STPS3045DJF-TR [STMICROELECTRONICS]

45 V, 30 A PowerFLAT Power Schottky rectifier;


型号：	STPS3045DJF-TR
厂家：	ST
描述：	45 V, 30 A PowerFLAT Power Schottky rectifier
文件：	总5页 (文件大小：76K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

STPS3045G

POWER SCHOTTKY RECTIFIER

MAIN PRODUCT CHARACTERISTICS

I_F(AV)

V_RRM

30 A

45 V

175°C

0.63 V

(max)

_F(max)

FEATURES AND BENEFITS

VERY SMALL CONDUCTION LOSSES

NEGLIGIBLE SWITCHING LOSSES

EXTREMELY FAST SWITCHING

LOW THERMAL RESISTANCE

HIGH DISSIPATION MINIATURE PACKAGE

D²PAK

DESCRIPTION

Single Schottky rectifier suited for switchmode

power supply and high frequency DC to DC con-

verters.

Packaged in D²PAK surface mount package , this

device is intended for use in low voltage, high fre-

quency inverters, free wheeling and polarity pro-

tection applications.

ABSOLUTE RATINGS

Symbol

(limiting values)

Parameter

Value

Unit

V_RRM

Repetitive peak reverse voltage

I_F(RMS)RMS forward current

I_F(AV)

I_FSM

I_RRM

Average forward current

Tc = 150°C

= 0.5

Surge non repetitive forward current

Repetitive peak reverse current

tp = 10 ms

Sinusoidal

200

tp = 2 µs

F = 1kHz square

I_RSM

Tstg

Non Repetitive peak reverse current

Storage temperature range

Maximum operating junction temperature*

Critical rate of rise of reverse voltage

tp = 100µs square

- 65 to + 175

175

°C

V/ s

dV/dt

10000

dPtot

dTj

* :

thermal runaway condition for a diode on its own heatsink

Rth(j−a)

October 1999 - Ed: 4A

1/5

STPS3045G

THERMAL RESISTANCES

Symbol

Parameter

Value

Unit

R_{th (j-c)}Junction to case

C/W

STATIC ELECTRICAL CHARACTERISTICS

Symbol

Parameter

Tests Conditions

Min. Typ. Max.

Unit

I_R*

Reverse leakage current

Tj = 25 C

V_R= V_RRM

500

Tj = 125 C

V_F**

Forward voltage drop

Tj = 125 C

I_F= 30 A

0.53

0.63

0.84

0.78

= 60 A

Tj = 25 C

I_F

0.68

Tj = 125 C

Pulse test : * tp = 5 ms, δ < 2 %

** tp = 380 µs, δ < 2%

To evaluate the conduction losses use the following equation :

P = 0.48 x I_F(AV)+ 0.005 I_{F (RMS)}

Fig. 2:

temperature ( =0.5).

Fig. 1:

average forward current.

Average forward current versus ambient

Average forward power dissipation versus

PF(av)(W)

IF(av)(A)

δ = 0.2

δ = 0.5

δ = 0.1

Rth(j-a)=Rth(j-c)

δ = 0.05

δ = 1

Rth(j-a)=30°C/W

=tp/T

IF(av) (A)

=tp/T

Tamb(°C)

75 100

125

150

175

2/5

STPS3045G

Fig. 3:

Non repetitive surge peak forward current

Fig. 4:

Relative variation of thermal impedance

versus overload duration (maximum values).

junction to case versus pulse duration.

Zth(j-c)/Rth(j-c)

IM(A)

400

1.0

350

0.8

300

250

δ = 0.5

0.6

Tc=75°C

200

150

100

Tc=100°C

Tc=125°C

0.4

δ = 0.2

δ = 0.1

0.2

t(s)

tp(s)

=0.5

=tp/T

Single pulse

0.0

1E-4

1E-3

1E-2

1E-1

1E+0

1E-3

1E-2

1E-1

1E+0

Fig. 5:

Fig. 6:

Junction capacitance versus reverse

voltage applied (typical values).

Reverse leakage current versus reverse

voltage applied (typical values)

C(nF)

IR(µA)

5.0

1E+5

F=1MHz

Tj=25°C

Tj=150°C

Tj=125°C

1E+4

Tj=100°C

1E+3

1.0

Tj=75°C

Tj=50°C

1E+2

Tj=25°C

1E+1

VR(V)

1E+0

0.1

Fig. 8:

Thermal resistance junction to ambient ver-

Fig. 7:

(maximum values).

Forward voltage drop versus forward current

sus copper surface under tab (Epoxy printed circuit

board, copper thickness: 35 m)

IFM(A)

Rth(j-a) (°C/W)

200

100

Typical values

Tj=125°C

Tj=25°C

Tj=125°C

S(Cu) (cm²)

VFM(V)

10 12 14 16 18 20

0.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

3/5

STPS3045G

PACKAGE MECHANICAL DATA

D²PAK

DIMENSIONS

Millimeters Inches

Min. Min.

REF.

Max.

4.60

2.69

0.23

0.93

1.70

0.60

1.36

9.35

10.40

5.28

15.85

1.40

1.75

3.20

Max.

0.181

0.106

0.009

0.037

0.067

0.024

0.054

0.368

0.409

0.208

0.624

0.055

0.069

0.126

4.40

2.49

0.03

0.70

1.14

0.45

1.23

8.95

10.00

4.88

15.00

1.27

1.40

2.40

0.173

0.098

0.001

0.027

0.045

0.017

0.048

0.352

0.393

0.192

0.590

0.050

0.055

0.094

0.40 typ.

0.016 typ.

* FLAT ZONE NO LESS THAN 2mm

0°

8°

0°

8°

FOOTPRINT DIMENSIONS

(in millimeters)

16.90

10.30

5.08

1.30

3.70

8.90

4/5

STPS3045G

Type

Marking

Package

D²PAK

Weight

1.48g

Base qty

Delivery mode

Tube

STPS3045G

STPS3045G-TR

STPS3045G

1.48g

500

Tape & Reel

Epoxy meets UL94, V0

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use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by

implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to

change without notice. This publication supersedes and replaces all information previously supplied.

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5/5

STPS3045DJF-TR [STMICROELECTRONICS]

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