STMEC001BTTR [STMICROELECTRONICS]
3-CHANNEL POWER SUPPLY SUPPORT CKT, PDSO20, LEAD FREE, TSSOP-20;型号: | STMEC001BTTR |
厂家: | ST |
描述: | 3-CHANNEL POWER SUPPLY SUPPORT CKT, PDSO20, LEAD FREE, TSSOP-20 电源电路 开关 电源管理电路 光电二极管 |
文件: | 总19页 (文件大小:246K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
STMEC001
Power interface switch for ExpressCardTM
Features
■ Compliant with PC Card™ standard for
ExpressCard
■ 3-channel power interface switch
■ Built-in under-voltage lockout (UVLO) circuit
■ Ultra-low standby-mode current
QFN16
■ Additional 5 V or 12 V power supply not
required
■ High reliability ensured with integrated over-
current, thermal and undervoltage protection
circuitries applied to each voltage rail
TSSOP20
■ Soft start function for non-rush current
■ Ultra-low standby-mode current for power
saving
Description
■ Ultra-low ON resistance for fast switching
The STMEC001 is an ExpressCard power
interface switch which provides the complete
power management solution required by the
ExpressCard specification.
The STMEC001 consists of 3 internal switches
distributing 3.3 V, 3.3V
, and 1.5 V to the
AUX
ExpressCard socket without the need of additional
charge pump or external switches.
The STMEC001 ExpressCard power switch is
ideal for notebook computers, desktop computers,
personal digital assistants (PDA), or other
handheld devices implementing the ExpressCard
schematic.
.
Table 1.
Device summary
Order code
Package
Packing
STMEC001QTR
STMEC001ATTR
QFN16
Tape and reel
Tape and reel
TSSOP20
April 2008
Rev 4
1/19
www.st.com
19
Contents
STMEC001
Contents
1
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.1
Pin functional description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2
3
4
Logic diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Power states . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
4.1
Power states description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
5
6
7
8
9
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Logic characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Switching times . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
2/19
STMEC001
Pin description
1
Pin description
Figure 1.
STMEC001 pin configuration (top view)
15
16
14 13
/STBY
1
2
12
11
VIN_3.3AUX
VO_3.3AUX
VIN_1.5V
VIN_3.3V
VO_3.3V
3
4
10
9
VO_1.5V
VO_3.3V
6
5
7
8
QFN16
NC
24
NC
1
2
/SYSRST
23
22
/OC
/SHDN
/STBY
3
RCLKEN
21
20
19
4
5
6
VIN_3.3VAUX
V0_3.3VAUX
VIN_3.3V
VIN_3.3V
VIN_1.5V
VIN_1.5V
VO_3.3V
VO_3.3V
7
8
9
18
17
VO_1.5V
16
15
VO_1.5V
/CPPE
/PERST
NC
10
GND
NC
11
12
/CPUSB
NC
14
13
TSSOP20
3/19
Pin description
STMEC001
Table 2.
Pin assignments
Name
Pin
Type
Description
QFN16 TSSOP20
-
1
2
NC
-
I
No connection
System Reset input - active low, logic level signal,
internal 150 KΩ pull-up
15
/SYSRST
Shutdown input - active low, logic level signal,
internal 150 KΩ pull-down
16
1
3
4
/SHDN
/STBY
I
I
Standby input - active low, logic level signal, internal
150 KΩ pull-down
2
-
5
6
VIN_3.3V
VIN_3.3V
I
I
3.3 V input for VO_3.3V
3.3 V input for VO_3.3V
Switched output that delivers 0 V, 3.3 V or high
impedance to card
3
4
7
8
VO_3.3V
VO_3.3V
O
O
Switched output that delivers 0 V, 3.3 V or high
impedance to card
5
-
9
/PERST
NC
O
-
A logic level power good to slot (delayed)
No connection
10
11
12
13
6
-
GND
NC
-
Ground
-
No connection
-
NC
-
No connection
Card Present input for USB cards, internal 150 KΩ
7
8
9
-
14
15
16
17
/CPUSB
/CPPE
I
pull-up
Card Present input for PCI ExpressCard, internal
150 KΩ pull-up
I
Switched output that delivers 0 V, 1.5 V or high
impedance to card
VO_1.5V
VO_1.5V
O
O
Switched output that delivers 0 V, 1.5 V or high
impedance to card
10
-
18
19
VIN_1.5V
VIN_1.5V
I
I
1.5 V input for 1.5Vout
1.5 V input for 1.5VOUT
Switched output that delivers 0 V, 3.3 V or high
impedance to card
11
12
20
21
VO_3.3VAUX
VIN_3.3VAUX
O
I
3.3 V input for VO_3.3VAUX and chip power
Reference Clock Enable signal. As an output, a
logic level power good to host for slot (open drain).
As an input, if kept inactive by the host, prevents
/PERST from being de-asserted, internal 150 KΩ
pull-up
13
22
RCLKEN
I/O
14
-
23
24
/OC
NC
O
-
Over-current status output for slot (open drain)
No connection
4/19
STMEC001
Pin description
1.1
Pin functional description
Table 3.
Symbol
Pin detailed descriptions
Description
A logic low level on this input indicates that the card present supports PCI Express
functions. This input pin connects to the 3.3 VAUX input through a 150 kΩinternal pull up.
When inserted, the card physically connects this input to ground if the card supports PCI
Express functions.
CPPE
A logic low level on this input indicates that the card present supports USB functions. The
input pin CPUSB connects to the 3.3 VAUX input through a 150 kΩinternal pull up. When
inserted, the card physically connects CPUSB to ground if the card supports USB
functions.
CPUSB
When asserted (logic low), this input instructs the STMEC001 to turn off all voltage
outputs and the discharge FETs at the 3 outputs are activated.
SHDN
STBY
When asserted (logic low), this input places the power switch in Standby Mode by turning
off the 3.3 V and 1.5 V power switches and keeping the 3.3 VAUX switch on.
This pin serves as both an input and an output. On power up, the power switch keeps this
signal at a low state as long as any of the output power rails are out of their tolerance
range. Once all output power rails are within tolerance, the power switch releases
RCLKEN RCLKEN allowing it to transition to a high state (internally pulled up to 3.3 VAUX). The
transition of RCLKEN from a low to a high state starts an internal timer for the purpose of
de-asserting /PERST. As an input, RCLKEN can be kept low to delay the start of the
/PERST internal timer. RCLKEN can be used by the host system to enable a clock driver.
On power up, this output remains asserted. Once all power rails are within tolerance,
PERST RCLKEN is asserted and /PERST is de-asserted after a time delay. On power down, this
output is asserted whenever any of the power rails drop below their voltage tolerance.
This input is driven by the host system and directly affects /PERST. Asserting /SYSRST
(logic level: low) forces /PERST to assert.
SYSRST
The OC pin is an open drain output for over-current indication. Output does not turn off
during over-current condition. The output voltage decreases as the output current
exceeds over-current limit. Only if the temperature increases above the limit the output is
OC
turned off completely. Over-current in one output does not affect the other outputs.
5/19
Logic diagram
STMEC001
2
Logic diagram
Figure 2.
STMEC001 block diagram
UVLO
V/I sense and
discharge switch
Vin_3.3V
Vin_1.5V
SW
VO_3.3V
VO_1.5V
V/I sense and
discharge switch
SW
SW
V/I sense and
discharge switch
Vin_3.3V
AUX
VO_3.3V
AUX
150 KΩ
150 KΩ
150 KΩ
150 KΩ
150 KΩ
150 KΩ
#PERST
#CPUSB
#SHDN
#STBY
Control logic
#SYSRST
#OC
#CPPE
RCLKEN
Thermal sense
POR
6/19
STMEC001
Logic diagram
Figure 3.
STMEC001 typical application
3.3 V
3.3 V IN
3.3 V AUX IN
Power supply
3.3 V AUX
1.5 V
1.5 V IN
STMEC001
ExpressCard
Power switch
ExpressCard
slot
Control signals
Control signals
ExpressCard
host
Data links
7/19
Maximum ratings
STMEC001
3
Maximum ratings
Stressing the device above the rating listed in the “Absolute maximum ratings” table may
cause permanent damage to the device. These are stress ratings only and operation of the
device at these or any other conditions above those indicated in the operating sections of
this specification is not implied. Exposure to absolute maximum rating conditions for
extended periods may affect device reliability. Refer also to the STMicroelectronics SURE
Program and other relevant quality documents.
(1)
Table 4.
Symbol
Absolute maximum ratings
Parameter
Value
Unit
VI(3.3VIN) – 0.3 to 4.6
VI(1.5VIN) – 0.3 to 4.6
V
V
V
VI
Input voltage
VI(3.3VAUX) – 0.3 to 4.6
VI(3.3VIN) internally limited
VI(1.5VIN) internally limited
VI(3.3VAUX) internally limited
IO
Output current
Operating junction temperature, TJ
(max to be calc. at worst case PD at
85° C ambient)
TOP
–40 to 120
° C
° C
TSTG
Storage temperature range
–55 to 150
1. Absolute maximum ratings are those values above which damage to the device may occur. Functional
operation under these conditions is not implied. All voltages are referenced to GND.
8/19
STMEC001
Power states
4
Power states
The STMEC001 operates in a number of states, as described in the following table:
Table 5.
Power states
Voltage inputs
Logic states
Outputs
Mode
3.3VAUX
3.3 V
1.5 V
/SHDN /CPUSB /CPPE
/STBY 3.3VAUX 3.3 V
1.5 V
ON
ON
ON
ON
ON
OFF
X
X
X
X
1
0
1
1
1
X
1
X
0
1
X
X
0
X
X
1
GND
GND
ON
GND
GND
ON
GND
GND
ON
No card
Shutdown
USB enable
PE enable
Standby
ON
ON
ON
X
ON
ON
ON
X
X
X
X
1
ON
ON
ON
X
X
0
ON
OFF
OFF
OFF
OFF
X
OFF
OFF
4.1
Power states description
●
●
●
No card mode: when no card is inserted, and at least 3.3 V
are grounded
is available, all outputs
AUX
Shutdown mode: when /SHDN is asserted, and at least 3.3 V
outputs are grounded
is available all
AUX
USB/PW enable mode: when all 3 inputs are available, detection of cartd insertion
turns on all 3 outputs.
–
VIN_3.3 V, VIN_3.3V
and VIN_1.5 V are present at the USB/PW enable input
AUX
of the power switch prior to a card being inserted. Power to the card is based on
the state of /CPUSB and /CPPE (see table).
–
The card is present and VIN_1.5 V or/and VIN_3.3 V is removed from the input of
the power switch; VIN_3.3V
will still be provided to the card, VIN_1.5 and
AUX
VIN_3.3 V will be disabled (see table). If power to VIN_1.5 V and VIN_3.3 V is
restored, output to the card will be restored.
–
Prior to the insertion of a card, VIN_3.3 V
is available, VIN_3.3 V and
AUX
VIN_1.5 V are not available; no power is made available to the card. If VIN_1.5 V
and VIN_3.3 V are made available at the input of the power switch after the card is
inserted, both VO_3.3 V and VO_1.5 V are made available to the card.
–
–
Standy mode: when all 3 supplies are available and /STBY is asserted. Only
3.3 V
output is on.
AUX
OFF mode: if V
is off, all outpus are off. When VIN_3.3V
is not present,
AUX
AUX
VIN_1.5 V or/and VIN_3.3 V must not be present.
9/19
Electrical characteristics
STMEC001
5
Electrical characteristics
Table 6.
Symbol
Recommended operating conditions
Parameter
Value
Unit
Input voltage: VI(3.3VIN) is required for its respective functions
Input voltage: VI(1.5VIN) is required for its respective functions
Input voltage: VI(3.3VAUX) is required for all circuit operations
Output current: IO(3.3V) at TJ = 100 °C
3.0 to 3.6
1.35 to 1.65
3.0 to 3.6
V
V
VI
V
1.3 (max.)
650 (max.)
275 (max.)
A
IO
Output current: IO(1.5V) at TJ = 100 °C
mA
mA
Output current: IO(AuxV) at TJ = 100 °C
Operating junction temperature, TJ (max to be calc. at worst case PD at
85° C ambient)
TOP
100
° C
Table 7.
Symbol
Electrical characteristics
T = 25° C, V (V 3.3 V) = V (V 3.3V
)= 3.3 V, V (V 1.5 V) = 1.5 V
I IN
J
I
IN
I
IN
AUX
Parameter
Test conditions
Min
Typ
Max
Unit
I = 1300 mA, TJ = 25 °C
I = 1300 mA, TJ = 100 ° C
I = 650 mA, TJ = 25 °C
I = 650 mA, TJ = 100 °C
I = 275 mA, TJ = 25 °C
I = 275 mA, TJ = 100 °C
I = 1300 mA, TJ = 25 °C
I = 1300 mA, TJ = 100 ° C
I = 650 mA, TJ = 25 °C
I = 650 mA, TJ = 100 °C
I = 275 mA, TJ = 25 °C
I = 275 mA, TJ = 100 °C
53
64
80
VIN_3.3 V to VO_3.3 V
VIN_1.5 V to VO_1.5 V
VIN_3.3VAUX to VO_VAUX
VIN_3.3 V to VO_3.3 V
VIN_1.5 V to VO_1.5 V
VIN_3.3VAUX to VO_VAUX
(1)
70
140
53
88
RSW
mΩ
TSSOP20
105
170
210
64
80
(1)
80
92
RSW
mΩ
QFN16
115
192
230
170
RO(3.3 V)
discharge resistance
I discharge = 1 mA
I discharge = 1 mA
I discharge = 1 mA
0.1
0.1
0.1
0.5
0.5
0.5
RO(1.5 V)
RO
ΚΩ
discharge resistance
RO(1.5 V)
discharge resistance
10/19
STMEC001
Electrical characteristics
Table 7.
Symbol
Electrical characteristics
T = 25° C, V (V 3.3 V) = V (V 3.3V
)= 3.3 V, V (V 1.5 V) = 1.5 V (continued)
I IN
J
I
IN
I
IN
AUX
Parameter
Test conditions
Min
Typ
Max
Unit
IO(3.3 V) limit
TJ -40°C to100°C
Output powered into a short
1.3
2.5
A
(limit is the steady state
value)
TJ -40°C to100°C
Output powered into a short
IOS
IO(1.5 V) limit
IO(VAUX) limit
650
275
1300
660
mA
TJ -40°C to 100° C
Output powered into a short
1. Switch resistance (in production - probe testing at 1.3 A. Final test at 1.0 A and apply guard band)
Table 8.
Symbol
Power switching
Parameter
Test condition
Min Typ Max Unit
Tsh
Thermal shutdown, trip point, TJ.
Hysteresis
Over-current condition
155
165 ° C
10
5
° C
VO (3.3VOUT) with100 mΩ short
VO (1.5VOUT) with100 mΩ short
VO (VAUX) with100 mΩ short
20
Current limit response time.
IOL
5
20
20
μs
From short to first threshold within 1.1 times
of the final current limit
5
VIN_3.3VAUX VO (VAUX) = VI(3.3VAUX) =
120
40
VI(3.3VIN) VO(1.5V) = VI(1.5VIN)
Input quiescent current:
normal operation
VIN_3.3V
TJ -40°C,100°C
VIN_1.5V
10
Outputs are ON and unloaded
VIN_3.3VAUX VO(VAUX) = VI(3.3VAUX) = VI(3.3VI
150 180
N) VO(1.5 V) = VI(1.5VIN)
Input quiescient current:
IQ
VIN_3.3V
25
10
40
25
μA
TJ -40°C,100°C]
Outputs are ON and unloaded
normal operation with pull-up
VIN_1.5V
VIN_3.3VAUX
150 270
TJ -40°C,100°C
discharge FETs are ON
Input quiescient current:
VIN_3.3V
10
10
50
15
5
15
15
100
20
10
10
50
15
50
15
50
/SHDN asserted with pull-up
VIN_1.5V
VIN_3.3VAUX
VIN_3.3V
Forward leakage current (current measured
at input pins/no card present)
SHDN
μA
μA
/SHDN inactive
VIN_1.5V
TJ = 25 °C
TJ = 100 °C
TJ = 25 °C
TJ = 100 °C
TJ = 25 °C
TJ = 100 °C
5
VIN_3.3VAUX
20
10
30
10
30
Reverse leakage current
(current measured from
output pins / input grounded)
(1)
ILEAK
VIN_1.5V
VIN_3.3V
1. All high side switches are in Hi-Z state, VO (AUX) = VO (3.3 V) = 3.3 V, Vo (1.5 V) = 1.5 V, TJ -40 °C,100 °C
11/19
Electrical characteristics
STMEC001
Table 9.
Symbol
Undervoltage lockout (UVLO)
Parameter
Test condition
Min Typ Max Unit
VIN_3.3 level, below which
VIN_3.3 and VIN_1.5 switches
are off
VIN_3.3 UVLO
VIN_1.5 UVLO
2.6
2.9
V
V
VIN_1.5 level, below which
VIN_3.3 and VIN_1.5 switches
are off
1
1.25
2.9
UVLO
VIN_3.3VAUX level, below which
sets the device into OFF state
VIN_3.3 VAUX UVLO
UVLO hysteresis
2.6
V
100
mV
12/19
STMEC001
Logic characteristics
6
Logic characteristics
Table 10. Logic states
Logic transition
Condition
Min
Typ
Max
Unit
High level
Low level
2.0
Logic input voltage
V
0.8
3.0
3.3 V output falling
AUX output falling
1.5 V output falling
2.7
2.7
1.2
PERST# assertion threshold of output
voltage
3.0
V
1.35
PERST# assertion delay from output
voltage invalid
Output falling below threshold
Output rising above threshold
500
ns
PERST# de-assertion from output
voltage valid
4
10
20
ms
ns
μs
PERST# assertion delay from SYSRST# STSRST asserted or de-asserted
500
100
RCLKEN assertion delay from output
Output rising above threshold
voltage valid
OC# output low voltage
OC# leakage current
IOC = 2 mA
VOC = 3.6 V
0.4
1
V
μA
Falling into or out of an over-current
condition
OC# deglitch
6
20
μs
Table 11. ESD protections
Pin
Condition
ESD tolerance
Unit
V
OUT (3.3 V, 1.5 V, AUX)
Versus GND & supply
Versus GND & supply
Versus GND
6
2
2
1
All other pins (except RCLKEN)
RCLKEN
kV
RCLKEN
Versus supply
13/19
Switching times
STMEC001
7
Switching times
Table 12. Switching characteristics
Symbol
Parameter
Condition
CL(3.3V) = 0.1 µF
Min Typ Max Unit
VIN_3.3V to VO_3.3V
0.1
0.1
0.1
3
3
3
Io(3.3V) = 0 A
CL(AUX) = 0.1 µF
Io(AUX) = 0A
VIN_3.3VAUX to VO_VAUX
VIN_1.5V to VO_1.5V
VIN_3.3V to VO_3.3V
VIN_3.3VAUX to VO_VAUX
VIN_1.5V to VO_1.5V
VIN_3.3V to VO_3.3V
VIN_3.3VAUX to VO_VAUX
VIN_1.5V to VO_1.5V
CL(1.5V) = 0.1 µF
Io(1.5V) = 0 A
tR
Output rise time
ms
CL(3.3V) = 100 µF
0.1
0.1
0.1
10
6
6
RL = VO_3.3V / 1.0 A
CL(3.3V) = 100 µF
RL = VO_VAUX/ 0.25 A
C
L(3.3V) = 100 µF
RL = VO_1.5 V / 0.5 A
L(3.3V) = 0.1 µF
6
C
150
150
Io(3.3V) = 0 A
CL(AUX) = 0.1 µF
Io(AUX) = 0 A
10
μs
Output fall time
(/CPUSB and
/CPPE inactive)
C
L(1.5V) = 0.1 µF
Io(1.5V) = 0 A
L(3.3V) = 20 µF, no load
tF
10
150
VIN_3.3V to VO_3.3V
VIN_3.3VAUX to VO_VAUX
VIN_1.5V to VO_1.5V
C
2.0
2.0
2.0
30.0
CL(AUX) = 20 µF, no load
CL(1.5V) = 20 µF, no load
30.0 ms
30.0
CL(3.3V) = 0.1 µF
Io(3.3V) = 0 A
VIN_3.3V to VO_3.3V
VIN_3.3VAUX to VO_VAUX
VIN_1.5V to VO_1.5V
VIN_3.3V to VO_3.3V
VIN_3.3VAUX to VO_VAUX
VIN_1.5V to VO_1.5V
10
10
80
CL(AUX) = 0.1 µF
Io(AUX) = 0 A
μs
80
C
L(1.5V) = 0.1 µF
Io(1.5V) = 0 A
L(3.3V) = 100 µF
10
80
Output fall time
(/SHDN active)
tSHDN
C
0.1
0.1
0.1
5.0
RL = VO_3.3V/1.0 A
CL(3.3V) = 100 µF
5.0
5.0
ms
RL = VO_VAUX/0.25 A
CL(3.3V) = 100 µF
RL = VO_1.5V/0.5 A
14/19
STMEC001
Switching times
Table 12. Switching characteristics (continued)
Symbol
Parameter
Condition
L(3.3V) = 0.1 µF
Min Typ Max Unit
C
VIN_3.3V to VO_3.3V
0.02
0.02
0.02
0.05
0.05
0.05
1.0
1.0
1.0
1.0
1.0
1.0
Io(3.3V) = 0 A
CL(AUX) = 0.1 µF,
Io(AUX) = 0 A
VIN_3.3VAUX to VO_VAUX
VIN_1.5V to VO_1.5V
VIN_3.3V to VO_3.3V
VIN_3.3VAUX to VO_VAUX
VIN_1.5V to VO_1.5V
C
L(1.5V) = 0.1 µF
Io(1.5V) = 0 A
L(3.3V)=100µF
Propagation
delay
tPD
ms
C
RL = VO_3.3V/1.0 A
CL(3.3V) = 100 µF
RL = VO_VAUX/0.25 A
CL(3.3V) = 100µF
RL = VO_1.5V/0.5 A
15/19
Package mechanical data
STMEC001
8
Package mechanical data
®
In order to meet environmental requirements, ST offers these devices in ECOPACK
packages. These packages have a Lead-free second level interconnect. The category of
second Level Interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
Figure 4.
QFN16 (3 x 3 mm) package outline
E
E2
A
K
A1
e
D2
D
b
K
r
L
A3
1. Drawing not to scale.
Table 13. QFN16 (3 x 3 mm) mechanical data
millimeters
Symbol
inches
Typ
Min
Typ
Max
Min
Max
A
A1
A3
b
0.80
0.90
0.02
0.20
0.25
3.00
1.70
3.00
1.70
0.50
0.20
0.40
0.09
1.00
0.05
0.032
0.035
0.001
0.008
0.010
0.118
0.067
0.118
0.067
0.020
0.008
0.016
0.039
0.002
0.18
1.55
1.55
0.30
1.80
1.80
0.007
0.061
0.061
0.012
0.071
0.071
D
D2
E
E2
e
K
L
0.30
0.50
0.012
0.006
0.020
r
16/19
STMEC001
Package mechanical data
Figure 5.
TSSOP20 package outline
A2
A
K
L
b
e
A1
E
c
D
E1
PIN 1 IDENTIFICATION
1
0087225C
1. Drawing not to scale.
Table 14. TSSOP20 mechanical data
millimeters
Symbol
inches
Min
Typ
Max
Min
Typ
Max
A
A1
A2
b
1.2
0.15
1.05
0.30
0.20
6.6
0.047
0.006
0.041
0.012
0.0079
0.260
0.260
0.176
0.05
0.8
0.002
0.031
0.007
0.004
0.252
0.244
0.169
0.004
0.039
1
0.19
0.09
6.4
c
D
6.5
6.4
0.256
0.252
E
6.2
6.6
E1
e
4.3
4.4
4.48
0.173
0.65 BSC
0.0256 BSC
K
0°
8°
0°
8°
L
0.45
0.60
0.75
0.018
0.024
0.030
17/19
Revision history
STMEC001
9
Revision history
Table 15. Document revision history
Date
Revision
Change
02-Aug-2006
08-Feb-2007
1
2
First release
Replaced TSSOP24 package information with QFN16
Modified title, added RSW values for QFN16 inTable 7 on page 10 ,
small text changes, layout restructure, content reworked to improve
readability in Section 4.1: Power states description on page 9, modified
Figure 2: STMEC001 block diagram on page 6
18-Oct-2007
17-Apr-2008
3
4
Modified: Figure 2 and Table 2: Pin assignments on page 4 and
Table 5: Power states on page 9, minor text changes.
18/19
STMEC001
Please Read Carefully:
Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the
right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any
time, without notice.
All ST products are sold pursuant to ST’s terms and conditions of sale.
Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no
liability whatsoever relating to the choice, selection or use of the ST products and services described herein.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this
document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products
or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such
third party products or services or any intellectual property contained therein.
UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED
WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED
WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS
OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.
UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT
RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING
APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY,
DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE
GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK.
Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void
any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any
liability of ST.
ST and the ST logo are trademarks or registered trademarks of ST in various countries.
Information in this document supersedes and replaces all information previously supplied.
The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.
© 2008 STMicroelectronics - All rights reserved
STMicroelectronics group of companies
Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan -
Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America
www.st.com
19/19
相关型号:
STMFSC008N10M5
MOSFET - PowerTrench®, N-Channel, Dual Cool®, Shielded Gate, 100 V, 60 A, 7.5 mΩ
ONSEMI
STMFSC017N15M5
MOSFET - PowerTrench®, N-Channel, Dual Cool®, Shielded Gate, 150 V, 40 A, 17 mΩ
ONSEMI
STMFSC3D1N08M7
MOSFET - PowerTrench®, N-Channel, Dual Cool®, Shielded Gate, 80 V, 110 A, 3.1 mΩ
ONSEMI
STMGCA-11.290MHZ
CMOS/TTL Output Clock Oscillator, 11.29MHz Nom, ROHS COMPLIANT, HERMETIC SEALED, CERAMIC PACKAGE-6
MICROSEMI
©2020 ICPDF网 联系我们和版权申明