STPS30L30C_10 [STMICROELECTRONICS]
Low drop power Schottky rectifier; 电力低压降肖特基整流器
| 型号： | STPS30L30C_10 |
| 厂家： | 
ST |
| 描述： | Low drop power Schottky rectifier |
| 文件： | 总9页 (文件大小：113K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
STPS30L30C
Low drop power Schottky rectifier
Features
A1
■ Very small conduction losses
■ Negligible switching losses
■ Extremely fast switching
■ Low forward voltage drop
■ Low thermal resistance
K
A2
K
K
A2
A2
■ Avalanche capability specified
A1
K
A1
D2PAK
Description
TO-220AB
STPS30L30CG
STPS30L30CT
This dual center tap Schottky rectifier is suited for
switch mode power supplies and high frequency
DC to DC converters.
2
2
A2
Packaged in TO-220AB, D PAK and I PAK, this
device is intended for use in low voltage, high
frequency inverters, free-wheeling and polarity
protection applications.
A1
K
I2PAK
STPS30L30CR
Table 1.
Device summary
IF(AV)
2 x 15 A
30 V
(a)
Figure 1.
Electrical characteristics
VRRM
Tj (max)
VF(typ)
I
V
I
150 °C
0.37 V
"Forward"
2 x I
X
O
I
F
I
O
X
V
AR
RRM
V
V
R
V
I
R
V
V
V
V
F F(2xI
F(I
)
)
o
To
o
"Reverse"
I
AR
a. VARM and IARM must respect the reverse safe
operating area defined in Figure 12 VAR and IAR are
pulse measurements (tp < 1 µs). VR, IR, VRRM and VF,
are static characteristics
April 2010
Doc ID 5506 Rev 6
1/9
www.st.com
9
Characteristics
STPS30L30C
1
Characteristics
Table 2.
Symbol
Absolute ratings (limiting values per diode)
Parameter
Value
Unit
VRRM Repetitive peak reverse voltage
IF(RMS) Forward rms current
30
30
V
A
Per diode
Per device
15
30
IF(AV)
Average forward current δ = 0.5
Tc = 140 °C,
A
IFSM
IRRM
IRSM
Surge non repetitive forward current tp = 10 ms sinusoidal,
220
1
A
A
Peak repetitive reverse current
Non repetitive peak reverse current tp = 100 µs square
Repetitive peak avalanche power tp = 1 µs Tj = 25 °C
Maximum repetitive peak avalanche tp < 1 µs Tj < 150 °C
tp = 2 µs square, F= 1 kHz square
3
A
(1)
PARM
5300
W
(2)
(2)
VARM
45
45
V
V
voltage
IAR < 35 A
Maximum single pulse peak
avalanche voltage
tp < 1 µs Tj < 150 °C
VASM
IAR < 35 A
Tstg
Tj
Storage temperature range
Maximum operating junction temperature (3)
-65 to + 175
150
°C
°C
dV/dt
Critical rate of rise of reverse voltage
10000
V/µs
1. For temperature or pulse time duration deratings, refer to Figure 4. and Figure 5.. More details regarding the avalanche
energy measurements and diode validation in the avalanche are provided in the application notes AN1768 and AN2025.
2. Refer to Figure 12
dPtot
dTj
1
---------------
-------------------------
3.
<
condition to avoid thermal runaway for a diode on its own heatsink
Rth(j – a)
(1)
Table 3.
Symbol
Thermal resistance
Parameter
Value
Unit
Per diode
Total
1.5
0.8
Rth(j-c)
Rth(c)
Junction to case
Coupling
°C/W
0.1
1. When the diodes 1 and 2 are used simultaneously: Δ Tj(diode 1) = P(diode1) x Rth(j-c)(Per diode) + P(diode 2) x Rth(c)
Table 4.
Symbol
Static electrical characteristics (per diode)
Parameter
Test conditions
Min.
Typ.
Max.
Unit
Tj = 25 °C
Tj = 125 °C
Tj = 25 °C
Tj = 125 °C
Tj = 25 °C
Tj = 125 °C
1.5
350
0.46
0.37
0.57
0.5
mA
mA
(1)
IR
Reverse leakage current
VR = VRRM
IF = 15 A
IF = 30A
170
0.33
0.43
(1)
VF
Forward voltage drop
V
1. Pulse test: tp = 380 µs, δ < 2%
To evaluate the conduction losses use the following equation:
2
P = 0.24 x I
+ 0.009 x I
F(AV)
F (RMS)
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Doc ID 5506 Rev 6
STPS30L30C
Figure 2.
Characteristics
Average forward power dissipation Figure 3.
versus average forward current
(per diode)
Average forward current per diode
versus ambient temperature
(δ = 0.5)
IF(av)(A)
PF(av)(W)
16
14
12
10
8
10
9
8
Rth(j-a)=Rth(j-c)
δ = 0.2
δ = 0.1
δ = 0.5
δ = 0.05
Rth(j-a)=15°C/W
7
6
5
4
3
2
1
0
δ = 1
Rth(j-a)=50°C/W
6
T
T
4
2
IF(av) (A)
Tamb(°C)
tp
=tp/T
δ
tp
=tp/T
δ
0
0
2
4
6
8
10 12 14 16 18 20
0
25
50
75
100
125
150
Figure 4.
Normalized avalanche power
derating versus pulse duration
Figure 5.
Normalized avalanche power
derating versus junction
temperature
P
(t )
p
ARM
(1µs)
P
(T )
j
(25°C)
ARM
P
ARM
P
ARM
1
1.2
1
0.1
0.8
0.6
0.4
0.2
0
0.01
T (°C)
j
t
(µs)
p
0.001
25
50
75
100
125
150
0.01
0.1
1
10
100
1000
Figure 6.
Non repetitive surge peak forward Figure 7.
current versus overload duration,
(maximum values per diode)
Relative variation of thermal
impedance junction to case
versus pulse duration
Zth(j-c)/Rth(j-c)
IM(A)
250
225
200
175
150
125
100
75
1.0
0.8
0.6
0.4
0.2
0.0
δ = 0.5
Tc=25°C
Tc=75°C
Tc=110°C
δ = 0.2
δ = 0.1
T
IM
50
25
0
t
t(s)
tp(s)
=tp/T
δ
tp
δ=0.5
Single pulse
1E-3
1E-2
1E-1
1E+0
1E-4
1E-3
1E-2
1E-1
1E+0
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Characteristics
STPS30L30C
Figure 8.
Reverse leakage current versus
Figure 9.
Junction capacitance versus
reverse voltage applied (typical
values per diode)
reverse voltage applied
(typical values per diode)
IR(mA)
C(nF)
1E+3
1E+2
1E+1
1E+0
1E-1
1E-2
5.0
Tj=150°C
Tj=125°C
F=1MHz
Tj=25°C
1.0
Tj=25°C
VR(V)
VR(V)
15
0.1
1
2
5
10
20
50
0
5
10
20
25
30
Figure 10. Forward voltage drop versus
Figure 11. Thermal resistance junction to
ambient versus copper surface
under tab
forward current (maximum values
per diode)
IFM(A)
Rth(j-a) (°C/W)
200
100
80
2
Epoxy printed circuit board, D PAK
copper thickness = 35 µm
70
60
50
40
30
20
10
0
Tj=15 0 °C
(typical values)
Tj=12 5 °C
10
Tj=25 °C
S(Cu) (cm²)
VFM(V)
1
0
4
8
12 16 20 24 28 32 36 40
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6
Figure 12. Reverse safe operating area (t < 1 µs and T < 150 °C)
p
j
Iarm (A)
55
50
45
40
35
30
25
20
Forbidden area
Operating area
Varm(V)
55
30
35
40
45
50
60
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Doc ID 5506 Rev 6
STPS30L30C
Package information
2
Package information
●
●
●
Epoxy meets UL94, V0
Cooling method: by conduction (C)
Recommended torque value: 0.4 to 0.6 N·m
In order to meet environmental requirements, ST offers these devices in different grades of
®
®
ECOPACK packages, depending on their level of environmental compliance. ECOPACK
specifications, grade definitions and product status are available at: www.st.com.
®
ECOPACK is an ST trademark.
Table 5.
TO-220AB dimensions
Dimensions
Millimeters
Ref.
Inches
Min. Max.
Min.
Max.
A
C
4.40
1.23
2.40
0.49
0.61
1.14
1.14
4.95
2.40
10
4.60
1.32
2.72
0.70
0.88
1.70
1.70
5.15
2.70
10.40
0.173
0.048
0.094
0.019
0.024
0.044
0.044
0.194
0.094
0.393
0.181
0.051
0.107
0.027
0.034
0.066
0.066
0.202
0.106
0.409
A
H2
D
Dia
C
E
L5
L7
F
F1
F2
G
L6
L2
F2
F1
D
L9
G1
H2
L2
L4
L5
L6
L7
L9
M
L4
16.4 typ.
0.645 typ.
F
M
13
14
0.511
0.104
0.600
0.244
0.137
0.551
0.116
0.620
0.259
0.154
G1
E
2.65
15.25
6.20
3.50
2.95
15.75
6.60
3.93
G
2.6 typ.
0.102 typ.
Diam.
3.75
3.85
0.147
0.151
Doc ID 5506 Rev 6
5/9
Package information
STPS30L30C
2
Mounting (soldering) the I PAK metal slug (heatsink) with alloy, like a surface mount device,
IS NOT PERMITTED. A standard through-hole mounting is mandatory.
2
Table 6.
I PAK dimensions
Dimensions
Millimeters
Ref.
Inches
Min.
Max.
Min.
Max.
A
A
A1
b
4.40
2.40
0.61
1.14
0.49
1.23
8.95
2.40
4.95
10
4.60
2.72
0.88
1.70
0.70
1.32
9.35
2.70
5.15
10.40
14
0.173
0.094
0.024
0.044
0.019
0.048
0.352
0.094
0.195
0.394
0.512
0.138
0.050
0.181
0.107
0.035
0.067
0.028
0.052
0.368
0.106
0.203
0.409
0.551
0.155
0.055
E
c2
L2
b1
c
D
c2
D
L1
A1
b1
b
L
e
e1
E
c
e
L
13
e1
L1
L2
3.50
1.27
3.93
1.40
6/9
Doc ID 5506 Rev 6
STPS30L30C
Package information
Dimensions
2
Table 7.
D PAK dimensions
Ref.
Millimeters
Inches
Min.
Max.
Min.
Max.
A
A1
A2
B
4.40
2.49
0.03
0.70
1.14
0.45
1.23
8.95
10.00
4.88
15.00
1.27
1.40
2.40
4.60
2.69
0.23
0.93
1.70
0.60
1.36
9.35
10.40
5.28
15.85
1.40
1.75
3.20
0.173
0.098
0.001
0.027
0.045
0.017
0.048
0.352
0.393
0.192
0.590
0.050
0.055
0.094
0.181
0.106
0.009
0.037
0.067
0.024
0.054
0.368
0.409
0.208
0.624
0.055
0.069
0.126
A
E
C2
L2
L3
D
B2
C
L
A1
C2
D
B2
B
R
C
E
G
G
A2
L
M
L2
L3
M
*
V2
* FLAT ZONE NO LESS THAN 2mm
R
0.40 typ.
0°
0.016 typ.
V2
8°
0°
8°
2
Figure 13. D PAK footprint (dimensions in mm)
16.90
10.30
5.08
1.30
3.70
8.90
Doc ID 5506 Rev 6
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Ordering information
STPS30L30C
3
Ordering information
Table 8.
Order code
STPS30L30CT
Ordering information
Marking
Package
Weight Base qty Delivery mode
STPS30L30CT
STPS30L30CR
STPS30L30CG
STPS30L30CG
TO-220AB
D2PAK
D2PAK
I2PAK
2.0 g
1.8 g
1.8 g
1.49 g
50
50
Tube
Tube
STPS30L30CG
STPS30L30CG-TR
STPS30L30CG-TR
1000
50
Tape and reel
Tube
4
Revision history
Table 9.
Date
Document revision history
Revision
Changes
Jul-2003
5C
Previous issue
Added Figure 1 and Figure 12. Added parameters VARM and VASM
to Table 2.
29-Apr-2010
6
8/9
Doc ID 5506 Rev 6
STPS30L30C
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