.00  
9.50  
0.5512  
0.4724  
0.3740  
0.5512  
0.4724  
0.3740  
0.0197  
D1  
D3  
L
D1  
D2  
E
L1  
60  
41  
14.00  
12.00  
9.50  
61  
40  
E1  
E2  
e
b
0.50  
E
E1  
E3  
L
0.45 0.60 0.75 0.0177 0.0236 0.0295  
1.00 0.039  
L1  
k
0d  
7d  
0d  
7d  
80  
21  
ddd  
0.08  
0.0031  
Number of Pins  
1
20  
e
N
80  
PIN 1  
IDENTIFICATION  
1Values in inches are converted from mm  
and rounded to 4 decimal digits.  
71/78  
Package mechanical data  
STR91xFA  
Figure 28. 128-Pin Low Profile Quad Flat Package  
inches1]  
mm  
SEATING  
PLANE  
Dim.  
Min Typ Max Min  
Typ  
Max  
C
A
1.60  
0.0630  
0.0059  
A1 0.05  
0.15 0.0020  
0.25 mm  
GAGE PLANE  
A2 1.35 1.40 1.45 0.0531 0.0551 0.0571  
ccc  
C
b
c
0.13 0.18 0.23 0.0051 0.0071 0.0091  
0.09 0.20 0.0035 0.0079  
15.80 16.00 16.20 0.6220 0.6299 0.6378  
D
D1  
D3  
D
L
D1 13.80 14.00 14.20 0.5433 0.5512 0.5591  
L1  
96  
65  
D3  
E
12.40  
0.4882  
15.80 16.00 16.20 0.6220 0.6299 0.6378  
97  
64  
E1 13.80 14.00 14.20 0.5433 0.5512 0.5591  
E3  
e
12.40  
0.40  
0.4882  
0.0157  
b
E
E1  
E3  
L
0.45 0.60 0.75 0.0177 0.0236 0.0295  
L1  
k
1.00  
0d 3.5d 7d  
0.08  
0.0394  
3.5d  
0d  
7d  
128  
33  
ccc  
0.0031  
1
32  
Number of Pins  
e
PIN 1  
IDENTIFICATION  
N
128  
1Values in inches are converted from  
mm and rounded to 4 decimal digits.  
72/78  
STR91xFA  
Package mechanical data  
Figure 29. 144-Low Profile Fine Pitch Ball Grid Array Package  
inches1)  
mm  
Typ  
Dim.  
Min  
1.21  
0.21  
Max  
Min  
Typ  
Max  
A
A1  
A2  
b
1.70 0.0476  
0.0083  
0.0669  
1.085  
0.0427  
0.35 0.40 0.45 0.0138 0.0157 0.0177  
9.85 10.00 10.15 0.3878 0.3937 0.3996  
D
D1  
E
8.80  
0.3465  
9.85 10.00 10.15 0.3878 0.3937 0.3996  
E1  
e
8.80  
0.80  
0.60  
0.3465  
0.0315  
0.0236  
F
ddd  
eee  
fff  
0.10  
0.0039  
0.0059  
0.0031  
0.15  
0.08  
Number of Pins  
N
144  
1Values in inches are converted from mm  
and rounded to 4 decimal digits.  
Figure 30. Recommended PCB Design rules (0.80/0.75mm pitch BGA)  
Dpad  
Dsm  
0.37 mm  
0.52 mm typ. (depends on solder  
mask registration tolerance  
Solder paste 0.37 mm aperture diameter  
– Non solder mask defined pads are recommended  
– 4 to 6 mils screen print  
Dpad  
Dsm  
73/78  
Package mechanical data  
STR91xFA  
7.1  
Thermal characteristics  
The average chip-junction temperature, T must never exceed 125° C.  
J
The average chip-junction temperature, T , in degrees Celsius, may be calculated using the  
J
following equation:  
T = T + (P x Θ )(1)  
J
A
D
JA  
Where:  
T is the Ambient Temperature in °C,  
A
Θ
is the Package Junction-to-Ambient Thermal Resistance, in ° C/W,  
JA  
P is the sum of P  
and P (P = P  
+ P ),  
INT I/O  
D
INT  
I/O  
D
P
is the product of I and V , expressed in Watts. This is the Chip Internal  
DD DD  
INT  
Power.  
P
represents the Power Dissipation on Input and Output Pins;  
I/O  
Most of the time for the applications P < P  
and may be neglected. On the other hand,  
INT  
I/O  
P
may be significant if the device is configured to drive continuously external modules and/or  
I/O  
memories. The worst case P  
of the STR91xFA is 500mW (I x V , or 250mA x 2.0V).  
INT  
DD DD  
An approximate relationship between P and T (if P is neglected) is given by:  
D
J
I/O  
P = K / (T + 273°C) (2)  
D
J
Therefore (solving equations 1 and 2):  
2
K = P x (T + 273°C) + Θ x P (3)  
D
A
JA  
D
where:  
K is a constant for the particular part, which may be determined from equation (3) by  
measuring P (at equilibrium) for a known T Using this value of K, the values of P  
D
A.  
D
and T may be obtained by solving equations (1) and (2) iteratively for any value of T .  
J
A
Table 34. Thermal characteristics  
Symbol  
Parameter  
Value  
Unit  
Thermal Resistance Junction-Ambient  
LQFP 80 - 12 x 12 mm / 0.5 mm pitch  
ΘJA  
41.5  
°C/W  
Thermal Resistance Junction-Ambient  
LQFP128 - 14 x 14 mm / 0.4 mm pitch  
ΘJA  
ΘJA  
38  
°C/W  
°C/W  
Thermal Resistance Junction-Ambient  
LFBGA 144 - 10 x 10 x 1.7mm  
36.5  
74/78  
STR91xFA  
Ordering information  
8
Ordering information  
Table 35. Ordering information  
Part Number  
Flash KB RAM KB  
Major Peripherals  
Package  
LQFP80,  
12x12 mm  
STR910FAM32X6  
256+32  
256+32  
256+32  
64  
64  
64  
CAN, 40 I/Os  
LQFP128,  
14x14 mm  
STR910FAW32X6  
STR910FAZ32H6  
CAN, EMI, 80 I/Os  
CAN, EMI, 80 I/Os  
LFBGA144  
10 x 10 x 1.7  
STR911FAM42X6  
STR911FAM44X6  
STR911FAW42X6  
STR911FAW44X6  
STR912FAW34X6  
STR912FAW42X6  
STR912FAW44X6  
STR912FAZ42H6  
STR912FAZ44H6  
256+32  
512+32  
256+32  
512+32  
512+32  
256+32  
512+32  
256+32  
512+32  
96  
96  
96  
96  
64  
96  
96  
96  
96  
LQFP80,  
12x12mm  
USB, CAN, 40 I/Os  
LQFP128,  
14x14mm  
USB, CAN, EMI, 80 I/Os  
Ethernet, USB, CAN, EMI, 80 I/Os  
Ethernet, USB, CAN, EMI, 80 I/Os  
LQFP128  
LQFP128  
LFBGA144  
10 x 10 x 1.7  
Ethernet, USB, CAN, EMI, 80 I/Os  
75/78  
Ordering information  
STR91xFA  
Table 36. Ordering information scheme  
STR9  
1
2
F
A
W
4
4
X
6
T
Example:  
Family  
ARM9 Microcontroller Family  
Series  
1 = STR9 Series 1  
Feature set  
0 = CAN, UART, IrDA, I2C, SSP  
1 = USB, CAN, UART, IrDA, I2C, SSP  
2 = USB, CAN, UART, IrDA, I2C, SSP, ETHERNET  
Memory type  
F = Flash  
Revision at product level  
A = Revison A  
No. of pins  
M = 80  
W = 128  
Z = 144  
SRAM size  
3 = 64K  
4 = 96K  
Program Memory Size  
2 = 256K  
4 = 512K  
Package  
X = plastic LQFP  
H = LFBGA  
Temperature Range  
6 = -40 to 85°C  
Shipping Option  
T = Tape & Reel Packing  
For a list of available options (e.g. speed, package) or for further information on any aspect of this  
device, please contact the ST Sales Office nearest to you.  
76/78  
STR91xFA  
Revision history  
9
Revision history  
Table 37. Revision history  
Date  
Revision  
Changes  
09-May-2007  
1
Initial release  
77/78  
STR91xFA  
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