STPS8170DEE [STMICROELECTRONICS]
Power Schottky rectifier; 功率肖特基整流器
| 型号： | STPS8170DEE |
| 厂家： | 
ST |
| 描述： | Power Schottky rectifier |
| 文件： | 总8页 (文件大小：91K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
STPS8170DEE
Power Schottky rectifier
Datasheet production data
Features
NC
■ Very low conduction losses
■ Negligible switching losses
■ Extremely fast switching
■ Low thermal resistance
A
K
A
A
NC
A
A
A
■ Avalanche capacity specified
■ High junction temperature
A
A
A
NC
®
■ ECOPACK 2 compliant component
K
K
Description
This Schottky rectifier is designed for switch mode
power supply and high frequency DC to DC
converters.
PowerFLAT(3.3 x 3.3)
STPS8170DEE-TR
Packaged in PowerFLAT™, this device is
intended for use in low voltage, high frequency,
inverters, free-wheeling, by-pass diode and
polarity protection applications.Its low profile was
especially designed to be used in applications
with space-saving constraints.
Table 1.
Device summary
Symbol
Value
IF(AV)
VRRM
8 A
170 V
175 °C
0.66 V
Tj (max)
VF (typ)
TM: PowerFLAT is a trademark of STMicroelectronics
September 2012
Doc ID 023260 Rev 1
1/8
This is information on a product in full production.
www.st.com
8
Characteristics
STPS8170DEE
1
Characteristics
Table 2.
Symbol
Absolute ratings (limiting values T
Parameter
= 25 °C unless otherwise specified)
amb
Value
Unit
V
VRRM
IF(RMS)
IF(AV)
IFSM
Repetitive peak reverse voltage
Forward rms current
170
15
8
A
Average forward current
Tc = 145 °C
= 0.5
A
Surge non repetitive forward current tp = 10 ms sinusoidal
100
A
(1)
PARM
Repetitive peak avalanche power
Storage temperature range
tp = 10 µs Tj = 125 °C
400
W
°C
°C
Tstg
Tj
-65 to +175
175
Maximum operating junction temperature
1. For pulse time duration deratings, please refer to Figure 3. More details regarding the avalanche energy
measurements and diode validation in the avalanche are provided in the STMicroelectronics Application
notes AN1768, “Admissible avalanche power of schottky diodes” and AN2025, “Converter improvement
using Schottky rectifier avalanche specification”.
Table 3.
Symbol
Thermal resistance
Parameter
Value
Unit
Rth(j-c) Junction to case
4
°C/W
Table 4.
Symbol
Static electrical characteristics
Parameter
Test conditions
Min.
Typ.
Max.
Unit
Tj = 25 °C
Tj = 125 °C
Tj = 25 °C
Tj = 125 °C
-
-
15
15
µA
(1)
IR
Reverse leakage current
VR = VRRM
IF = 8A
1.5
mA
0.90
0.72
(2)
VF
Forward voltage drop
V
-
0.66
1. Pulse test: tp = 5 ms, < 2%
2. Pulse test: tp = 380 µs, < 2%
To evaluate the conduction losses use the following equation:
2
P = 0.62 x IF(AV) + 0.0125 x IF (RMS)
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STPS8170DEE
Characteristics
Figure 1.
Average forward power dissipation Figure 2.
versus average forward current
Average forward current versus
ambient temperature( = 0.5)
P
F(AV)
(W)
IF(AV)(A)
10
8
9
8
7
6
5
4
3
2
1
0
δ = 0.5
δ = 0.2
R
=R
th(j-a) th(j-c)
δ = 0.1
δ = 0.05
δ = 1
6
4
T
T
2
I
(A)
tp
50
Tamb(°C)
125
=tp/T
δ
F(AV)
tp
10
=tp/T
δ
0
0
25
75
100
150
175
0
1
2
3
4
5
6
7
8
9
11
Figure 3.
Normalized avalanche power
derating versus pulse duration
Figure 4.
Relative variation of thermal
impedance junction to case versus
pulse duration
Z
/R
th(j-c) th(j-c)
PARM(t
)
p
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
PARM(10 µs)
1
0.1
0.01
Single pulse
t
(s)
tp(µs)
1000
p
0.001
1
10
100
1.E-05
1.E-04
1.E-03
1.E-02
1.E-01
1.E+00
Figure 5.
Reverse leakage current versus
reverse voltage applied (typical
values)
Figure 6.
Junction capacitance versus
reverse voltage applied (typical
values)
C(pF)
1000
IR(mA)
1.E+01
1.E+00
1.E-01
1.E-02
1.E-03
1.E-04
1.E-05
T
= 150 °C
j
F=1 MHz
VOSC=30 mVRMS
Tj =25 °C
T
T
= 125 °C
j
= 100 °C
= 75 °C
j
T
j
100
T
= 50 °C
= 25 °C
j
T
j
VR(V)
160
V
R
(V)
10
1
0
20
40
60
80
100
120
140
180
10
100
1000
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Characteristics
STPS8170DEE
Figure 7.
Forward voltage drop versus
forward current
Figure 8.
Thermal resistance junction to
ambient versus copper surface
under tab
I
(A)
R
(°C/W)
FM
th(j-a)
100.0
10.0
1.0
250
200
150
100
50
PowerFLAT (3.3x3.3)
Tj=125 °C
(Maximum values)
epoxy printed board FR4, copper thickness=35µm
Tj=125 °C
(Typical values)
Tj=25 °C
(Maximum values)
S
(cm²)
9
V
(V)
Cu
FM
0
0.1
0
1
2
3
4
5
6
7
8
10
0.0
0.2
0.4
0.6
0.8
1.0
1.2
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Doc ID 023260 Rev 1
STPS8170DEE
Package information
2
Package information
●
●
Epoxy meets UL94,V0
Lead-free package
In order to meet environmental requirements, ST offers these devices in different grades of
®
®
ECOPACK packages, depending on their level of environmental compliance. ECOPACK
specifications, grade definitions and product status are available at: www.st.com.
®
ECOPACK is an ST trademark.
Figure 9.
PowerFLAT-3.3x3.3-8L dimensions (definitions)
Exposed pad
L
E
E2
E/2
L1
A3
b
nc
a
nc
a
D/2
e/2
e
D
D2
D3
k
k
L2
A
Index area
(D/2 x E/2)
Projection
Table 5.
Ref.
PowerFLAT-8L dimensions (values)
Dimensions
Millimeters
Typ.
Inches
Typ.
Min.
Max.
Min.
Max.
A
A3
A4
b
0.95
1.00
0.20
0.20
0.37
3.30
2.31
1.67
0.65
3.30
1.75
0.38
0.62
0.93
1.05
0.037
0.039
0.0079
0.0079
0.015
0.130
0.091
0.066
0.026
0.130
0.069
0.015
0.024
0.037
0.041
0.30
3.20
2.24
1.60
0.44
3.40
2.38
1.74
0.012
0.126
0.017
0.134
0.094
0.069
D
D2
D3
e
0.088
0.063
E
3.20
1.68
0.31
0.55
0.86
3.40
1.82
0.45
0.69
1.00
0.126
0.066
0.012
0.22
0.134
0.072
0.018
0.027
0.039
E2
L
L1
L2
0.034
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Package information
Figure 10. Footprint (dimensions in mm)
STPS8170DEE
3.50
1.75
0.21
0.52
1.25
1.79
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STPS8170DEE
Ordering information
3
Ordering information
Table 6.
Ordering information
Order code
Marking
Package
Weight
Base qty Delivery mode
PowerFLAT
(3.3 x 3.3)
Tape and reel
STPS8170DEE-TR
PS8170
34 mg
3000
13” reel
4
Revision history
Table 7.
Date
09-Sep-2012
Document revision history
Revision
Changes
1
First issue.
Doc ID 023260 Rev 1
7/8
STPS8170DEE
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