SA12B5 [STMICROELECTRONICS]

SCHOTTKY ARRAYS; 肖特基阵列


型号：	SA12B5
厂家：	ST
描述：	SCHOTTKY ARRAYS 肖特基阵列
文件：	总5页 (文件大小：61K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

SA12B5

SA16B3 / SA16B6

SCHOTTKY ARRAYS

Application Specific Discretes

A.S.D.^TM

MAIN APPLICATIONS

Any electronic equipment where suitable bus

termination is required to avoid signal reflections

and distortions :

PCs

Workstations

High frequencyprocessor boards

Dataline interface

DESCRIPTION

Dedicated to bus termination, the Schottky arrays

SA12B5, SA16B3 and SA16B6 minimise stray

emissions from PCB tracks. They provide suitable

termination by avoiding signal reflexions and

distortions.

SO-16

FEATURES

12-BIT (SA12) OR 16-BIT (SA16) DUAL

SCHOTTKY DIODE ARRAYS

REVERSE VOLTAGE: V_RRM= 7.5 V

FORWARD VOLTAGEV_F< 1.3 V

BENEFITS

Provides impedance matching, and minimizes

distortion.

SO-20

Lowers EMI / RFI radiation.

Eliminates negative voltage : minimizes risk of

latch-up for sensitiveICs.

Savesvaluable space on board.

COMPLIESWITH FOLLOWING STANDARD :

- MIL STD 883C - Method 3015-6 - class3

- IEC1000-4-2 level 4

SSOP20

April 1999 - Ed: 1

1/5

SA12B5 / SA16B3 / SA16B6

FUNCTIONAL DIAGRAM

(SO-20 and SSOP20)

FUNCTIONAL DIAGRAM

(SO-16)

11 SS

ABSOLUTE MAXIMUM RATINGS (T_amb= 25 °C)

Symbol

Parameterand test conditions

Value

Unit

Power dissipation

SO-20

SO-16 and SSOP20

1250

850

V_OP

V_PP

7.5

Maximum operating voltage (V_CC- V_SS

)

Maximum electrostatic discharge

MIL STD 883C - Method3015-6 / IEC1000-4-2contact

Operatingtemperaturerange (see note 1)

Storage temperaturerange

T_op

T_stg

T_L

-40 to +85

-55 to +150

260

°C

Maximum lead temperaturefor soldering during 10s

Maximum junction temperature

T_j

150

Note1: withintheToprange, the SAxxkeepon operating. Theimpacts oftheambient temperature are givenby deratingcurves on thefollowingpage.

ELECTRICAL CHARACTERISTICS (T_amb= 25°C)

Symbol

Parameterand test conditions

Leakagecurrent @ V_RRM= 7.5 V

Typ.

Max.

Unit

I_R

V_F

Forward voltage

(see note 2)

IPP = 18 mA

_PP= 50 mA

1.05

1.3

C_d

Capacitance

V_bias= 0V, F = 1MHz

Note 2: for both pull-up and pull-down schotty diodes.

THERMAL RESISTANCE

Symbol

R_th(j-a)

Parameter

Junctionto ambient

Packages

Value

Unit

SO-16 and SSOP20

SO-20

140

100

°C/W

2/5

SA12B5 / SA16B3 / SA16B6

Fig1-1:

Fig1-2:

Clamping forward voltage versus peak

pulse current (typical values, high level).

Clamping forward voltage versus peak

pulse current(typical values, low level).

Ipp(A)

5.0

1E+0

tp=2.5µs

Tj=25°C

tp=2.5µs

Tj=25°C

1E-1

1.0

1E-2

Tj=85°C

Tj=-40°C

1E-3

Vcl(V)

1E-4

0.1

0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0

Fig 2: Leakage current versus junction tempera-

ture (typical values).

Fig 3: Non repetitive surge peak forward current

versus pulse duration (rectangularwaveform).

IFSM(A)

IR(µA)

1E+2

Tj initial =25°C

VR=7.5V

1E+1

1E+0

1E-1

tp(µs)

Tj(°C)

1E-2

100

125

100

1000

Fig 4:

Fig 5:

Non repetitive surge peak forward current

Capacitance between input or output and

versus initial junction temperature.

ground versus applied voltage (typical values).

Ci/o(pF)

IFSM[Tj] / IFSM[Tj=25°C]

1.2

Vcc=5V

F=1MHz

Vosc=30mV

1.0

0.8

0.6

0.4

0.2

Vi/o-gnd(V)

Tj(°C)

0.0

100

125

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0

3/5

SA12B5 / SA16B3 / SA16B6

TYPICAL APPLICATION

VCC

SAxxBx

Bus

High speed

memory

µP

MARKING

Type

Package

SO16

Marking

SA12B5

SA16B3

SA16B6

SA12B5

SA16B3

SA16B6

SO20

SSOP20

PACKAGE MECHANICAL DATA

SO-16

DIMENSIONS

Millimeters Inches

Min. Typ. Max. Min. Typ. Max.

REF.

1.75

0.069

0.008

0.063

0.018

0.010

0.1

0.20 0.004

1.6

D (1)

0.35

0.19

0.46 0.014

0.25 0.007

F (1)

0.5

0.020

(1) Do not include mold

flash or protrusions.Mold

flash or protrusionsshall

not exceed0.15mm

(0.006inches)

45°(typ.)

9.8

5.8

10 0.386

6.2 0.228

0.394

0.244

1.27

8.89

0.050

0.350

Weight : 0.160g

3.8

4.6

0.5

4.0 0.150

5.3 0.181

1.27 0.020

0.75

0.158

0.209

0.050

0.030

8°(typ.)

4/5

SA12B5 / SA16B3 / SA16B6

DIMENSIONS

PACKAGE MECHANICAL DATA

SO-20

REF.

Millimeters

Inches

Min. Typ. Max. Min. Typ. Max.

2.35

2.65 0.092

0.20 0.004

0.51 0.013

0.32 0.009

13.0 0.484

7.60 0.291

0.104

0.008

0.020

0.013

0.512

0.299

A1 0.10

0.33

0.23

12.6

7.40

1.27

0.050

10.0

0.25

0.50

10.65 0.394

0.75 0.010

1.27 0.020

8° (max)

0.419

0.029

0.050

Weight : 0.520g

SSOP20

DIMENSIONS

REF.

Millimeters

Inches

Min. Typ. Max. Min. Typ. Max.

2.00

0.079

0.010

0.079

a2 A

0.25

1.51

2.00 0.059

0.25 0.30 0.35 0.010 0.012 0.014

0.10

7.05

7.60

0.35 0.004

8.05 0.278

8.70 0.299

0.014

0.317

0.343

5.02 6.10 6.22 0.198 0.240 0.245

0.65 0.026

0°

10°

0°

10°

0.25 0.50 0.80 0.010 0.020 0.031

Weight : 0.180g

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5/5

SA12B5 [STMICROELECTRONICS]

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