M48Z58-70PC6TR [STMICROELECTRONICS]

64 Kbit 8Kb x 8 ZEROPOWER SRAM; 64 Kbit的是8K ×8 ZEROPOWER SRAM
M48Z58-70PC6TR
型号: M48Z58-70PC6TR
厂家: ST    ST
描述:

64 Kbit 8Kb x 8 ZEROPOWER SRAM
64 Kbit的是8K ×8 ZEROPOWER SRAM

静态存储器
文件: 总17页 (文件大小:135K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
M48Z58  
M48Z58Y  
®
64 Kbit (8Kb x 8) ZEROPOWER SRAM  
INTEGRATED ULTRA LOW POWER SRAM,  
POWER-FAIL CONTROL CIRCUIT and  
BATTERY  
READ CYCLE TIME EQUALS WRITE CYCLE  
TIME  
SNAPHAT (SH)  
Battery  
AUTOMATIC POWER-FAIL CHIP DESELECT and  
WRITE PROTECTION  
WRITE PROTECT VOLTAGES  
(VPFD = Power-fail Deselect Voltage):  
– M48Z58: 4.50V VPFD 4.75V  
– M48Z58Y: 4.20V VPFD 4.50V  
28  
28  
1
SELF-CONTAINED BATTERY in the CAPHAT  
DIP PACKAGE  
1
PCDIP28 (PC)  
Battery CAPHAT  
PACKAGING INCLUDES a 28-LEAD SOIC  
SOH28 (MH)  
and SNAPHAT® TOP  
(to be Ordered Separately)  
SOIC PACKAGE PROVIDES DIRECT  
CONNECTION for a SNAPHAT TOP which  
CONTAINS the BATTERY and CRYSTAL  
Figure 1. Logic Diagram  
PIN and FUNCTION COMPATIBLE with  
JEDEC STANDARD 8K x 8 SRAMs  
DESCRIPTION  
V
CC  
The M48Z58/58Y ZEROPOWER® RAM is an 8K x  
8 non-volatile static RAM that integrates power-fail  
deselect circuitry and battery control logic on a  
single die. The monolithic chip is available in two  
special packages to provide a highly integrated  
battery backed-up memory solution.  
13  
8
A0-A12  
DQ0-DQ7  
W
E
M48Z58  
M48Z58Y  
Table 1. Signal Names  
A0-A12  
Address Inputs  
Data Inputs / Outputs  
Chip Enable  
G
DQ0-DQ7  
E
G
Output Enable  
Write Enable  
Supply Voltage  
Ground  
V
SS  
W
AI01176B  
VCC  
VSS  
March 1999  
1/17  
M48Z58, M48Z58Y  
Figure 2A. DIP Pin Connections  
Figure 2B. SOIC Pin Connections  
NC  
A12  
A7  
1
2
3
4
5
6
7
8
9
28  
27  
V
CC  
W
NC  
A12  
A7  
1
28  
27  
26  
25  
24  
23  
22  
21  
20  
19  
18  
17  
16  
15  
V
CC  
W
2
26 NC  
25 A8  
24 A9  
23 A11  
3
NC  
A8  
A6  
A6  
4
A5  
A5  
5
A9  
A4  
A4  
6
A11  
G
A3  
22  
G
A3  
7
M48Z58  
M48Z58Y  
M48Z58Y  
A2  
21 A10  
A2  
8
A10  
E
A1  
20  
E
A1  
9
A0 10  
DQ0 11  
DQ1 12  
DQ2 13  
19 DQ7  
18 DQ6  
17 DQ5  
16 DQ4  
15 DQ3  
A0  
10  
11  
12  
13  
14  
DQ7  
DQ6  
DQ5  
DQ4  
DQ3  
DQ0  
DQ1  
DQ2  
V
14  
V
SS  
SS  
AI01177B  
AI01178B  
Warning:  
Warning:  
NC = Not Connected.  
NC = Not Connected.  
Table 2. Absolute Maximum Ratings (1)  
Symbol  
TA  
Parameter  
Ambient Operating Temperature Grade 1  
Value  
Unit  
0 to 70  
–40 to 85  
°C  
Grade 6  
TSTG  
Storage Temperature (VCC Off)  
–40 to 85  
260  
°C  
°C  
V
(2)  
TSLD  
Lead Solder Temperature for 10 seconds  
Input or Output Voltages  
Supply Voltage  
VIO  
VCC  
IO  
–0.3 to 7  
–0.3 to 7  
20  
V
Output Current  
mA  
W
PD  
Power Dissipation  
1
Notes:  
1. Stresses greater than those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a  
stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational  
section of this specification is not implied. Exposure to the absolute maximum rating conditions for extended periods of time may  
affect reliability.  
2. Soldering temperature not to exceed 260°C for 10 seconds (total thermal budget not to exceed 150°C for longer than 30 seconds).  
CAUTION: Negative undershoots below –0.3 volts are not allowed on any pin while in the Battery Back-up mode.  
CAUTION: Do NOT wave solder SOIC to avoid damaging SNAPHAT sockets.  
Table 3. Operating Modes (1)  
Mode  
Deselect  
Write  
VCC  
E
VIH  
VIL  
VIL  
VIL  
X
G
X
W
X
DQ0-DQ7  
High Z  
DIN  
Power  
Standby  
4.75V to 5.5V  
or  
4.5V to 5.5V  
X
VIL  
VIH  
VIH  
X
Active  
Read  
VIL  
VIH  
X
DOUT  
Active  
Read  
High Z  
High Z  
High Z  
Active  
Deselect  
Deselect  
V
SO to VPFD (min) (2)  
CMOS Standby  
Battery Back-up Mode  
VSO  
X
X
X
Notes  
: 1. X = VIH or VIL; VSO = Battery Back-up Switchover Voltage.  
2. See Table 7 for details.  
2/17  
M48Z58, M48Z58Y  
Figure 3. Block Diagram  
A0-A12  
LITHIUM  
CELL  
DQ0-DQ7  
E
POWER  
8K x 8  
SRAM ARRAY  
VOLTAGE SENSE  
AND  
SWITCHING  
CIRCUITRY  
V
PFD  
W
G
V
V
CC  
SS  
AI01394  
DESCRIPTION  
Table 4. AC Measurement Conditions  
(cont’d)  
The M48Z58/58Y is a non-volatile pin and function  
equivalent to any JEDEC standard 8K x 8 SRAM.  
It also easily fits into many ROM, EPROM, and  
EEPROM sockets, providing the non-volatility of  
PROMs without any requirement for special write  
timing or limitations on the number of writes that  
can be performed.  
Input Rise and Fall Times  
5ns  
Input Pulse Voltages  
0 to 3V  
1.5V  
Input and Output Timing Ref. Voltages  
Note that Output Hi-Z is defined as the point where data is no  
longer driven.  
The 28 pin 600mil DIP CAPHAT houses the  
M48Z58/58Y silicon with a long life lithium button  
cell in a single package.  
Figure 4. AC Testing Load Circuit  
5V  
The 28 pin 330mil SOIC provides sockets with gold  
plated contacts at both ends for direct connection  
to a separate SNAPHAT housing containing the  
battery. The unique design allows the SNAPHAT  
battery package to be mounted on top of the SOIC  
package after the completion of the surface mount  
process. Insertion of the SNAPHAT housing after  
reflow prevents potential batterydamage due to the  
high temperatures required for device surface-  
mounting. The SNAPHAT housing is keyed to pre-  
vent reverse insertion.  
1.9kΩ  
DEVICE  
UNDER  
TEST  
OUT  
1kΩ  
C
= 100pF or 5pF  
L
The SOIC and battery packages are shipped sepa-  
rately in plastic anti-static tubes or in Tape & Reel  
form.  
C
includes JIG capacitance  
L
AI01030  
3/17  
M48Z58, M48Z58Y  
Table 5. Capacitance (1, 2)  
°
(TA = 25 C)  
Symbol  
Parameter  
Input Capacitance  
Test Condition  
VIN = 0V  
Min  
Max  
10  
Unit  
pF  
CIN  
(3)  
CIO  
Input / Output Capacitance  
VOUT = 0V  
10  
pF  
Notes:  
1. Effective capacitance measured with power supply at 5V.  
2. Sampled only, not 100% tested.  
3. Outputs deselected.  
Table 6. DC Characteristics  
°
°
(TA = 0 to 70 C or –40 to 85 C; VCC = 4.75V to 5.5V or 4.5V to 5.5V)  
Symbol  
ILI  
Parameter  
Input Leakage Current  
Output Leakage Current  
Supply Current  
Test Condition  
0V VIN VCC  
0V VOUT VCC  
Outputs open  
E = VIH  
Min  
Max  
Unit  
µA  
µA  
mA  
mA  
mA  
V
±1  
ILO  
±5  
ICC  
50  
ICC1  
ICC2  
VIL  
Supply Current (Standby) TTL  
Supply Current (Standby) CMOS  
Input Low Voltage  
3
3
E = VCC – 0.2V  
–0.3  
2.2  
0.8  
VIH  
Input High Voltage  
VCC + 0.3  
0.4  
V
VOL  
VOH  
Output Low Voltage  
IOL = 2.1mA  
IOH = –1mA  
V
Output High Voltage  
2.4  
V
Table 7. Power Down/Up Trip Points DC Characteristics (1)  
°
°
(TA = 0 to 70 C or –40 to 85 C)  
Symbol  
VPFD  
Parameter  
Min  
4.5  
4.2  
Typ  
4.6  
Max  
4.75  
4.5  
Unit  
Power-fail Deselect Voltage (M48Z58/58Y)  
Power-fail Deselect Voltage (M48Z58/58YY)  
Battery Back-up Switchover Voltage  
Expected Data Retention Time  
V
VPFD  
4.35  
3.0  
V
V
VSO  
(2)  
tDR  
10  
YEARS  
Notes:  
1. All voltages referenced to VSS  
.
2. At 25 °C  
DESCRIPTION  
(cont’d)  
tion. When VCC is out of tolerance, the circuit write  
protects the SRAM, providing a high degree of data  
security in the midst of unpredictable system op-  
eration brought on by low VCC. As VCC falls below  
approximately 3V, the control circuitry connects the  
battery which maintains data until valid power re-  
turns.  
For the 28 lead SOIC, the battery package (i.e.  
SNAPHAT) part number is "M4Z28-BR00SH1".  
The M48Z58/58Y also has its own Power-fail De-  
tect circuit. The controlcircuitry constantly monitors  
the single 5V supply for an out of tolerance condi-  
4/17  
M48Z58, M48Z58Y  
Table 8. Power Down/Up Mode AC Characteristics  
°
°
(TA = 0 to 70 C or –40 to 85 C)  
Symbol  
Parameter  
Min  
0
Max  
Unit  
µs  
tPD  
E or W at VIH before Power Down  
(1)  
tF  
VPFD (max) to VPFD (min) VCC Fall Time  
VPFD (min) to VSS VCC Fall Time  
300  
10  
10  
1
µs  
(2)  
tFB  
µs  
tR  
tRB  
VPFD(min) to VPFD (max) VCC Rise Time  
VSS to VPFD (min) VCC Rise Time  
VPFD (max) to Inputs Recognized  
µs  
µs  
(3)  
tREC  
40  
200  
ms  
Notes  
µ
: 1. VPFD (max) to VPFD (min) fall time of less than tF may result in deselection/write protection not occurring until 200 s after  
VCC passes VPFD (min).  
2. VPFD (min) to VSS fall time of less than tFB may cause corruption of RAM data.  
3. tREC (min) = 20ms for industrial temperature grade 6 device.  
Figure 5. Power Down/Up Mode AC Waveforms  
V
CC  
V
V
V
(max)  
(min)  
PFD  
PFD  
SO  
tF  
tR  
tFB  
tRB  
tPD  
tDR  
tREC  
RECOGNIZED  
RECOGNIZED  
INPUTS  
DON'T CARE  
HIGH-Z  
OUTPUTS  
VALID  
VALID  
(PER CONTROL INPUT)  
(PER CONTROL INPUT)  
AI01168C  
5/17  
M48Z58, M48Z58Y  
Table 9. Read Mode AC Characteristics  
°
°
(TA = 0 to 70 C or –40 to 85 C; VCC = 4.75V to 5.5V or 4.5V to 5.5V)  
M48Z58 / M48Z58Y  
-70  
Symbol  
Parameter  
Unit  
Min  
Max  
tAVAV  
Read Cycle Time  
70  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
(1)  
tAVQV  
Address Valid to Output Valid  
70  
70  
35  
(1)  
tELQV  
Chip Enable Low to Output Valid  
Output Enable Low to Output Valid  
Chip Enable Low to Output Transition  
Output Enable Low to Output Transition  
Chip Enable High to Output Hi-Z  
Output Enable High to Output Hi-Z  
Address Transition to Output Transition  
(1)  
tGLQV  
(2)  
tELQX  
5
5
(2)  
tGLQX  
(2)  
tEHQZ  
25  
25  
(2)  
tGHQZ  
(1)  
tAXQX  
10  
Notes:  
1. CL = 100pF (see Figure 4).  
2. CL = 5pF (see Figure 4).  
Figure 6. Read Mode AC Waveforms  
tAVAV  
VALID  
A0-A12  
tAVQV  
tELQV  
tAXQX  
tEHQZ  
E
tELQX  
tGLQV  
tGHQZ  
G
tGLQX  
DQ0-DQ7  
VALID  
AI01385  
Note:  
Write Enable (W) = High.  
6/17  
M48Z58, M48Z58Y  
Table 10. Write Mode AC Characteristics  
°
°
(TA = 0 to 70 C or –40 to 85 C; VCC = 4.75V to 5.5V or 4.5V to 5.5V)  
M48Z58 / M48Z58Y  
-70  
Symbol  
Parameter  
Unit  
Min  
70  
0
Max  
tAVAV  
tAVWL  
tAVEL  
Write Cycle Time  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
Address Valid to Write Enable Low  
Address Valid to Chip Enable Low  
Write Enable Pulse Width  
0
tWLWH  
tELEH  
tWHAX  
tEHAX  
tDVWH  
tDVEH  
tWHDX  
tEHDX  
50  
55  
0
Chip Enable Low to Chip Enable High  
Write Enable High to Address Transition  
Chip Enable High to Address Transition  
Input Valid to Write Enable High  
Input Valid to Chip Enable High  
0
30  
30  
5
Write Enable High to Input Transition  
Chip Enable High to Input Transition  
Write Enable Low to Output Hi-Z  
Address Valid to Write Enable High  
Address Valid to Chip Enable High  
Write Enable High to Output Transition  
5
(1, 2)  
tWLQZ  
25  
tAVWH  
tAVEH  
60  
60  
5
(1, 2)  
tWHQX  
Notes:  
1. CL = 5pF (see Figure 4).  
2. If E goes low simultaneously with W going low, the outputs remain in the high impedance state.  
READ MODE  
time (tAXQX) but will go indeterminate until the next  
Address Access.  
The M48Z58/58Y is in the Read Mode whenever  
W (Write Enable) is high, E (Chip Enable) is low.  
Thus, the unique address specified by the 13 Ad-  
dress Inputs defines which one of the 8,192 bytes  
of data is to be accessed. Valid data will be avail-  
able at the Data I/O pins within Address Access  
time (tAVQV) after the last address input signal is  
stable, providing that the E and G access times are  
also satisfied. If the E and G access times are not  
met, valid data will be available after the latter of  
the Chip Enable Access time (tELQV) or Output  
Enable Access time (tGLQV).  
The state of the eight three-state Data I/O signals  
is controlled by E and G. If the outputs are activated  
before tAVQV, the data lines will be driven to an  
indeterminate state until tAVQV. If the Address In-  
puts are changed while E and G remain active,  
output data will remain valid for Output Data Hold  
WRITE MODE  
The M48Z58/58Y is in the Write Mode whenever W  
and E are low. The start of a write is referenced  
from the latter occurring falling edge of W or E. A  
write is terminated by the earlier rising edge of W  
or E. The addresses must be held valid throughout  
the cycle. E or W must return high for a minimum  
of tEHAX from Chip Enable or tWHAX from Write  
Enable prior to the initiation of another read or write  
cycle. Data-in must be valid tDVWH prior to the end  
of write and remain valid for tWHDX afterward. G  
should be kept high during write cycles to avoid bus  
contention; although, if the output bus has been  
activated by a low on E and G, a low on W will  
disable the outputs tWLQZ after W falls.  
7/17  
M48Z58, M48Z58Y  
Figure 7. Write Enable Controlled, Write AC Waveforms  
tAVAV  
A0-A12  
VALID  
tAVWH  
tAVEL  
tAVWL  
tWHAX  
E
tWLWH  
W
tWLQZ  
tWHQX  
tWHDX  
DQ0-DQ7  
DATA INPUT  
tDVWH  
AI01386  
Figure 8. Chip Enable Controlled, Write AC Waveforms  
tAVAV  
A0-A12  
VALID  
tAVEH  
tELEH  
tAVEL  
tEHAX  
E
tAVWL  
W
tEHDX  
DQ0-DQ7  
DATA INPUT  
tDVEH  
AI01387B  
8/17  
M48Z58, M48Z58Y  
DATA RETENTION MODE  
POWER SUPPLY DECOUPLING and UNDER-  
SHOOT PROTECTION  
With valid VCC applied, the M48Z58/58Y operates  
as a conventional BYTEWIDE static RAM.  
Should the supply voltage decay, the RAM will  
automatically power-fail deselect, write protecting  
itself when VCC falls within the VPFD(max),  
VPFD(min) window. All outputs become high imped-  
ance, and all inputs are treated as "don’t care."  
ICC transients, including those produced by output  
switching, can produce voltage fluctuations, result-  
ing in spikes on the VCC bus. These transients can  
be reduced if capacitors are used to store energy,  
which stabilizes the VCC bus. The energy stored in  
the bypass capacitors will be released as low going  
spikes are generated or energy will be absorbed  
when overshoots occur. A ceramic bypass capaci-  
Note:  
A power failure during a write cycle may  
corrupt data at the currently addressed location,  
but does not jeopardize the rest of the RAM’s  
content. At voltages below VPFD(min), the user can  
be assured the memory will be in a write protected  
state, provided the VCC fall time is not less than tF.  
The M48Z58/58Y may respond to transient noise  
spikes on VCC that reach into the deselect window  
during the time the device is sampling VCC. There-  
fore, decoupling of the power supply lines is rec-  
ommended.  
µ
tor value of 0.1 F (as shown in Figure 9) is recom-  
mended in order to provide the needed filtering.  
In addition to transients that are caused by normal  
SRAM operation, power cycling can generate  
negative voltage spikes on VCC that drive it to  
values below VSS by as much as one Volt. These  
negative spikes can cause data corruption in the  
SRAM while in battery backup mode. To protect  
from these voltage spikes, it is recommeded to  
connect a schottky diode from VCC to VSS (cathode  
connected to VCC, anode to VSS). Schottky diode  
1N5817 is recommended for through hole and  
MBRS120T3 is recommended for surface mount.  
When VCC drops below VSO, the control circuit  
switches power to the internal battery which pre-  
serves data. The internal button cell will maintain  
data in the M48Z58/58Y for an accumulated period  
of at least 10 years when VCC is less than VSO  
.
As system power returns and VCC rises above VSO  
,
Figure 9. Supply Voltage Protection  
the battery is disconnected, and the power supply  
is switched to external VCC. Write protection con-  
tinues until VCC reaches VPFD(min) plus tREC(min).  
Normal RAM operation can resume tREC after VCC  
exceeds VPFD(max).  
V
CC  
V
CC  
For more information on Battery Storage Life refer  
to the Application Note AN1012.  
0.1µF  
DEVICE  
V
SS  
AI02169  
9/17  
M48Z58, M48Z58Y  
ORDERING INFORMATION SCHEME  
Example:  
M48Z58Y -70 MH  
1
TR  
Supply Voltage and Write  
Protect Voltage  
Speed  
Package  
Temp. Range  
Shipping Method  
for SOIC  
58 (1) VCC = 4.75V to 5.5V  
-70 70ns  
PC  
PCDIP28  
1
0 to 70 °C  
blank Tubes  
VPFD = 4.5V to 4.75V  
MH (2,3)SOH28  
6 (4) –40 to 85°C  
TR  
Tape & Reel  
58Y VCC = 4.5V to 5.5V  
VPFD = 4.2V to 4.5V  
Notes:  
1. The M48Z58 part is offered with the PCDIP28 (i.e. CAPHAT) package only.  
2. The SOIC package (SOH28) requires the battery package (SNAPHAT) which is ordered separately under the part number  
"M4Z28-BR00SH1" in plastic tube or "M4Z28-BR00SH1TR" in Tape & Reel form.  
3. Delivery may include either the 2-pin version of the SOIC/SNAPHAT or the 4-pin version of the SOIC/SNAPHAT. Both are  
functionally equivalent (see package drawing section for details).  
4. Industrial temperature grade available in SOIC package (SOH28) only.  
Caution:  
Do not place the SNAPHAT battery package "M4Z28-BR00SH1" in conductive foam since this will drain the lithium button-cell  
battery.  
For a list of available options (Speed, Package, etc...) or for further information on any aspect of this device,  
please contact the STMicroelectronics Sales Office nearest to you.  
10/17  
M48Z58, M48Z58Y  
PCDIP28 - 28 pin Plastic DIP, battery CAPHAT  
mm  
Min  
inches  
Min  
Symb  
Typ  
Max  
9.65  
0.76  
8.89  
0.53  
1.78  
0.31  
39.88  
18.34  
2.79  
36.32  
16.00  
3.81  
Typ  
Max  
A
A1  
A2  
B
8.89  
0.38  
8.38  
0.38  
1.14  
0.20  
39.37  
17.83  
2.29  
29.72  
15.24  
3.05  
28  
0.350  
0.015  
0.330  
0.015  
0.045  
0.008  
1.550  
0.702  
0.090  
1.170  
0.600  
0.120  
28  
0.380  
0.030  
0.350  
0.021  
0.070  
0.012  
1.570  
0.722  
0.110  
1.430  
0.630  
0.150  
B1  
C
D
E
e1  
e3  
eA  
L
N
A2  
A
L
A1  
e1  
C
B1  
B
eA  
e3  
D
N
1
E
PCDIP  
Drawing is not to scale.  
11/17  
M48Z58, M48Z58Y  
SOH28 - 28 lead Plastic Small Outline, 4-socket battery SNAPHAT  
mm  
Min  
inches  
Min  
Symb  
Typ  
Max  
3.05  
0.36  
2.69  
0.51  
0.32  
18.49  
8.89  
Typ  
Max  
0.120  
0.014  
0.106  
0.020  
0.012  
0.728  
0.350  
A
A1  
A2  
B
0.05  
2.34  
0.36  
0.15  
17.71  
8.23  
0.002  
0.092  
0.014  
0.006  
0.697  
0.324  
C
D
E
e
1.27  
0.050  
eB  
H
3.20  
11.51  
0.41  
0°  
3.61  
12.70  
1.27  
8°  
0.126  
0.453  
0.016  
0°  
0.142  
0.500  
0.050  
8°  
L
α
N
28  
28  
CP  
0.10  
0.004  
A2  
A
C
eB  
B
e
CP  
D
N
E
H
A1  
α
L
1
SOH-A  
Drawing is not to scale.  
12/17  
M48Z58, M48Z58Y  
SOH28 - 28 lead Plastic Small Outline, 2-socket battery SNAPHAT  
mm  
Min  
inches  
Symb  
Typ  
Max  
3.05  
0.36  
2.69  
0.51  
0.32  
18.49  
8.89  
Typ  
Min  
Max  
0.120  
0.014  
0.106  
0.020  
0.012  
0.728  
0.350  
A
A1  
A2  
B
0.05  
2.34  
0.36  
0.15  
17.71  
8.23  
0.002  
0.092  
0.014  
0.006  
0.697  
0.324  
C
D
E
e
1.27  
0.050  
eB  
H
3.20  
11.51  
0.41  
0°  
3.61  
12.70  
1.27  
8°  
0.126  
0.453  
0.016  
0°  
0.142  
0.500  
0.050  
8°  
L
α
N
28  
28  
CP  
0.10  
0.004  
A2  
A
C
eB  
B
e
CP  
D
N
E
H
A1  
α
L
1
SOH-B  
Drawing is not to scale.  
13/17  
M48Z58, M48Z58Y  
SH - 4-pin SNAPHAT Housing for 49 mAh Battery  
mm  
Min  
inches  
Min  
Symb  
Typ  
Max  
9.78  
7.24  
6.99  
0.38  
0.56  
21.84  
14.99  
15.95  
3.61  
2.29  
Typ  
Max  
0.385  
0.285  
0.275  
0.015  
0.022  
0.860  
0.590  
0.628  
0.142  
0.090  
A
A1  
A2  
A3  
B
6.73  
6.48  
0.265  
0.255  
0.46  
21.21  
14.22  
15.55  
3.20  
0.018  
0.835  
0.560  
0.612  
0.126  
0.080  
D
E
eA  
eB  
L
2.03  
A2  
A1  
A
A3  
L
eA  
D
B
eB  
E
SH  
Drawing is not to scale.  
14/17  
M48Z58, M48Z58Y  
SH - 2-pin SNAPHAT Housing for 49 mAh Battery  
mm  
Min  
inches  
Symb  
Typ  
Max  
9.78  
7.24  
6.99  
0.38  
0.56  
21.84  
14.99  
3.61  
2.29  
Typ  
Min  
Max  
0.385  
0.285  
0.275  
0.015  
0.022  
0.860  
0.590  
0.142  
0.090  
A
A1  
A2  
A3  
B
6.73  
6.48  
0.265  
0.255  
0.46  
21.21  
14.22  
3.20  
0.018  
0.835  
0.560  
0.126  
0.080  
D
E
eB  
L
2.03  
A2  
A1  
A
A3  
L
B
eB  
D
E
SHZP-A  
Drawing is not to scale.  
15/17  
M48Z58, M48Z58Y  
SH - 2-pin SNAPHAT Housing for 130 mAh Battery  
mm  
Min  
inches  
Min  
Symb  
Typ  
Max  
10.54  
8.51  
Typ  
Max  
0.415  
0.335  
0.315  
0.015  
0.022  
0.860  
0.710  
0.142  
0.090  
A
A1  
A2  
A3  
B
8.00  
7.24  
0.315  
0.285  
8.00  
0.38  
0.46  
21.21  
17.27  
3.20  
0.56  
0.018  
0.835  
0.680  
0.126  
0.080  
D
21.84  
18.03  
3.61  
E
eB  
L
2.03  
2.29  
A2  
A1  
A
A3  
L
B
eB  
D
E
SHZP-B  
Drawing is not to scale.  
16/17  
M48Z58, M48Z58Y  
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences  
of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted  
by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to  
change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not  
authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.  
The ST logo is a registered trademark of STMicroelectronics  
© 1999 STMicroelectronics - All Rights Reserved  
® ZEROPOWER and SNAPHAT are registered trademarks of STMicroelectronics  
CAPHAT and BYTEWIDE are trademarks of STMicroelectronics  
STMicroelectronics GROUP OF COMPANIES  
Australia - Brazil - China - France - Germany - Italy - Japan - Korea - Malaysia - Malta - Mexico - Morocco - The Netherlands -  
Singapore - Spain - Sweden - Switzerland - Taiwan - Thailand - United Kingdom - U.S.A.  
http://www.st.com  
17/17  

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