STP100NF04 [STMICROELECTRONICS]

N-CHANNEL 40V - 0.0043ohm - 120A TO-220/D2PAK/I2PAK STripFET⑩ II POWER MOSFET; N沟道40V - 0.0043ohm - 120A TO- 220 / D2PAK / I2PAK STripFET⑩ II功率MOSFET
STP100NF04
型号: STP100NF04
厂家: ST    ST
描述:

N-CHANNEL 40V - 0.0043ohm - 120A TO-220/D2PAK/I2PAK STripFET⑩ II POWER MOSFET
N沟道40V - 0.0043ohm - 120A TO- 220 / D2PAK / I2PAK STripFET⑩ II功率MOSFET

晶体 晶体管 功率场效应晶体管 开关 脉冲 局域网
文件: 总15页 (文件大小:586K)
中文:  中文翻译
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STP100NF04  
STB100NF04, STB100NF04-1  
2
2
N-CHANNEL 40V - 0.0043- 120A TO-220/D PAK/I PAK  
STripFET™ II POWER MOSFET  
AUTOMOTIVE SPECIFIC  
TYPE  
V
R
I
D
Pw  
DSS  
DS(on)  
STP100NF04  
STB100NF04  
STB100NF04-1  
40 V  
40 V  
40 V  
< 0.0046 120 A 300 W  
< 0.0046 120 A 300 W  
<0.0046 120 A 300 W  
TYPICAL R (on) = 0.0043  
STANDARD THRESHOLD DRIVE  
100% AVALANCHE TESTED  
DS  
3
2
1
2
TO-220  
I PAK  
3
1
DESCRIPTION  
2
D PAK  
This Power Mosfet is the latest development of ST-  
Microelectronics unique “Single Feature Size™”  
strip-based process. The resulting transistor shows  
extremely high packing density for low on-resis-  
tance, rugged avalanche characteristics and less  
critical alignment steps therefore a remarkable man-  
ufacturing reproducibility.  
INTERNAL SCHEMATIC DIAGRAM  
APPLICATIONS  
HIGH CURRENT, HIGH SWITCHING SPEED  
MOTOR CONTROL, AUDIO AMPLIFIERS  
DC-DC & DC-AC CONVERTERS  
SOLENOID AND RELAY DRIVERS  
ORDERING INFORMATION  
SALES TYPE  
MARKING  
P100NF04  
B100NF04  
PACKAGE  
PACKAGING  
TUBE  
STP100NF04  
STB100NF04T4  
STB100NF04-1  
TO-220  
2
TAPE & REEL  
D PAK  
2
B100NF04  
TUBE  
I PAK  
February 2002  
1/15  
STP100NF04, STB100NF04, STB100NF04-1  
ABSOLUTE MAXIMUM RATINGS  
Symbol  
Parameter  
Value  
40  
Unit  
V
V
Drain-source Voltage (V = 0)  
DS  
GS  
V
Drain-gate Voltage (R = 20 k)  
40  
V
DGR  
GS  
V
Gate- source Voltage  
± 20  
120  
120  
480  
300  
2
V
GS  
I
(#)  
Drain Current (continuos) at T = 25°C  
A
D
C
I
Drain Current (continuos) at T = 100°C  
A
D
C
I
( )  
Drain Current (pulsed)  
A
DM  
P
TOT  
Total Dissipation at T = 25°C  
W
C
Derating Factor  
W/°C  
V/ns  
J
dv/dt (1)  
Peak Diode Recovery voltage slope  
Single Pulse Avalanche Energy  
6
E
(2)  
1.2  
AS  
T
T
stg  
Operating Junction Temperature  
Storage Temperature  
-55 to 175  
°C  
j
( ) Pulse width limited by safe operating area  
(1) I 120A, di/dt 300A/µs, V V  
, T T  
j JMAX.  
SD  
DD  
(BR)DSS  
(2) Starting T = 25°C, I = 60A, V =30 V  
j
d
DD  
(#) Current Limited by Package  
THERMAL DATA  
2
2
TO-220 / I PAK / D PAK  
Rthj-case  
Rthj-pcb  
Rthj-amb  
Thermal Resistance Junction-case Max  
0.5  
°C/W  
°C/W  
°C/W  
°C  
Thermal Resistance Junction-pcb Max  
See Curve on page 6  
Thermal Resistance Junction-ambient (Free air) Max  
Maximum Lead Temperature For Soldering Purpose  
62.5  
300  
T
l
ELECTRICAL CHARACTERISTICS (TCASE =25°C UNLESS OTHERWISE SPECIFIED)  
ON/OFF  
Symbol  
Parameter  
Drain-source  
Test Conditions  
Min.  
Typ.  
Max.  
Unit  
V
I
D
= 250 µA, V = 0  
40  
V
(BR)DSS  
GS  
Breakdown Voltage  
I
Zero Gate Voltage  
V
= Max Rating  
DS  
1
10  
µA  
µA  
DSS  
Drain Current (V = 0)  
V
= Max Rating, T = 125 °C  
GS  
DS  
C
I
Gate-body Leakage  
V
GS  
= ± 20V  
±100  
nA  
GSS  
Current (V = 0)  
DS  
V
V
V
= V , I = 250µA  
Gate Threshold Voltage  
2
4
V
GS(th)  
DS  
GS  
D
R
Static Drain-source On  
Resistance  
= 10V, I = 50 A  
0.0043 0.0046  
DS(on)  
GS  
D
2/15  
STP100NF04, STB100NF04, STB100NF04-1  
ELECTRICAL CHARACTERISTICS (CONTINUED)  
DYNAMIC  
Symbol  
Parameter  
Test Conditions  
= 15 V I = 50 A  
Min.  
Typ.  
Max.  
Unit  
g
fs  
(1)  
Forward Transconductance  
V
DS  
150  
S
, D  
C
Input Capacitance  
Output Capacitance  
Reverse Transfer  
Capacitance  
V
DS  
= 25V, f = 1 MHz, V = 0  
5100  
1300  
160  
pF  
pF  
pF  
iss  
GS  
C
oss  
C
rss  
SWITCHING ON  
Symbol  
Parameter  
Test Conditions  
Min.  
Typ.  
Max.  
Unit  
t
Turn-on Delay Time  
Rise Time  
V
= 20 V, I = 60 A  
35  
220  
ns  
ns  
d(on)  
DD  
D
t
r
R = 4.7V = 10 V  
G GS  
(Resistive Load see, Figure 3)  
Q
Q
Q
V
V
= 32V, I = 120 A,  
= 10V  
110  
35  
35  
150  
g
Total Gate Charge  
Gate-Source Charge  
Gate-Drain Charge  
DD  
D
nC  
nC  
nC  
gs  
gd  
GS  
(see, Figure 4)  
SWITCHING OFF  
Symbol  
Parameter  
Test Conditions  
= 20 V, I = 60 A  
R = 4.7V = 10 V  
G GS  
Min.  
Min.  
Typ.  
Max.  
Unit  
t
Turn-off Delay Time  
Fall Time  
V
DD  
80  
50  
ns  
ns  
d(off)  
D
t
f
(Resistive Load see, Figure 3)  
SOURCE DRAIN DIODE  
Symbol  
Parameter  
Test Conditions  
Typ.  
Max.  
Unit  
I
120  
480  
A
A
Source-drain Current  
Source-drain Current (pulsed)  
SD  
(2)  
I
SDM  
V
(1)  
I
I
= 120 A, V = 0  
Forward On Voltage  
1.3  
V
SD  
SD  
GS  
t
= 120 A, di/dt = 100A/µs  
= 20V, T = 150°C  
Reverse Recovery Time  
Reverse Recovery Charge  
Reverse Recovery Current  
75  
185  
5
ns  
nC  
A
rr  
SD  
Q
V
DD  
rr  
RRM  
j
I
(see test circuit, Figure 5)  
Note: 1. Pulsed: Pulse duration = 300 µs, duty cycle 1.5 %.  
2. Pulse width limited by safe operating area.  
3/15  
STP100NF04, STB100NF04, STB100NF04-1  
Power Derating vs Tc  
Max Id Current vs Tc  
Output Characteristics  
Transfer Characteristics  
Transconductance  
Static Drain-source On Resistance  
4/15  
STP100NF04, STB100NF04, STB100NF04-1  
Capacitance Variations  
Gate Charge vs Gate-source Voltage  
Normalized Gate Thereshold Voltage vs Temp.  
Normalized On Resistance vs Temperature  
Source-drain Diode Forward Characteristics  
NormalizedBreakdownvoltagevsTemperature  
5/15  
STP100NF04, STB100NF04, STB100NF04-1  
Thermal Resistance Rthj-a vs PCB Copper Area  
Max Power Dissipation vs PCB Copper Area  
Safe Operating Area  
Thermal Impedance  
6/15  
STP100NF04, STB100NF04, STB100NF04-1  
Allowable Iav vs. Time in Avalanche  
The previous curve gives the safe operating area for unclamped inductive loads, single pulse or repetitive,  
under the following conditions:  
P
E
= 0.5 * (1.3 * BV  
* I  
)
AV  
D(AVE)  
AS(AR)  
DSS  
= P  
* t  
AV  
D(AVE)  
Where:  
is the Allowable Current in Avalanche  
I
AV  
P
is the Average Power Dissipation in Avalanche (Single Pulse)  
D(AVE)  
t
is the Time in Avalanche  
AV  
To derate above 25 °C, at fixed I  
the following equation must be applied:  
AV,  
I
AV  
= 2 * (T  
- T  
) / (1.3 * BV  
* Z )  
DSS th  
jmax  
CASE  
Where:  
= K * R is the value coming from Normalized Thermal Response at fixed pulse width equal to T .  
AV  
Z
th  
th  
7/15  
STP100NF04, STB100NF04, STB100NF04-1  
SPICE THERMAL MODEL  
Parameter  
CTHERM1  
CTHERM2  
CTHERM3  
CTHERM4  
Node  
5 - 4  
4 - 3  
3 - 2  
2 - 1  
Value  
0.011  
0.0012  
0.05  
0.1  
RTHERM1  
RTHERM2  
RTHERM3  
RTHERM4  
5 - 4  
4 - 3  
3 - 2  
2 - 1  
0.09  
0.02  
0.11  
0.17  
8/15  
STP100NF04, STB100NF04, STB100NF04-1  
Fig. 1: Unclamped Inductive Load Test Circuit  
Fig. 2: Unclamped Inductive Waveform  
Fig. 3.1: Inductive Load Switching And Diode Re-  
covery Times Waveform  
Fig. 3: Switching Times Test Circuit For  
Resistive Load  
Fig. 4: Gate Charge test Circuit  
Fig. 4.1: Gate Charge test Waveform  
9/15  
STP100NF04, STB100NF04, STB100NF04-1  
Fig. 5: Test Circuit For Diode Recovery Times  
Fig. 5.1: Diode Recovery Times Waveform  
10/15  
STP100NF04, STB100NF04, STB100NF04-1  
TO-220 MECHANICAL DATA  
mm  
inch  
TYP.  
DIM.  
MIN.  
4.40  
1.23  
2.40  
TYP.  
MAX.  
4.60  
1.32  
2.72  
MIN.  
0.173  
0.048  
0.094  
MAX.  
0.181  
0.051  
0.107  
A
C
D
D1  
E
1.27  
0.050  
0.49  
0.61  
1.14  
1.14  
4.95  
2.4  
0.70  
0.88  
1.70  
1.70  
5.15  
2.7  
0.019  
0.024  
0.044  
0.044  
0.194  
0.094  
0.393  
0.027  
0.034  
0.067  
0.067  
0.203  
0.106  
0.409  
F
F1  
F2  
G
G1  
H2  
L2  
L4  
L5  
L6  
L7  
L9  
DIA.  
10.0  
10.40  
16.4  
0.645  
13.0  
2.65  
15.25  
6.2  
14.0  
2.95  
15.75  
6.6  
0.511  
0.104  
0.600  
0.244  
0.137  
0.147  
0.551  
0.116  
0.620  
0.260  
0.154  
0.151  
3.5  
3.93  
3.85  
3.75  
L2  
Dia.  
L5  
L9  
L7  
L6  
L4  
P011C  
11/15  
STP100NF04, STB100NF04, STB100NF04-1  
D2PAK MECHANICAL DATA  
mm.  
TYP  
inch  
TYP.  
DIM.  
MIN.  
4.4  
MAX.  
4.6  
MIN.  
0.173  
0.098  
0.001  
0.027  
0.044  
0.017  
0.048  
0.352  
MAX.  
0.181  
0.106  
0.009  
0.036  
0.067  
0.023  
0.053  
0.368  
A
A1  
A2  
B
2.49  
0.03  
0.7  
2.69  
0.23  
0.93  
1.7  
B2  
C
1.14  
0.45  
1.23  
8.95  
0.6  
C2  
D
1.36  
9.35  
D1  
E
8
0.315  
0.334  
10  
10.4  
0.393  
E1  
G
8.5  
4.88  
15  
5.28  
15.85  
1.4  
0.192  
0.590  
0.050  
0.055  
0.094  
0.208  
0.625  
0.055  
0.068  
0.126  
L
L2  
L3  
M
1.27  
1.4  
1.75  
3.2  
2.4  
R
0.4  
0.015  
V2  
0º  
8º  
3
12/15  
1
STP100NF04, STB100NF04, STB100NF04-1  
TO-262 (I2PAK) MECHANICAL DATA  
mm  
inch  
TYP.  
DIM.  
MIN.  
4.4  
TYP.  
MAX.  
4.6  
MIN.  
0.173  
0.098  
0.027  
0.044  
0.017  
0.048  
0.352  
0.094  
0.393  
0.515  
0.137  
0.050  
MAX.  
0.181  
0.106  
0.036  
0.067  
0.023  
0.053  
0.368  
0.106  
0.409  
0.531  
0.149  
0.055  
A
A1  
B
2.49  
0.7  
2.69  
0.93  
1.7  
B2  
C
1.14  
0.45  
1.23  
8.95  
2.4  
0.6  
C2  
D
1.36  
9.35  
2.7  
e
E
10  
10.4  
13.6  
3.78  
1.4  
L
13.1  
3.48  
1.27  
L1  
L2  
L1  
L2  
D
L
P011P5/E  
13/15  
STP100NF04, STB100NF04, STB100NF04-1  
D2PAK FOOTPRINT  
TUBE SHIPMENT (no suffix)*  
TAPE AND REEL SHIPMENT (suffix ”T4”)*  
REEL MECHANICAL DATA  
mm  
MIN. MAX. MIN. MAX.  
330 12.992  
inch  
DIM.  
A
B
C
D
G
N
T
1.5  
0.059  
12.8  
20.2  
24.4  
100  
13.2 0.504 0.520  
0795  
26.4 0.960 1.039  
3.937  
30.4  
1.197  
BASE QTY  
BULK QTY  
1000  
TAPE MECHANICAL DATA  
1000  
mm  
inch  
DIM.  
MIN. MAX. MIN. MAX.  
10.5 10.7 0.413 0.421  
15.7 15.9 0.618 0.626  
A0  
B0  
D
1.5  
1.6 0.059 0.063  
D1  
E
1.59 1.61 0.062 0.063  
1.65 1.85 0.065 0.073  
F
11.4  
4.8  
3.9  
11.9  
1.9  
50  
11.6 0.449 0.456  
5.0 0.189 0.197  
4.1 0.153 0.161  
12.1 0.468 0.476  
2.1 0.075 0.082  
1.574  
K0  
P0  
P1  
P2  
R
T
0.25 0.35 0.0098 0.0137  
23.7 24.3 0.933 0.956  
W
* on sales type  
14/15  
STP100NF04, STB100NF04, STB100NF04-1  
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences  
of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is  
granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specification mentioned in this publication are  
subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products  
are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.  
The ST logo is a trademark of STMicroelectronics  
© 2000 STMicroelectronics – Printed in Italy – All Rights Reserved  
STMicroelectronics GROUP OF COMPANIES  
Australia - Brazil - China - Finland - France - Germany - Hong Kong - India - Italy - Japan - Malaysia - Malta - Morocco -  
Singapore - Spain - Sweden - Switzerland - United Kingdom - U.S.A.  
http://www.st.com  
15/15  

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