M29W102BB70N6T [STMICROELECTRONICS]
1 Mbit 64Kb x16, Boot Block Low Voltage Single Supply Flash Memory; 1兆位64Kb的X16 ，引导块低电压单电源闪存
| 型号： | M29W102BB70N6T |
| 厂家： | 
ST |
| 描述： | 1 Mbit 64Kb x16, Boot Block Low Voltage Single Supply Flash Memory |
| 文件： | 总20页 (文件大小：155K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
M29W102BT
M29W102BB
1 Mbit (64Kb x16, Boot Block)
Low Voltage Single Supply Flash Memory
■ SINGLE 2.7 to 3.6V SUPPLY VOLTAGE for
PROGRAM, ERASE and READ OPERATIONS
■ ACCESS TIME: 50ns
■ PROGRAMMING TIME
– 10µs per Word typical
■ 5 MEMORY BLOCKS
– 1 Boot Block (Top or Bottom Location)
– 2 Parameter and 2 Main Blocks
■ PROGRAM/ERASE CONTROLLER
– Embedded Word Program algorithm
– Embedded Multi-Block/Chip Erase algorithm
– Status Register Polling and Toggle Bits
■ ERASE SUSPEND and RESUME MODES
TSOP40 (N)
10 x 14mm
Figure 1. Logic Diagram
– Read and Program another Block during
Erase Suspend
■ UNLOCK BYPASS PROGRAM COMMAND
V
CC
– Faster Production/Batch Programming
■ TEMPORARY BLOCK UNPROTECTION
MODE
16
16
■ LOW POWER CONSUMPTION
A0-A15
DQ0-DQ15
– Standby and Automatic Standby
W
E
■ 100,000 PROGRAM/ERASE CYCLES per
BLOCK
M29W102BT
M29W102BB
■ M28F102 COMPATIBLE
G
– Pin-out and Read Mode
RP
■ 20 YEARS DATA RETENTION
– Defectivity below 1 ppm/year
■ ELECTRONIC SIGNATURE
– Manufacturer Code: 0020h
V
SS
– Top Device Code M29W102BT: 0099h
– Bottom Device Code M29W102BB: 0098h
AI02785
March 2000
1/20
M29W102BT, M29W102BB
Figure 2. TSOP Connections
SUMMARY DESCRIPTION
The M29W102B is a 1 Mbit (64Kb x16) non-vola-
tile memory that can be read, erased and repro-
grammed. These operations can be performed
using a single low voltage (2.7 to 3.6V) supply. On
power-up the memory defaults to its Read mode
where it can be read in the same way as a ROM or
EPROM.
A9
A10
A11
A12
A13
A14
A15
NC
1
40
V
SS
A8
A7
A6
The memory is divided into blocks that can be
erased independently so it is possible to preserve
valid data while old data is erased. Each block can
be protected independently to prevent accidental
Program or Erase commands from modifying the
memory. Program and Erase commands are writ-
ten to the Command Interface of the memory. An
on-chip Program/Erase Controller simplifies the
process of programming or erasing the memory by
taking care of all of the special operations that are
required to update the memory contents. The end
of a program or erase operation can be detected
and any error conditions identified. The command
set required to control the memory is consistent
with JEDEC standards.
The blocks in the memory are asymmetrically ar-
ranged, see Tables 3 and 4, Block Addresses. The
first or last 32 Kwords have been divided into four
additional blocks. The 8 Kword Boot Block can be
used for small initialization code to start the micro-
processor, the two 4 Kword Parameter Blocks can
be used for parameter storage and the remaining
16 Kwords are a small Main Block where the appli-
cation may be stored.
A5
A4
A3
A2
W
A1
V
10
11
31
30
A0
M29W102BT
M29W102BB
CC
RP
G
E
DQ15
DQ14
DQ13
DQ12
DQ11
DQ10
DQ9
DQ0
DQ1
DQ2
DQ3
DQ4
DQ5
DQ6
DQ7
DQ8
20
21
V
SS
AI02786
Chip Enable, Output Enable and Write Enable sig-
nals control the bus operation of the memory.
They allow simple connection to most micropro-
cessors, often without additional logic.
The memory is offered in a TSOP40 (10 x 14mm)
package and it is supplied with all the bits erased
(set to ’1’).
Table 1. Signal Names
A0-A15
Address Inputs
Data Inputs/Outputs
DQ0-DQ15
E
Chip Enable
Output Enable
Write Enable
G
W
RP
Reset/Block Temporary Unprotect
Supply Voltage
V
CC
V
SS
Ground
NC
Not Connected Internally
2/20
M29W102BT, M29W102BB
(1)
Table 2. Absolute Maximum Ratings
Symbol
Parameter
Value
Unit
°C
Ambient Operating Temperature (Temperature Range Option 1)
Ambient Operating Temperature (Temperature Range Option 6)
Temperature Under Bias
0 to 70
T
A
–40 to 85
–50 to 125
–65 to 150
°C
T
°C
BIAS
T
Storage Temperature
°C
STG
(2)
Input or Output Voltage
Supply Voltage
–0.6 to 4
–0.6 to 4
V
V
V
V
IO
V
CC
V
Identification Voltage
–0.6 to 13.5
ID
Note: 1. Except for the rating "Operating Temperature Range", stresses above those listed in the Table "Absolute Maximum Ratings" may
cause permanent damage to the device. These are stress ratings only and operation of the device at these or any other conditions
above those indicated in the Operating sections of this specification is not implied. Exposure to Absolute Maximum Rating condi-
tions for extended periods may affect device reliability. Refer also to the STMicroelectronics SURE Program and other relevant qual-
ity documents.
2. Minimum Voltage may undershoot to –2V during transition and for less than 20ns during transitions.
Table 3. Top Boot Block Addresses
M29W102BT
Table 4. Bottom Boot Block Addresses
M29W102BB
Size
(KWords)
Size
(KWords)
#
Address Range
#
Address Range
4
3
2
1
0
8
4
E000h-FFFFh
D000h-DFFFh
C000h-CFFFh
8000h-BFFFh
0000h-7FFFh
4
3
2
1
0
32
16
4
8000h-FFFFh
4000h-7FFFh
3000h-3FFFh
2000h-2FFFh
0000h-1FFFh
4
16
32
4
8
3/20
M29W102BT, M29W102BB
SIGNAL DESCRIPTIONS
See Figure 1, Logic Diagram, and Table 1, Signal
Names, for a brief overview of the signals connect-
ed to this device.
Address Inputs (A0-A15). The Address Inputs
select the cells in the memory array to access dur-
ing Bus Read operations. During Bus Write opera-
tions they control the commands sent to the
Command Interface of the internal state machine.
Data Inputs/Outputs (DQ0-DQ15). The Data In-
puts/Outputs output the data stored at the selected
address during a Bus Read operation. During Bus
Write operations DQ0-DQ7 represent the com-
mands sent to the Command Interface of the inter-
nal state machine; the Command Interface does
not use DQ8-DQ15 to decode the commands.
t
. After Reset/Block Temporary Unprotect
PLPX
goes High, V , the memory will be ready for Bus
Read and Bus Write operations after t
or t
Figure 10, Reset/Temporary Unprotect AC Char-
acteristics for more details.
Holding RP at V will temporarily unprotect the
protected blocks in the memory. Program and
Erase operations on all blocks will be possible.
The transition from V to V must be slower than
IH
PHEL
, whichever occurs last. See Table 15 and
PLYH
ID
IH
ID
t
.
PHPHH
Reset/Block Temporary Unprotect can be left un-
connected. A weak internal pull-up resistor en-
sures that the memory always operates correctly.
V
Supply Voltage. The V
Supply Voltage
CC
CC
supplies the power for all operations (Read, Pro-
gram, Erase etc.).
Chip Enable (E). The Chip Enable, E, activates
the memory, allowing Bus Read and Bus Write op-
erations to be performed. When Chip Enable is
The Command Interface is disabled when the V
Supply Voltage is less than the Lockout Voltage,
V . This prevents Bus Write operations from ac-
LKO
CC
High, V , all other pins are ignored.
IH
cidentally damaging the data during power-up,
power-down and power surges. If the Program/
Erase Controller is programming or erasing during
this time then the operation aborts and the memo-
ry contents being altered will be invalid.
Output Enable (G). The Output Enable, G, con-
trols the Bus Read operation of the memory.
Write Enable (W). The Write Enable, W, controls
the Bus Write operation of the memory’s Com-
mand Interface.
Reset/Block Temporary Unprotect (RP). The Re-
set/Block Temporary Unprotect pin can be used to
apply a Hardware Reset to the memory or to tem-
porarily unprotect all blocks that have been pro-
tected.
A 0.1µF capacitor should be connected between
the V
Supply Voltage pin and the V Ground
CC
SS
pin to decouple the current surges from the power
supply. The PCB track widths must be sufficient to
carry the currents required during program and
erase operations, I
.
CC3
A Hardware Reset is achieved by holding Reset/
V
Ground. The V Ground is the reference for
SS
SS
Block Temporary Unprotect Low, V , for at least
IL
all voltage measurements.
4/20
M29W102BT, M29W102BB
BUS OPERATIONS
ance state. To reduce the Supply Current to the
Standby Supply Current, I
, Chip Enable should
CC2
There are five standard bus operations that control
the device. These are Bus Read, Bus Write, Out-
put Disable, Standby and Automatic Standby. See
Table 5, Bus Operations, for a summary. Typically
glitches of less than 5ns on Chip Enable or Write
Enable are ignored by the memory and do not af-
fect bus operations.
be held within V ± 0.2V. For the Standby current
CC
level see Table 11, DC Characteristics.
During program or erase operations the memory
will continue to use the Program/Erase Supply
Current, I
, for Program or Erase operations un-
CC3
til the operation completes.
Bus Read. Bus Read operations read from the
memory cells, or specific registers in the Com-
mand Interface. A valid Bus Read operation in-
volves setting the desired address on the Address
Automatic Standby. If CMOS levels (V ± 0.2V)
CC
are used to drive the bus and the bus is inactive for
150ns or more the memory enters Automatic
Standby where the internal Supply Current is re-
Inputs, applying a Low signal, V , to Chip Enable
duced to the Standby Supply Current, I
. The
IL
CC2
and Output Enable and keeping Write Enable
Data Inputs/Outputs will still output data if a Bus
Read operation is in progress.
High, V . The Data Inputs/Outputs will output the
IH
value, see Figure 7, Read Mode AC Waveforms,
and Table 12, Read AC Characteristics, for details
of when the output becomes valid.
Special Bus Operations
Additional bus operations can be performed to
read the Electronic Signature and also to apply
and remove Block Protection. These bus opera-
tions are intended for use by programming equip-
ment and are not usually used in applications.
Bus Write. Bus Write operations write to the
Command Interface. A valid Bus Write operation
begins by setting the desired address on the Ad-
dress Inputs. The Address Inputs are latched by
the Command Interface on the falling edge of Chip
Enable or Write Enable, whichever occurs last.
The Data Inputs/Outputs are latched by the Com-
mand Interface on the rising edge of Chip Enable
or Write Enable, whichever occurs first. Output En-
They require V to be applied to some pins.
ID
Electronic Signature. The memory has two
codes, the manufacturer code and the device
code, that can be read to identify the memory.
These codes can be read by applying the signals
listed in Table 5, Bus Operations.
Block Protection and Blocks Unprotection. Each
block can be separately protected against acci-
dental Program or Erase. Protected blocks can be
unprotected to allow data to be changed.
able must remain High, V , during the whole Bus
IH
Write operation. See Figures 8 and 9, Write AC
Waveforms, and Tables 13 and 14, Write AC
Characteristics, for details of the timing require-
ments.
There are two methods available for protecting
and unprotecting the blocks, one for use on pro-
gramming equipment and the other for in-system
use. For further information refer to Application
Note AN1122, Applying Protection and Unprotec-
tion to M29 Series Flash.
Output Disable. The Data Inputs/Outputs are in
the high impedance state when Output Enable is
High, V .
IH
Standby. When Chip Enable is High, V , the
IH
memory enters Standby mode and the Data In-
puts/Outputs pins are placed in the high-imped-
Table 5. Bus Operations
Data
Address Inputs
Operation
Bus Read
E
G
W
Inputs/Outputs
V
IL
V
V
IH
Cell Address
Data Output
Data Input
Hi-Z
IL
IH
IH
V
V
V
V
V
Bus Write
Command Address
IL
IL
X
Output Disable
Standby
X
IH
V
X
X
X
Hi-Z
IH
A0 = V , A1 = V , A9 = V ,
Read Manufacturer
Code
IL
IL
ID
V
V
V
V
0020h
IL
IL
IL
IL
IH
IH
Others V or V
IL
IH
A0 = V , A1 = V , A9 = V ,
0099h (M29W102BT)
0098h (M29W102BB)
IH
IL
ID
V
V
Read Device Code
Others V or V
IL
IH
Note: X = V or V
.
IH
IL
5/20
M29W102BT, M29W102BB
COMMAND INTERFACE
All Bus Write operations to the memory are inter-
preted by the Command Interface. Commands
consist of one or more sequential Bus Write oper-
ations. Failure to observe a valid sequence of Bus
Write operations will result in the memory return-
ing to Read mode. The long command sequences
are imposed to maximize data security.
state machine and starts the Program/Erase Con-
troller.
If the address falls in a protected block then the
Program command is ignored, the data remains
unchanged. The Status Register is never read and
no error condition is given.
During the program operation the memory will ig-
nore all commands. It is not possible to issue any
command to abort or pause the operation. Typical
program times are given in Table 7. Bus Read op-
erations during the program operation will output
the Status Register on the Data Inputs/Outputs.
See the section on the Status Register for more
details.
After the program operation has completed the
memory will return to the Read mode, unless an
error has occurred. When an error occurs the
memory will continue to output the Status Regis-
ter. A Read/Reset command must be issued to re-
set the error condition and return to Read mode.
The commands are summarized in Table 6, Com-
mands. Refer to Table 6 in conjunction with the
text descriptions below.
Read/Reset Command. The Read/Reset com-
mand returns the memory to its Read mode where
it behaves like a ROM or EPROM. It also resets
the errors in the Status Register. Either one or
three Bus Write operations can be used to issue
the Read/Reset command.
If the Read/Reset command is issued during a
Block Erase operation or following a Programming
or Erase error then the memory will take upto 10µs
to abort. During the abort period no valid data can
be read from the memory. Issuing a Read/Reset
command during a Block Erase operation will
leave invalid data in the memory.
Note that the Program command cannot change a
bit set at ’0’ back to ’1’. One of the Erase Com-
mands must be used to set all the bits in a block or
in the whole memory from ’0’ to ’1’.
Auto Select Command. The Auto Select com-
mand is used to read the Manufacturer Code, the
Device Code and the Block Protection Status.
Three consecutive Bus Write operations are re-
quired to issue the Auto Select command. Once
the Auto Select command is issued the memory
remains in Auto Select mode until another com-
mand is issued.
Unlock Bypass Command. The Unlock Bypass
command is used in conjunction with the Unlock
Bypass Program command to program the memo-
ry. When the access time to the device is long (as
with some EPROM programmers) considerable
time saving can be made by using these com-
mands. Three Bus Write operations are required
to issue the Unlock Bypass command.
From the Auto Select mode the Manufacturer
Code can be read using a Bus Read operation
Once the Unlock Bypass command has been is-
sued the memory will only accept the Unlock By-
pass Program command and the Unlock Bypass
Reset command. The memory can be read as if in
Read mode.
with A0 = V and A1 = V . The other address bits
IL
IL
may be set to either V or V . The Manufacturer
IL
IH
Code for STMicroelectronics is 0020h.
The Device Code can be read using a Bus Read
Unlock Bypass Program Command. The Un-
lock Bypass Program command can be used to
program one address in memory at a time. The
command requires two Bus Write operations, the
final write operation latches the address and data
in the internal state machine and starts the Pro-
gram/Erase Controller.
operation with A0 = V and A1 = V . The other
IH
IL
address bits may be set to either V or V . The
IL
IH
Device Code for the M29W102BT is 0099h and
the M29W102BB is 0098h.
The Block Protection Status of each block can be
read using a Bus Read operation with A0 = V ,
IL
A1 = V , and A12-A15 specifying the address of
the block. The other address bits may be set to ei-
The Program operation using the Unlock Bypass
Program command behaves identically to the Pro-
gram operation using the Program command. A
protected block cannot be programmed; the oper-
ation cannot be aborted and the Status Register is
read. Errors must be reset using the Read/Reset
command, which leaves the device in Unlock By-
pass Mode. See the Program command for details
on the behavior.
IH
ther V or V . If the addressed block is protected
IL
IH
then 01h is output on Data Inputs/Outputs
DQ0-DQ7, otherwise 00h is output.
Program Command. The Program command
can be used to program a value to one address in
the memory array at a time. The command re-
quires four Bus Write operations, the final write op-
eration latches the address and data in the internal
6/20
M29W102BT, M29W102BB
Table 6. Commands
Command
Bus Write Operations
3rd 4th
Addr Data Addr Data Addr Data Addr Data Addr Data Addr Data
1st
2nd
5th
6th
1
3
3
4
3
X
F0
AA
AA
AA
AA
Read/Reset
555
555
555
555
2AA
2AA
2AA
2AA
55
55
55
55
X
F0
90
A0
20
Auto Select
Program
555
555
555
PA
PD
Unlock Bypass
Unlock Bypass
Program
2
X
A0
PA
PD
Unlock Bypass Reset
Chip Erase
2
6
X
90
AA
AA
B0
30
X
00
55
55
555
2AA
2AA
555
555
80
80
555
555
AA
AA
2AA
2AA
55
55
555
BA
10
30
Block Erase
6+ 555
Erase Suspend
Erase Resume
1
1
X
X
Note: X Don’t Care, PA Program Address, PD Program Data, BA Any address in the Block.
All values in the table are in hexadecimal.
The Command Interface only uses address bits A0-A10 and DQ0-DQ7 to verify the commands, the upper address bits and the upper data
bits are Don’t Care.
Read/Reset. After a Read/Reset command, read the memory as normal until another command is issued.
Auto Select. After an Auto Select command, read Manufacturer ID, Device ID or Block Protection Status.
Program, Unlock Bypass Program, Chip Erase, Block Erase. After these commands read the Status Register until the Program/Erase
Controller completes and the memory returns to Read Mode. Add additional Blocks during Block Erase Command with additional Bus Write
Operations until the Timeout Bit is set.
Unlock Bypass. After the Unlock Bypass command issue Unlock Bypass Program or Unlock Bypass Reset commands.
Unlock Bypass Reset. After the Unlock Bypass Reset command read the memory as normal until another command is issued.
Erase Suspend. After the Erase Suspend command read non-erasing memory blocks as normal, issue Auto Select and Program commands
on non-erasing blocks as normal.
Erase Resume. After the Erase Resume command the suspended Erase operation resumes, read the Status Register until the Program/
Erase Controller completes and the memory returns to Read Mode.
Unlock Bypass Reset Command. The Unlock
Bypass Reset command can be used to return to
Read/Reset mode from Unlock Bypass Mode.
Two Bus Write operations are required to issue the
Unlock Bypass Reset command.
Chip Erase Command. The Chip Erase com-
mand can be used to erase the entire chip. Six Bus
Write operations are required to issue the Chip
Erase Command and start the Program/Erase
Controller.
If any blocks are protected then these are ignored
and all the other blocks are erased. If all of the
blocks are protected the Chip Erase operation ap-
pears to start but will terminate within about 100µs,
leaving the data unchanged. No error condition is
given when protected blocks are ignored.
During the erase operation the memory will ignore
all commands. It is not possible to issue any com-
mand to abort the operation. Typical chip erase
times are given in Table 7. All Bus Read opera-
tions during the Chip Erase operation will output
the Status Register on the Data Inputs/Outputs.
See the section on the Status Register for more
details.
After the Chip Erase operation has completed the
memory will return to the Read Mode, unless an
error has occurred. When an error occurs the
memory will continue to output the Status Regis-
ter. A Read/Reset command must be issued to re-
set the error condition and return to Read Mode.
The Chip Erase Command sets all of the bits in un-
protected blocks of the memory to ’1’. All previous
data is lost.
7/20
M29W102BT, M29W102BB
Block Erase Command. The Block Erase com-
mand can be used to erase a list of one or more
blocks. Six Bus Write operations are required to
select the first block in the list. Each additional
block in the list can be selected by repeating the
sixth Bus Write operation using the address of the
additional block. The Block Erase operation starts
the Program/Erase Controller about 50µs after the
last Bus Write operation. Once the Program/Erase
Controller starts it is not possible to select any
more blocks. Each additional block must therefore
be selected within 50µs of the last block. The 50µs
timer restarts when an additional block is selected.
The Status Register can be read after the sixth
Bus Write operation. See the Status Register for
details on how to identify if the Program/Erase
Controller has started the Block Erase operation.
If any selected blocks are protected then these are
ignored and all the other selected blocks are
erased. If all of the selected blocks are protected
the Block Erase operation appears to start but will
terminate within about 100µs, leaving the data un-
changed. No error condition is given when protect-
ed blocks are ignored.
During the Block Erase operation the memory will
ignore all commands except the Erase Suspend
and Read/Reset commands. Typical block erase
times are given in Table 7. All Bus Read opera-
tions during the Block Erase operation will output
the Status Register on the Data Inputs/Outputs.
See the section on the Status Register for more
details.
After the Block Erase operation has completed the
memory will return to the Read Mode, unless an
error has occurred. When an error occurs the
memory will continue to output the Status Regis-
ter. A Read/Reset command must be issued to re-
set the error condition and return to Read mode.
The Block Erase Command sets all of the bits in
the unprotected selected blocks to ’1’. All previous
data in the selected blocks is lost.
Erase Suspend Command. The Erase Suspend
Command may be used to temporarily suspend a
Block Erase operation and return the memory to
Read mode. The command requires one Bus
Write operation.
The Program/Erase Controller will suspend within
15µs of the Erase Suspend Command being is-
sued. Once the Program/Erase Controller has
stopped the memory will be set to Read mode and
the Erase will be suspended. If the Erase Suspend
command is issued during the period when the
memory is waiting for an additional block (before
the Program/Erase Controller starts) then the
Erase is suspended immediately and will start im-
mediately when the Erase Resume Command is
issued. It will not be possible to select any further
blocks for erasure after the Erase Resume.
During Erase Suspend it is possible to Read and
Program cells in blocks that are not being erased;
both Read and Program operations behave as
normal on these blocks. Reading from blocks that
are being erased will output the Status Register. It
is also possible to enter the Auto Select mode: the
memory will behave as in the Auto Select mode on
all blocks until a Read/Reset command returns the
memory to Erase Suspend mode.
Erase Resume Command. The Erase Resume
command must be used to restart the Program/
Erase Controller from Erase Suspend. An erase
can be suspended and resumed more than once.
Table 7. Program, Erase Times and Program, Erase Endurance Cycles
(T = 0 to 70°C or –40 to 85°C)
A
Typical after
(1)
Parameter
Min
Max
Unit
Typ
(1)
100k W/E Cycles
Chip Erase (All bits in the memory set to ‘0’)
Chip Erase
0.7
0.7
1.5
0.8
10
sec
sec
1.5
0.8
10
9
6
Block Erase (32 Kwords)
Program
sec
200
4
µs
Chip Program
0.7
0.7
sec
Program/Erase Cycles (per Block)
100,000
cycles
Note: 1. T = 25°C, V = 3.3V.
A
CC
8/20
M29W102BT, M29W102BB
STATUS REGISTER
Toggle Bit (DQ6). The Toggle Bit can be used to
identify whether the Program/Erase Controller has
successfully completed its operation or if it has re-
sponded to an Erase Suspend. The Toggle Bit is
output on DQ6 when the Status Register is read.
During Program and Erase operations the Toggle
Bit changes from ’0’ to ’1’ to ’0’, etc., with succes-
sive Bus Read operations at any address. After
successful completion of the operation the memo-
ry returns to Read mode.
During Erase Suspend mode the Toggle Bit will
output when addressing a cell within a block being
erased. The Toggle Bit will stop toggling when the
Program/Erase Controller has suspended the
Erase operation.
Figure 4, Data Toggle Flowchart, gives an exam-
ple of how to use the Data Toggle Bit.
Error Bit (DQ5). The Error Bit can be used to
identify errors detected by the Program/Erase
Controller. The Error Bit is set to ’1’ when a Pro-
gram, Block Erase or Chip Erase operation fails to
write the correct data to the memory. If the Error
Bit is set a Read/Reset command must be issued
before other commands are issued. The Error bit
is output on DQ5 when the Status Register is read.
Bus Read operations from any address always
read the Status Register during Program and
Erase operations. It is also read during Erase Sus-
pend when an address within a block being erased
is accessed.
The bits in the Status Register are summarized in
Table 8, Status Register Bits.
Data Polling Bit (DQ7). The Data Polling Bit can
be used to identify whether the Program/Erase
Controller has successfully completed its opera-
tion or if it has responded to an Erase Suspend.
The Data Polling Bit is output on DQ7 when the
Status Register is read.
During Program operations the Data Polling Bit
outputs the complement of the bit being pro-
grammed to DQ7. After successful completion of
the Program operation the memory returns to
Read mode and Bus Read operations from the ad-
dress just programmed output DQ7, not its com-
plement.
During Erase operations the Data Polling Bit out-
puts ’0’, the complement of the erased state of
DQ7. After successful completion of the Erase op-
eration the memory returns to Read Mode.
Note that the Program command cannot change a
bit set at ’0’ back to ’1’ and attempting to do so may
or may not set DQ5 at ’1’. In both cases, a succes-
sive Bus Read operation will show the bit is still ’0’.
One of the Erase commands must be used to set
all the bits in a block or in the whole memory from
’0’ to ’1’.
In Erase Suspend mode the Data Polling Bit will
output a ’1’ during a Bus Read operation within a
block being erased. The Data Polling Bit will
change from a ’0’ to a ’1’ when the Program/Erase
Controller has suspended the Erase operation.
Figure 3, Data Polling Flowchart, gives an exam-
ple of how to use the Data Polling Bit. A Valid Ad-
dress is the address being programmed or an
address within the block being erased.
Table 8. Status Register Bits
Operation
Address
Any Address
DQ7
DQ7
DQ7
DQ7
0
DQ6
Toggle
Toggle
Toggle
Toggle
Toggle
Toggle
Toggle
Toggle
No Toggle
DQ5
0
DQ3
–
DQ2
–
Program
Program During Erase Suspend
Program Error
Any Address
0
–
–
Any Address
1
–
–
Chip Erase
Any Address
0
1
Toggle
Toggle
No Toggle
Toggle
No Toggle
Toggle
Erasing Block
0
0
0
Block Erase before timeout
Block Erase
Non-Erasing Block
Erasing Block
0
0
0
0
0
1
Non-Erasing Block
Erasing Block
0
0
1
1
0
–
Erase Suspend
Erase Error
Non-Erasing Block
Good Block Address
Faulty Block Address
Data read as normal
0
0
Toggle
Toggle
1
1
1
No Toggle
Toggle
1
Note: Unspecified data bits should be ignored.
9/20
M29W102BT, M29W102BB
Figure 3. Data Polling Flowchart
Figure 4. Data Toggle Flowchart
START
START
READ
DQ5 & DQ6
READ DQ5 & DQ7
at VALID ADDRESS
READ DQ6
DQ7
=
DATA
YES
DQ6
NO
=
NO
TOGGLE
YES
NO
DQ5
= 1
NO
DQ5
= 1
YES
YES
READ DQ7
at VALID ADDRESS
READ DQ6
TWICE
DQ7
=
DATA
YES
DQ6
=
NO
TOGGLE
NO
FAIL
YES
FAIL
PASS
PASS
AI01370B
AI03598
Erase Timer Bit (DQ3). The Erase Timer Bit can
be used to identify the start of Program/Erase
Controller operation during a Block Erase com-
mand. Once the Program/Erase Controller starts
erasing the Erase Timer Bit is set to ’1’. Before the
Program/Erase Controller starts the Erase Timer
Bit is set to ’0’ and additional blocks to be erased
may be written to the Command Interface. The
Erase Timer Bit is output on DQ3 when the Status
Register is read.
Alternative Toggle Bit (DQ2). The Alternative
Toggle Bit can be used to monitor the Program/
Erase controller during Erase operations. The Al-
ternative Toggle Bit is output on DQ2 when the
Status Register is read.
within the blocks being erased. Once the operation
completes the memory returns to Read mode.
During Erase Suspend the Alternative Toggle Bit
changes from ’0’ to ’1’ to ’0’, etc. with successive
Bus Read operations from addresses within the
blocks being erased. Bus Read operations to ad-
dresses within blocks not being erased will output
the memory cell data as if in Read mode.
After an Erase operation that causes the Error Bit
to be set the Alternative Toggle Bit can be used to
identify which block or blocks have caused the er-
ror. The Alternative Toggle Bit changes from ’0’ to
’1’ to ’0’, etc. with successive Bus Read Opera-
tions from addresses within blocks that have not
erased correctly. The Alternative Toggle Bit does
not change if the addressed block has erased cor-
rectly.
During Chip Erase and Block Erase operations the
Toggle Bit changes from ’0’ to ’1’ to ’0’, etc., with
successive Bus Read operations from addresses
10/20
M29W102BT, M29W102BB
Table 9. AC Measurement Conditions
Parameter
M29W102B
50
3.0 to 3.6V
30pF
70 / 90
2.7 to 3.6V
30pF
V
CC
Supply Voltage
Load Capacitance (C )
L
Input Rise and Fall Times
≤ 10ns
0 to 3V
1.5V
≤ 10ns
0 to 3V
1.5V
Input Pulse Voltages
Input and Output Timing Ref. Voltages
Figure 5. AC Testing Input Output Waveform
Figure 6. AC Testing Load Circuit
0.8V
3V
1N914
1.5V
0V
3.3kΩ
AI01417
DEVICE
UNDER
TEST
OUT
C
= 30pF
L
C
includes JIG capacitance
AI02978
L
Table 10. Capacitance
(T = 25 °C, f = 1 MHz)
A
Symbol
Parameter
Input Capacitance
Output Capacitance
Test Condition
Min
Max
6
Unit
pF
C
V
= 0V
= 0V
IN
IN
C
OUT
V
OUT
12
pF
Note: Sampled only, not 100% tested.
11/20
M29W102BT, M29W102BB
Table 11. DC Characteristics
(T = 0 to 70°C or –40 to 85°C)
A
(3)
Symbol
Parameter
Test Condition
Min
Max
Unit
Typ
(1)
0V ≤ V ≤ V
Input Leakage Current
RP Leakage Current High
RP Leakage Current Low
Output Leakage Current
±1
±1
µA
µA
µA
µA
I
IN
CC
LI
I
RP = V
RP = V
LR1
CC
SS
I
–0.2
–10
±1
LR2
I
0V ≤ V
≤ V
OUT CC
LO
E = V , G = V
,
IL
IH
I
Supply Current (Read)
4
10
100
20
mA
µA
CC1
f = 6MHz
I
E = V ± 0.2V
Supply Current (Standby)
Supply Current (Program/Erase)
30
CC2
CC
Program/Erase
Controller active
(2)
mA
I
CC3
V
Input Low Voltage
Input High Voltage
Output Low Voltage
Output High Voltage
Identification Voltage
Identification Current
–0.5
0.8
V
V
IL
V
V
0.7V
V
+ 0.3
CC
IH
CC
I
= 1.8mA
0.45
V
OL
OH
OL
V
I
= –100µA
V
– 0.4
V
OH
CC
V
ID
11.5
12.5
100
V
I
A9 = V
µA
ID
ID
Program/Erase Lockout Supply
Voltage
(2)
1.8
2.3
V
V
LKO
Note: 1. Excluding the RP input.
2. Sampled only, not 100% tested.
3. T = 25°C, V = 3.3V
A
CC
12/20
M29W102BT, M29W102BB
Table 12. Read AC Characteristics
(T = 0 to 70°C or –40 to 85°C)
A
M29W102B
Unit
Symbol
Alt
Parameter
Test Condition
50
70
90
E = V ,
IL
t
t
Address Valid to Next Address Valid
Address Valid to Output Valid
Min
50
70
90
ns
ns
AVAV
RC
G = V
IL
E = V ,
IL
t
t
ACC
Max
50
70
90
AVQV
G = V
IL
IL
IL
Chip Enable Low to Output
Transition
(1)
t
G = V
Min
Max
Min
0
50
0
0
70
0
0
90
0
ns
ns
ns
t
LZ
ELQX
t
G = V
E = V
Chip Enable Low to Output Valid
t
CE
ELQV
Output Enable Low to Output
Transition
(1)
t
t
OLZ
IL
IL
GLQX
t
t
E = V
Output Enable Low to Output Valid
Chip Enable High to Output Hi-Z
Output Enable High to Output Hi-Z
Max
Max
Max
25
20
20
30
25
25
35
30
30
ns
ns
ns
GLQV
OE
(1)
(1)
t
G = V
t
t
HZ
DF
IL
IL
EHQZ
t
E = V
GHQZ
t
Chip Enable, Output Enable or
Address Transition to Output
Transition
EHQX
t
t
OH
Min
0
0
0
ns
GHQX
t
AXQX
Note: 1. Sampled only, not 100% tested.
Figure 7. Read Mode AC Waveforms
tAVAV
VALID
A0-A15
tAVQV
tAXQX
E
tELQV
tELQX
tEHQX
tEHQZ
G
tGLQX
tGLQV
tGHQX
tGHQZ
VALID
DQ0-DQ15
AI02980
13/20
M29W102BT, M29W102BB
Table 13. Write AC Characteristics, Write Enable Controlled
(T = 0 to 70°C or –40 to 85°C)
A
M29W102B
Symbol
Alt
Parameter
Unit
50
50
0
70
70
0
90
90
0
t
t
WC
Address Valid to Next Address Valid
Chip Enable Low to Write Enable Low
Write Enable Low to Write Enable High
Input Valid to Write Enable High
Min
Min
Min
Min
Min
Min
Min
Min
Min
Min
Min
Min
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
µs
AVAV
t
t
CS
ELWL
t
t
40
25
0
45
30
0
45
45
0
WLWH
WP
t
t
DVWH
DS
DH
CH
t
t
t
Write Enable High to Input Transition
Write Enable High to Chip Enable High
Write Enable High to Write Enable Low
Address Valid to Write Enable Low
Write Enable Low to Address Transition
Output Enable High to Write Enable Low
Write Enable High to Output Enable Low
WHDX
t
0
0
0
WHEH
t
t
WPH
30
0
30
0
30
0
WHWL
t
t
AS
AVWL
t
t
AH
40
0
45
0
45
0
WLAX
t
GHWL
t
t
OEH
0
0
0
WHGL
t
t
V
High to Chip Enable Low
CC
50
50
50
VCHEL
VCS
Figure 8. Write AC Waveforms, Write Enable Controlled
tAVAV
A0-A15
VALID
tWLAX
tAVWL
tWHEH
E
tELWL
tWHGL
G
W
tGHWL
tWLWH
tWHWL
tWHDX
tDVWH
VALID
DQ0-DQ15
V
CC
tVCHEL
AI02119
14/20
M29W102BT, M29W102BB
Table 14. Write AC Characteristics, Chip Enable Controlled
(T = 0 to 70°C or –40 to 85°C)
A
M29W102B
Unit
Symbol
Alt
Parameter
50
50
0
70
70
0
90
90
0
t
t
WC
Address Valid to Next Address Valid
Write Enable Low to Chip Enable Low
Chip Enable Low to Chip Enable High
Input Valid to Chip Enable High
Min
Min
Min
Min
Min
Min
Min
Min
Min
Min
Min
Min
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
µs
AVAV
t
t
WS
WLEL
t
t
40
25
0
45
30
0
45
45
0
ELEH
CP
DS
t
t
t
DVEH
t
Chip Enable High to Input Transition
Chip Enable High to Write Enable High
Chip Enable High to Chip Enable Low
Address Valid to Chip Enable Low
Chip Enable Low to Address Transition
Output Enable High Chip Enable Low
Chip Enable High to Output Enable Low
EHDX
DH
t
t
WH
0
0
0
EHWH
t
t
30
0
30
0
30
0
EHEL
CPH
t
t
AS
AVEL
t
t
AH
40
0
45
0
45
0
ELAX
t
GHEL
t
t
0
0
0
EHGL
OEH
t
t
V
High to Write Enable Low
CC
50
50
50
VCHWL
VCS
Figure 9. Write AC Waveforms, Chip Enable Controlled
tAVAV
A0-A15
VALID
tELAX
tAVEL
tEHWH
W
G
E
tWLEL
tEHGL
tGHEL
tELEH
tEHEL
tEHDX
tDVEH
VALID
DQ0-DQ15
V
CC
tVCHWL
AI02120
15/20
M29W102BT, M29W102BB
Table 15. Reset/Block Temporary Unprotect AC Characteristics
(T = 0 to 70°C or –40 to 85°C)
A
M29W102B
70
Symbol
Alt
Parameter
Unit
50
90
(1)
t
PHWL
RP High to Write Enable Low, Chip Enable
Low, Output Enable Low
t
t
Min
50
50
50
ns
PHEL
RH
(1)
t
PHGL
t
t
RP Pulse Width
Min
Max
Min
500
10
500
10
500
10
ns
µs
ns
PLPX
(1)
RP
t
RP Low to Read Mode
t
READY
PLYH
(1)
t
RP Rise Time to V
500
500
500
t
VIDR
ID
PHPHH
Note: 1. Sampled only, not 100% tested.
Figure 10. Reset/Block Temporary Unprotect AC Waveforms
W, E, G
tPHWL, tPHEL, tPHGL
tPLPX
RP
tPHPHH
tPLYH
AI02943
16/20
M29W102BT, M29W102BB
Table 16. Ordering Information Scheme
Example:
M29W102BB
70 NZ
1
T
Device Type
M29
Operating Voltage
W = V = 2.7 to 3.6V
CC
Device Function
102B = 1 Mbit (64Kb x16), Boot Block
Array Matrix
T = Top Boot
B = Bottom Boot
Speed
50 = 50 ns
70 = 70 ns
90 = 90 ns
Package
N = TSOP40: 10 x 14mm
Temperature Range
1 = 0 to 70 °C
6 = –40 to 85 °C
Option
T = Tape & Reel Packing
Note: The last two characters of the ordering code may be replaced by a letter code for preprogrammed
parts, otherwise devices are shipped from the factory with the memory content bits erased to ’1’.
For a list of available options (Speed, Package, etc...) or for further information on any aspect of this de-
vice, please contact the ST Sales Office nearest to you.
17/20
M29W102BT, M29W102BB
Table 17. Revision History
Date
Revision Details
August 1999
First Issue
Status Register bit DQ5 clarification
03/09/00
Data Polling Flowchart diagram change (Figure 3)
Data Toggle Flowchart diagram change (Figure 4)
18/20
M29W102BT, M29W102BB
Table 18. TSOP40 - 40 lead Plastic Thin Small Outline, 10 x 14mm, Package Mechanical Data
mm
Min
inches
Min
Symbol
Typ
Max
1.20
0.15
1.05
0.27
0.21
14.20
12.50
10.10
–
Typ
Max
0.0472
0.0059
0.0413
0.0106
0.0083
0.5591
0.4921
0.3976
–
A
A1
A2
B
0.05
0.95
0.17
0.10
13.80
12.30
9.90
–
0.0020
0.0374
0.0067
0.0039
0.5433
0.4843
0.3898
–
C
D
D1
E
e
0.50
0.0197
L
0.50
0°
0.70
5°
0.0197
0°
0.0276
5°
α
N
40
40
CP
0.10
0.0039
Figure 11. TSOP40 - 40 lead Plastic Thin Small Outline, 10 x 14mm, Package Outline
A2
1
N
e
E
B
N/2
D1
D
A
CP
DIE
C
TSOP-a
Drawing is not to scale.
A1
α
L
19/20
M29W102BT, M29W102BB
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences
of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted
by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject
to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not
authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
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20/20
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