M95640-WMB3P/PB [STMICROELECTRONICS]
IC,SERIAL EEPROM,8KX8,CMOS,LLCC,8PIN,PLASTIC;
| 型号： | M95640-WMB3P/PB |
| 厂家： | 
ST |
| 描述： | IC,SERIAL EEPROM,8KX8,CMOS,LLCC,8PIN,PLASTIC 可编程只读存储器 电动程控只读存储器 电可擦编程只读存储器 时钟 |
| 文件： | 总42页 (文件大小：772K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
M95320 M95320-W M95320-R M95320-S
M95640 M95640-W M95640-R M95640-S
32Kbit and 64Kbit Serial SPI Bus EEPROMs
With High Speed Clock
FEATURES SUMMARY
■
Compatible with SPI Bus Serial Interface
(Positive Clock SPI Modes)
Figure 1. Packages
■
Single Supply Voltage:
–
–
–
–
4.5 to 5.5V for M95320 and M95640
2.5 to 5.5V for M95320-W and M95320-W
1.8 to 5.5V for M95320-R and M95640-R
1.65 to 5.5V for M95320-S and M95640-S
8
■
■
■
■
■
■
■
■
■
20MHz, 10MHz, 5MHz or 2MHz clock rates
5ms or 10ms Write Time
Status Register
Hardware Protection of the Status Register
BYTE and PAGE WRITE (up to 32 Bytes)
Self-Timed Programming Cycle
Adjustable Size Read-Only EEPROM Area
Enhanced ESD Protection
1
PDIP8 (BN)
0.25 mm frame
8
More than 100000 or 1 million Erase/Write
Cycles (depending on ordering options)
More than 40-Year Data Retention
1
■
SO8 (MN)
150 mil width
Table 1. Product List
Reference
Part Number
M95320
M95320-W
M95320-R
M95320-S
M95640
M95320
M95640
TSSOP8 (DW)
169 mil width
M95640-W
M95640-R
M95640-S
MLP8 (MB)
2x3 mm
May 2005
1/42
M95640, M95320
TABLE OF CONTENTS
FEATURES SUMMARY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Table 1. Product List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Figure 1. Packages. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
SUMMARY DESCRIPTION. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Table 2. How to Identify Previous, Current and New Products by the Process Identification Letter 5
Figure 2. Logic Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Figure 3. 8 Pin Package Connections. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Table 3. Signal Names . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
SIGNAL DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Serial Data Output (Q). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Serial Data Input (D) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Serial Clock (C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Chip Select (S) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Hold (HOLD) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Write Protect (W). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
CONNECTING TO THE SPI BUS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Figure 4. Bus Master and Memory Devices on the SPI Bus. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
SPI Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Figure 5. SPI Modes Supported . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
OPERATING FEATURES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Power-Up . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Power On Reset: VCC Lock-Out Write Protect . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Power-down . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Active Power and Standby Power Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Hold Condition. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Figure 6. Hold Condition Activation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Status Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
WIP bit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
WEL bit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
BP1, BP0 bits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
SRWD bit. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Table 4. Status Register Format . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Data Protection and Protocol Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Table 5. Write-Protected Block Size . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
MEMORY ORGANIZATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
2/42
M95640, M95320
Figure 7. Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
INSTRUCTIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Table 6. Instruction Set . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Write Enable (WREN) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Figure 8. Write Enable (WREN) Sequence. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Write Disable (WRDI). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Figure 9. Write Disable (WRDI) Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Read Status Register (RDSR). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
WIP bit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
WEL bit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
BP1, BP0 bits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
SRWD bit. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 10.Read Status Register (RDSR) Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Write Status Register (WRSR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Table 7. Protection Modes. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Table 8. Address Range Bits. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Figure 11.Write Status Register (WRSR) Sequence. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Read from Memory Array (READ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Figure 12.Read from Memory Array (READ) Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Write to Memory Array (WRITE). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Figure 13.Byte Write (WRITE) Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Figure 14.Page Write (WRITE) Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
POWER-UP AND DELIVERY STATE. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Power-up State . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
INITIAL DELIVERY STATE. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
MAXIMUM RATING. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Table 9. Absolute Maximum Ratings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
DC AND AC PARAMETERS. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Table 10. Operating Conditions (M95320 and M95640) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Table 11. Operating Conditions (M95320-W and M95640-W) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Table 12. Operating Conditions (M95320-R and M95640-R) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Table 13. Operating Conditions (M95320-S and M95640-S) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Table 14. AC Measurement Conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Figure 15.AC Measurement I/O Waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Table 15. Capacitance. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Table 16. DC Characteristics (M95320 and M95640, Device Grade 6) . . . . . . . . . . . . . . . . . . . . . 24
Table 17. DC Characteristics (M95320 and M95640, Device Grade 3) . . . . . . . . . . . . . . . . . . . . . 25
Table 18. DC Characteristics (M95320-W and M95640-W, Device Grade 6) . . . . . . . . . . . . . . . . . 26
Table 19. DC Characteristics (M95320-W and M95640-W, Device Grade 3) . . . . . . . . . . . . . . . . . 27
Table 20. DC Characteristics (M95320-R and M95640-R) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Table 21. DC Characteristics (M95320-S and M95640-S) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
3/42
M95640, M95320
Table 22. AC Characteristics (M95320 and M95640, Device Grade 6). . . . . . . . . . . . . . . . . . . . . . 28
Table 23. AC Characteristics (M95320 and M95640, Device Grade 3). . . . . . . . . . . . . . . . . . . . . . 29
Table 24. AC Characteristics (M95320-W and M95640-W, Device Grade 6) . . . . . . . . . . . . . . . . . 30
Table 25. AC Characteristics (M95320-W and M95640-W, Device Grade 3) . . . . . . . . . . . . . . . . . 31
Table 26. AC Characteristics (M95320-R and M95640-R) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Table 27. AC Characteristics (M95320-S and M95640-S, Device Grade 3) . . . . . . . . . . . . . . . . . . 33
Figure 16.Serial Input Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Figure 17.Hold Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Figure 18.Output Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
PACKAGE MECHANICAL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
Figure 19.PDIP8 – 8 pin Plastic DIP, 0.25mm lead frame, Package Outline . . . . . . . . . . . . . . . . . 36
Table 28. PDIP8 – 8 pin Plastic DIP, 0.25mm lead frame, Package Mechanical Data . . . . . . . . . . 36
Figure 20.SO8 narrow – 8 lead Plastic Small Outline, 150 mils body width, Package Outline . . . . 37
Table 29. SO8 narrow – 8 lead Plastic Small Outline, 150 mils body width, Package Mechanical Data
37
Figure 21.TSSOP8 – 8 lead Thin Shrink Small Outline, Package Outline . . . . . . . . . . . . . . . . . . . 38
Table 30. TSSOP8 – 8 lead Thin Shrink Small Outline, Package Mechanical Data . . . . . . . . . . . . 38
Figure 22.MLP8 - 8-lead Ultra thin Fine pitch Dual Flat No Lead, Package Outline . . . . . . . . . . . . 39
Table 31. MLP8 - 8-lead Ultra thin Fine pitch Dual Flat No Lead, Package Mechanical Data . . . . 39
PART NUMBERING . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
Table 32. Ordering Information Scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
REVISION HISTORY. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
Table 33. Document Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
4/42
M95640, M95320
SUMMARY DESCRIPTION
These electrically erasable programmable memo-
ry (EEPROM) devices are accessed by a high
speed SPI-compatible bus.
The device is accessed by a simple serial interface
that is SPI-compatible. The bus signals are C, D
and Q, as shown in Table 3. and Figure 2..
The M95320, M95320-W, M95320-R and
M95320-S are 32Kbit devices organized as 4096
x 8 bits. The M95640, M95640-W, M95640-R and
M95640-S are 64Kbit devices organized as 8192
x 8 bits.
The device is selected when Chip Select (S) is tak-
en Low. Communications with the device can be
interrupted using Hold (HOLD).
The devices are available in three different ver-
sions identified by a specific marking (see Table
2.).
Table 2. How to Identify Previous, Current and New Products by the Process Identification Letter
Markings on
Previous
Markings on
Current
Markings on
New
Devices Root Part Numbers
1
1
1
Products
Products
Products
M95320, M95640, M95320-W, M95640-W
Device Grade 6
xxxxS
xxxxV
xxxxP
M95320, M95640, M95320-W, M95640-W Device Grade 3
M95320-R, M95640-R
xxxxS
xxxxB
xxxxP
xxxxP
xxxxP
-
-
-
-
M95320-S, M95640-S
Note: 1. For further information, please ask your ST Sales Office for Process Change Notices.
Figure 2. Logic Diagram
Figure 3. 8 Pin Package Connections
M95xxx
S
Q
1
2
3
4
8
V
CC
HOLD
7
V
CC
W
6
5
C
D
V
SS
AI01790D
D
C
S
Q
Note: 1. See PACKAGE MECHANICAL section for package di-
mensions and how to identify pin-1.
2. NC, Not Connected.
M95xxx
Table 3. Signal Names
W
C
D
Serial Clock
Serial data Input
Serial data Output
Chip Select
Write Protect
Hold
HOLD
Q
S
V
SS
W
AI01789C
HOLD
V
Supply Voltage
Ground
CC
V
SS
5/42
M95640, M95320
SIGNAL DESCRIPTION
During all operations, VCC must be held stable and
within the specified valid range: VCC(min) to
VCC(max).
All of the input and output signals must be held
High or Low (according to voltages of VIH, VOH, VIL
or VOL, as specified in Table 16. to Table 20.).
These signals are described next.
(Q) is at high impedance. Unless an internal Write
cycle is in progress, the device will be in the Stand-
by Power mode. Driving Chip Select (S) Low se-
lects the device, placing it in the Active Power
mode.
After Power-up, a falling edge on Chip Select (S)
is required prior to the start of any instruction.
Serial Data Output (Q). This output signal is
used to transfer data serially out of the device.
Data is shifted out on the falling edge of Serial
Clock (C).
Serial Data Input (D). This input signal is used to
transfer data serially into the device. It receives in-
structions, addresses, and the data to be written.
Values are latched on the rising edge of Serial
Clock (C).
Serial Clock (C). This input signal provides the
timing of the serial interface. Instructions, address-
es, or data present at Serial Data Input (D) are
latched on the rising edge of Serial Clock (C). Data
on Serial Data Output (Q) changes after the falling
edge of Serial Clock (C).
Hold (HOLD). The Hold (HOLD) signal is used to
pause any serial communications with the device
without deselecting the device.
During the Hold condition, the Serial Data Output
(Q) is high impedance, and Serial Data Input (D)
and Serial Clock (C) are Don’t Care.
To start the Hold condition, the device must be se-
lected, with Chip Select (S) driven Low.
Write Protect (W). The main purpose of this in-
put signal is to freeze the size of the area of mem-
ory that is protected against Write instructions (as
specified by the values in the BP1 and BP0 bits of
the Status Register).
This pin must be driven either High or Low, and
must be stable during all write operations.
Chip Select (S). When this input signal is High,
the device is deselected and Serial Data Output
6/42
M95640, M95320
CONNECTING TO THE SPI BUS
These devices are fully compatible with the SPI
protocol.
All instructions, addresses and input data bytes
are shifted in to the device, most significant bit
first. The Serial Data Input (D) is sampled on the
first rising edge of the Serial Clock (C) after Chip
Select (S) goes Low.
All output data bytes are shifted out of the device,
most significant bit first. The Serial Data Output
(Q) is latched on the first falling edge of the Serial
Clock (C) after the instruction (such as the Read
from Memory Array and Read Status Register in-
structions) have been clocked into the device.
Figure 4. shows three devices, connected to an
MCU, on a SPI bus. Only one device is selected at
a time, so only one device drives the Serial Data
Output (Q) line at a time, all the others being high
impedance.
Figure 4. Bus Master and Memory Devices on the SPI Bus
VCC
SDO
SPI Interface with
(CPOL, CPHA) =
(0, 0) or (1, 1)
SDI
SCK
VCC
VCC
VCC
C
Q
D
C
Q
D
C Q D
Bus Master
(ST6, ST7, ST9,
ST10, Others)
SPI Memory
Device
SPI Memory
Device
SPI Memory
Device
R
R
R
CS3 CS2 CS1
S
S
S
W
HOLD
W
HOLD
HOLD
W
AI03746e
Note: The Write Protect (W) and Hold (HOLD) signals should be driven, High or Low as appropriate.
7/42
M95640, M95320
SPI Modes
These devices can be driven by a microcontroller
with its SPI peripheral running in either of the two
following modes:
is available from the falling edge of Serial Clock
(C).
The difference between the two modes, as shown
in Figure 5., is the clock polarity when the bus
master is in Stand-by mode and not transferring
data:
–
–
CPOL=0, CPHA=0
CPOL=1, CPHA=1
–
–
C remains at 0 for (CPOL=0, CPHA=0)
C remains at 1 for (CPOL=1, CPHA=1)
For these two modes, input data is latched in on
the rising edge of Serial Clock (C), and output data
Figure 5. SPI Modes Supported
CPOL CPHA
C
C
0
1
0
1
D
MSB
Q
MSB
AI01438B
8/42
M95640, M95320
OPERATING FEATURES
Power-Up
Active Power and Standby Power Modes
When the power supply is turned on, VCC rises
When Chip Select (S) is Low, the device is select-
ed, and in the Active Power mode. The device
consumes ICC, as specified in Table 16. to Table
20..
When Chip Select (S) is High, the device is dese-
lected. If an Erase/Write cycle is not currently in
progress, the device then goes in to the Standby
Power mode, and the device consumption drops
from VSS to VCC
.
During this time, the Chip Select (S) must be al-
lowed to follow the VCC voltage. It must not be al-
lowed to float, but should be connected to VCC via
a suitable pull-up resistor.
As a built in safety feature, Chip Select (S) is edge
sensitive as well as level sensitive. After Power-
up, the device does not become selected until a
falling edge has first been detected on Chip Select
(S). This ensures that Chip Select (S) must have
been High, prior to going Low to start the first op-
eration.
to ICC1
.
Hold Condition
The Hold (HOLD) signal is used to pause any se-
rial communications with the device without reset-
ting the clocking sequence.
Power On Reset: VCC Lock-Out Write Protect
During the Hold condition, the Serial Data Output
(Q) is high impedance, and Serial Data Input (D)
and Serial Clock (C) are Don’t Care.
To enter the Hold condition, the device must be
selected, with Chip Select (S) Low.
Normally, the device is kept selected, for the whole
duration of the Hold condition. Deselecting the de-
vice while it is in the Hold condition, has the effect
of resetting the state of the device, and this mech-
anism can be used if it is required to reset any pro-
cesses that had been in progress.
The Hold condition starts when the Hold (HOLD)
signal is driven Low at the same time as Serial
Clock (C) already being Low (as shown in Figure
6.).
In order to prevent inadvertent Write operations
during Power-up, each device include a Power On
Reset (POR) circuit. At Power-up, the device will
not respond to any instruction until VCC has
reached the Power On Reset threshold voltage.
This threshold is lower than the VCC min operating
voltage defined in Tables 10, 11, 12 and 13.
Similarly, as soon as VCC drops from the normal
operating voltage, below the Power On Reset
threshold voltage, the device stops responding to
any instruction sent to it.
Prior to selecting and issuing instructions to the
memory, a valid stable VCC voltage must be ap-
plied. This voltage must remain stable and valid
until the end of the transmission of the instruction
and, for a Write instruction, until the completion o
the internal write cycle (tW).
The Hold condition ends when the Hold (HOLD)
signal is driven High at the same time as Serial
Clock (C) already being Low.
Figure 6. also shows what happens if the rising
and falling edges are not timed to coincide with
Serial Clock (C) being Low.
Power-down
At Power-down, the device must be deselected.
Chip Select (S) should be allowed to follow the
voltage applied on VCC
.
9/42
M95640, M95320
Figure 6. Hold Condition Activation
C
HOLD
Hold
Hold
Condition
Condition
AI02029D
Status Register
Data Protection and Protocol Control
Figure 7. shows the position of the Status Register
in the control logic of the device. The Status Reg-
ister contains a number of status and control bits
that can be read or set (as appropriate) by specific
instructions.
WIP bit. The Write In Progress (WIP) bit indicates
whether the memory is busy with a Write or Write
Status Register cycle.
WEL bit. The Write Enable Latch (WEL) bit indi-
cates the status of the internal Write Enable Latch.
BP1, BP0 bits. The Block Protect (BP1, BP0) bits
are non-volatile. They define the size of the area to
be software protected against Write instructions.
SRWD bit. The Status Register Write Disable
(SRWD) bit is operated in conjunction with the
Write Protect (W) signal. The Status Register
Write Disable (SRWD) bit and Write Protect (W)
signal allow the device to be put in the Hardware
Protected mode. In this mode, the non-volatile bits
of the Status Register (SRWD, BP1, BP0) become
read-only bits.
Non-volatile memory devices can be used in envi-
ronments that are particularly noisy, and within ap-
plications that could experience problems if
memory bytes are corrupted. Consequently, the
device features the following data protection
mechanisms:
■
Write and Write Status Register instructions
are checked that they consist of a number of
clock pulses that is a multiple of eight, before
they are accepted for execution.
■
All instructions that modify data must be
preceded by a Write Enable (WREN)
instruction to set the Write Enable Latch
(WEL) bit. This bit is returned to its reset state
by the following events:
–
–
Power-up
Write Disable (WRDI) instruction
completion
–
–
Write Status Register (WRSR) instruction
completion
Write (WRITE) instruction completion
■
■
The Block Protect (BP1, BP0) bits allow part of
the memory to be configured as read-only.
This is the Software Protected Mode (SPM).
The Write Protect (W) signal allows the Block
Protect (BP1, BP0) bits to be protected. This is
the Hardware Protected Mode (HPM).
Table 4. Status Register Format
b7
b0
SRWD
0
0
0
BP1 BP0 WEL WIP
For any instruction to be accepted, and executed,
Chip Select (S) must be driven High after the rising
edge of Serial Clock (C) for the last bit of the in-
struction, and before the next rising edge of Serial
Clock (C).
Two points need to be noted in the previous sen-
tence:
Status Register Write Protect
Block Protect Bits
Write Enable Latch Bit
Write In Progress Bit
10/42
M95640, M95320
–
The ‘last bit of the instruction’ can be the
eighth bit of the instruction code, or the eighth
bit of a data byte, depending on the instruction
(except for Read Status Register (RDSR) and
Read (READ) instructions).
–
The ‘next rising edge of Serial Clock (C)’ might
(or might not) be the next bus transaction for
some other device on the SPI bus.
Table 5. Write-Protected Block Size
Status Register Bits
Array Addresses Protected
Protected Block
M95640, M95640-W,
M95640-R, M95640-S
M95320, M95320-W,
M95320-R, M95320-S
BP1
BP0
0
0
1
1
0
1
0
1
none
none
none
Upper quarter
Upper half
1800h - 1FFFh
1000h - 1FFFh
0000h - 1FFFh
0C00h - 0FFFh
0800h - 0FFFh
0000h - 0FFFh
Whole memory
11/42
M95640, M95320
MEMORY ORGANIZATION
The memory is organized as shown in Figure 7..
Figure 7. Block Diagram
HOLD
High Voltage
Generator
W
S
Control Logic
C
D
Q
I/O Shift Register
Address Register
and Counter
Data
Register
Status
Register
Size of the
Read only
EEPROM
area
1 Page
X Decoder
AI01272C
12/42
M95640, M95320
INSTRUCTIONS
Each instruction starts with a single-byte code, as
summarized in Table 6..
If an invalid instruction is sent (one not contained
in Table 6.), the device automatically deselects it-
self.
Table 6. Instruction Set
Instruc
Instruction
Format
Description
tion
WREN Write Enable
0000 0110
0000 0100
0000 0101
0000 0001
WRDI
RDSR
Write Disable
Read Status Register
WRSR Write Status Register
READ
Read from Memory Array
0000 0011
0000 0010
WRITE Write to Memory Array
13/42
M95640, M95320
Write Enable (WREN)
As shown in Figure 8., to send this instruction to
the device, Chip Select (S) is driven Low, and the
bits of the instruction byte are shifted in, on Serial
Data Input (D). The device then enters a wait
state. It waits for a the device to be deselected, by
Chip Select (S) being driven High.
The Write Enable Latch (WEL) bit must be set pri-
or to each WRITE and WRSR instruction. The only
way to do this is to send a Write Enable instruction
to the device.
Figure 8. Write Enable (WREN) Sequence
S
0
1
2
3
4
5
6
7
C
D
Q
Instruction
High Impedance
AI02281E
Write Disable (WRDI)
The device then enters a wait state. It waits for a
the device to be deselected, by Chip Select (S) be-
ing driven High.
The Write Enable Latch (WEL) bit, in fact, be-
comes reset by any of the following events:
One way of resetting the Write Enable Latch
(WEL) bit is to send a Write Disable instruction to
the device.
As shown in Figure 9., to send this instruction to
the device, Chip Select (S) is driven Low, and the
bits of the instruction byte are shifted in, on Serial
Data Input (D).
–
–
–
–
Power-up
WRDI instruction execution
WRSR instruction completion
WRITE instruction completion.
Figure 9. Write Disable (WRDI) Sequence
S
0
1
2
3
4
5
6
7
C
D
Q
Instruction
High Impedance
AI03750D
14/42
M95640, M95320
Read Status Register (RDSR)
BP1, BP0 bits. The Block Protect (BP1, BP0) bits
are non-volatile. They define the size of the area to
be software protected against Write instructions.
These bits are written with the Write Status Regis-
ter (WRSR) instruction. When one or both of the
Block Protect (BP1, BP0) bits is set to 1, the rele-
vant memory area (as defined in Table 4.) be-
comes protected against Write (WRITE)
instructions. The Block Protect (BP1, BP0) bits
can be written provided that the Hardware Protect-
ed mode has not been set.
The Read Status Register (RDSR) instruction al-
lows the Status Register to be read. The Status
Register may be read at any time, even while a
Write or Write Status Register cycle is in progress.
When one of these cycles is in progress, it is rec-
ommended to check the Write In Progress (WIP)
bit before sending a new instruction to the device.
It is also possible to read the Status Register con-
tinuously, as shown in Figure 10..
SRWD bit. The Status Register Write Disable
(SRWD) bit is operated in conjunction with the
Write Protect (W) signal. The Status Register
Write Disable (SRWD) bit and Write Protect (W)
signal allow the device to be put in the Hardware
Protected mode (when the Status Register Write
Disable (SRWD) bit is set to 1, and Write Protect
(W) is driven Low). In this mode, the non-volatile
bits of the Status Register (SRWD, BP1, BP0) be-
come read-only bits and the Write Status Register
(WRSR) instruction is no longer accepted for exe-
cution.
The status and control bits of the Status Register
are as follows:
WIP bit. The Write In Progress (WIP) bit indicates
whether the memory is busy with a Write or Write
Status Register cycle. When set to 1, such a cycle
is in progress, when reset to 0 no such cycle is in
progress.
WEL bit. The Write Enable Latch (WEL) bit indi-
cates the status of the internal Write Enable Latch.
When set to 1 the internal Write Enable Latch is
set, when set to 0 the internal Write Enable Latch
is reset and no Write or Write Status Register in-
struction is accepted.
Figure 10. Read Status Register (RDSR) Sequence
S
0
1
2
3
4
5
6
7
8
9
10 11 12 13 14 15
C
D
Instruction
Status Register Out
Status Register Out
High Impedance
Q
7
6
5
4
3
2
1
0
7
6
5
4
3
2
1
0
7
MSB
MSB
AI02031E
15/42
M95640, M95320
Write Status Register (WRSR)
(WIP) bit. The Write In Progress (WIP) bit is 1 dur-
ing the self-timed Write Status Register cycle, and
is 0 when it is completed. When the cycle is com-
pleted, the Write Enable Latch (WEL) is reset.
The Write Status Register (WRSR) instruction al-
lows the user to change the values of the Block
Protect (BP1, BP0) bits, to define the size of the
area that is to be treated as read-only, as defined
in Table 4..
The Write Status Register (WRSR) instruction also
allows the user to set or reset the Status Register
Write Disable (SRWD) bit in accordance with the
Write Protect (W) signal. The Status Register
Write Disable (SRWD) bit and Write Protect (W)
signal allow the device to be put in the Hardware
Protected Mode (HPM). The Write Status Register
(WRSR) instruction is not executed once the Hard-
ware Protected Mode (HPM) is entered.
The contents of the Status Register Write Disable
(SRWD) and Block Protect (BP1, BP0) bits are fro-
zen at their current values from just before the
start of the execution of Write Status Register
(WRSR) instruction. The new, updated, values
take effect at the moment of completion of the ex-
ecution of Write Status Register (WRSR) instruc-
tion.
The Write Status Register (WRSR) instruction al-
lows new values to be written to the Status Regis-
ter. Before it can be accepted, a Write Enable
(WREN) instruction must previously have been ex-
ecuted. After the Write Enable (WREN) instruction
has been decoded and executed, the device sets
the Write Enable Latch (WEL).
The Write Status Register (WRSR) instruction is
entered by driving Chip Select (S) Low, followed
by the instruction code and the data byte on Serial
Data Input (D).
The instruction sequence is shown in Figure 11..
The Write Status Register (WRSR) instruction has
no effect on b6, b5, b4, b1 and b0 of the Status
Register. b6, b5 and b4 are always read as 0.
Chip Select (S) must be driven High after the rising
edge of Serial Clock (C) that latches in the eighth
bit of the data byte, and before the next rising edge
of Serial Clock (C). Otherwise, the Write Status
Register (WRSR) instruction is not executed. As
soon as Chip Select (S) is driven High, the self-
timed Write Status Register cycle (whose duration
is tW) is initiated. While the Write Status Register
cycle is in progress, the Status Register may still
be read to check the value of the Write In Progress
Table 7. Protection Modes
Memory Content
W
Signal
SRWD
Bit
Write Protection of the
Status Register
Mode
1
1
Protected Area
Unprotected Area
1
0
0
0
Status Register is Writable
Software (if the WREN instruction
Protected has set the WEL bit)
Ready to accept Write
instructions
Write Protected
(SPM)
The values in the BP1 and
BP0 bits can be changed
1
1
Status Register is
Hardware Hardware write protected
Protected The values in the BP1 and Write Protected
Ready to accept Write
instructions
0
1
(HPM)
BP0 bits cannot be
changed
Note: 1. As defined by the values in the Block Protect (BP1, BP0) bits of the Status Register, as shown in Table 5..
The protection features of the device are summa-
rized in Table 5..
–
–
If Write Protect (W) is driven High, it is
possible to write to the Status Register
provided that the Write Enable Latch (WEL) bit
has previously been set by a Write Enable
(WREN) instruction.
If Write Protect (W) is driven Low, it is not
possible to write to the Status Register even if
the Write Enable Latch (WEL) bit has
When the Status Register Write Disable (SRWD)
bit of the Status Register is 0 (its initial delivery
state), it is possible to write to the Status Register
provided that the Write Enable Latch (WEL) bit has
previously been set by a Write Enable (WREN) in-
struction, regardless of the whether Write Protect
(W) is driven High or Low.
previously been set by a Write Enable
(WREN) instruction. (Attempts to write to the
Status Register are rejected, and are not
accepted for execution). As a consequence,
all the data bytes in the memory area that are
software protected (SPM) by the Block Protect
When the Status Register Write Disable (SRWD)
bit of the Status Register is set to 1, two cases
need to be considered, depending on the state of
Write Protect (W):
16/42
M95640, M95320
(BP1, BP0) bits of the Status Register, are
also hardware protected against data
modification.
If Write Protect (W) is permanently tied High, the
Hardware Protected Mode (HPM) can never be
activated, and only the Software Protected Mode
(SPM), using the Block Protect (BP1, BP0) bits of
the Status Register, can be used.
Regardless of the order of the two events, the
Hardware Protected Mode (HPM) can be entered:
–
by setting the Status Register Write Disable
(SRWD) bit after driving Write Protect (W) Low
Table 8. Address Range Bits
–
or by driving Write Protect (W) Low after
setting the Status Register Write Disable
(SRWD) bit.
32 Kbit
Devices
64 Kbit
Devices
Device
Address Bits
A12-A0
A11-A0
The only way to exit the Hardware Protected Mode
(HPM) once entered is to pull Write Protect (W)
High.
Note: b15 to b13 are Don’t Care on the 64 Kbit devices.
b15 to b12 are Don’t Care on the 32 Kbit devices.
Figure 11. Write Status Register (WRSR) Sequence
S
0
1
2
3
4
5
6
7
8
9
10 11 12 13 14 15
C
Instruction
Status
Register In
7
6
5
4
3
2
0
1
D
Q
High Impedance
MSB
AI02282D
17/42
M95640, M95320
Read from Memory Array (READ)
When the highest address is reached, the address
counter rolls over to zero, allowing the Read cycle
to be continued indefinitely. The whole memory
can, therefore, be read with a single READ instruc-
tion.
The Read cycle is terminated by driving Chip Se-
lect (S) High. The rising edge of the Chip Select
(S) signal can occur at any time during the cycle.
As shown in Figure 12., to send this instruction to
the device, Chip Select (S) is first driven Low. The
bits of the instruction byte and address bytes are
then shifted in, on Serial Data Input (D). The ad-
dress is loaded into an internal address register,
and the byte of data at that address is shifted out,
on Serial Data Output (Q).
If Chip Select (S) continues to be driven Low, the
internal address register is automatically incre-
mented, and the byte of data at the new address is
shifted out.
The first byte addressed can be any byte within
any page.
The instruction is not accepted, and is not execut-
ed, if a Write cycle is currently in progress.
Figure 12. Read from Memory Array (READ) Sequence
S
0
1
2
3
4
5
6
7
8
9
10
20 21 22 23 24 25 26 27 28 29 30 31
C
Instruction
16-Bit Address
15 14 13
MSB
3
2
1
0
D
Q
Data Out 1
Data Out 2
High Impedance
2
7
6
5
4
3
1
7
0
MSB
AI01793D
Note: Depending on the memory size, as shown in Table 8., the most significant address bits are Don’t Care.
18/42
M95640, M95320
Write to Memory Array (WRITE)
Each time a new data byte is shifted in, the least
significant bits of the internal address counter are
incremented. If the number of data bytes sent to
the device exceeds the page boundary, the inter-
nal address counter rolls over to the beginning of
the page, and the previous data there are overwrit-
ten with the incoming data. (The page size of
these devices is 32 bytes).
As shown in Figure 13., to send this instruction to
the device, Chip Select (S) is first driven Low. The
bits of the instruction byte, address byte, and at
least one data byte are then shifted in, on Serial
Data Input (D).
The instruction is terminated by driving Chip Se-
lect (S) High at a byte boundary of the input data.
In the case of Figure 13., this occurs after the
eighth bit of the data byte has been latched in, in-
dicating that the instruction is being used to write
a single byte. The self-timed Write cycle starts,
and continues for a period tWC (as specified in Ta-
ble 22. to Table 26.), at the end of which the Write
in Progress (WIP) bit is reset to 0.
If, though, Chip Select (S) continues to be driven
Low, as shown in Figure 14., the next byte of input
data is shifted in, so that more than a single byte,
starting from the given address towards the end of
the same page, can be written in a single internal
Write cycle.
The instruction is not accepted, and is not execut-
ed, under the following conditions:
–
if the Write Enable Latch (WEL) bit has not
been set to 1 (by executing a Write Enable
instruction just before)
–
–
if a Write cycle is already in progress
if the device has not been deselected, by Chip
Select (S) being driven High, at a byte
boundary (after the eighth bit, b0, of the last
data byte that has been latched in)
–
if the addressed page is in the region
protected by the Block Protect (BP1 and BP0)
bits.
Figure 13. Byte Write (WRITE) Sequence
S
0
1
2
3
4
5
6
7
8
9
10
20 21 22 23 24 25 26 27 28 29 30 31
C
Instruction
16-Bit Address
Data Byte
15 14 13
3
2
1
0
7
6
5
4
3
2
0
1
D
Q
High Impedance
AI01795D
Note: Depending on the memory size, as shown in Table 8., the most significant address bits are Don’t Care.
19/42
M95640, M95320
Figure 14. Page Write (WRITE) Sequence
S
0
1
2
3
4
5
6
7
8
9
10
20 21 22 23 24 25 26 27 28 29 30 31
C
D
Instruction
16-Bit Address
Data Byte 1
15 14 13
3
2
1
0
7
6
5
4
3
2
0
1
S
C
32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47
Data Byte 2
Data Byte 3
Data Byte N
7
6
5
4
3
2
0
7
6
5
4
3
2
0
6
5
4
3
2
0
1
1
1
D
AI01796D
Note: Depending on the memory size, as shown in Table 8., the most significant address bits are Don’t Care.
20/42
M95640, M95320
POWER-UP AND DELIVERY STATE
Power-up State
After Power-up, the device is in the following state:
The SRWD, BP1 and BP0 bits of the Status Reg-
ister are unchanged from the previous power-
down (they are non-volatile bits).
–
–
Standby Power mode
deselected (after Power-up, a falling edge is
required on Chip Select (S) before any
instructions can be started).
INITIAL DELIVERY STATE
–
–
–
not in the Hold Condition
the Write Enable Latch (WEL) is reset to 0
Write In Progress (WIP) is reset to 0
The device is delivered with the memory array set
at all 1s (FFh). The Status Register Write Disable
(SRWD) and Block Protect (BP1 and BP0) bits are
initialized to 0.
21/42
M95640, M95320
MAXIMUM RATING
Stressing the device outside the ratings listed in
Table 9. may cause permanent damage to the de-
vice. These are stress ratings only, and operation
of the device at these, or any other conditions out-
side those indicated in the Operating sections of
this specification, is not implied. Exposure to Ab-
solute Maximum Rating conditions for extended
periods may affect device reliability. Refer also to
the STMicroelectronics SURE Program and other
relevant quality documents.
Table 9. Absolute Maximum Ratings
Symbol
Parameter
Min.
Max.
Unit
°C
°C
V
T
Storage Temperature
–65
150
STG
1
TLEAD
VO
Lead Temperature during Soldering
Output Voltage
See note
–0.50
–0.50
–0.50
V
CC+0.6
VI
Input Voltage
6.5
V
V
CC
Supply Voltage
6.5
V
2
VESD
–4000
4000
V
Electrostatic Discharge Voltage (Human Body model)
®
Note: 1. Compliant with JEDEC Std J-STD-020C (for small body, Sn-Pb or Pb assembly), the ST ECOPACK 7191395 specification, and
the European directive on Restrictions on Hazardous Substances (RoHS) 2002/95/EU
2. AEC-Q100-002 (compliant with JEDEC Std JESD22-A114A, C1=100pF, R1=1500Ω, R2=500Ω)
22/42
M95640, M95320
DC AND AC PARAMETERS
This section summarizes the operating and mea-
surement conditions, and the DC and AC charac-
teristics of the device. The parameters in the DC
and AC Characteristic tables that follow are de-
rived from tests performed under the Measure-
ment Conditions summarized in the relevant
tables. Designers should check that the operating
conditions in their circuit match the measurement
conditions when relying on the quoted parame-
ters.
Table 10. Operating Conditions (M95320 and M95640)
Symbol
Parameter
Min.
4.5
Max.
5.5
Unit
V
V
Supply Voltage
CC
Ambient Operating Temperature (Device Grade 6)
Ambient Operating Temperature (Device Grade 3)
–40
–40
85
°C
°C
TA
125
Table 11. Operating Conditions (M95320-W and M95640-W)
Symbol
Parameter
Min.
2.5
Max.
5.5
Unit
V
V
Supply Voltage
CC
Ambient Operating Temperature (Device Grade 6)
Ambient Operating Temperature (Device Grade 3)
–40
–40
85
°C
°C
TA
125
Table 12. Operating Conditions (M95320-R and M95640-R)
1
1
Symbol
Unit
V
Parameter
Min.
1.8
Max.
5.5
V
Supply Voltage
Ambient Operating Temperature
CC
TA
–40
85
°C
Note: 1. This product is under development. For more information, please contact your nearest ST sales office.
Table 13. Operating Conditions (M95320-S and M95640-S)
1
1
Symbol
Unit
V
Parameter
Min.
1.65
–40
Max.
5.5
V
Supply Voltage
Ambient Operating Temperature
CC
TA
85
°C
Note: 1. This product is under development. For more information, please contact your nearest ST sales office.
Table 14. AC Measurement Conditions
Symbol
Parameter
Min.
Typ.
Max.
Unit
C
Load Capacitance
30
pF
ns
V
L
Input Rise and Fall Times
50
0.2V to 0.8V
Input Pulse Voltages
CC
CC
0.3V to 0.7V
Input and Output Timing Reference Voltages
V
CC
CC
Note: Output Hi-Z is defined as the point where data out is no longer driven.
23/42
M95640, M95320
Figure 15. AC Measurement I/O Waveform
Input Levels
Input and Output
Timing Reference Levels
0.8V
CC
0.7V
CC
0.3V
CC
0.2V
CC
AI00825B
Table 15. Capacitance
Symbol
COUT
Parameter
Test Condition
= 0V
Min.
Max.
Unit
pF
Output Capacitance (Q)
Input Capacitance (D)
Input Capacitance (other pins)
V
8
8
6
OUT
CIN
V
IN
= 0V
= 0V
pF
V
IN
pF
Note: Sampled only, not 100% tested, at T =25°C and a frequency of 5MHz.
A
Table 16. DC Characteristics (M95320 and M95640, Device Grade 6)
Symbol
Parameter
Test Condition
IN = VSS or VCC
Min.
Max.
± 2
Unit
ILI
Input Leakage Current
Output Leakage Current
V
µA
µA
ILO
S = VCC, VOUT = VSS or VCC
± 2
C = 0.1VCC/0.9VCC at 5MHz,
VCC = 5V, Q = open,
4
5
mA
2
Previous Product
C = 0.1VCC/0.9VCC at 10MHz,
ICC
Supply Current
mA
mA
µA
µA
µA
3
V
CC = 5V, Q = open, Current Product
C = 0.1VCC/0.9VCC at 20MHz,
10
10
2
4,5
V
CC = 5V, Q = open, New Product
S = VCC, VCC = 5V,
2
V
IN = VSS or VCC, Previous Product
S = VCC , VCC = 5V,
Supply Current
(Standby)
ICC1
3
V
IN = VSS or VCC, Current Product
S = VCC, VCC = 5V,
2
4,5
V
IN = VSS or VCC, New Product
VIL
VIH
Input Low Voltage
Input High Voltage
–0.45
0.3 VCC
VCC+1
0.4
V
V
0.7 VCC
1
Output Low Voltage
Output High Voltage
I
OL = 2 mA, VCC = 5V
V
V
VOL
1
IOH = –2 mA, VCC = 5V
0.8 VCC
VOH
Note: 1. For all 5V range devices, the device meets the output requirements for both TTL and CMOS standards.
2. Previous product version is identified by Process Identification letter ‘S’.
3. Current product version is identified by Process Identification letter ‘V’’.
4. New product version is identified by Process Identification letter ‘P’.
5. Preliminary data.
24/42
M95640, M95320
Table 17. DC Characteristics (M95320 and M95640, Device Grade 3)
Symbol
Parameter
Test Condition
VIN = VSS or VCC
Min.
Max.
± 2
Unit
µA
ILI
Input Leakage Current
Output Leakage Current
ILO
S = VCC, VOUT = VSS or VCC
± 2
µA
C = 0.1VCC/0.9VCC at 2MHz,
2
4
mA
mA
mA
µA
2
VCC = 5V, Q = open, Previous Product
C = 0.1VCC/0.9VCC at 5MHz,
ICC
Supply Current
3
VCC = 5V, Q = open, Current Product
C = 0.1VCC/0.9VCC at 20MHz,
12
20
5
4,5
2
VCC = 5V, Q = open, New Product
S = VCC , VCC = 5V,
V
IN = VSS or VCC, Previous Product
S = VCC, VCC = 5V,
Supply Current
(Standby)
ICC1
µA
3
V
IN = VSS or VCC, Current Product
S = VCC , VCC = 5V,
2
µA
4,5
V
IN = VSS or VCC, New Product
VIL
VIH
Input Low Voltage
Input High Voltage
Output Low Voltage
–0.45
0.3 VCC
VCC+1
V
V
V
0.7 VCC
1
IOL = 2mA, VCC = 5V
OH = –2mA, VCC = 5V
0.4
VOL
1
Output High Voltage
I
0.8 VCC
V
VOH
Note: 1. For all 5V range devices, the device meets the output requirements for both TTL and CMOS standards.
2. Previous product version is identified by Process Identification letter ‘S’.
3. Current product version is identified by Process Identification letters ‘B’.
4. New product version is identified by Process Identification letters ‘P’.
5. Preliminary data.
25/42
M95640, M95320
Table 18. DC Characteristics (M95320-W and M95640-W, Device Grade 6)
Symbol
Parameter
Test Condition
VIN = VSS or VCC
Min.
Max.
± 2
Unit
µA
ILI
Input Leakage Current
Output Leakage Current
ILO
S = VCC, VOUT = VSS or VCC
± 2
µA
C = 0.1VCC/0.9VCC at 2MHz,
2
3
mA
mA
mA
µA
1
VCC = 2.5V, Q = open, Previous Product
C = 0.1VCC/0.9VCC at 5MHz,
ICC
Supply Current
2
VCC = 2.5V, Q = open, Current Product
C = 0.1VCC/0.9VCC at 10MHz,
5
2
1
3,4
VCC = 2.5V, Q = open, New Product
S = VCC, VCC = 2.5V,
1
V
IN = VSS or VCC, Previous Product
S = VCC, VCC = 2.5V
Supply Current
(Standby)
ICC1
µA
2
V
IN = VSS or VCC, Current Product
S = VCC, VCC = 2.5V
µA
1
3,4
V
IN = VSS or VCC, New Product
VIL
VIH
Input Low Voltage
Input High Voltage
Output Low Voltage
Output High Voltage
–0.45
0.3 VCC
VCC+1
0.4
V
V
V
V
0.7 VCC
VOL
VOH
I
OL = 1.5mA, VCC = 2.5V
I
OH = –0.4mA, VCC = 2.5V
0.8 VCC
Note: 1. Previous product version is identified by Process Identification letter ‘S’.
2. Current product version is identified by Process Identification letter ‘V’’.
3. New product version is identified by Process Identification letter ‘P’.
4. Preliminary data.
Table 19. DC Characteristics (M95320-W and M95640-W, Device Grade 3)
Symbol
Parameter
Test Condition
VIN = VSS or VCC
Max.
± 2
Unit
µA
Min.
ILI
Input Leakage Current
Output Leakage Current
ILO
S = VCC, VOUT = VSS or VCC
± 2
µA
C = 0.1VCC/0.9VCC at 5MHz,
3
6
mA
mA
1
V
CC = 2.5V, Q = open, Current Product
ICC
Supply Current
C = 0.1VCC/0.9VCC at 10MHz,
2
V
CC = 2.5V, Q = open, New Product
ICC1
VIL
Supply Current (Standby)
Input Low Voltage
S = VCC, VCC = 2.5V, VIN = VSS or VCC
2
µA
V
–0.45
0.3 VCC
VCC+1
0.4
VIH
Input High Voltage
0.7 VCC
V
VOL
VOH
Output Low Voltage
Output High Voltage
I
OL = 1.5mA, VCC = 2.5V
V
IOH = –0.4mA, VCC = 2.5V
0.8 VCC
V
Note: 1. Current product version is identified by Process Identification letter ‘B’.
2. New product version is identified by Process Identification letter ‘P’.
26/42
M95640, M95320
Table 20. DC Characteristics (M95320-R and M95640-R)
1,2
1,2
Symbol
Parameter
Unit
µA
Test Condition
VIN = VSS or VCC
Min.
Max.
± 1
ILI
Input Leakage Current
Output Leakage Current
ILO
S = VCC, VOUT = VSS or VCC
± 1
µA
C = 0.1VCC/0.9VCC at 5MHz,
VCC = 1.8 V, Q = open
ICC
Supply Current
3
mA
ICC1
VIL
Supply Current (Standby)
Input Low Voltage
S = VCC, VIN = VSS or VCC, VCC = 1.8V
1
µA
V
–0.45
0.3 VCC
VCC+1
0.3
VIH
Input High Voltage
0.7 VCC
V
VOL
VOH
Output Low Voltage
Output High Voltage
IOL = 0.15 mA, VCC = 1.8 V
V
IOH = –0.1 mA, VCC = 1.8 V
0.8 VCC
V
Note: 1. This product is under qualification. For more information, please contact your nearest ST sales office.
2. Preliminary data.
Table 21. DC Characteristics (M95320-S and M95640-S)
1,2
1,2
Symbol
ILI
Parameter
Unit
µA
Test Condition
VIN = VSS or VCC
Min.
Max.
Input Leakage Current
Output Leakage Current
± 1
± 1
ILO
S = VCC, VOUT = VSS or VCC
µA
C = 0.1VCC/0.9VCC at 2MHz,
VCC = 1.65 V, Q = open
ICC
Supply Current
1
mA
ICC1
VIL
Supply Current (Standby)
Input Low Voltage
S = VCC, VIN = VSS or VCC, VCC = 1.65V
1
µA
V
–0.45
0.3 VCC
VCC+1
0.3
VIH
Input High Voltage
0.7 VCC
V
VOL
VOH
Output Low Voltage
Output High Voltage
IOL = 0.15 mA, VCC = 1.65V
V
IOH = –0.1 mA, VCC = 1.65V
0.8 VCC
V
Note: 1. This product is under qualification. For more information, please contact your nearest ST sales office.
2. Preliminary data.
27/42
M95640, M95320
Table 22. AC Characteristics (M95320 and M95640, Device Grade 6)
Test conditions specified in Table 14. and Table 10.
Previous
Product
Current
Product
New Product
5,6
Version
3
4
Symbol Alt.
Parameter
Unit
Version
Version
Min.
Max.
Min. Max. Min. Max.
f
f
SCK
Clock Frequency
D.C.
90
5
D.C.
15
10
D.C.
15
20
MHz
ns
C
t
t
t
S Active Setup Time
S Not Active Setup Time
S Deselect Time
SLCH
CSS1
CSS2
t
90
15
15
ns
SHCH
t
t
100
90
40
20
ns
SHSL
CS
t
t
CSH
S Active Hold Time
S Not Active Hold Time
25
15
ns
CHSH
t
90
15
15
ns
CHSL
1
t
Clock High Time
Clock Low Time
Clock Rise Time
Clock Fall Time
90
90
40
40
20
20
ns
ns
µs
µs
t
CLH
CH
1
t
t
CLL
CL
2
2
t
1
1
1
1
2
2
t
RC
CLCH
CHCL
t
t
FC
t
t
DSU
Data In Setup Time
20
30
70
40
0
15
15
15
20
0
5
ns
ns
ns
ns
ns
DVCH
CHDX
HHCH
t
t
DH
Data In Hold Time
10
15
15
0
t
Clock Low Hold Time after HOLD not Active
Clock Low Hold Time after HOLD Active
Clock Low Set-up Time before HOLD Active
t
HLCH
t
CLHL
Clock Low Set-up Time before HOLD not
Active
t
0
0
0
ns
CLHH
2
t
Output Disable Time
Clock Low to Output Valid
Output Hold Time
100
60
25
25
20
20
ns
ns
ns
ns
t
DIS
SHQZ
t
t
t
V
CLQV
CLQX
t
t
0
0
0
HO
RO
2
Output Rise Time
50
50
20
20
25
25
5
20
20
20
20
5
t
t
QLQH
QHQL
2
t
Output Fall Time
ns
ns
ns
ms
FO
t
t
HOLD High to Output Valid
HOLD Low to Output High-Z
Write Time
50
HHQV
LZ
2
t
100
10
t
HZ
HLQZ
t
t
WC
W
Note: 1. t + t must never be lower than the shortest possible clock period, 1/f (max).
CH
CL
C
2. Value guaranteed by characterization, not 100% tested in production.
3. Previous product version is identified by Process Identification letter ‘S’.
4. Current product version is identified by Process Identification letter ‘V’’.
5. New product version is identified by Process Identification letter ‘P’.
6. Preliminary Data.
28/42
M95640, M95320
Table 23. AC Characteristics (M95320 and M95640, Device Grade 3)
Test conditions specified in Table 14. and Table 10.
Previous
Product
Current
Product
New
Product
5,6
3
4
Symbol
Alt.
Parameter
Unit
Version
Version
Version
Min. Max. Min. Max.
Min. Max.
f
f
Clock Frequency
D.C.
200
200
200
200
200
2
D.C.
90
5
D.C.
15
20
MHz
ns
C
SCK
CSS1
CSS2
t
t
t
S Active Setup Time
S Not Active Setup Time
S Deselect Time
SLCH
t
90
15
ns
SHCH
t
t
100
90
20
ns
SHSL
CS
t
t
CSH
S Active Hold Time
S Not Active Hold Time
15
ns
CHSH
t
90
15
ns
CHSL
1
t
Clock High Time
Clock Low Time
Clock Rise Time
Clock Fall Time
200
200
90
90
20
20
ns
ns
µs
µs
t
CLH
CH
1
t
t
CLL
CL
2
2
t
1
1
1
1
2
2
t
t
RC
CLCH
CHCL
t
FC
t
t
DSU
Data In Setup Time
40
50
140
90
0
20
30
70
40
0
5
ns
ns
ns
ns
ns
DVCH
CHDX
HHCH
t
t
Data In Hold Time
10
15
15
0
DH
t
Clock Low Hold Time after HOLD not Active
Clock Low Hold Time after HOLD Active
Clock Low Set-up Time before HOLD Active
t
HLCH
t
t
CLHL
Clock Low Set-up Time before HOLD not
Active
0
0
0
ns
CLHH
2
t
Output Disable Time
Clock Low to Output Valid
Output Hold Time
250
150
100
60
20
20
ns
ns
ns
ns
t
DIS
SHQZ
t
t
t
CLQV
CLQX
V
t
0
0
0
HO
RO
2
2
t
Output Rise Time
100
100
100
250
10
50
50
50
100
5
20
20
20
20
5
t
t
QLQH
t
Output Fall Time
ns
ns
ns
ms
FO
QHQL
t
t
HOLD High to Output Valid
HOLD Low to Output High-Z
Write Time
HHQV
LZ
2
t
t
HZ
HLQZ
t
t
WC
W
Note: 1. t + t must never be lower than the shortest possible clock period, 1/f (max).
CH
CL
C
2. Value guaranteed by characterization, not 100% tested in production.
3. Previous product version is identified by Process Identification letter ‘S’.
4. Current product version is identified by Process Identification letter ‘B’.
5. New product version is identified by Process Identification letter ‘P’.
6. Preliminary Data.
29/42
M95640, M95320
Table 24. AC Characteristics (M95320-W and M95640-W, Device Grade 6)
Test conditions specified in Table 14. and Table 11.
Previous
Product
Current
Product
New
Product
3
4
5,6
Symbol Alt.
Parameter
Unit
Version
Version
Version
Min. Max. Min. Max. Min. Max.
f
f
SCK
Clock Frequency
D.C.
200
200
200
200
200
200
2
D.C.
90
5
D.C.
30
10
MHz
ns
C
t
t
t
S Active Setup Time
S Not Active Setup Time
S Deselect Time
SLCH
CSS1
CSS2
t
90
30
ns
SHCH
t
t
100
90
40
ns
SHSL
CHSH
CS
t
t
CSH
S Active Hold Time
S Not Active Hold Time
Clock High Time
30
ns
t
90
30
ns
CHSL
1
t
90
40
ns
t
CLH
CH
1
t
Clock Low Time
Clock Rise Time
200
90
40
ns
µs
t
CLL
CL
2
2
t
1
1
1
1
2
2
t
t
RC
CLCH
t
Clock Fall Time
µs
ns
ns
ns
ns
ns
FC
CHCL
t
t
DSU
Data In Setup Time
40
50
140
90
0
20
30
70
40
0
10
10
30
30
0
DVCH
CHDX
HHCH
t
t
t
Data In Hold Time
DH
Clock Low Hold Time after HOLD not Active
Clock Low Hold Time after HOLD Active
Clock Low Set-up Time before HOLD Active
t
HLCH
t
t
CLHL
Clock Low Set-up Time before HOLD not
Active
0
0
0
ns
CLHH
2
t
Output Disable Time
Clock Low to Output Valid
Output Hold Time
250
150
100
60
40
40
ns
ns
ns
ns
t
DIS
SHQZ
t
t
CLQV
V
t
t
0
0
0
CLQX
HO
RO
2
t
Output Rise Time
100
100
100
250
10
50
50
50
100
5
40
40
40
40
5
t
t
QLQH
2
t
Output Fall Time
ns
ns
ns
ms
FO
QHQL
t
t
HOLD High to Output Valid
HOLD Low to Output High-Z
Write Time
HHQV
LZ
2
t
t
HZ
HLQZ
t
t
WC
W
Note: 1. t + t must never be lower than the shortest possible clock period, 1/f (max).
CH
CL
C
2. Value guaranteed by characterization, not 100% tested in production.
3. Previous product version is identified by Process Identification letter ‘S’.
4. Current product version is identified by Process Identification letter ‘V’’.
5. New product version is identified by Process Identification letter ‘P’.
6. Preliminary Data.
30/42
M95640, M95320
Table 25. AC Characteristics (M95320-W and M95640-W, Device Grade 3)
Test conditions specified in Table 14. and Table 11.
Current Product
New Product
3
4,5
Version
Version
Symbol Alt.
Parameter
Unit
Min.
Max.
Min.
Max.
f
f
SCK
Clock Frequency
D.C.
90
5
D.C.
30
10
MHz
ns
C
t
t
t
S Active Setup Time
S Not Active Setup Time
S Deselect Time
SLCH
CSS1
CSS2
t
90
30
ns
SHCH
t
t
100
90
40
ns
SHSL
CHSH
CS
t
t
CSH
S Active Hold Time
S Not Active Hold Time
Clock High Time
30
ns
t
90
30
ns
CHSL
1
t
90
40
ns
t
CLH
CH
1
t
Clock Low Time
Clock Rise Time
90
40
ns
µs
t
CLL
CL
2
2
t
1
1
2
2
t
t
RC
CLCH
t
Clock Fall Time
µs
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
FC
CHCL
t
t
DSU
Data In Setup Time
20
30
70
40
0
10
10
30
30
0
DVCH
CHDX
HHCH
t
t
Data In Hold Time
DH
t
Clock Low Hold Time after HOLD not Active
Clock Low Hold Time after HOLD Active
Clock Low Set-up Time before HOLD Active
Clock Low Set-up Time before HOLD not Active
Output Disable Time
t
HLCH
t
CLHL
t
0
0
CLHH
2
t
100
60
40
40
t
DIS
SHQZ
t
t
Clock Low to Output Valid
Output Hold Time
CLQV
CLQX
V
t
t
0
0
HO
RO
2
t
Output Rise Time
50
40
t
t
QLQH
2
t
Output Fall Time
50
50
100
5
40
40
40
5
ns
ns
FO
QHQL
t
t
HOLD High to Output Valid
HOLD Low to Output High-Z
Write Time
HHQV
LZ
2
t
ns
t
HZ
HLQZ
t
W
t
WC
ms
Note: 1. t + t must never be lower than the shortest possible clock period, 1/f (max).
CH
CL
C
2. Value guaranteed by characterization, not 100% tested in production.
3. Current product version is identified by Process Identification letter ‘V’’.
4. New product version is identified by Process Identification letter ‘P’.
5. Preliminary Data.
31/42
M95640, M95320
Table 26. AC Characteristics (M95320-R and M95640-R)
Test conditions specified in Table 14. and Table 12.
3,4
3,4
Symbol
Alt.
Parameter
Unit
MHz
ns
Min.
D.C.
Max.
f
C
f
Clock Frequency
5
SCK
CSS1
CSS2
t
t
t
S Active Setup Time
S Not Active Setup Time
S Deselect Time
60
60
90
60
60
90
SLCH
t
ns
SHCH
t
t
ns
SHSL
CS
t
t
CSH
S Active Hold Time
S Not Active Hold Time
Clock High Time
ns
CHSH
t
ns
CHSL
1
t
ns
t
CLH
CH
1
t
Clock Low Time
Clock Rise Time
90
ns
µs
t
CLL
CL
2
2
t
2
2
t
t
RC
CLCH
t
Clock Fall Time
µs
ns
ns
ns
ns
0
FC
CHCL
t
t
DSU
Data In Setup Time
20
20
60
60
0
DVCH
CHDX
HHCH
t
t
DH
Data In Hold Time
t
Clock Low Hold Time after HOLD not Active
Clock Low Hold Time after HOLD Active
Clock Low Set-up Time before HOLD Active
Clock Low Set-up Time before HOLD not Active
Output Disable Time
t
HLCH
t
CLHL
t
0
0
CLHH
2
t
80
80
ns
ns
ns
t
DIS
SHQZ
t
t
V
Clock Low to Output Valid
CLQV
CLQX
t
t
t
Output Hold Time
0
HO
RO
2
Output Rise Time
80
80
80
80
5
ns
ns
ns
ns
ms
t
t
QLQH
2
t
Output Fall Time
FO
QHQL
t
t
HOLD High to Output Valid
HOLD Low to Output High-Z
Write Time
HHQV
LZ
2
t
t
HZ
HLQZ
t
W
t
WC
Note: 1. t + t must never be lower than the shortest possible clock period, 1/f (max).
CH
CL
C
2. Value guaranteed by characterization, not 100% tested in production.
3. Preliminary data: this product is under qualification. For more information, please contact your nearest ST sales office.
4. New product version is identified by Process Identification letter ‘P’.
32/42
M95640, M95320
Table 27. AC Characteristics (M95320-S Device Grade 3)
Test conditions specified in Table 14. and Table 12.
3,4
3,4
Symbol
Alt.
Parameter
Unit
MHz
ns
Min.
D.C.
Max.
f
C
f
Clock Frequency
2
SCK
CSS1
CSS2
t
t
t
S Active Setup Time
S Not Active Setup Time
S Deselect Time
150
150
200
150
150
200
SLCH
t
ns
SHCH
t
t
ns
SHSL
CS
t
t
CSH
S Active Hold Time
S Not Active Hold Time
Clock High Time
ns
CHSH
t
ns
CHSL
1
t
ns
t
CLH
CH
1
t
Clock Low Time
Clock Rise Time
200
ns
µs
t
CLL
CL
2
2
t
2
2
t
t
RC
CLCH
t
Clock Fall Time
µs
ns
ns
ns
ns
0
FC
CHCL
t
t
DSU
Data In Setup Time
50
50
150
150
0
DVCH
CHDX
HHCH
t
t
DH
Data In Hold Time
t
Clock Low Hold Time after HOLD not Active
Clock Low Hold Time after HOLD Active
Clock Low Set-up Time before HOLD Active
Clock Low Set-up Time before HOLD not Active
Output Disable Time
t
HLCH
t
CLHL
t
0
0
CLHH
2
t
200
200
ns
ns
ns
t
DIS
SHQZ
t
t
V
Clock Low to Output Valid
CLQV
CLQX
t
t
t
Output Hold Time
0
HO
RO
2
Output Rise Time
200
200
200
200
10
ns
ns
ns
ns
ms
t
t
QLQH
QHQL
2
t
Output Fall Time
FO
t
t
HOLD High to Output Valid
HOLD Low to Output High-Z
Write Time
HHQV
LZ
2
t
t
HZ
HLQZ
t
t
WC
W
Note: 1. t + t must never be lower than the shortest possible clock period, 1/f (max).
CH
CL
C
2. Value guaranteed by characterization, not 100% tested in production.
3. Preliminary data: this product is under qualification. For more information, please contact your nearest ST sales office.
4. New product version is identified by Process Identification letter ‘P’.
33/42
M95640, M95320
Figure 16. Serial Input Timing
tSHSL
S
tCHSL
tSLCH
tCHSH
tSHCH
C
tDVCH
tCHCL
tCHDX
tCLCH
MSB IN
LSB IN
D
Q
High Impedance
AI01447C
Figure 17. Hold Timing
S
tHLCH
tCLHL
tHHCH
C
tCLHH
tHHQV
tHLQZ
Q
D
HOLD
AI01448B
34/42
M95640, M95320
Figure 18. Output Timing
S
tCH
C
tCLQV
tCLQV
tCL
tSHQZ
tCLQX
tCLQX
LSB OUT
Q
D
tQLQH
tQHQL
ADDR.LSB IN
AI01449D
35/42
M95640, M95320
PACKAGE MECHANICAL
Figure 19. PDIP8 – 8 pin Plastic DIP, 0.25mm lead frame, Package Outline
E
b2
A2
A1
A
L
c
b
e
eA
eB
D
8
1
E1
PDIP-B
Note: Drawing is not to scale.
Table 28. PDIP8 – 8 pin Plastic DIP, 0.25mm lead frame, Package Mechanical Data
mm
inches
Min.
Symb.
Typ.
Min.
Max.
Typ.
Max.
A
A1
A2
b
5.33
0.210
0.38
2.92
0.36
1.14
0.20
9.02
7.62
6.10
–
0.015
0.115
0.014
0.045
0.008
0.355
0.300
0.240
–
3.30
0.46
1.52
0.25
9.27
7.87
6.35
2.54
7.62
4.95
0.56
1.78
0.36
10.16
8.26
7.11
–
0.130
0.018
0.060
0.010
0.365
0.310
0.250
0.100
0.300
0.195
0.022
0.070
0.014
0.400
0.325
0.280
–
b2
c
D
E
E1
e
eA
eB
L
–
–
–
–
10.92
3.81
0.430
0.150
3.30
2.92
0.130
0.115
36/42
M95640, M95320
Figure 20. SO8 narrow – 8 lead Plastic Small Outline, 150 mils body width, Package Outline
h x 45˚
C
A
B
CP
e
D
N
1
E
H
A1
α
L
SO-a
Note: Drawing is not to scale.
Table 29. SO8 narrow – 8 lead Plastic Small Outline, 150 mils body width, Package Mechanical Data
mm
Min.
1.35
0.10
0.33
0.19
4.80
3.80
–
inches
Min.
0.053
0.004
0.013
0.007
0.189
0.150
–
Symb.
Typ.
Max.
1.75
0.25
0.51
0.25
5.00
4.00
–
Typ.
Max.
0.069
0.010
0.020
0.010
0.197
0.157
–
A
A1
B
C
D
E
e
1.27
0.050
H
h
5.80
0.25
0.40
0°
6.20
0.50
0.90
8°
0.228
0.010
0.016
0°
0.244
0.020
0.035
8°
L
α
N
CP
8
8
0.10
0.004
37/42
M95640, M95320
Figure 21. TSSOP8 – 8 lead Thin Shrink Small Outline, Package Outline
D
8
5
c
E1
E
1
4
α
A1
L
A
A2
L1
CP
b
e
TSSOP8AM
Note: Drawing is not to scale.
Table 30. TSSOP8 – 8 lead Thin Shrink Small Outline, Package Mechanical Data
mm
inches
Min.
Symbol
Typ.
Min.
Max.
1.200
0.150
1.050
0.300
0.200
0.100
3.100
–
Typ.
Max.
0.0472
0.0059
0.0413
0.0118
0.0079
0.0039
0.1220
–
A
A1
A2
b
0.050
0.800
0.190
0.090
0.0020
0.0315
0.0075
0.0035
1.000
0.0394
c
CP
D
3.000
0.650
6.400
4.400
0.600
1.000
2.900
–
0.1181
0.0256
0.2520
0.1732
0.0236
0.0394
0.1142
–
e
E
6.200
4.300
0.450
6.600
4.500
0.750
0.2441
0.1693
0.0177
0.2598
0.1772
0.0295
E1
L
L1
α
0°
8°
0°
8°
38/42
M95640, M95320
Figure 22. MLP8 - 8-lead Ultra thin Fine pitch Dual Flat No Lead, Package Outline
e
b
D
L1
L3
E
E2
L
A
D2
ddd
A1
UFDFPN-01
Note: Drawing is not to scale.
Table 31. MLP8 - 8-lead Ultra thin Fine pitch Dual Flat No Lead, Package Mechanical Data
millimeters
Min
inches
Min
Symbol
Typ
Max
0.60
0.05
0.30
Typ
Max
0.024
0.002
0.012
A
A1
b
0.55
0.50
0.022
0.020
0.000
0.008
0.00
0.25
2.00
0.20
0.010
0.079
D
D2
ddd
E
1.55
1.65
0.05
0.061
0.065
0.002
3.00
0.118
E2
e
0.15
–
0.25
–
0.006
–
0.010
–
0.50
0.45
0.020
0.018
L
0.40
0.50
0.15
0.016
0.020
0.006
L1
L3
N
0.30
0.012
8
8
39/42
M95640, M95320
PART NUMBERING
Table 32. Ordering Information Scheme
Example:
M95640
–
W MN
6
T
P
Device Type
M95 = SPI serial access EEPROM
2
Device Function
640 = 64 Kbit (8192 x 8)
320 = 32 Kbit (4096 x 8)
Operating Voltage
blank = V = 4.5 to 5.5V
CC
W = V = 2.5 to 5.5V
CC
R = V = 1.8 to 5.5V
CC
S = V = 1.65 to 5.5V
CC
Package
BN = PDIP8
MN = SO8 (150 mil width)
DW = TSSOP8 (169 mil width)
MB = MLP8 (2x3 mm)
Device Grade
6 = Industrial temperature range, –40 to 85 °C.
Device tested with standard test flow
1
3 = Device tested with High Reliability Certified Flow .
Automotive temperature range (–40 to 125 °C)
Option
blank = Standard Packing
T = Tape and Reel Packing
Plating Technology
blank = Standard SnPb plating
P or G = Lead-Free and RoHS compliant
Note: 1. ST strongly recommends the use of the Automotive Grade devices for use in an automotive environment. The High Reliability Cer-
tified Flow (HRCF) is described in the quality note QNEE9801. Please ask your nearest ST sales office for a copy.
2. Devices bearing the process identification letter “B” or “V” in the package marking (on the top side of the package, on the right side),
guarantee more than 1 million Erase/Write cycle endurance (see Table 2.). For more information about these devices, and their
device identification, please contact your nearest ST sales office, and ask for the Product Change Notice.
For a list of available options (speed, package, etc.) or for further information on any aspect of this device,
please contact your nearest ST Sales Office.
40/42
M95640, M95320
REVISION HISTORY
Table 33. Document Revision History
Date
Rev.
Description of Revision
Human Body Model meets JEDEC std (Table 2). Minor adjustments on pp 1,11,15. New clause
on p7. Addition of TSSOP8 package on pp 1, 2, Ordering Info, Mechanical Data
13-Jul-2000
1.2
Test condition added I and I , and specification of t
and t
removed.
DHDL
LI
LO
DLDH
t
, t
, t
and t
changed to 50ns for the -V range.
DHDL
CLCH CHCL DLDH
“-V” Voltage range changed to “2.7V to 3.6V” throughout.
Maximum lead soldering time and temperature conditions updated.
Instruction sequence illustrations updated.
16-Mar-2001
1.3
“Bus Master and Memory Devices on the SPI bus” illustration updated.
Package Mechanical data updated
19-Jul-2001
06-Dec-2001
18-Dec-2001
08-Feb-2002
1.4 M95160 and M95080 devices removed to their own data sheet
Endurance increased to 1M write/erase cycles
Instruction sequence illustrations updated
1.5
2.0 Document reformatted using the new template. No parameters changed.
Announcement made of planned upgrade to 10MHz clock for the 5V, –40 to 85°C, range.
Endurance set to 100K write/erase cycles
2.1
10MHz, 5MHz, 2MHz clock; 5ms, 10ms Write Time; 100K, 1M erase/write cycles distinguished
on front page, and in the DC and AC Characteristics tables
18-Dec-2002
2.2
26-Mar-2003
26-Jun-2003
15-Oct-2003
21-Nov-2003
28-Jan-2004
2.3 Process indentification letter corrected in footnote to AC Characteristics table for temp. range 3
2.4 -S voltage range upgraded by removing it and inserting -R voltage range in its place
Table of contents, and Pb-free options added. V (min) improved to -0.45V
3.0
3.1
IL
V (min) and V (min) corrected (improved) to -0.45V
I
O
4.0 TSSOP8 connections added to DIP and SO connections
M95320-S and M95640-S root part numbers (1.65 to 5.5V Supply) and related characteristics
added.
20MHz Clock rate added.TSSOP14 package removed and MLP8 package added.
Description of Power On Reset: VCC Lock-Out Write Protect updated.
Product List summary table added. Absolute Maximum Ratings for V (min) and V (min)
improved. Soldering temperature information clarified for RoHS compliant devices. Device
Grade 3 clarified, with reference to HRCF and automotive environments. AEC-Q100-002
IO
CC
24-May-2005
5.0
compliance. t
(min) and t
(min) is t for products under “S” process. t
corrected
CHHL
CHHH
CH
HHQX
to t
.
HHQV
Figure 17., Hold Timing updated.
41/42
M95640, M95320
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences
of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted
by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject
to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not
authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
The ST logo is a registered trademark of STMicroelectronics.
All other names are the property of their respective owners
© 2005 STMicroelectronics - All rights reserved
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42/42
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