STH315N10F7-2 [STMICROELECTRONICS]

High avalanche ruggedness;
STH315N10F7-2
型号: STH315N10F7-2
厂家: ST    ST
描述:

High avalanche ruggedness

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STH315N10F7-2,  
STH315N10F7-6  
Automotive-grade N-channel 100 V, 2.1 mΩ typ., 180 A  
STripFET™ F7 Power MOSFETs  
Datasheet  
-
production data  
Features  
VDS  
RDS(on) max.  
ID  
Order codes  
TAB  
TAB  
STH315N10F7-2  
STH315N10F7-6  
100 V  
2.3 mΩ  
180 A  
2
1
7
3
Designed for automotive applications and  
1
AEC-Q101 qualified  
H2PAK-6  
H2PAK-2  
Among the lowest RDS(on) on the market  
Excellent figure of merit (FoM)  
Low Crss/Ciss ratio for EMI immunity  
High avalanche ruggedness  
Applications  
Figure 1. Internal schematic diagram  
Switching applications  
Description  
These N-channel Power MOSFETs utilize  
STripFET™ F7 technology with an enhanced  
trench gate structure that results in very low on-  
state resistance, while also reducing internal  
capacitance and gate charge for faster and more  
efficient switching.  
Table 1. Device summary  
Order codes  
STH315N10F7-2  
STH315N10F7-6  
Marking  
Package  
Packaging  
H2PAK-2  
H2PAK-6  
315N10F7  
Tape and reel  
September 2014  
DocID025090 Rev 4  
1/19  
This is information on a product in full production.  
www.st.com  
Contents  
STH315N10F7-2, STH315N10F7-6  
Contents  
1
2
Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3  
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4  
2.1  
Electrical characteristics (curves) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6  
3
4
Test circuits  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8  
Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9  
2
4.1  
4.2  
H PAK-2, STH315N10F7-2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10  
2
H PAK-6, STH315N10F7-6 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13  
5
6
Packaging mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16  
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18  
2/19  
DocID025090 Rev 4  
STH315N10F7-2, STH315N10F7-6  
Electrical ratings  
1
Electrical ratings  
Table 2. Absolute maximum ratings  
Symbol  
VDS  
Parameter  
Drain-source voltage  
Value  
100  
Unit  
V
VGS  
Gate-source voltage  
± 20  
180  
V
(1)  
Drain current (continuous) at TC = 25°C  
Drain current (continuous) at TC=100°C  
Drain current (pulsed)  
A
ID  
(1)  
120  
720  
A
A
ID  
(2)  
IDM  
PTOT  
Total dissipation at TC = 25°C  
Derating factor  
315  
2.1  
W
W/°C  
Single pulse avalanche energy  
(TJ = 25 °C, L=0.55 mH, Ias= 65 A)  
(3)  
1
J
EAS  
Tj  
Operating junction temperature  
storage temperature  
- 55 to 175  
°C  
Tstg  
1. Current limited by package.  
2. Pulse width limited by safe operating area.  
3. Starting T =25°C, I =60 A, V =50 V  
J
D
DD  
Table 3. Thermal data  
Symbol  
Parameter  
Value  
0.48  
35  
Unit  
°C/W  
°C/W  
Rthj-case  
Thermal resistance junction-case  
(1)  
Thermal resistance junction-pcb max  
Rthj-pcb  
1. When mounted on 1 inch² FR-4 board, 2oz Cu  
DocID025090 Rev 4  
3/19  
19  
Electrical characteristics  
STH315N10F7-2, STH315N10F7-6  
2
Electrical characteristics  
(TCASE = 25 °C unless otherwise specified).  
Table 4. On/off states  
Symbol  
Parameter  
Test conditions  
Min.  
Typ.  
Max.  
Unit  
Drain-source breakdown  
voltage  
V(BR)DSS  
VGS= 0, ID = 250 µA  
100  
V
V
V
GS = 0, VDS= 100 V  
GS = 0, VDS= 100 V,  
1
µA  
µA  
Zero gate voltage drain  
current  
IDSS  
100  
TC= 125°C  
IGSS  
Gate body leakage current VDS = 0, VGS = 20 V  
100  
4.5  
nA  
V
VGS(th)  
Gate threshold voltage  
VDS= VGS, ID = 250 µA  
VGS= 10 V, ID= 60 A  
2.5  
3.5  
2.1  
Static drain-source  
on- resistance  
RDS(on)  
2.3  
mΩ  
Table 5. Dynamic  
Test conditions  
Symbol  
Ciss  
Parameter  
Input capacitance  
Output capacitance  
Min.  
Typ.  
12800  
3500  
Max.  
Unit  
pF  
-
-
-
-
Coss  
VGS = 0, VDS = 25 V,  
f = 1 MHz  
pF  
Reverse transfer  
capacitance  
Crss  
-
170  
-
pF  
Qg  
Qgs  
Qgd  
Total gate charge  
Gate-source charge  
Gate-drain charge  
-
-
-
180  
78  
-
-
-
nC  
nC  
nC  
VDD = 50 V, ID = 180 A,  
VGS = 10 V  
(see Figure 14)  
34  
Table 6. Switching times  
Test conditions  
Symbol  
Parameter  
Turn-on delay time  
Rise time  
Min.  
Typ.  
62  
Max.  
Unit  
ns  
td(on)  
tr  
td(off)  
tf  
-
-
-
-
-
-
-
-
V
DD = 50 V, ID = 90 A  
G = 4.7 Ω VGS = 10 V  
108  
148  
40  
ns  
R
(see Figure 13,  
Figure 18)  
Turn-off delay time  
Fall time  
ns  
ns  
4/19  
DocID025090 Rev 4  
STH315N10F7-2, STH315N10F7-6  
Electrical characteristics  
Table 7. Source drain diode  
Test conditions  
Symbol  
Parameter  
Min.  
Typ.  
Max.  
Unit  
ISD  
Source-drain current  
-
180  
A
Source-drain current  
(pulsed)  
(1)  
-
720  
1.5  
A
ISDM  
(2)  
Forward on voltage  
ISD=60 A, VGS=0  
-
-
-
-
V
ns  
nC  
A
VSD  
trr  
Reverse recovery time  
85  
200  
4.7  
ISD=180 A,  
di/dt = 100 A/µs,  
VDD=80 V, Tj=150°C  
Qrr  
Reverse recovery charge  
IRRM  
Reverse recovery current (see Figure 15)  
1. Pulse width limited by safe operating area.  
2. Pulse duration = 300µs, duty cycle 1.5%  
DocID025090 Rev 4  
5/19  
19  
Electrical characteristics  
STH315N10F7-2, STH315N10F7-6  
2.1  
Electrical characteristics (curves)  
Figure 2. Safe operating area  
Figure 3. Thermal impedance  
AM15430v1  
280tok  
I
D
(A)  
K
10-1  
10-2  
δ=0.5  
100  
0.2  
0.1  
0.05  
10  
1
100µs  
0.02  
Zth=k Rthj-c  
Tj=175°C  
Tc=25°C  
δ=tp/τ  
1ms  
0.01  
Sinlge  
pulse  
10ms  
Single pulse  
10-4  
tp  
τ
0.1  
10-2  
10-5  
10-3  
10-1  
10  
V
DS(V)  
p(s)  
t
0.1  
1
Figure 4. Output characteristics  
Figure 5. Transfer characteristics  
AM14734v1  
AM14735v1  
ID  
(A)  
ID  
VGS=10V  
8V  
(A)  
V
DS = 2V  
350  
300  
250  
200  
150  
100  
7V  
300  
250  
200  
150  
100  
50  
6V  
50  
0
5V  
0
2
8
VDS(V)  
1
2
3
5
8
VGS(V)  
0
4
6
0
4
6
7
Figure 6. Gate charge vs gate-source voltage  
Figure 7. Static drain-source on-resistance  
AM14736v1  
AM15431v1  
VGS  
(V)  
R
DS(on)  
(mΩ)  
VDD=50V  
ID=180A  
V
GS=10V  
2.25  
2.20  
2.15  
10  
8
6
4
2.10  
2.05  
2
2
0
80  
120  
160  
40  
50  
100  
150  
Qg(nC)  
ID  
(A)  
0
0
6/19  
DocID025090 Rev 4  
STH315N10F7-2, STH315N10F7-6  
Electrical characteristics  
Figure 8. Normalized V(BR)DSS vs temperature  
Figure 9. Capacitance variations  
AM14742v1  
AM14738v1  
V(BR)DSS  
C
(norm)  
(pF)  
ID = 1mA  
14000  
1.04  
1.02  
1.00  
Ciss  
12000  
10000  
8000  
6000  
0.98  
4000  
2000  
0.96  
0.94  
Crss  
Coss  
0
-75  
-25  
0
25  
75  
125  
0
60  
TJ(°C)  
20  
80  
VDS(V)  
100  
40  
Figure 10. Source-drain diode forward  
characteristics  
Figure 11. Normalized gate threshold voltage vs  
temperature  
AM14739v1  
AM14741v1  
VSD  
VGS(th)  
(V)  
(norm)  
1.05  
ID = 250µA  
1.0  
TJ=-50°C  
0.95  
0.85  
0.75  
0.90  
0.80  
TJ=25°C  
0.65  
0.55  
0.45  
0.70  
0.60  
TJ=150°C  
0
-75  
-25  
0
25  
75  
125  
80  
160  
ISD(A)  
TJ(°C)  
40  
120  
Figure 12. Normalized on-resistance vs  
temperature  
AM14740v1  
RDS(on)  
(norm)  
2.0  
ID = 60A  
1.6  
1.2  
0.8  
0.4  
-75  
-25  
0
25  
75  
125  
TJ(°C)  
DocID025090 Rev 4  
7/19  
19  
Test circuits  
STH315N10F7-2, STH315N10F7-6  
3
Test circuits  
Figure 13. Switching times test circuit for  
resistive load  
Figure 14. Gate charge test circuit  
VDD  
12V  
47kΩ  
1kΩ  
100nF  
2200  
μF  
3.3  
μF  
RL  
IG=CONST  
VDD  
100Ω  
Vi=20V=VGMAX  
D.U.T.  
VD  
RG  
VGS  
2200  
μF  
D.U.T.  
VG  
2.7kΩ  
47kΩ  
PW  
1kΩ  
PW  
AM01468v1  
AM01469v1  
Figure 15. Test circuit for inductive load  
switching and diode recovery times  
Figure 16. Unclamped inductive load test circuit  
L
A
A
A
B
D
S
FAST  
DIODE  
L=100μH  
VD  
G
2200  
μF  
D.U.T.  
B
3.3  
μF  
VDD  
3.3  
μF  
1000  
μF  
B
VDD  
25  
Ω
ID  
D
G
RG  
S
Vi  
D.U.T.  
Pw  
AM01470v1  
AM01471v1  
Figure 17. Unclamped inductive waveform  
Figure 18. Switching time waveform  
ton  
toff  
tdoff  
V(BR)DSS  
tr  
tf  
tdon  
VD  
90%  
10%  
90%  
IDM  
10%  
VGS  
VDS  
ID  
0
0
VDD  
VDD  
90%  
10%  
AM01472v1  
AM01473v1  
8/19  
DocID025090 Rev 4  
STH315N10F7-2, STH315N10F7-6  
Package mechanical data  
4
Package mechanical data  
In order to meet environmental requirements, ST offers these devices in different grades of  
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®  
specifications, grade definitions and product status are available at: www.st.com.  
ECOPACK® is an ST trademark.  
DocID025090 Rev 4  
9/19  
19  
Package mechanical data  
STH315N10F7-2, STH315N10F7-6  
4.1  
H2PAK-2, STH315N10F7-2  
Figure 19. H²PAK-2 drawing  
8159712_C  
10/19  
DocID025090 Rev 4  
STH315N10F7-2, STH315N10F7-6  
Package mechanical data  
Table 8. H²PAK-2 mechanical data  
mm  
Dim.  
Min.  
Typ.  
Max.  
A
A1  
C
4.30  
0.03  
1.17  
4.98  
0.50  
0.78  
10.00  
7.40  
15.30  
1.27  
4.93  
6.85  
1.5  
4.80  
0.20  
1.37  
5.18  
0.90  
0.85  
10.40  
7.80  
15.80  
1.40  
5.23  
7.25  
1.7  
e
E
F
H
H1  
L
-
L1  
L2  
L3  
L4  
M
R
2.6  
2.9  
0.20  
0°  
0.60  
8°  
V
DocID025090 Rev 4  
11/19  
19  
Package mechanical data  
STH315N10F7-2, STH315N10F7-6  
Figure 20. H²PAK-2 recommended footprint (dimensions are in mm)  
8159712_C  
12/19  
DocID025090 Rev 4  
STH315N10F7-2, STH315N10F7-6  
Package mechanical data  
4.2  
H2PAK-6, STH315N10F7-6  
Figure 21. H²PAK-6 drawing  
8159693_Rev_F  
DocID025090 Rev 4  
13/19  
19  
Package mechanical data  
STH315N10F7-2, STH315N10F7-6  
Table 9. H²PAK-6 mechanical data  
mm  
Dim.  
Min.  
Typ.  
Max.  
A
A1  
C
4.30  
0.03  
1.17  
2.34  
4.88  
7.42  
0.45  
0.50  
10.00  
7.40  
14.75  
1.27  
4.35  
6.85  
1.5  
4.80  
0.20  
1.37  
2.74  
5.28  
7.82  
0.60  
0.70  
10.40  
7.80  
15.25  
1.40  
4.95  
7.25  
1.75  
2.50  
0.60  
8°  
e
e1  
e2  
E
F
H
-
H1  
L
L1  
L2  
L3  
L4  
M
R
1.90  
0.20  
0°  
V
14/19  
DocID025090 Rev 4  
STH315N10F7-2, STH315N10F7-6  
Package mechanical data  
Figure 22. H²PAK-6 recommended footprint (dimensions are in mm)  
footprint_Rev_F  
DocID025090 Rev 4  
15/19  
19  
Packaging mechanical data  
STH315N10F7-2, STH315N10F7-6  
5
Packaging mechanical data  
Figure 23. Tape  
10 pitches cumulative  
tolerance on tape +/- 0.2 mm  
P0  
D
P2  
Top cover  
tape  
T
E
F
W
K0  
B0  
A0  
D1  
P1  
User direction of feed  
R
Bending radius  
User direction of feed  
AM08852v2  
16/19  
DocID025090 Rev 4  
STH315N10F7-2, STH315N10F7-6  
Packaging mechanical data  
Table 10. Tape and reel mechanical data  
Tape Reel  
mm  
mm  
Dim.  
Dim.  
Min.  
Max.  
Min.  
Max.  
A0  
B0  
D
10.5  
15.7  
1.5  
10.7  
15.9  
1.6  
A
B
C
D
G
N
T
330  
1.5  
12.8  
20.2  
24.4  
100  
13.2  
26.4  
30.4  
D1  
E
1.59  
1.65  
11.4  
4.8  
1.61  
1.85  
11.6  
5.0  
F
K0  
P0  
P1  
P2  
R
3.9  
4.1  
11.9  
1.9  
12.1  
2.1  
Base qty  
Bulk qty  
1000  
1000  
50  
T
0.25  
23.7  
0.35  
24.3  
W
Figure 24. Reel  
T
REEL DIMENSIONS  
40mm min.  
Access hole  
At sl ot location  
B
D
C
N
A
G measured at hub  
Full radius  
Tape slot  
in core for  
tape start 25 mm min.  
width  
AM08851v2  
DocID025090 Rev 4  
17/19  
19  
Revision history  
STH315N10F7-2, STH315N10F7-6  
6
Revision history  
Table 11. Document revision history  
Date  
Revision  
Changes  
02-Aug-2013  
1
Initial release.  
– Modified: Table 1, RDS(on) typical value in Table 4  
03-Sep-2013  
2
– Minor text changes  
– Modified: title and Features in cover page  
– Updated: Section 4: Package mechanical data  
– Minor text changes  
27-May-2014  
12-Sep-2014  
3
4
– Modified: title, features and description in cover page.  
18/19  
DocID025090 Rev 4  
STH315N10F7-2, STH315N10F7-6  
IMPORTANT NOTICE – PLEASE READ CAREFULLY  
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improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on  
ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order  
acknowledgement.  
Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or  
the design of Purchasers’ products.  
No license, express or implied, to any intellectual property right is granted by ST herein.  
Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product.  
ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners.  
Information in this document supersedes and replaces information previously supplied in any prior versions of this document.  
© 2014 STMicroelectronics – All rights reserved  
DocID025090 Rev 4  
19/19  
19  

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