M27V322-100F1 [STMICROELECTRONICS]

32 Mbit 2Mb x16 Low Voltage UV EPROM and OTP EPROM; 32兆位的2Mb x16的低电压UV EPROM和OTP EPROM
M27V322-100F1
型号: M27V322-100F1
厂家: ST    ST
描述:

32 Mbit 2Mb x16 Low Voltage UV EPROM and OTP EPROM
32兆位的2Mb x16的低电压UV EPROM和OTP EPROM

存储 内存集成电路 CD PC 可编程只读存储器 电动程控只读存储器
文件: 总13页 (文件大小:114K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
M27V322  
32 Mbit (2Mb x16) Low Voltage UV EPROM and OTP EPROM  
3.3V ± 10% SUPPLY VOLTAGE in READ  
OPERATION  
READ ACCESS TIME  
– 100ns at V = 3.0V to 3.6V  
CC  
PIN COMPATIBLE WITH M27C322  
WORD-WIDE CONFIGURABLE  
32 Mbit MASK ROM REPLACEMENT  
LOW POWER CONSUMPTION  
– Active Current 30mA at 5MHz  
– Stand-by Current 60µA  
42  
42  
1
1
FDIP42W (F)  
PDIP42 (P)  
PROGRAMMING VOLTAGE: 12V ± 0.25V  
PROGRAMMING TIME: 50µs/word  
ELECTRONIC SIGNATURE  
– Manufacturer Code: 0020h  
Figure 1. Logic Diagram  
– Device Code: 0034h  
DESCRIPTION  
The M27V322 is a 32 Mbit EPROM offered in the  
UV range (ultra violet erase) and OTP range. It is  
ideally suited for microprocessor systems requir-  
ing large data or program storage. It is organised  
as 2 MWords of 16 bit. The pin-out is compatible  
with a 32 Mbit Mask ROM.  
V
CC  
21  
16  
The FDIP42W (window ceramic frit-seal package)  
has a transparent lid which allows the user to ex-  
pose the chip to ultraviolet light to erase the bit pat-  
tern. A new pattern can then be written rapidly to  
the device by following the programming proce-  
dure.  
For applications where the content is programmed  
only one time and erasure is not required, the  
M27V322 is offered in PDIP42 package.  
A0-A20  
Q0-Q15  
E
M27V322  
GV  
PP  
V
SS  
AI03050  
March 2000  
1/13  
M27V322  
Figure 2A. DIP Connections  
Table 1. Signal Names  
A0-A20  
Q0-Q15  
E
Address Inputs  
A18  
A17  
A7  
1
2
3
4
5
6
7
8
9
42 A19  
41 A8  
Data Outputs  
40 A9  
Chip Enable  
A6  
39 A10  
38 A11  
37 A12  
36 A13  
35 A14  
34 A15  
33 A16  
32 A20  
GV  
Output Enable / Program Supply  
Supply Voltage  
Ground  
PP  
A5  
A4  
V
CC  
A3  
A2  
V
SS  
A1  
A0 10  
M27V322  
E
11  
12  
13  
from E to output (t  
output after a delay of t  
). Data is available at the  
ELQV  
V
31  
V
SS  
from the falling edge  
SS  
PP  
GLQV  
of GV , assuming that E has been low and the  
GV  
30 Q15  
29 Q7  
28 Q14  
27 Q6  
26 Q13  
25 Q5  
24 Q12  
23 Q4  
PP  
addresses have been stable for at least t  
-
AVQV  
Q0 14  
Q8 15  
Q1 16  
Q9 17  
Q2 18  
t
.
GLQV  
Standby Mode  
The M27V322 has a standby mode which reduces  
the supply current from 30mA to 30µA. The  
M27V322 is placed in the standby mode by apply-  
ing a CMOS high signal to the E input.When in the  
standby mode, the outputs are in a high imped-  
Q10 19  
Q3 20  
ance state, independent of the GV input.  
PP  
Q11 21  
22  
V
CC  
Two Line Output Control  
AI03051  
Because EPROMs are usually used in larger  
memory arrays, this product features a 2 line con-  
trol function which accommodates the use of mul-  
tiple memory connection. The two line control  
function allows:  
a. the lowest possible memory power dissipation,  
b. complete assurance that output bus contention  
will not occur.  
DEVICE OPERATION  
The operating modes of the M27V322 are listed in  
the Operating Modes Table. A single power supply  
is required in the read mode. All inputs are TTL  
compatible except for V and 12V on A9 for the  
Electronic Signature.  
PP  
For the most efficient use of these two control  
lines, E should be decoded and used as the prima-  
Read Mode  
ry device selecting function, while GV should be  
PP  
The M27V322 has a word-wide organization. Chip  
Enable (E) is the power control and should be  
used for device selection. Output Enable (G) is the  
output control and should be used to gate data to  
the output pins independent of device selection.  
Assuming that the addresses are stable, the ad-  
made a common connection to all devices in the  
array and connected to the READ line from the  
system control bus. This ensures that all deselect-  
ed memory devices are in their low power standby  
mode and that the output pins are only active  
when data is required from a particular memory  
device.  
dress access time (t  
) is equal to the delay  
AVQV  
2/13  
M27V322  
(1)  
Table 2. Absolute Maximum Ratings  
Symbol  
Parameter  
Value  
Unit  
°C  
°C  
°C  
V
(3)  
T
A
–40 to 125  
–50 to 125  
–65 to 150  
–2 to 7  
Ambient Operating Temperature  
T
Temperature Under Bias  
BIAS  
T
STG  
Storage Temperature  
(2)  
Input or Output Voltage (except A9)  
V
IO  
V
Supply Voltage  
–2 to 7  
–2 to 13.5  
–2 to 14  
V
V
V
CC  
(2)  
A9 Voltage  
V
A9  
V
Program Supply Voltage  
PP  
Note: 1. Except for the rating "Operating Temperature Range", stresses above those listed in the Table "Absolute Maximum Ratings" may  
cause permanent damage to the device. These are stress ratings only and operation of the device at these or any other conditions  
above those indicated in the Operating sections of this specification is not implied. Exposure to Absolute Maximum Rating condi-  
tions for extended periods may affect device reliability. Refer also to the STMicroelectronics SURE Program and other relevant qual-  
ity documents.  
2. Minimum DC voltage on Input or Output is –0.5V with possible undershoot to –2.0V for a period less than 20ns. Maximum DC  
voltage on Output is V  
3. Depends on range.  
+0.5V with possible overshoot to V  
+2V for a period less than 20ns.  
CC  
CC  
Table 3. Operating Modes  
Mode  
GV  
E
A9  
X
Q15-Q0  
Data Out  
Hi-Z  
PP  
V
IL  
V
IL  
Read  
V
IL  
V
IH  
Output Disable  
Program  
X
V
IL  
Pulse  
V
X
Data In  
Hi-Z  
PP  
PP  
V
V
Program Inhibit  
Standby  
X
IH  
IH  
V
X
X
Hi-Z  
V
IL  
V
IL  
V
ID  
Electronic Signature  
Codes  
Note: X = V or V , V = 12V ± 0.5V.  
IH IL ID  
Table 4. Electronic Signature  
Identifier  
Manufacturer’s Code  
Device Code  
A0  
Q7  
0
Q6  
0
Q5  
1
Q4  
Q3  
0
Q2  
0
Q1  
0
Q0  
0
Hex Data  
V
IL  
0
1
20h  
34h  
V
0
0
1
0
1
0
0
IH  
Note: Outputs Q15-Q8 are set to '0'.  
3/13  
M27V322  
Table 5. AC Measurement Conditions  
High Speed  
10ns  
Standard  
20ns  
Input Rise and Fall Times  
Input Pulse Voltages  
0 to 3V  
1.5V  
0.4V to 2.4V  
0.8V and 2V  
Input and Output Timing Ref. Voltages  
Figure 3. AC Testing Input Output Waveform  
Figure 4. AC Testing Load Circuit  
1.3V  
High Speed  
1N914  
3V  
1.5V  
3.3kΩ  
0V  
DEVICE  
UNDER  
TEST  
OUT  
Standard  
C
L
2.4V  
2.0V  
0.8V  
0.4V  
C
C
C
= 30pF for High Speed  
= 100pF for Standard  
includes JIG capacitance  
L
L
L
AI01822  
AI01823B  
(1)  
Table 6. Capacitance  
Symbol  
(T = 25 °C, f = 1 MHz)  
A
Parameter  
Input Capacitance  
Output Capacitance  
Test Condition  
Min  
Max  
10  
Unit  
pF  
C
V
= 0V  
= 0V  
IN  
IN  
C
OUT  
V
OUT  
12  
pF  
Note: 1. Sampled only, not 100% tested.  
System Considerations  
put control and by properly selected decoupling  
capacitors. It is recommended that a 0.1µF ceram-  
The power switching characteristics of Advanced  
CMOS EPROMs require careful decoupling of the  
supplies to the devices. The supply current ICC  
has three segments of importance to the system  
designer: the standby current, the active current  
and the transient peaks that are produced by the  
falling and rising edges of E. The magnitude of the  
transient current peaks is dependent on the ca-  
pacitive and inductive loading of the device out-  
puts. The associated transient voltage peaks can  
be suppressed by complying with the two line out-  
ic capacitor is used on every device between V  
CC  
and V . This should be a high frequency type of  
SS  
low inherent inductance and should be placed as  
close as possible to the device. In addition, a  
4.7µF electrolytic capacitor should be used be-  
tween V  
and V for every eight devices. This  
CC  
SS  
capacitor should be mounted near the power sup-  
ply connection point. The purpose of this capacitor  
is to overcome the voltage drop caused by the in-  
ductive effects of PCB traces.  
4/13  
M27V322  
(1)  
Table 7. Read Mode DC Characteristics  
(T = –40 to 85 °C or 0 to 70 °C; V = 3.3V ± 10%; V = V  
)
A
CC  
PP  
CC  
Symbol  
Parameter  
Input Leakage Current  
Output Leakage Current  
Test Condition  
Min  
Max  
±1  
Unit  
µA  
I
0V V V  
LI  
IN  
CC  
I
0V V V  
OUT CC  
±10  
µA  
LO  
E = V , GV = V , I = 0mA,  
IL OUT  
IL  
PP  
I
Supply Current  
30  
mA  
CC  
f = 5MHz  
I
I
1
2
E = V  
Supply Current (Standby) TTL  
Supply Current (Standby) CMOS  
Program Current  
1
mA  
µA  
µA  
V
CC  
IH  
E > V – 0.2V  
60  
10  
CC  
CC  
I
V
= V  
PP CC  
PP  
V
0.2V  
CC  
Input Low Voltage  
–0.6  
IL  
(2)  
0.7V  
V
CC  
+ 0.5  
Input High Voltage  
V
V
V
V
CC  
IH  
V
V
I
= 2.1mA  
Output Low Voltage  
0.4  
OL  
OL  
I
= –400µA  
OH  
Output High Voltage TTL  
2.4  
OH  
Note: 1. V must be applied simultaneously with or before V and removed simultaneously or after V .  
PP  
CC  
PP  
2. Maximum DC voltage on Output is V +0.5V.  
CC  
(1)  
Table 8. Read Mode AC Characteristics  
(T = –40 to 85 °C or 0 to 70 °C; V = 3.3V ± 10%; V = V  
)
A
CC  
PP  
CC  
M27V322  
-120  
(3)  
Symbol  
Alt  
Parameter  
Test Condition  
-150  
Unit  
-100  
Min Max Min Max Min Max  
t
t
E = V , G = V  
Address Valid to Output Valid  
100  
100  
120  
120  
150  
150  
ns  
ns  
AVQV  
ACC  
IL  
IL  
t
t
G = V  
IL  
Chip Enable Low to Output Valid  
ELQV  
CE  
Output Enable Low to Output  
Valid  
t
t
E = V  
IL  
50  
45  
45  
60  
50  
50  
60  
50  
50  
ns  
ns  
ns  
GLQV  
OE  
(2)  
t
G = V  
Chip Enable High to Output Hi-Z  
0
0
0
0
0
0
t
DF  
DF  
IL  
EHQZ  
GHQZ  
Output Enable High to Output  
Hi-Z  
(2)  
t
E = V  
t
IL  
Address Transition to Output  
Transition  
t
t
E = V , G = V  
IL IL  
5
5
5
ns  
AXQX  
OH  
Note: 1. V must be applied simultaneously with or before V and removed simultaneously or after V  
PP  
CC  
PP  
2. Sampled only, not 100% tested.  
3. Speed obtained with High Speed measurement conditions.  
5/13  
M27V322  
Figure 5. Read Mode AC Waveforms  
VALID  
tGLQV  
VALID  
A0-A20  
tAVQV  
tAXQX  
E
tEHQZ  
tGHQZ  
GV  
PP  
tELQV  
Hi-Z  
Q0-Q15  
AI02207  
(1)  
Table 9. Programming Mode DC Characteristics  
(T = 25 °C; V = 6.25V ± 0.25V; V = 12V ± 0.25V)  
A
CC  
PP  
Symbol  
Parameter  
Test Condition  
Min  
Max  
±10  
50  
Unit  
µA  
mA  
mA  
V
I
V
V V  
Input Leakage Current  
Supply Current  
LI  
IL  
IN  
IH  
I
CC  
I
PP  
E = V  
Program Current  
Input Low Voltage  
Input High Voltage  
Output Low Voltage  
Output High Voltage TTL  
A9 Voltage  
50  
IL  
V
–0.3  
2.4  
0.8  
IL  
V
IH  
V
+ 0.5  
CC  
V
V
OL  
I
= 2.1mA  
OL  
0.4  
V
V
OH  
I
= –2.5mA  
3.5  
V
OH  
V
ID  
11.5  
12.5  
V
Note: 1. V must be applied simultaneously with or before V and removed simultaneously or after V .  
PP  
CC  
PP  
6/13  
M27V322  
(1)  
Table 10. MARGIN MODE AC Characteristics  
(T = 25 °C; V = 6.25V ± 0.25V; V = 12V ± 0.25V)  
A
CC  
PP  
Symbol  
Alt  
Parameter  
Test Condition  
Min  
2
Max  
Unit  
µs  
t
t
V
High to V High  
A9 PP  
A9HVPH  
AS9  
t
t
V
High to Chip Enable Low  
PP  
2
µs  
VPHEL  
VPS  
AS10  
AS10  
AH10  
t
t
t
t
V
A10  
High to Chip Enable High (Set)  
Low to Chip Enable High (Reset)  
1
µs  
A10HEH  
t
V
A10  
1
µs  
A10LEH  
t
Chip Enable Transition to V  
Transition  
1
µs  
EXA10X  
A10  
t
t
Chip Enable Transition to V Transition  
PP  
2
µs  
EXVPX  
VPH  
t
t
V Transition to V Transition  
PP A9  
2
µs  
VPXA9X  
AH9  
Note: 1. V must be applied simultaneously with or before V and removed simultaneously or after V .  
PP  
CC  
PP  
(1)  
Table 11. Programming Mode AC Characteristics  
(T = 25 °C; V = 6.25V ± 0.25V; V = 12V ± 0.25V)  
A
CC  
PP  
Symbol  
Alt  
Parameter  
Test Condition  
Min  
1
Max  
Unit  
µs  
µs  
µs  
µs  
ns  
µs  
µs  
µs  
µs  
µs  
t
t
t
Address Valid to Chip Enable Low  
Input Valid to Chip Enable Low  
AVEL  
AS  
t
1
QVEL  
DS  
t
t
V
V
V
High to Chip Enable Low  
High to Chip Enable Low  
Rise Time  
2
VCHEL  
VCS  
CC  
PP  
PP  
t
t
1
VPHEL  
OES  
t
t
PRT  
50  
45  
2
VPLVPH  
t
t
PW  
Chip Enable Program Pulse Width (Initial)  
Chip Enable High to Input Transition  
55  
ELEH  
t
t
DH  
EHQX  
t
t
Chip Enable High to V Transition  
2
EHVPX  
OEH  
PP  
t
t
VR  
V
Low to Chip Enable Low  
PP  
1
VPLEL  
t
t
DV  
Chip Enable Low to Output Valid  
Chip Enable High to Output Hi-Z  
Chip Enable High to Address Transition  
1
ELQV  
(2)  
t
0
0
130  
ns  
ns  
t
DFP  
EHQZ  
t
t
AH  
EHAX  
Note: 1. V must be applied simultaneously with or before V and removed simultaneously or after V .  
PP  
CC  
PP  
2. Sampled only, not 100% tested.  
Programming  
olet light (UV EPROM). The M27V322 is in the  
programming mode when V input is at 12.V,  
PP  
When delivered (and after each erasure for UV  
EPROM), all bits of the M27V322 are in the "1"  
state. Data is introduced by selectively program-  
ming "0"s into the desired bit locations. Although  
only "0"s will be programmed, both "1"s and "0"s  
can be present in the data word. The only way to  
change a "0" to a "1" is by die exposition to ultravi-  
GV is at V and E is pulsed to V . The data to  
PP  
IH  
IL  
be programmed is applied to 16 bits in parallel to  
the data output pins. The levels required for the  
address and data inputs are TTL. V is specified  
CC  
to be 6.25V ± 0.25V.  
7/13  
M27V322  
Figure 6. MARGIN MODE AC Waveforms  
V
CC  
A8  
A9  
tA9HVPH  
tVPXA9X  
GV  
E
PP  
tVPHEL  
tEXVPX  
tA10HEH  
tEXA10X  
A10 Set  
A10 Reset  
tA10LEH  
AI00736B  
Note: A8 High level = 5V; A9 High level = 12V.  
Figure 7. Programming and Verify Modes AC Waveforms  
VALID  
A0-A20  
Q0-Q15  
tAVEL  
tQVEL  
tEHAX  
DATA IN  
DATA OUT  
tEHQX  
tEHQZ  
V
CC  
tVCHEL  
tVPHEL  
tEHVPX  
tELQV  
GV  
PP  
tVPLEL  
E
tELEH  
PROGRAM  
VERIFY  
AI02205  
Note: BYTE = V  
8/13  
.
IH  
M27V322  
Figure 8. Programming Flowchart  
GV at V . Data should be verified with t  
ter the falling edge of E.  
On-Board Programming  
af-  
PP  
IL  
ELQV  
V
= 6.25V, V  
= 12V  
PP  
CC  
The M27V322 can be directly programmed in the  
application circuit. See the relevant Application  
Note AN620.  
SET MARGIN MODE  
n = 0  
Electronic Signature  
The Electronic Signature (ES) mode allows the  
reading out of a binary code from an EPROM that  
will identify its manufacturer and type. This mode  
is intended for use by programming equipment to  
automatically match the device to be programmed  
with its corresponding programming algorithm.  
The ES mode is functional in the 25°C ± 5°C am-  
bient temperature range that is required when pro-  
gramming the M27V322. To activate the ES mode,  
the programming equipment must force 11.5V to  
12.5V on address line A9 of the M27V322, with  
E = 50µs Pulse  
NO  
NO  
++n  
= 25  
VERIFY  
++ Addr  
YES  
YES  
Last  
NO  
FAIL  
Addr  
V
= V = 5V. Two identifier bytes may then be  
PP  
CC  
YES  
sequenced from the device outputs by toggling ad-  
dress line A0 from V to V . All other address  
IL  
IH  
RESET MARGIN MODE  
lines must be held at V during Electronic Signa-  
IL  
ture mode.  
CHECK ALL WORDS  
Byte 0 (A0 = V ) represents the manufacturer  
IL  
1st: V  
= 5V  
= 3V  
CC  
2nd: V  
code and byte 1 (A0 = V ) the device identifier  
IH  
CC  
code. For the STMicroelectronics M27V322, these  
two identifier bytes are given in Table 4 and can be  
read-out on outputs Q0 to Q7.  
AI03059B  
ERASURE OPERATION (applies to UV EPROM)  
The erasure characteristics of the M27V322 is  
such that erasure begins when the cells are ex-  
posed to light with wavelengths shorter than ap-  
proximately 4000 Å. It should be noted that  
sunlight and some type of fluorescent lamps have  
wavelengths in the 3000-4000 Å range. Research  
shows that constant exposure to room level fluo-  
rescent lighting could erase a typical M27V322 in  
about 3 years, while it would take approximately 1  
week to cause erasure when exposed to direct  
sunlight. If the M27V322 is to be exposed to these  
types of lighting conditions for extended periods of  
time, it is suggested that opaque labels be put over  
the M27V322 window to prevent unintentional era-  
sure. The recommended erasure procedure for  
M27V322 is exposure to short wave ultraviolet  
light which has a wavelength of 2537 Å. The inte-  
grated dose (i.e. UV intensity x exposure time) for  
PRESTO III Programming Algorithm  
The PRESTO III Programming Algorithm allows  
the whole array to be programed with a guaran-  
teed margin in a typical time of 100 seconds. Pro-  
gramming with PRESTO III consists of applying a  
sequence of 50µs program pulses to each word  
until a correct verify occurs (see Figure 8). During  
programing and verify operation a MARGIN  
MODE circuit must be activated to guarantee that  
each cell is programed with enough margin. No  
overprogram pulse is applied since the verify in  
MARGIN MODE provides the necessary margin to  
each programmed cell.  
Program Inhibit  
Programming of multiple M27V322s in parallel  
with different data is also easily accomplished. Ex-  
cept for E, all like inputs including GV of the par-  
PP  
2
erasure should be a minimum of 30 W-sec/cm .  
allel M27V322 may be common. A TTL low level  
pulse applied to a M27V322's E input and V at  
12V, will program that M27V322. A high level E in-  
put inhibits the other M27V322s from being pro-  
grammed.  
The erasure time with this dosage is approximate-  
ly 30 to 40 minutes using an ultraviolet lamp with  
PP  
2
12000 µW/cm power rating. The M27V322  
should be placed within 2.5cm (1 inch) of the lamp  
tubes during the erasure. Some lamps have a filter  
on their tubes which should be removed before  
erasure.  
Program Verify  
A verify (read) should be performed on the pro-  
grammed bits to determine that they were correct-  
ly programmed. The verify is accomplished with  
9/13  
M27V322  
Table 12. Ordering Information Scheme  
Example:  
M27V322  
-100 X  
F
1
Device Type  
M27  
Supply Voltage  
V = 3.3V ±10%  
Device Function  
322 = 32 Mbit (2Mb x16)  
Speed  
(1)  
-100 = 100 ns  
-120 = 120 ns  
-150 = 150 ns  
V
Tolerance  
CC  
blank = 3.3V ±10%  
X = 3.3V ±5%  
Package  
F = FDIP42W  
P = PDIP42  
Temperature Range  
1 = 0 to 70 °C  
6 = –40 to 85 °C  
Note: 1. High Speed, see AC Characteristics section for further information.  
For a list of available options (Speed, Package, etc...) or for further information on any aspect of this de-  
vice, please contact the STMicroelectronics Sales Office nearest to you.  
Table 13. Revision History  
Date  
July 1999  
Revision Details  
First Issue  
Programming Flowchart changed (Figure 8)  
02/09/00  
PRESTO III Programming Algorithm paragraph changed  
FDIP42W Package Dimension, L Max added (Table 14)  
10/13  
M27V322  
Table 14. FDIP42W - 42 pin Ceramic Frit-seal DIP with window, Package Mechanical Data  
mm  
Min  
inches  
Min  
Symb  
Typ  
Max  
5.72  
1.40  
4.57  
4.50  
0.56  
Typ  
Max  
0.225  
0.055  
0.180  
0.177  
0.022  
A
A1  
A2  
A3  
B
0.51  
3.91  
3.89  
0.41  
0.020  
0.154  
0.153  
0.016  
B1  
C
1.45  
0.057  
0.23  
54.41  
0.30  
54.86  
0.009  
2.142  
0.012  
2.160  
D
D2  
E
50.80  
15.24  
2.000  
0.600  
E1  
e
14.50  
14.90  
0.571  
0.587  
2.54  
0.100  
0.590  
eA  
eB  
L
14.99  
16.18  
3.18  
1.52  
18.03  
4.10  
2.49  
0.637  
0.125  
0.060  
0.710  
0.161  
0.098  
S
K
8.00  
0.315  
0.630  
K1  
α
16.00  
4°  
11°  
4°  
11°  
N
42  
42  
Figure 9. FDIP42W - 42 pin Ceramic Frit-seal DIP with window, Package Outline  
A2  
A3  
A
L
A1  
e1  
α
B1  
B
C
eA  
eB  
D2  
D
S
N
1
K
E1  
E
K1  
FDIPW-b  
Note: Drawing is not to scale.  
11/13  
M27V322  
Table 15. PDIP42 - 42 pin Plastic DIP, 600 mils width, Package Mechanical Data  
Symb  
mm  
Min  
inches  
Min  
Typ  
Max  
5.08  
Typ  
Max  
0.200  
A
A1  
A2  
B
0.25  
3.56  
0.38  
1.27  
0.20  
52.20  
0.010  
0.140  
0.015  
0.050  
0.008  
2.055  
4.06  
0.53  
1.65  
0.36  
52.71  
0.160  
0.021  
0.065  
0.014  
2.075  
B1  
C
D
D2  
E
50.80  
15.24  
2.000  
0.600  
E1  
e1  
eA  
eB  
L
13.59  
13.84  
0.535  
0.545  
2.54  
0.100  
0.590  
14.99  
15.24  
3.18  
0.86  
0°  
17.78  
3.43  
1.37  
10°  
0.600  
0.125  
0.034  
0°  
0.700  
0.135  
0.054  
10°  
S
α
N
42  
42  
Figure 10. PDIP42 - 42 pin Plastic DIP, 600 mils width, Package Outline  
A2  
A
L
A1  
e1  
α
C
B1  
B
eA  
eB  
D2  
D
S
N
1
E1  
E
PDIP  
Note: Drawing is not to scale.  
12/13  
M27V322  
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences  
of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted  
by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject  
to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not  
authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.  
The ST logo is registered trademark of STMicroelectronics  
2000 STMicroelectronics - All Rights Reserved  
All other names are the property of their respective owners.  
STMicroelectronics GROUP OF COMPANIES  
Australia - Brazil - China - Finland - France - Germany - Hong Kong - India - Italy - Japan - Malaysia - Malta - Morocco -  
Singapore - Spain - Sweden - Switzerland - United Kingdom - U.S.A.  
http://www.st.com  
13/13  

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