M41T11_11 [STMICROELECTRONICS]
Serial real-time clock (RTC) with 56 bytes of NVRAM; 串行实时时钟( RTC ),具有56字节的NVRAM型号: | M41T11_11 |
厂家: | ST |
描述: | Serial real-time clock (RTC) with 56 bytes of NVRAM |
文件: | 总30页 (文件大小:231K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
M41T11
Serial real-time clock (RTC) with 56 bytes of NVRAM
Datasheet − production data
Features
■ Counters for seconds, minutes, hours, day,
date, month, years and century
8
■ 32 KHz crystal oscillator integrating load
capacitance (12.5 pF) providing exceptional
oscillator stability and high crystal series
resistance operation
1
SO8
2
■ Serial interface supports I C bus (100 kHz
protocol)
■ Ultra-low battery supply current of 0.8 µA (typ.
at 3 V)
■ 2.0 to 5.5 V clock operating voltage
■ Automatic switchover and deselect circuitry
■ 56 bytes of general purpose RAM
®
SNAPHAT battery & crystal
■ Software clock calibration to compensate
crystal deviation due to temperature
■ Automatic leap year compensation
■ Operating temperature of –40 to 85°C
■ Packaging includes a 28-lead SOIC and
28
1
®
SNAPHAT top (to be ordered separately;
3.3 V to 5.0 V supply voltage only)
SOH28
■ RoHS compliant
– Lead-free second level interconnect
June 2012
Doc ID 6103 Rev 10
1/30
This is information on a product in full production.
www.st.com
1
Contents
M41T11
Contents
1
2
Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.1
2-wire bus characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.1.1
2.1.2
2.1.3
2.1.4
2.1.5
Bus not busy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Start data transfer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Stop data transfer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Data valid . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Acknowledge . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.2
2.3
2.4
Read mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Write mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Data retention mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
3
Clock operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
3.1
3.2
3.3
Clock calibration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Output driver pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Preferred initial power-on defaults . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
4
5
6
7
8
9
Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
DC and AC parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Part numbering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Environmental information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
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M41T11
List of tables
List of tables
Table 1.
Table 2.
Table 3.
Table 4.
Table 5.
Table 6.
Table 7.
Table 8.
Table 9.
Table 10.
Table 11.
Table 12.
Table 13.
Table 14.
Table 15.
Table 16.
Table 17.
Signal names . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
AC characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Register map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Operating and AC measurement conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Capacitance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
DC characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Crystal electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Power down/up AC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Power down/up trip points DC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
SO8 – 8-lead plastic small outline (150 mils body width) package mechanical data . . . . . 23
®
SOH28 – 28-lead plastic small outline, battery SNAPHAT package mechanical data. . . 24
®
SH – 4-pin SNAPHAT housing for 48 mAh battery & crystal, package mechanical data. 25
®
SH – 4-pin SNAPHAT housing for 120 mAh battery & crystal, package mech. data . . . . 26
Ordering information scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
®
SNAPHAT battery table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
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List of figures
M41T11
List of figures
Figure 1.
Figure 2.
Figure 3.
Figure 4.
Figure 5.
Figure 6.
Figure 7.
Figure 8.
Figure 9.
Logic diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
8-pin SOIC connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
28-pin SOIC connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Serial bus data transfer sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Acknowledgement sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Bus timing requirements sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Slave address location . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Read mode sequence. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Figure 10. Alternate read mode sequence. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Figure 11. Write mode sequence. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Figure 12. Crystal accuracy across temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Figure 13. Clock calibration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Figure 14. AC testing input/output waveform. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Figure 15. Power down/up mode AC waveforms. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Figure 16. SO8 – 8-lead plastic small outline package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
®
Figure 17. SOH28 – 28-lead plastic small outline, battery SNAPHAT package outline. . . . . . . . . . . 24
®
Figure 18. SH – 4-pin SNAPHAT housing for 48 mAh battery & crystal package outline . . . . . . . . . 25
®
Figure 19. SH – 4-pin SNAPHAT housing for 120 mAh battery & crystal, package outline. . . . . . . . 26
Figure 20. Recycling symbols . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
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Doc ID 6103 Rev 10
M41T11
Description
1
Description
The M41T11 is a low-power serial real-time clock (RTC) with 56 bytes of NVRAM. A built-in
32.768 kHz oscillator (external crystal controlled) and the first 8 bytes of the RAM are used
for the clock/calendar function and are configured in binary-coded decimal (BCD) format.
Addresses and data are transferred serially via a two-line bidirectional bus. The built-in
address register is incremented automatically after each write or read data byte.
The M41T11 clock has a built-in power sense circuit which detects power failures and
automatically switches to the battery supply during power failures. The energy needed to
sustain the RAM and clock operations can be supplied from a small lithium coin cell.
Typical data retention time is in excess of 5 years with a 50 mA/h, 3 V lithium cell. The
®
M41T11 is supplied in an 8-lead plastic small outline package or 28-lead SNAPHAT
package.
The 28-pin, 330 mil SOIC provides sockets with gold plated contacts at both ends for direct
connection to a separate SNAPHAT housing containing the battery and crystal. The unique
design allows the SNAPHAT battery package to be mounted on top of the SOIC package
after the completion of the surface mount process. Insertion of the SNAPHAT housing after
reflow prevents potential battery and crystal damage due to the high temperatures required
for device surface-mounting. The SNAPHAT housing is keyed to prevent reverse insertion.
The SOIC and battery/crystal packages are shipped separately. For the 28-lead SOIC, the
battery/crystal package (i.e. SNAPHAT) part number is “M4Txx-BR12SH” (see Table 16 on
page 27).
Caution:
Do not place the SNAPHAT battery/crystal package “M4Txx-BR12SH” in conductive foam
since this will drain the lithium button-cell battery.
Figure 1.
Logic diagram
V
V
BAT
CC
OSCO
SDA
OSCI
SCL
M41T11
FT/OUT
V
SS
AI01000
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Description
M41T11
Table 1.
Signal names
OSCI
Oscillator input
OCSO
FT/OUT
SDA
Oscillator output
Frequency test/output driver (open drain)
Serial data address input/output
Serial clock
SCL
VBAT
Battery supply voltage
Supply voltage
VCC
VSS
Ground
Figure 2.
8-pin SOIC connections
M41T11
OSCI
1
8
V
CC
OSCO
2
3
4
7
6
FT/OUT
V
SCL
BAT
V
5
SDA
SS
AI01001
Figure 3.
28-pin SOIC connections
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
1
28
27
26
25
24
23
22
21
20
19
18
17
16
15
V
CC
NC
2
3
FT/OUT
NC
4
5
NC
6
NC
7
NC
M41T11
8
NC
9
SCL
NC
10
11
12
13
14
NC
NC
SDA
NC
V
SS
AI03606
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Doc ID 6103 Rev 10
M41T11
Description
Figure 4.
Block diagram
1 Hz
SECONDS
OSCI
OSCILLATOR
32.768 kHz
MINUTES
CENTURY/HOURS
DAY
DIVIDER
OSCO
FT/OUT
DATE
MONTH
VOLTAGE
SENSE
V
CC
YEAR
CONTROL
LOGIC
and
V
SS
CONTROL
SWITCH
CIRCUITRY
V
BAT
RAM
(56 x 8)
SCL
SDA
SERIAL
BUS
INTERFACE
ADDRESS
REGISTER
AI02566
Doc ID 6103 Rev 10
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Operation
M41T11
2
Operation
The M41T11 clock operates as a slave device on the serial bus. Access is obtained by
implementing a start condition followed by the correct slave address (D0h). The 64 bytes
contained in the device can then be accessed sequentially in the following order:
st
●
●
●
●
●
●
●
●
●
1 byte: seconds register
nd
2
3
byte: minutes register
rd
th
byte: century/hours register
4 byte: day register
th
5 byte: date register
th
6 byte: month register
th
7 byte: years register
th
8 byte: control register
th
th
9 - 64 bytes: RAM
The M41T11 clock continually monitors V for an out of tolerance condition. Should V
CC
CC
fall below V , the device terminates an access in progress and resets the device address
SO
counter. Inputs to the device will not be recognized at this time to prevent erroneous data
from being written to the device from an out of tolerance system. When V falls below V
,
CC
SO
the device automatically switches over to the battery and powers down into an ultra low
current mode of operation to conserve battery life. Upon power-up, the device switches from
battery to V at V and recognizes inputs.
CC
SO
2.1
2-wire bus characteristics
This bus is intended for communication between different ICs. It consists of two lines: one
bidirectional for data signals (SDA) and one for clock signals (SCL). Both the SDA and the
SCL lines must be connected to a positive supply voltage via a pull-up resistor.
The following protocol has been defined:
●
●
●
Data transfer may be initiated only when the bus is not busy.
During data transfer, the data line must remain stable whenever the clock line is high.
Changes in the data line while the clock line is high will be interpreted as control
signals.
Accordingly, the following bus conditions have been defined:
2.1.1
2.1.2
Bus not busy
Both data and clock lines remain high.
Start data transfer
A change in the state of the data line, from high to low, while the clock is high, defines the
START condition.
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M41T11
Operation
2.1.3
Stop data transfer
A change in the state of the data line, from low to high, while the clock is high, defines the
STOP condition.
2.1.4
Data valid
The state of the data line represents valid data when after a start condition, the data line is
stable for the duration of the high period of the clock signal. The data on the line may be
changed during the low period of the clock signal. There is one clock pulse per bit of data.
Each data transfer is initiated with a start condition and terminated with a stop condition.
The number of data bytes transferred between the start and stop conditions is not limited.
The information is transmitted byte-wide and each receiver acknowledges with a ninth bit.
By definition, a device that gives out a message is called “transmitter”, the receiving device
that gets the message is called “receiver”. The device that controls the message is called
“master”. The devices that are controlled by the master are called “slaves”.
2.1.5
Acknowledge
Each byte of eight bits is followed by one acknowledge bit. This acknowledge bit is a low
level put on the bus by the receiver, whereas the master generates an extra acknowledge
related clock pulse.
A slave receiver which is addressed is obliged to generate an acknowledge after the
reception of each byte. Also, a master receiver must generate an acknowledge after the
reception of each byte that has been clocked out of the slave transmitter.
The device that acknowledges has to pull down the SDA line during the acknowledge clock
pulse in such a way that the SDA line is a stable low during the high period of the
acknowledge related clock pulse. Of course, setup and hold times must be taken into
account. A master receiver must signal an end-of-data to the slave transmitter by not
generating an acknowledge on the last byte that has been clocked out of the slave. In this
case, the transmitter must leave the data line high to enable the master to generate the
STOP condition.
Figure 5.
Serial bus data transfer sequence
DATA LINE
STABLE
DATA VALID
CLOCK
DATA
START
CHANGE OF
STOP
CONDITION
DATA ALLOWED
CONDITION
AI00587
Doc ID 6103 Rev 10
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Operation
Figure 6.
M41T11
Acknowledgement sequence
CLOCK PULSE FOR
ACKNOWLEDGEMENT
START
SCLK FROM
MASTER
1
2
8
9
DATA OUTPUT
BY TRANSMITTER
MSB
LSB
DATA OUTPUT
BY RECEIVER
AI00601
Figure 7.
Bus timing requirements sequence
SDA
tBUF
tHD:STA
tR
tHD:STA
tF
SCL
tHIGH
tSU:DAT
tHD:DAT
tSU:STA
tSU:STO
P
S
tLOW
SR
P
AI00589
1. P = STOP and S = START
10/30
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M41T11
Operation
Table 2.
Symbol
AC characteristics
Parameter(1)
Min
Max
Unit
fSCL
tLOW
tHIGH
tR
SCL clock frequency
Clock low period
0
4.7
4
100
kHz
µs
Clock high period
µs
SDA and SCL rise time
SDA and SCL fall time
1
µs
tF
300
ns
START condition hold time
(after this period the first clock pulse is generated)
tHD:STA
tSU:STA
4
µs
µs
START condition setup time
(only relevant for a repeated start condition)
4.7
tSU:DAT Data setup time
250
0
ns
µs
µs
µs
(2)
tHD:DAT
Data hold time
tSU:STO STOP condition setup time
tBUF Time the bus must be free before a new transmission can start
4.7
4.7
1. Valid for ambient operating temperature: TA = –40 to 85°C; VCC = 2.0 to 5.5 V (except where noted).
2. Transmitter must internally provide a hold time to bridge the undefined region (300 ns max.) of the falling
edge of SCL.
2.2
Read mode
In this mode, the master reads the M41T11 slave after setting the slave address (see
Figure 8). Following the write mode control bit (R/W = 0) and the acknowledge bit, the word
address A is written to the on-chip address pointer. Next the START condition and slave
n
address are repeated, followed by the READ mode control bit (R/W = 1). At this point, the
master transmitter becomes the master receiver. The data byte which was addressed will be
transmitted and the master receiver will send an acknowledge bit to the slave transmitter
(see Figure 9). The address pointer is only incremented on reception of an acknowledge bit.
The M41T11 slave transmitter will now place the data byte at address A + 1 on the bus. The
n
master receiver reads and acknowledges the new byte and the address pointer is
incremented to A + 2.
n
This cycle of reading consecutive addresses will continue until the master receiver sends a
STOP condition to the slave transmitter.
An alternate READ mode may also be implemented, whereby the master reads the M41T11
slave without first writing to the (volatile) address pointer. The first address that is read is the
last one stored in the pointer (see Figure 10 on page 12).
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Operation
Figure 8.
M41T11
Slave address location
R/W
START
SLAVE ADDRESS
A
1
1
0
1
0
0
0
AI00602
Figure 9.
Read mode sequence
BUS ACTIVITY:
MASTER
WORD
ADDRESS (An)
SDA LINE
S
S
DATA n
DATA n+1
BUS ACTIVITY:
SLAVE
ADDRESS
SLAVE
ADDRESS
DATA n+X
P
AI00899
Figure 10. Alternate read mode sequence
BUS ACTIVITY:
MASTER
SDA LINE
S
DATA n
DATA n+1
DATA n+X
P
BUS ACTIVITY:
SLAVE
ADDRESS
AI00895
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M41T11
Operation
2.3
Write mode
In this mode the master transmitter transmits to the M41T11 slave receiver. Bus protocol is
shown in Figure 11. Following the START condition and slave address, a logic '0' (R/W = 0)
is placed on the bus and indicates to the addressed device that word address An will follow
and is to be written to the on-chip address pointer. The data word to be written to the
memory is strobed in next and the internal address pointer is incremented to the next
memory location within the RAM on the reception of an acknowledge clock. The M41T11
slave receiver will send an acknowledge clock to the master transmitter after it has received
the slave address and again after it has received the word address and each data byte.
2.4
Data retention mode
With valid V applied, the M41T11 can be accessed as described above with read or write
CC
cycles. Should the supply voltage decay, the M41T11 will automatically deselect, write
protecting itself when V falls (see Figure 15).
CC
Figure 11. Write mode sequence
BUS ACTIVITY:
MASTER
WORD
ADDRESS (An)
SDA LINE
S
DATA n
DATA n+1
DATA n+X
P
BUS ACTIVITY:
SLAVE
ADDRESS
AI00591
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Clock operation
M41T11
3
Clock operation
The eight byte clock register (see Table 3) is used to both set the clock and to read the date
and time from the clock, in a binary coded decimal format. Seconds, minutes, and hours are
contained within the first three registers. Bits D6 and D7 of clock register 2 (hours register)
contain the CENTURY ENABLE bit (CEB) and the CENTURY bit (CB). Setting CEB to a '1'
will cause CB to toggle, either from '0' to '1' or from '1' to '0' at the turn of the century
(depending upon its initial state). If CEB is set to a '0', CB will not toggle. Bits D0 through D2
of register 3 contain the day (day of week). Registers 4, 5 and 6 contain the date (day of
month), month and years. The final register is the control register (this is described in the
clock calibration section). Bit D7 of register 0 contains the STOP bit (ST). Setting this bit to a
'1' will cause the oscillator to stop. If the device is expected to spend a significant amount of
time on the shelf, the oscillator may be stopped to reduce current drain. When reset to a '0'
the oscillator restarts within one second.
Note:
In order to guarantee oscillator startup after the initial power-up, set the ST bit to a '1,' then
reset this bit to a '0.' This sequence enables a “kick start” circuit which aids the oscillator
startup during worst case conditions of voltage and temperature.
The seven clock registers may be read one byte at a time, or in a sequential block. The
control register (address location 7) may be accessed independently. Provision has been
made to assure that a clock update does not occur while any of the seven clock addresses
are being read. If a clock address is being read, an update of the clock registers will be
delayed by 250 ms to allow the read to be completed before the update occurs. This will
prevent a transition of data during the read.
Note:
This 250 ms delay affects only the clock register update and does not alter the actual clock
time.
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M41T11
Clock operation
(1)
Table 3.
Address
Register map
Data
D3
Function/range
BCD format
D7
D6
D5
D4
D2
D1
D0
0
ST
X
10 seconds
10 minutes
Seconds
Seconds
Minutes
00-59
00-59
1
Minutes
Hours
2
CEB(2) CB
10 hours
Century/hours 0-1/00-23
3
X
X
X
X
X
X
X
X
X
Day
Day
Date
01-07
01-31
01-12
00-99
4
10 date
Date
Month
5
X
10 M.
Month
Year
6
7
10 years
FT
Years
OUT
S
Calibration
Control
1. Keys:
S = SIGN bit
FT = FREQUENCY TEST bit
ST = STOP bit
OUT = Output level
X = Don’t care
CEB = Century enable bit
CB = Century bit
2. When CEB is set to '1', CB will toggle from '0' to '1' or from '1' to '0' every 100 years (dependent upon the
initial value set). When CEB is set to '0', CB will not toggle.When CEB is set to '1', CB will toggle from '0' to
'1' or from '1' to '0' every 100 years (dependent upon the initial value set). When CEB is set to '0', CB will
not toggle.
3.1
Clock calibration
The M41T11 is driven by a quartz controlled oscillator with a nominal frequency of
32,768 Hz. The devices are tested not to exceed 35 ppm (parts per million) oscillator
frequency error at 25°C, which equates to about 1.53 minutes per month. With the
calibration bits properly set, the accuracy of each M41T11 improves to better than 2 ppm
at 25°C.
The oscillation rate of any crystal changes with temperature (see Figure 12 on page 17).
Most clock chips compensate for crystal frequency and temperature shift error with
cumbersome trim capacitors. The M41T11 design, however, employs periodic counter
correction. The calibration circuit adds or subtracts counts from the oscillator divider circuit
at the divide by 256 stage, as shown in Figure 13 on page 17. The number of times pulses
are blanked (subtracted, negative calibration) or split (added, positive calibration) depends
upon the value loaded into the five-bit calibration byte found in the control register. Adding
counts speeds the clock up, subtracting counts slows the clock down.
The calibration byte occupies the five lower order bits (D4-D0) in the control register (addr
7). This byte can be set to represent any value between 0 and 31 in binary form. Bit D5 is a
sign bit; '1' indicates positive calibration, '0' indicates negative calibration. Calibration occurs
within a 64 minute cycle. The first 62 minutes in the cycle may, once per minute, have one
second either shortened by 128 or lengthened by 256 oscillator cycles. If a binary '1' is
loaded into the register, only the first 2 minutes in the 64 minute cycle will be modified; if a
binary 6 is loaded, the first 12 will be affected, and so on.
Therefore, each calibration step has the effect of adding 512 or subtracting 256 oscillator
cycles for every 125,829,120 actual oscillator cycles, that is +4.068 or –2.034 ppm of
Doc ID 6103 Rev 10
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Clock operation
M41T11
adjustment per calibration step in the calibration register. Assuming that the oscillator is in
fact running at exactly 32,768 Hz, each of the 31 increments in the calibration byte would
represent +10.7 or –5.35 seconds per month which corresponds to a total range of +5.5 or
–2.75 minutes per month.
Two methods are available for ascertaining how much calibration a given M41T11 may
require. The first involves simply setting the clock, letting it run for a month and comparing it
to a known accurate reference (like WWV broadcasts). While that may seem crude, it allows
the designer to give the end user the ability to calibrate his clock as his environment may
require, even after the final product is packaged in a non-user serviceable enclosure. All the
designer has to do is provide a simple utility that accessed the calibration byte.
The second approach is better suited to a manufacturing environment, and involves the use
of some test equipment. When the frequency test (FT) bit, the seventh-most significant bit in
the control register, is set to a '1', and the oscillator is running at 32,768 Hz, the FT/OUT pin
of the device will toggle at 512 Hz. Any deviation from 512 Hz indicates the degree and
direction of oscillator frequency shift at the test temperature.
For example, a reading of 512.01024 Hz would indicate a +20 ppm oscillator frequency
error, requiring a –10(XX001010) to be loaded into the calibration byte for correction. Note
that setting or changing the calibration byte does not affect the frequency test output
frequency.
3.2
3.3
Output driver pin
When the FT bit is not set, the FT/OUT pin becomes an output driver that reflects the
contents of D7 of the control register. In other words, when D6 of location 7 is a zero and D7
of location 7 is a zero and then the FT/OUT pin will be driven low.
Note: The FT/OUT pin is open drain which requires an external pull-up resistor.
Preferred initial power-on defaults
Upon initial application of power to the device, the FT bit will be set to a '0' and the OUT bit
will be set to a '1'. All other register bits will initially power on in a random state.
16/30
Doc ID 6103 Rev 10
M41T11
Clock operation
Figure 12. Crystal accuracy across temperature
Frequency (ppm)
20
0
–20
–40
–60
–80
ΔF
F
= K x (T –TO)2
–100
–120
–140
–160
K = –0.036 ppm/°C2 0.006 ppm/°C2
TO = 25°C 5°C
–40
–30
–20
–10
0
10
20
30
40
50
60
70
80
Temperature °C
AI00999b
Figure 13. Clock calibration
NORMAL
POSITIVE
CALIBRATION
NEGATIVE
CALIBRATION
AI00594B
Doc ID 6103 Rev 10
17/30
Maximum ratings
M41T11
4
Maximum ratings
Stressing the device above the rating listed in the absolute maximum ratings table may
cause permanent damage to the device. These are stress ratings only and operation of the
device at these or any other conditions above those indicated in the operating sections of
this specification is not implied. Exposure to absolute maximum rating conditions for
extended periods may affect device reliability.
Table 4.
Symbol
Absolute maximum ratings
Parameter
Value
Unit
TA
Ambient operating temperature
–40 to 85
–40 to 85
–55 to 125
260
°C
SNAPHAT®
SOIC
TSTG
Storage temperature (VCC off, oscillator off)
°C
(1)
TSLD
Lead solder temperature for 10 seconds
Input or output voltages
Supply voltage
°C
V
VIO
VCC
IO
–0.3 to 7
–0.3 to 7
20
V
Output current
mA
W
PD
Power dissipation
0.25
1. Lead-free (Pb-free) lead finish: reflow at peak temperature of 260°C (the time above 255°C must not
exceed 30 seconds).
Caution:
Negative undershoots below –0.3 V are not allowed on any pin while in the battery backup
mode.
®
Caution:
Do NOT wave solder SOIC to avoid damaging SNAPHAT sockets.
18/30
Doc ID 6103 Rev 10
M41T11
DC and AC parameters
5
DC and AC parameters
This section summarizes the operating and measurement conditions, as well as the DC and
AC characteristics of the device. The parameters in the following DC and AC characteristic
tables are derived from tests performed under the measurement conditions listed in Table 5:
Operating and AC measurement conditions. Designers should check that the operating
conditions in their projects match the measurement conditions when using the quoted
parameters.
(1)
Table 5.
Operating and AC measurement conditions
Parameter
M41T11
Unit
Supply voltage (VCC
)
2.0 to 5.5(2)
–40 to 85
V
°C
pF
ns
V
Ambient operating temperature (TA)
Load capacitance (CL)
100
Input rise and fall times
≤ 50
Input pulse voltages
0.2VCC to 0.8VCC
0.3VCC to 0.7VCC
Input and output timing ref. voltages
V
1. Output Hi-Z is defined as the point where data is no longer driven.
2. Supply voltage for SOH28 is 3.3 V to 5.5 V.
Figure 14. AC testing input/output waveform
0.8V
CC
0.7V
CC
0.3V
CC
0.2V
CC
AI02568
Doc ID 6103 Rev 10
19/30
DC and AC parameters
M41T11
Unit
Table 6.
Symbol
Capacitance
Parameter(1)(2)
Min
Max
CIN
Input capacitance (SCL)
7
pF
pF
ns
(3)
COUT
Output capacitance (SDA, FT/OUT)
Low-pass filter input time constant (SDA and SCL)
10
tLP
250
1000
1. Effective capacitance measured with power supply at 5 V; sampled only, not 100% tested.
2. At 25°C, f = 1 MHz.
3. Outputs deselected.
Table 7.
Symbol
DC characteristics
Parameter
Test Condition(1)
Min
Typ
Max
Unit
ILI
Input leakage current
Output leakage current
Supply current
0V ≤ VIN ≤ VCC
0V ≤ VOUT ≤ VCC
1
1
µA
µA
µA
µA
V
ILO
ICC1
ICC2
VIL
Switch frequency = 100 kHz
SCL, SDA = VCC – 0.3 V
300
70
Supply current (standby)
Input low voltage
–0.3
0.3VCC
VIH
VOL
Input high voltage
Output low voltage
0.7VCC
VCC + 0.5
0.4
V
V
IOL = 3 mA
FT/OUT
Pull-up supply voltage
(open drain)
5.5
3.5(4)
1
V
V
(2)
VBAT
Battery supply voltage
Battery supply current
2.5(3)
3
TA = 25°C, VCC = 0 V,
oscillator ON, VBAT = 3 V
IBAT
0.8
µA
1. Valid for ambient operating temperature: TA = –40 to 85°C; VCC = 2.0 to 5.5 V (except where noted).
2. STMicroelectronics recommends the RAYOVAC BR1225 or BR1632 (or equivalent) as the battery supply.
3. After switchover (VSO), VBAT(min) can be 2.0 V for crystal with RS = 40 KΩ.
4. For rechargeable back-up, VBAT(max) may be considered VCC
.
Table 8.
Symbol
Crystal electrical characteristics
Parameter(1)(2)(3)
Min
Typ
Max
Unit
f
Resonant frequency
Series resistance
Load capacitance
32.768
kHz
kΩ
pF
O
RS
CL
60(4)
12.5
1. These values are externally supplied if using the SO8 package. STMicroelectronics recommends the KDS
DT-38: 1TA/1TC252E127, Tuning Fork Type (thru-hole) or the DMX-26S: 1TJS125FH2A212, (SMD)
quartz crystal for industrial temperature operations. Please refer to the KDS website for further information
on this crystal type.
2. Load capacitors are integrated within the M41T11. Circuit board layout considerations for the 32.768 kHz
crystal of minimum trace lengths and isolation from RF generating signals should be taken into account.
®
3. All SNAPHAT battery:crystal tops meet these specifications.
4. ESR (max) = 110 kΩ for VCC or VBAT > 2.5 V.
20/30
Doc ID 6103 Rev 10
M41T11
DC and AC parameters
Figure 15. Power down/up mode AC waveforms
V
CC
V
SO
tPD
tREC
SDA
SCL
DON'T CARE
AI00596
Table 9.
Power down/up AC characteristics
Parameter(1)(2)
Symbol
Min
Max
Unit
tPD
SCL and SDA at VIH before power down
SCL and SDA at VIH after power up
0
ns
µs
tREC
10
1. Valid for ambient operating temperature: TA = –40 to 85°C; VCC = 2.0 to 5.5 V (except where noted).
2. VCC fall time should not exceed 5 mV/µs.
Table 10. Power down/up trip points DC characteristics
Symbol
Parameter(1)(2)
Min
Typ
Max(3)
Unit
(4)
VSO
Battery backup switchover voltage VBAT – 0.80 VBAT – 0.50 VBAT – 0.30
V
1. Valid for ambient operating temperature: TA = –40 to 85°C; VCC = 2.0 to 5.5 V (except where noted).
2. All voltages referenced to VSS
.
3. In 3.3 V application, if initial battery voltage is ≥ 3.4 V, it may be necessary to reduce battery voltage (i.e.,
through wave soldering the battery) in order to avoid inadvertent switchover/deselection for VCC – 10%
operation.
4. Switchover and deselect point.
Doc ID 6103 Rev 10
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Package mechanical data
M41T11
6
Package mechanical data
In order to meet environmental requirements, ST offers these devices in different grades of
®
®
ECOPACK packages, depending on their level of environmental compliance. ECOPACK
specifications, grade definitions and product status are available at: www.st.com.
®
ECOPACK is an ST trademark.
22/30
Doc ID 6103 Rev 10
M41T11
Package mechanical data
Figure 16. SO8 – 8-lead plastic small outline package outline
h x 45˚
c
A2
A
ccc
b
e
0.25 mm
D
GAUGE PLANE
k
8
1
E1
E
L
A1
L1
SO-A
1. Drawing is not to scale.
Table 11. SO8 – 8-lead plastic small outline (150 mils body width) package
mechanical data
millimeters
Min
inches
Min
Symbol
Typ
Max
Typ
Max
A
A1
A2
b
1.75
0.25
0.069
0.010
0.10
1.25
0.28
0.17
0.004
0.049
0.011
0.007
0.48
0.23
0.10
5.00
6.20
4.00
–
0.019
0.009
0.004
0.197
0.244
0.157
–
c
ccc
D
4.90
6.00
3.90
1.27
4.80
5.80
3.80
–
0.193
0.236
0.154
0.050
0.189
0.228
0.150
–
E
E1
e
h
0.25
0°
0.50
8°
0.010
0°
0.020
8°
k
L
0.40
1.27
0.016
0.050
L1
1.04
0.041
Doc ID 6103 Rev 10
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Package mechanical data
M41T11
®
Figure 17. SOH28 – 28-lead plastic small outline, battery SNAPHAT package
outline
A2
A
C
eB
B
e
CP
D
N
E
H
A1
α
L
1
SOH-A
1. Drawing is not to scale.
®
Table 12. SOH28 – 28-lead plastic small outline, battery SNAPHAT package
mechanical data
mm
Min
inches
Min
Symb
Typ
Max
Typ
Max
A
A1
A2
B
3.05
0.36
2.69
0.51
0.32
18.49
8.89
–
0.120
0.014
0.106
0.020
0.012
0.728
0.350
–
0.05
2.34
0.36
0.15
17.71
8.23
–
0.002
0.092
0.014
0.006
0.697
0.324
–
C
D
E
e
1.27
0.050
eB
H
3.20
11.51
0.41
0°
3.61
12.70
1.27
8°
0.126
0.453
0.016
0°
0.142
0.500
0.050
8°
L
α
N
28
28
CP
0.10
0.004
24/30
Doc ID 6103 Rev 10
M41T11
Package mechanical data
®
Figure 18. SH – 4-pin SNAPHAT housing for 48 mAh battery & crystal package
outline
A2
A1
A
A3
L
eA
D
B
eB
E
SHTK-A
1. Drawing is not to scale.
®
Table 13. SH – 4-pin SNAPHAT housing for 48 mAh battery & crystal, package
mechanical data
mm
Min
inches
Min
Symb
Typ
Max
Typ
Max
A
A1
A2
A3
B
9.78
7.24
6.99
0.38
0.56
21.84
14.99
15.95
3.61
2.29
0.385
0.285
0.275
0.015
0.022
0.860
0.590
0.628
0.142
0.090
6.73
6.48
0.265
0.255
0.46
21.21
14.22
15.55
3.20
0.018
0.835
0.560
0.612
0.126
0.080
D
E
eA
eB
L
2.03
Doc ID 6103 Rev 10
25/30
Package mechanical data
M41T11
®
Figure 19. SH – 4-pin SNAPHAT housing for 120 mAh battery & crystal, package
outline
A2
A1
A
A3
L
eA
D
B
eB
E
SHTK-B
1. Drawing is not to scale.
®
Table 14. SH – 4-pin SNAPHAT housing for 120 mAh battery & crystal, package
mech. data
mm
Min
inches
Min
Symb
Typ
Max
Typ
Max
A
A1
A2
A3
B
10.54
8.51
0.415
0.335
0.315
0.015
0.022
0.860
0.710
0.628
0.142
0.090
8.00
7.24
0.315
0.285
8.00
0.38
0.46
21.21
17.27
15.55
3.20
0.56
0.018
0.835
0.680
0.612
0.126
0.080
D
21.84
18.03
15.95
3.61
E
eA
eB
L
2.03
2.29
26/30
Doc ID 6103 Rev 10
M41T11
Part numbering
7
Part numbering
Table 15. Ordering information scheme
Example:
M41T
11
M
6
F
Device type
M41T
Supply voltage
11 = VCC = 2.0 to 5.5 V(1)
Package
M = SO8 (150 mil width)
MH(2) = SOH28
Temperature range
6 = –40 to 85°C
Shipping method
F = ECOPACK® package, tape & reel
1. SOH28 supply voltage is 3.3 V to 5.5 V.
2. The SOIC package (SOH28) requires the SNAPHAT® battery package which is ordered separately (see
Table 16).
Caution:
Do not place the SNAPHAT battery package “M4TXX-BR12SH” in conductive foam as it will
drain the lithium button-cell battery.
For other options, or for more information on any aspect of this device, please contact the
ST sales office nearest you.
®
Table 16. SNAPHAT battery table
Part Number
Description
Package
M4T28-BR12SH
M4T32-BR12SH
Lithium battery (48 mAh) SNAPHAT
Lithium battery (120 mAh) SNAPHAT
SH
SH
Doc ID 6103 Rev 10
27/30
Environmental information
M41T11
8
Environmental information
Figure 20. Recycling symbols
This product contains a non-rechargeable lithium (lithium carbon monofluoride chemistry)
button cell battery fully encapsulated in the final product.
Recycle or dispose of batteries in accordance with the battery manufacturer's instructions
and local/national disposal and recycling regulations.
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M41T11
Revision history
9
Revision history
Table 17. Revision history
Date
Revision
Changes
Added lead-free second level interconnect information to cover page and Section 6:
Package mechanical data; some text changes; updated Table 4.
03-Oct-2007
02-May-2008
08-Jan-2009
7
8
9
Updated Figure 16, Table 11, 15.
Updated Table 4, Section 6: Package mechanical data;
added Section 8: Environmental information.
Added ESR footnote to Table 8: Crystal electrical characteristics
Removed shipping method in tubes from Table 15: Ordering information scheme
Updated Section 8: Environmental information
11-Jun-2012
10
Minor textual updates
Doc ID 6103 Rev 10
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M41T11
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