M24128-DRDW6 [STMICROELECTRONICS]
128-Kbit serial I²C bus EEPROM;型号: | M24128-DRDW6 |
厂家: | ST |
描述: | 128-Kbit serial I²C bus EEPROM 可编程只读存储器 电动程控只读存储器 电可擦编程只读存储器 |
文件: | 总40页 (文件大小:1265K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
M24128-BW M24128-BR
M24128-BF M24128-DF
128-Kbit serial I²C bus EEPROM
Datasheet - production data
Features
2
• Compatible with all I C bus modes:
– 1 MHz
– 400 kHz
– 100 kHz
TSSOP8 (DW)
169 mil width
• Memory array:
– 128 Kbit (16 Kbytes) of EEPROM
– Page size: 64 bytes
– Additional Write lockable page
(M24128-D order codes)
• Single supply voltage and high speed:
– 1 MHz clock from 1.7 V to 5.5 V
SO8 (MN)
150 mil width
• Write:
– Byte Write within 5 ms
– Page Write within 5 ms
• Operating temperature range: from -40 °C up
to +85 °C
• Random and sequential Read modes
• Write protect of the whole memory array
• Enhanced ESD/Latch-Up protection
• More than 4 million Write cycles
UFDFPN8
(MC)
• More than 200-year data retention
• Packages:
– RoHS compliant and halogen-free
®
(ECOPACK )
WLCSP (CS)
April 2013
DocID16892 Rev 23
1/40
This is information on a product in full production.
www.st.com
1
Contents
M24128-BW M24128-BR M24128-BF M24128-DF
Contents
1
2
Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Signal description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.1
2.2
2.3
2.4
2.5
2.6
Serial Clock (SCL) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Serial Data (SDA) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Chip Enable (E2, E1, E0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Write Control (WC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
VSS (ground) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Supply voltage (VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.6.1
2.6.2
2.6.3
2.6.4
Operating supply voltage V
CC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9
Power-up conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Device reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Power-down conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
3
4
Memory organization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Device operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
4.1
4.2
4.3
4.4
4.5
Start condition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Stop condition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Data input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Acknowledge bit (ACK) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Device addressing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
5
Instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
5.1
Write operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
5.1.1
5.1.2
5.1.3
5.1.4
5.1.5
5.1.6
Byte Write . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Page Write . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Write Identification Page (M24128-D only) . . . . . . . . . . . . . . . . . . . . . . 17
Lock Identification Page (M24128-D only) . . . . . . . . . . . . . . . . . . . . . . . 17
ECC (Error Correction Code) and Write cycling . . . . . . . . . . . . . . . . . . 17
Minimizing Write delays by polling on ACK . . . . . . . . . . . . . . . . . . . . . . 18
5.2
Read operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
5.2.1
Random Address Read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
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Contents
5.2.2
5.2.3
Current Address Read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Sequential Read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
5.3
5.4
Read Identification Page (M24128-D only) . . . . . . . . . . . . . . . . . . . . . . . 20
Read the lock status (M24128-D only) . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
6
Initial delivery state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Maximum rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
DC and AC parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Part numbering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
7
8
9
10
11
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List of tables
M24128-BW M24128-BR M24128-BF M24128-DF
List of tables
Table 1.
Table 2.
Table 3.
Table 4.
Table 5.
Table 6.
Table 7.
Table 8.
Table 9.
Table 10.
Table 11.
Table 12.
Table 13.
Table 14.
Table 15.
Table 16.
Table 17.
Table 18.
Table 19.
Table 20.
Table 21.
Signal names . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Device select code . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Most significant address byte . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Least significant address byte . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Operating conditions (voltage range W) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Operating conditions (voltage range R) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Operating conditions (voltage range F) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
AC measurement conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Input parameters. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Cycling performance by groups of four bytes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Memory cell data retention . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
DC characteristics (M24128-BW, device grade 6) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
DC characteristics (M24128-BR, device grade 6). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
DC characteristics (M24128-R, device grade 6). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
DC characteristics (M24128-BF, M24128-DF, device grade 6) . . . . . . . . . . . . . . . . . . . . . 28
400 kHz AC characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
1 MHz AC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
TSSOP8 – 8-lead thin shrink small outline, package mechanical data. . . . . . . . . . . . . . . . 33
SO8N – 8-lead plastic small outline, 150 mils body width, package data. . . . . . . . . . . . . . 34
UFDFPN8 (MLP8) – package dimensions (UFDFPN: Ultra thin Fine pitch
Dual Flat Package, No lead). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
M24128-DFCS6TP/K, WLCSP 8-bump wafer-level chip scale package mechanical data. 37
Ordering information scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
Table 22.
Table 23.
Table 24.
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List of figures
List of figures
Figure 1.
Figure 2.
Figure 3.
Logic diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
8-pin package connections, top view . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
WLCSP connections for the M24128-DFCS6TP/K
(top view, marking side, with balls on the underside) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Device select code . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Figure 4.
Figure 5.
Figure 6.
Figure 7.
Figure 8.
Figure 9.
2
I C bus protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Write mode sequences with WC = 0 (data write enabled) . . . . . . . . . . . . . . . . . . . . . . . . . 15
Write mode sequences with WC = 1 (data write inhibited) . . . . . . . . . . . . . . . . . . . . . . . . . 16
Write cycle polling flowchart using ACK . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Figure 10. Read mode sequences. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Figure 11. AC measurement I/O waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Figure 12. Maximum R
value versus bus parasitic capacitance (C ) for
bus
bus
2
an I C bus at maximum frequency f = 400 kHz . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
C
Figure 13. Maximum R
value versus bus parasitic capacitance C ) for
bus
bus
2
an I C bus at maximum frequency f = 1MHz . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
C
Figure 14. AC waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Figure 15. TSSOP8 – 8-lead thin shrink small outline, package outline . . . . . . . . . . . . . . . . . . . . . . . 33
Figure 16. SO8N – 8-lead plastic small outline, 150 mils body width, package outline . . . . . . . . . . . . 34
Figure 17. UFDFPN8 (MLP8) – package outline (UFDFPN: Ultra thin Fine pitch
Dual Flat Package, No lead). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Figure 18. M24128-DFCS6TP/K, WLCSP 8-bump wafer-level chip
scale package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
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Description
M24128-BW M24128-BR M24128-BF M24128-DF
1
Description
2
The M24128 is a 128-Kbit I C-compatible EEPROM (Electrically Erasable PROgrammable
Memory) organized as 16 K × 8 bits.
The M24128-BW can operate with a supply voltage from 2.5 V to 5.5 V, the M24128-BR can
operate with a supply voltage from 1.8 V to 5.5 V, and the M24128-BF and M24128-DF can
operate with a supply voltage from 1.7 V to 5.5 V. All these devices operate with a clock
frequency of 1 MHz (or less), over an ambient temperature range of –40 °C / +85 °C. The
M24128-Dx offers an additional page, named the Identification Page (64 bytes). The
Identification Page can be used to store sensitive application parameters which can be
(later) permanently locked in Read-only mode.
Figure 1. Logic diagram
V
CC
3
E0-E2
SDA
M24xxx
SCL
WC
V
SS
AI01844f
Table 1. Signal names
Function
Signal name
Direction
E2, E1, E0
SDA
Chip Enable
Serial Data
Serial Clock
Write Control
Supply voltage
Ground
Input
I/O
Input
Input
-
SCL
WC
VCC
VSS
-
Figure 2. 8-pin package connections, top view
E0
E1
E2
1
2
3
4
8
7
6
5
V
CC
WC
SCL
SDA
V
SS
AI01845f
1. See Section 9: Package mechanical data for package dimensions, and how to identify pin 1.
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Description
Figure 3. WLCSP connections for the M24128-DFCS6TP/K
(top view, marking side, with balls on the underside)
E1
WC
VCC
E0
VSS
SDA
SCL
E2
MS30919V1
Caution:
As EEPROM cells lose their charge (and so their binary value) when exposed to ultra violet
(UV) light, EEPROM dice delivered in wafer form or in WLCSP package by
STMicroelectronics must never be exposed to UV light.
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Signal description
M24128-BW M24128-BR M24128-BF M24128-DF
2
Signal description
2.1
Serial Clock (SCL)
The signal applied on the SCL input is used to strobe the data available on SDA(in) and to
output the data on SDA(out).
2.2
2.3
Serial Data (SDA)
SDA is an input/output used to transfer data in or data out of the device. SDA(out) is an
open drain output that may be wire-OR’ed with other open drain or open collector signals on
the bus. A pull-up resistor must be connected from Serial Data (SDA) to V (Figure 12
CC
indicates how to calculate the value of the pull-up resistor).
Chip Enable (E2, E1, E0)
(E2,E1,E0) input signals are used to set the value that is to be looked for on the three least
significant bits (b3, b2, b1) of the 7-bit device select code. These inputs must be tied to V
CC
or V , as shown in Table 2. When not connected (left floating), these inputs are read as low
SS
(0).
Figure 4. Device select code
V
V
CC
CC
M24xxx
M24xxx
E
E
i
i
V
V
SS
SS
Ai12806
2.4
Write Control (WC)
This input signal is useful for protecting the entire contents of the memory from inadvertent
write operations. Write operations are disabled to the entire memory array when Write
Control (WC) is driven high. Write operations are enabled when Write Control (WC) is either
driven low or left floating.
When Write Control (WC) is driven high, device select and address bytes are
acknowledged, Data bytes are not acknowledged.
2.5
VSS (ground)
V
is the reference for the V supply voltage.
SS
CC
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Signal description
2.6
Supply voltage (VCC)
2.6.1
Operating supply voltage V
CC
Prior to selecting the memory and issuing instructions to it, a valid and stable V voltage
CC
within the specified [V (min), V (max)] range must be applied (see Operating conditions
CC
CC
in Section 8: DC and AC parameters). In order to secure a stable DC supply voltage, it is
recommended to decouple the V line with a suitable capacitor (usually of the order of
CC
10 nF to 100 nF) close to the V /V package pins.
CC SS
This voltage must remain stable and valid until the end of the transmission of the instruction
and, for a write instruction, until the completion of the internal write cycle (t ).
W
2.6.2
2.6.3
Power-up conditions
The V voltage has to rise continuously from 0 V up to the minimum V operating voltage
CC
CC
(see Operating conditions in Section 8: DC and AC parameters) and the rise time must not
vary faster than 1 V/µs.
Device reset
In order to prevent inadvertent write operations during power-up, a power-on-reset (POR)
circuit is included.
At power-up, the device does not respond to any instruction until V has reached the
CC
internal reset threshold voltage. This threshold is lower than the minimum V operating
CC
voltage (see Operating conditions in Section 8: DC and AC parameters). When V passes
CC
over the POR threshold, the device is reset and enters the Standby Power mode; however,
the device must not be accessed until V reaches a valid and stable DC voltage within the
CC
specified [V (min), V (max)] range (see Operating conditions in Section 8: DC and AC
CC
CC
parameters).
In a similar way, during power-down (continuous decrease in V ), the device must not be
CC
accessed when V drops below V (min). When V drops below the power-on-reset
CC
CC
CC
threshold voltage, the device stops responding to any instruction sent to it.
2.6.4
Power-down conditions
During power-down (continuous decrease in V ), the device must be in the Standby Power
CC
mode (mode reached after decoding a Stop condition, assuming that there is no internal
write cycle in progress).
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Memory organization
M24128-BW M24128-BR M24128-BF M24128-DF
3
Memory organization
The memory is organized as shown below.
Figure 5. Block diagram
WC
E0
E1
E2
High voltage
generator
Control logic
SCL
SDA
I/O shift register
Data
Address register
and counter
register
1 page
Identification page
X decoder
MS30912V1
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Device operation
4
Device operation
2
The device supports the I C protocol. This is summarized in Figure 6. Any device that sends
data on to the bus is defined to be a transmitter, and any device that reads the data to be a
receiver. The device that controls the data transfer is known as the bus master, and the
other as the slave device. A data transfer can only be initiated by the bus master, which will
also provide the serial clock for synchronization. The device is always a slave in all
communications.
2
Figure 6. I C bus protocol
SCL
SDA
SDA
Input
SDA
Change
START
Condition
STOP
Condition
1
2
3
7
8
9
SCL
SDA
ACK
MSB
START
Condition
1
2
3
7
8
9
SCL
SDA
MSB
ACK
STOP
Condition
AI00792B
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Device operation
M24128-BW M24128-BR M24128-BF M24128-DF
4.1
Start condition
Start is identified by a falling edge of Serial Data (SDA) while Serial Clock (SCL) is stable in
the high state. A Start condition must precede any data transfer instruction. The device
continuously monitors (except during a Write cycle) Serial Data (SDA) and Serial Clock
(SCL) for a Start condition.
4.2
Stop condition
Stop is identified by a rising edge of Serial Data (SDA) while Serial Clock (SCL) is stable and
driven high. A Stop condition terminates communication between the device and the bus
master. A Read instruction that is followed by NoAck can be followed by a Stop condition to
force the device into the Standby mode.
A Stop condition at the end of a Write instruction triggers the internal Write cycle.
4.3
4.4
Data input
During data input, the device samples Serial Data (SDA) on the rising edge of Serial Clock
(SCL). For correct device operation, Serial Data (SDA) must be stable during the rising edge
of Serial Clock (SCL), and the Serial Data (SDA) signal must change only when Serial Clock
(SCL) is driven low.
Acknowledge bit (ACK)
The acknowledge bit is used to indicate a successful byte transfer. The bus transmitter,
whether it be bus master or slave device, releases Serial Data (SDA) after sending eight bits
th
of data. During the 9 clock pulse period, the receiver pulls Serial Data (SDA) low to
acknowledge the receipt of the eight data bits.
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Device operation
4.5
Device addressing
To start communication between the bus master and the slave device, the bus master must
initiate a Start condition. Following this, the bus master sends the device select code, shown
in Table 2 (on Serial Data (SDA), most significant bit first).
Table 2. Device select code
Device type identifier(1)
Chip Enable address(2)
RW
b0
b7
b6
b5
b4
b3
b2
b1
Device select code
when addressing the
memory array
1
0
1
0
E2
E1
E0
RW
RW
Device select code
when accessing the
Identification page
1
0
1
1
E2
E1
E0
1. The most significant bit, b7, is sent first.
2. E0, E1 and E2 are compared with the value read on input pins E0, E1,and E2.
When the device select code is received, the device only responds if the Chip Enable
Address is the same as the value on the Chip Enable (E2, E1, E0) inputs.
th
The 8 bit is the Read/Write bit (RW). This bit is set to 1 for Read and 0 for Write operations.
If a match occurs on the device select code, the corresponding device gives an
th
acknowledgment on Serial Data (SDA) during the 9 bit time. If the device does not match
the device select code, it deselects itself from the bus, and goes into Standby mode.
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Instructions
M24128-BW M24128-BR M24128-BF M24128-DF
5
Instructions
5.1
Write operations
Following a Start condition the bus master sends a device select code with the R/W bit (RW)
reset to 0. The device acknowledges this, as shown in Figure 7, and waits for two address
bytes. The device responds to each address byte with an acknowledge bit, and then waits
for the data byte.
Table 3. Most significant address byte
A15
A7
A14
A6
A13
A12
A11
A10
A9
A1
A8
A0
Table 4. Least significant address byte
A5 A4 A3 A2
When the bus master generates a Stop condition immediately after a data byte Ack bit (in
th
the “10 bit” time slot), either at the end of a Byte Write or a Page Write, the internal Write
cycle t is triggered. A Stop condition at any other time slot does not trigger the internal
W
Write cycle.
After the Stop condition and the successful completion of an internal Write cycle (t ), the
W
device internal address counter is automatically incremented to point to the next byte after
the last modified byte.
During the internal Write cycle, Serial Data (SDA) is disabled internally, and the device does
not respond to any requests.
If the Write Control input (WC) is driven High, the Write instruction is not executed and the
accompanying data bytes are not acknowledged, as shown in Figure 8.
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Instructions
5.1.1
Byte Write
After the device select code and the address bytes, the bus master sends one data byte. If
the addressed location is Write-protected, by Write Control (WC) being driven high, the
device replies with NoAck, and the location is not modified. If, instead, the addressed
location is not Write-protected, the device replies with Ack. The bus master terminates the
transfer by generating a Stop condition, as shown in Figure 7.
Figure 7. Write mode sequences with WC = 0 (data write enabled)
WC
ACK
ACK
ACK
ACK
Byte Write
Dev sel
Byte addr
Byte addr
Data in
R/W
WC
ACK
ACK
ACK
ACK
Page Write
Dev sel
Byte addr
Byte addr
Data in 1
Data in 2
R/W
WC (cont'd)
ACK
ACK
Page Write (cont'd)
Data in N
AI01106d
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Instructions
M24128-BW M24128-BR M24128-BF M24128-DF
5.1.2
Page Write
The Page Write mode allows up to 64 bytes to be written in a single Write cycle, provided
that they are all located in the same page in the memory: that is, the most significant
memory address bits, b13-b6, are the same. If more bytes are sent than will fit up to the end
of the page, a “roll-over” occurs, i.e. the bytes exceeding the page end are written on the
same page, from location 0.
The bus master sends from 1 to 64 bytes of data, each of which is acknowledged by the
device if Write Control (WC) is low. If Write Control (WC) is high, the contents of the
addressed memory location are not modified, and each data byte is followed by a NoAck, as
shown in Figure 8. After each transferred byte, the internal page address counter is
incremented.
The transfer is terminated by the bus master generating a Stop condition.
Figure 8. Write mode sequences with WC = 1 (data write inhibited)
WC
ACK
ACK
ACK
NO ACK
Byte Write
Dev sel
Byte addr
Byte addr
Data in
R/W
WC
ACK
ACK
ACK
NO ACK
Data in 2
Page Write
Dev sel
Byte addr
Byte addr
Data in 1
R/W
WC (cont'd)
NO ACK
NO ACK
Page Write (cont'd)
Data in N
AI01120d
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Instructions
5.1.3
Write Identification Page (M24128-D only)
The Identification Page (64 bytes) is an additional page which can be written and (later)
permanently locked in Read-only mode. It is written by issuing the Write Identification Page
instruction. This instruction uses the same protocol and format as Page Write (into memory
array), except for the following differences:
•
•
Device type identifier = 1011b
MSB address bits A16/A9 are don't care except for address bit A10 which must be ‘0’.
LSB address bits A7/A0 define the byte address inside the Identification page.
If the Identification page is locked, the data bytes transferred during the Write Identification
Page instruction are not acknowledged (NoAck).
5.1.4
5.1.5
Lock Identification Page (M24128-D only)
The Lock Identification Page instruction (Lock ID) permanently locks the Identification page
in Read-only mode. The Lock ID instruction is similar to Byte Write (into memory array) with
the following specific conditions:
•
•
•
Device type identifier = 1011b
Address bit A10 must be ‘1’; all other address bits are don't care
The data byte must be equal to the binary value xxxx xx1x, where x is don't care
ECC (Error Correction Code) and Write cycling
The Error Correction Code (ECC) is an internal logic function which is transparent for the
2
I C communication protocol.
(1)
The ECC logic is implemented on each group of four EEPROM bytes . Inside a group, if a
single bit out of the four bytes happens to be erroneous during a Read operation, the ECC
detects this bit and replaces it with the correct value. The read reliability is therefore much
improved.
Even if the ECC function is performed on groups of four bytes, a single byte can be
written/cycled independently. In this case, the ECC function also writes/cycles the three
(1)
other bytes located in the same group . As a consequence, the maximum cycling budget is
defined at group level and the cycling can be distributed over the 4 bytes of the group: the
sum of the cycles seen by byte0, byte1, byte2 and byte3 of the same group must remain
below the maximum value defined Table 11: Cycling performance by groups of four bytes.
1. A group of four bytes is located at addresses [4*N, 4*N+1, 4*N+2, 4*N+3], where N is an
integer.
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Instructions
M24128-BW M24128-BR M24128-BF M24128-DF
5.1.6
Minimizing Write delays by polling on ACK
The maximum Write time (tw) is shown in AC characteristics tables in Section 8: DC and AC
parameters, but the typical time is shorter. To make use of this, a polling sequence can be
used by the bus master.
The sequence, as shown in Figure 9, is:
•
Initial condition: a Write cycle is in progress.
•
Step 1: the bus master issues a Start condition followed by a device select code (the
first byte of the new instruction).
•
Step 2: if the device is busy with the internal Write cycle, no Ack will be returned and
the bus master goes back to Step 1. If the device has terminated the internal Write
cycle, it responds with an Ack, indicating that the device is ready to receive the second
part of the instruction (the first byte of this instruction having been sent during Step 1).
Figure 9. Write cycle polling flowchart using ACK
Write cycle
in progress
Start condition
Device select
with RW = 0
ACK
NO
returned
First byte of instruction
with RW = 0 already
decoded by the device
YES
Next
Operation is
addressing the
memory
NO
YES
Send Address
and Receive ACK
ReStart
NO
YES
Stop
StartCondition
Data for the
Write cperation
Device select
with RW = 1
Continue the
Continue the
Random Read operation
Write operation
AI01847de
1. The seven most significant bits of the Device Select code of a Random Read (bottom right box in the
figure) must be identical to the seven most significant bits of the Device Select code of the Write (polling
instruction in the figure).
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Instructions
5.2
Read operations
Read operations are performed independently of the state of the Write Control (WC) signal.
After the successful completion of a Read operation, the device internal address counter is
incremented by one, to point to the next byte address.
For the Read instructions, after each byte read (data out), the device waits for an
acknowledgment (data in) during the 9th bit time. If the bus master does not acknowledge
during this 9th time, the device terminates the data transfer and switches to its Standby
mode.
Figure 10. Read mode sequences
ACK
NO ACK
Current
Address
Read
Dev sel
Data out
R/W
ACK
ACK
ACK
ACK
NO ACK
Random
Address
Read
Dev sel *
Byte addr
Byte addr
Dev sel *
Data out
R/W
R/W
ACK
ACK
ACK
NO ACK
Data out N
Sequential
Current
Read
Dev sel
Data out 1
R/W
ACK
R/W
ACK
ACK
ACK
R/W
ACK
Sequention
Random
Read
Dev sel *
Byte addr
Byte addr
Dev sel *
Data out1
ACK
NO ACK
Data out N
AI01105d
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Instructions
M24128-BW M24128-BR M24128-BF M24128-DF
5.2.1
Random Address Read
A dummy Write is first performed to load the address into this address counter (as shown in
Figure 10) but without sending a Stop condition. Then, the bus master sends another Start
condition, and repeats the device select code, with the RW bit set to 1. The device
acknowledges this, and outputs the contents of the addressed byte. The bus master must
not acknowledge the byte, and terminates the transfer with a Stop condition.
5.2.2
Current Address Read
For the Current Address Read operation, following a Start condition, the bus master only
sends a device select code with the R/W bit set to 1. The device acknowledges this, and
outputs the byte addressed by the internal address counter. The counter is then
incremented. The bus master terminates the transfer with a Stop condition, as shown in
Figure 10, without acknowledging the byte.
Note that the address counter value is defined by instructions accessing either the memory
or the Identification page. When accessing the Identification page, the address counter
value is loaded with the byte location in the Identification page, therefore the next Current
Address Read in the memory uses this new address counter value. When accessing the
memory, it is safer to always use the Random Address Read instruction (this instruction
loads the address counter with the byte location to read in the memory, see Section 5.2.1)
instead of the Current Address Read instruction.
5.2.3
Sequential Read
This operation can be used after a Current Address Read or a Random Address Read. The
bus master does acknowledge the data byte output, and sends additional clock pulses so
that the device continues to output the next byte in sequence. To terminate the stream of
bytes, the bus master must not acknowledge the last byte, and must generate a Stop
condition, as shown in Figure 10.
The output data comes from consecutive addresses, with the internal address counter
automatically incremented after each byte output. After the last memory address, the
address counter “rolls-over”, and the device continues to output data from memory address
00h.
5.3
Read Identification Page (M24128-D only)
The Identification Page (64 bytes) is an additional page which can be written and (later)
permanently locked in Read-only mode.
The Identification Page can be read by issuing an Read Identification Page instruction. This
instruction uses the same protocol and format as the Random Address Read (from memory
array) with device type identifier defined as 1011b. The MSB address bits A15/A6 are don't
care, the LSB address bits A5/A0 define the byte address inside the Identification Page. The
number of bytes to read in the ID page must not exceed the page boundary (e.g.: when
reading the Identification Page from location 10d, the number of bytes should be less than
or equal to 54, as the ID page boundary is 64 bytes).
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M24128-BW M24128-BR M24128-BF M24128-DF
Initial delivery state
5.4
Read the lock status (M24128-D only)
The locked/unlocked status of the Identification page can be checked by transmitting a
specific truncated command [Identification Page Write instruction + one data byte] to the
device. The device returns an acknowledge bit if the Identification page is unlocked,
otherwise a NoAck bit if the Identification page is locked.
Right after this, it is recommended to transmit to the device a Start condition followed by a
Stop condition, so that:
•
Start: the truncated command is not executed because the Start condition resets the
device internal logic,
•
Stop: the device is then set back into Standby mode by the Stop condition.
6
Initial delivery state
The device is delivered with all the memory array bits and Identification page bits set to 1
(each byte contains FFh).
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Maximum rating
M24128-BW M24128-BR M24128-BF M24128-DF
7
Maximum rating
Stressing the device outside the ratings listed in Table 5 may cause permanent damage to
the device. These are stress ratings only, and operation of the device at these, or any other
conditions outside those indicated in the operating sections of this specification, is not
implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Table 5. Absolute maximum ratings
Symbol
Parameter
Min.
Max.
Unit
Ambient operating temperature
Storage temperature
–40
–65
130
150
°C
°C
°C
mA
V
TSTG
TLEAD
IOL
Lead temperature during soldering
DC output current (SDA = 0)
Input or output range
see note (1)
-
5
VIO
–0.50
–0.50
-
6.5
VCC
Supply voltage
6.5
V
VESD
Electrostatic pulse (Human Body model)(2)
4000
V
1. Compliant with JEDEC Std J-STD-020D (for small body, Sn-Pb or Pb assembly), the ST
ECOPACK® 7191395 specification, and the European directive on Restrictions on Hazardous
Substances (RoHS) 2002/95/EU.
2. Positive and negative pulses applied on different combinations of pin connections, according to
AEC-Q100-002 (compliant with JEDEC Std JESD22-A114, C1=100 pF, R1=1500 Ω).
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DC and AC parameters
8
DC and AC parameters
This section summarizes the operating and measurement conditions, and the DC and AC
characteristics of the device.
Table 6. Operating conditions (voltage range W)
Symbol
Parameter
Min.
Max.
Unit
VCC
TA
Supply voltage
2.5
–40
-
5.5
85
1
V
Ambient operating temperature
Operating clock frequency
°C
fC
MHz
Table 7. Operating conditions (voltage range R)
Symbol
Parameter
Min.
Max.
Unit
VCC
TA
Supply voltage
1.8
–40
-
5.5
85
1
V
Ambient operating temperature
Operating clock frequency
°C
fC
MHz
Table 8. Operating conditions (voltage range F)
Symbol
Parameter
Min.
Max.
Unit
VCC
TA
Supply voltage
1.7
–40
-
5.5
85
1
V
Ambient operating temperature
Operating clock frequency
°C
fC
MHz
Table 9. AC measurement conditions
Symbol
Cbus
Parameter
Min.
Max.
Unit
Load capacitance
100
pF
ns
V
SCL input rise/fall time, SDA input fall time
Input levels
-
50
0.2 VCC to 0.8 VCC
0.3 VCC to 0.7 VCC
Input and output timing reference levels
V
Figure 11. AC measurement I/O waveform
Input voltage levels
Input and output
Timing reference levels
0.8V
CC
CC
0.7V
0.3V
CC
CC
0.2V
MS19774V1
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DC and AC parameters
Symbol
M24128-BW M24128-BR M24128-BF M24128-DF
Table 10. Input parameters
Parameter(1)
Test condition
Input capacitance (SDA)
Min. Max. Unit
CIN
CIN
ZL
-
-
-
8
6
-
pF
pF
kΩ
kΩ
Input capacitance (other pins)
-
VIN < 0.3 VCC
VIN > 0.7 VCC
50
500
Input impedance (E2, E1, E0, WC)(2)
ZH
-
1. Characterized only, not tested in production.
2. E2, E1, E0 input impedance when the memory is selected (after a Start condition).
Table 11. Cycling performance by groups of four bytes
Symbol
Parameter
Test condition(1)
Max.
Unit
TA ≤ 25 °C, VCC(min) < VCC
<
4,000,000
Write cycle
Write cycle(3)
VCC(max)
Ncycle
endurance(2)
TA = 85 °C, VCC(min) < VCC < VCC(max) 1,200,000
1. Cycling performance for products identified by process letter K.
2. The Write cycle endurance is defined for groups of four data bytes located at addresses [4*N,
4*N+1, 4*N+2, 4*N+3] where N is an integer. The Write cycle endurance is defined by
characterization and qualification.
3. A Write cycle is executed when either a Page Write, a Byte Write, a Write Identification Page or
a Lock Identification Page instruction is decoded. When using the Byte Write, the Page Write or
the Write Identification Page, refer also to Section 5.1.5: ECC (Error Correction Code) and
Write cycling.
Table 12. Memory cell data retention
Parameter
Data retention(1)
Test condition
TA = 55 °C
Min.
Unit
200
Year
1. For products identified by process letter K. The data retention behavior is checked in
production. The 200-year limit is defined from characterization and qualification results.
Table 13. DC characteristics (M24128-BW, device grade 6)
Test conditions (in addition to those
Symbol
Parameter
Min.
Max.
Unit
in Table 6)
Input leakage current
(SCL, SDA, E2, E1,
E0)
VIN = VSS or VCC, device in Standby
mode
ILI
-
± 2
µA
Output leakage
current
SDA in Hi-Z, external voltage applied
on SDA: VSS or VCC
ILO
-
-
-
-
± 2
1(1)
2
µA
mA
mA
mA
VCC = 2.5 V, fc = 400 kHz
(rise/fall time < 50 ns)
VCC = 5.5 V, fc = 400 kHz
(rise/fall time < 50 ns)
ICC
Supply current (Read)
2.5 V < VCC < 5.5 V, fc = 1 MHz(2)
(rise/fall time < 50 ns)
2.5
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DC and AC parameters
Table 13. DC characteristics (M24128-BW, device grade 6) (continued)
Test conditions (in addition to those
Symbol
Parameter
Min.
Max.
2(3)(4)
2
Unit
mA
µA
in Table 6)
ICC0
Supply current (Write) During tW, 2.5 V < VCC < 5.5 V
Device not selected(5), VIN = VSS or
-
-
VCC, VCC = 2.5 V
Standby supply
current
ICC1
Device not selected(5), VIN = VSS or
VCC, VCC = 5.5 V
-
3
µA
V
Input low voltage
(SCL, SDA, WC)
VIL
-
–0.45
0.7 VCC
0.3 VCC
6.5
Input high voltage
(SCL, SDA)
-
V
VIH
Input high voltage
(WC, E2, E1, E0)
-
0.7 VCC VCC+0.6
V
I
OL = 2.1 mA, VCC = 2.5 V or
VOL
Output low voltage
-
0.4
V
IOL = 3 mA, VCC = 5.5 V
1. 2 mA for previous devices identified by process letter A.
2. Only for devices identified by process letter K (devices operating at fC max = 1 MHz, see
Table 18).
3. Characterized value, not tested in production.
4. 5 mA for previous devices identified by process letter A.
5. The device is not selected after power-up, after a Read instruction (after the Stop condition), or
after the completion of the internal write cycle tW (tW is triggered by the correct decoding of a
Write instruction).
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DC and AC parameters
M24128-BW M24128-BR M24128-BF M24128-DF
Table 14. DC characteristics (M24128-BR, device grade 6)
Test conditions(1) (in addition
Symbol
Parameter
Min.
Max.
Unit
to those in Table 7)
Input leakage current
(E0, E1, E2, SCL, SDA)
VIN = VSS or VCC, device in
Standby mode
ILI
-
± 2
± 2
µA
µA
mA
mA
mA
µA
V
SDA in Hi-Z, external voltage
applied on SDA: VSS or VCC
ILO
Output leakage current
Supply current (Read)
-
VCC = 1.8 V, fc= 400 kHz
fc= 1 MHz(2)
-
0.8
ICC
-
2.5
During tW, VCC = 1.81.7 V < VCC
< 2.5 V
ICC0
ICC1
VIL
Supply current (Write)
Standby supply current
-
-
2(3)(4)
1
Device not selected(5)
,
VIN = VSS or VCC, VCC = 1.8 V
Input low voltage
(SCL, SDA, WC)
1.8 V ≤ VCC < 2.5 V
–0.45
0.75 VCC
0.25 VCC
6.5
Input high voltage
(SCL, SDA)
1.8 V ≤ VCC < 2.5 V
V
VIH
Input high voltage
(WC, E2, E1, E0)
1.8 V ≤ VCC < 2.5 V
0.75 VCC VCC+0.6
0.2
V
V
VOL
Output low voltage
IOL = 1 mA, VCC = 1.8 V(6)
-
1. If the application uses the voltage range R device with 2.5 V < Vcc < 5.5 V and -40 °C < TA <
+85 °C, please refer to Table 13 instead of this table.
2. Only for devices identified with process letter K.
3. Characterized value, not tested in production.
4. 3 mA for previous devices identified by process letter A.
5. The device is not selected after power-up, after a Read instruction (after the Stop condition), or
after the completion of the internal write cycle tW (tW is triggered by the correct decoding of a
Write instruction).
6. IOL = 0.7 mA for devices identified by process letters G or S.
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DC and AC parameters
Table 15. DC characteristics (M24128-R, device grade 6)
Test conditions (in addition to
Symbol
Parameter
Min.
Max.
Unit
those in Table 7)
VIN = VSS or VCC
Input leakage current
(E1, E2, SCL, SDA)
ILI
-
-
-
-
-
± 2
± 2
1
µA
µA
device in Standby mode
SDA in Hi-Z, external voltage
applied on SDA: VSS or VCC
ILO
Output leakage current
Supply current (Read)
VCC = 1.8 V, fc= 400 kHz
VCC = 2.5 V, fc =400 kHz
VCC = 5.5 V, fc =400 kHz
mA
mA
mA
1
ICC
1.5
fc= 1 MHz
-
-
-
1.5
mA
mA
µA
(1)
ICC0
Supply current (Write)
Standby supply current
During tW
Device not selected(2)
VIN = VSS or VCC, VCC = 1.8 V
,
3
5
ICC1
Device not selected(1)
,
-
µA
VIN = VSS or VCC, VCC = 5.5 V
1.8 V ≤ VCC < 2.5 V
2.5 V ≤ VCC < 5.5 V
1.8 V ≤ VCC < 2.5 V
2.5 V ≤ VCC < 5.5 V
–0.45
–0.45
0.25 VCC
0.30 VCC
V
V
V
V
V
V
V
Input low voltage
(SCL, SDA, WC)
VIL
VIH
0.75 VCC VCC+1
0.70 VCC 0 VCC+1
Input high voltage
(SCL, SDA)
I
OL = 1.0 mA, VCC = 1.8 V
-
-
-
0.2
0.4
0.4
VOL
Output low voltage
IOL = 2.1 mA, VCC = 2.5 V
IOL = 3.0 mA, VCC = 5.5 V
1. Characterized only, not tested in production.
2. The device is not selected after power-up, after a Read instruction (after the Stop condition), or
after the completion of the internal write cycle tW (tW is triggered by the correct decoding of a
Write instruction).
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DC and AC parameters
M24128-BW M24128-BR M24128-BF M24128-DF
Table 16. DC characteristics (M24128-BF, M24128-DF, device grade 6)
Test conditions(1) (in addition
Symbol
Parameter
Min.
Max.
Unit
µA
to those in Table 8)
VIN = VSS or VCC
Input leakage current
(E0, E1, E2, SCL, SDA)
ILI
-
-
-
-
± 2
± 2
0.8
2.5
device in Standby mode
SDA in Hi-Z, external voltage
applied on SDA: VSS or VCC
ILO
Output leakage current
Supply current (Read)
µA
VCC = 1.7 V, fc= 400 kHz
fc= 1 MHz(2)
mA
mA
ICC
ICC
Supply current (Read)
Supply current (Write)
VCC = 1.6 V, fc= 400 kHz
-
-
0.8
mA
mA
ICC0
During tW 1.7 V < VCC < 2.5 V
2(3)(4)
Device not selected(5)
VIN = VSS or VCC, VCC = 1.7 V
,
ICC1
VIL
Standby supply current
-
1
µA
V
Input low voltage
(SCL, SDA, WC)
1.7 V ≤ VCC < 2.5 V
–0.45
0.25 VCC
6.5
Input high voltage
(SCL, SDA)
1.7 V ≤ VCC < 2.5 V
0.75 VCC
V
VIH
Input high voltage
(WC, E2, E1, E0)
1.7 V ≤ VCC < 2.5 V
0.75 VCC VCC+0.6
0.2
V
V
VOL
Output low voltage
IOL = 1 mA, VCC = 1.7 V
-
1. If the application uses the voltage range F device with 2.5 V < VCC < 5.5 V and -40 °C < TA <
+85 °C, please refer to Table 13 instead of this table.
2. Only for devices identified by process letter K (see Table 18).
3. Characterized value, not tested in production.
4. 3 mA for previous devices identified by process letter A.
5. The device is not selected after power-up, after a Read instruction (after the Stop condition), or
after the completion of the internal write cycle tW (tW is triggered by the correct decoding of a
Write instruction).
28/40
DocID16892 Rev 23
M24128-BW M24128-BR M24128-BF M24128-DF
DC and AC parameters
Table 17. 400 kHz AC characteristics
Parameter
Symbol
Alt.
Min.
Max.
Unit
fC
fSCL
tHIGH
tLOW
tF
Clock frequency
-
400
kHz
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
tCHCL
tCLCH
Clock pulse width high
Clock pulse width low
SDA (out) fall time
600
-
-
1300
20(2)
300
(1)
tQL1QL2
tXH1XH2
tXL1XL2
tDXCH
(3)
(3)
tR
Input signal rise time
Input signal fall time
(3)
(3)
tF
tSU:DAT Data in set up time
tHD:DAT Data in hold time
100
0
-
tCLDX
-
(4)
tCLQX
tDH
tAA
Data out hold time
100(5)
-
(6)
tCLQV
Clock low to next data valid (access time)
-
900
tCHDL
tDLCL
tCHDH
tSU:STA Start condition setup time
tHD:STA Start condition hold time
tSU:STO Stop condition set up time
600
600
600
-
-
-
Time between Stop condition and next Start
condition
tDHDL
tBUF
1300
-
ns
(7)(1)
tWLDL
tSU:WC WC set up time (before the Start condition)
tHD:WC WC hold time (after the Stop condition)
0
1
-
-
-
µs
µs
(8)(1)
tDHWH
tW
tWR
Internal Write cycle duration
5
ms
Pulse width ignored (input filter on SCL and
SDA) - single glitch
80(9)
ns
(1)
tNS
-
1. Characterized only, not tested in production.
2. With CL = 10 pF.
3. There is no min. or max. values for the input signal rise and fall times. It is however
recommended by the I²C specification that the input signal rise and fall times be more than
20 ns and less than 300 ns when fC < 400 kHz.
4. To avoid spurious Start and Stop conditions, a minimum delay is placed between SCL=1 and
the falling or rising edge of SDA.
5. 200 ns for previous devices identified by process letter A.
6. tCLQV is the time (from the falling edge of SCL) required by the SDA bus line to reach either
0.3VCC or 0.7VCC, assuming that Rbus × Cbus time constant is within the values specified in
Figure 12.
7. WC=0 set up time condition to enable the execution of a WRITE command.
8. WC=0 hold time condition to enable the execution of a WRITE command.
9. 100 ns for previous devices identified by process letter A.
DocID16892 Rev 23
29/40
DC and AC parameters
M24128-BW M24128-BR M24128-BF M24128-DF
Table 18. 1 MHz AC characteristics
Parameter(1)
Clock frequency
Symbol
Alt.
Min.
Max.
Unit
fC
fSCL
0
1
-
MHz
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
tCHCL
tHIGH Clock pulse width high
tLOW Clock pulse width low
260
tCLCH
500
-
(2)
(2)
tXH1XH2
tXL1XL2
tR
tF
tF
Input signal rise time
Input signal fall time
SDA (out) fall time
(2)
(2)
tQL1QL2
20(4)
50
120
(3)
tDXCX
tCLDX
tSU:DAT Data in setup time
tHD:DAT Data in hold time
-
0
-
(5)
tCLQX
tDH
tAA
Data out hold time
100
-
-
(6)
tCLQV
Clock low to next data valid (access time)
450
tCHDL
tDLCL
tCHDH
tSU:STA Start condition setup time
tHD:STA Start condition hold time
tSU:STO Stop condition setup time
250
250
250
-
-
-
Time between Stop condition and next Start
condition
tDHDL
tBUF
500
-
ns
(7)(3)
tWLDL
tSU:WC WC set up time (before the Start condition)
tHD:WC WC hold time (after the Stop condition)
0
1
-
-
-
µs
µs
(8)(3)
tDHWH
tW
tWR
Write time
5
ms
Pulse width ignored (input filter on SCL and
SDA)
(3)
tNS
-
80
ns
1. Only for M24128 devices identified by the process letter K.
2. There is no min. or max. values for the input signal rise and fall times. It is however
recommended by the I²C specification that the input signal rise and fall times be less than
120 ns when fC < 1 MHz.
3. Characterized only, not tested in production.
4. With CL = 10 pF.
5. To avoid spurious Start and Stop conditions, a minimum delay is placed between SCL=1 and
the falling or rising edge of SDA.
6. tCLQV is the time (from the falling edge of SCL) required by the SDA bus line to reach either
0.3 VCC or 0.7 VCC, assuming that the Rbus × Cbus time constant is within the values specified
in Figure 12.
7. WC=0 set up time condition to enable the execution of a WRITE command.
8. WC=0 hold time condition to enable the execution of a WRITE command.
30/40
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M24128-BW M24128-BR M24128-BF M24128-DF
DC and AC parameters
Figure 12. Maximum R
value versus bus parasitic capacitance (C ) for
bus
bus
2
an I C bus at maximum frequency f = 400 kHz
C
100
The R
x C time constant
bus
bus
must be below the 400 ns
time constant line represented
on the left.
V
CC
10
R
bus
Here R
bus
× C = 120 ns
bus
4 k
SCL
SDA
I²C bus
master
M24xxx
1
30 pF
C
bus
10
100
Bus line capacitor (pF)
1000
ai14796b
Figure 13. Maximum R
value versus bus parasitic capacitance C ) for
bus
bus
2
an I C bus at maximum frequency f = 1MHz
C
V
100
CC
R
bus
The R
× C
time constant
bus
bus
must be below the 150 ns
time constant line represented
on the left.
SCL
SDA
I²C bus
master
10
4
M24xxx
Here,
C
×
bus
= 120 ns
C
R
bus
bus
1
10
30
Bus line capacitor (pF)
100
MS19745V1
DocID16892 Rev 23
31/40
DC and AC parameters
M24128-BW M24128-BR M24128-BF M24128-DF
Figure 14. AC waveforms
Start
condition
Start
condition
Stop
condition
tXL1XL2
tCHCL
tXH1XH2
SCL
tCLCH
tDLCL
tXL1XL2
SDA In
WC
SDA
Input
tCHDL
tCLDX
tDXCH
SDA
Change
tXH1XH2
tCHDH
tDHDL
tDHWH
tWLDL
Stop
condition
Start
condition
SCL
SDA In
tW
Write cycle
tCHDH
tCHDL
SCL
tCLQV
tCLQX
Data valid
tQL1QL2
Data valid
SDA Out
AI00795g
32/40
DocID16892 Rev 23
M24128-BW M24128-BR M24128-BF M24128-DF
Package mechanical data
9
Package mechanical data
In order to meet environmental requirements, ST offers these devices in different grades of
®
®
ECOPACK packages, depending on their level of environmental compliance. ECOPACK
specifications, grade definitions and product status are available at: www.st.com.
®
ECOPACK is an ST trademark.
Figure 15. TSSOP8 – 8-lead thin shrink small outline, package outline
1. Drawing is not to scale.
Table 19. TSSOP8 – 8-lead thin shrink small outline, package mechanical data
millimeters
Min.
inches(1)
Symbol
Typ.
Max.
Typ.
Min.
Max.
A
–
–
–
1.200
0.150
1.050
0.300
0.200
0.100
3.100
–
–
–
0.0472
0.0059
0.0413
0.0118
0.0079
0.0039
0.1220
–
A1
A2
b
0.050
0.800
0.190
0.090
–
–
0.0020
0.0315
0.0075
0.0035
–
1.000
–
0.0394
–
c
–
–
CP
D
–
–
3.000
0.650
6.400
4.400
0.600
1.000
–
2.900
–
0.1181
0.0256
0.2520
0.1732
0.0236
0.0394
–
0.1142
–
e
E
6.200
4.300
0.450
–
6.600
4.500
0.750
–
0.2441
0.1693
0.0177
–
0.2598
0.1772
0.0295
–
E1
L
L1
α
0°
8°
0°
8°
1. Values in inches are converted from mm and rounded to four decimal digits.
DocID16892 Rev 23
33/40
Package mechanical data
M24128-BW M24128-BR M24128-BF M24128-DF
Figure 16. SO8N – 8-lead plastic small outline, 150 mils body width, package outline
h x 45˚
A2
A
c
ccc
b
e
0.25 mm
D
GAUGE PLANE
k
8
1
E1
E
L
A1
L1
SO-A
1. Drawing is not to scale.
Table 20. SO8N – 8-lead plastic small outline, 150 mils body width, package data
millimeters
Min
inches (1)
Symbol
Typ
Max
Typ
Min
Max
A
–
–
1.750
0.250
–
–
–
0.0689
0.0098
–
A1
A2
b
–
0.100
1.250
0.280
0.170
–
–
0.0039
0.0492
0.0110
0.0067
–
–
–
–
0.480
0.230
0.100
5.000
6.200
4.000
–
–
0.0189
0.0091
0.0039
0.1969
0.2441
0.1575
–
c
–
–
–
ccc
D
–
4.900
6.000
3.900
1.270
–
4.800
5.800
3.800
–
0.1929
0.2362
0.1535
0.0500
–
0.1890
0.2283
0.1496
–
E
E1
e
h
0.250
0°
0.500
8°
0.0098
0°
0.0197
8°
k
–
–
L
–
0.400
–
1.270
–
–
0.0157
–
0.0500
–
L1
1.040
0.0409
1. Values in inches are converted from mm and rounded to four decimal digits.
34/40
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M24128-BW M24128-BR M24128-BF M24128-DF
Package mechanical data
Figure 17. UFDFPN8 (MLP8) – package outline (UFDFPN: Ultra thin Fine pitch
Dual Flat Package, No lead)
e
b
D
L1
L3
Pin 1
E2
K
E
L
A
D2
eee
A1
1. Drawing is not to scale.
ZW_MEeV2
2. The central pad (area E2 by D2 in the above illustration) is internally pulled to VSS. It must not be
connected to any other voltage or signal line on the PCB, for example during the soldering process.
Table 21. UFDFPN8 (MLP8) – package dimensions (UFDFPN: Ultra thin Fine pitch
Dual Flat Package, No lead)
millimeters
Min
inches(1)
Symbol
Typ
Max
Typ
Min
Max
A
0.550
0.450
0.000
0.200
1.900
1.200
2.900
1.200
–
0.600
0.050
0.300
2.100
1.600
3.100
1.600
–
0.0217
0.0177
0.0000
0.0079
0.0748
0.0472
0.1142
0.0472
–
0.0236
0.0020
0.0118
0.0827
0.0630
0.1220
0.0630
–
A1
0.020
0.0008
b
0.250
0.0098
D
2.000
0.0787
D2 (rev MC)
–
–
E
3.000
0.1181
E2 (rev MC)
–
–
e
0.500
0.0197
K (rev MC)
–
–
–
–
–
0.300
0.300
–
–
–
–
–
–
–
0.0118
0.0118
–
–
L
L1
0.500
0.150
–
0.0197
0.0059
–
L3
0.300
0.080
0.0118
0.0031
eee(2)
–
–
1. Values in inches are converted from mm and rounded to four decimal digits.
2. Applied for exposed die paddle and terminals. Exclude embedding part of exposed die paddle
from measuring.
DocID16892 Rev 23
35/40
Package mechanical data
M24128-BW M24128-BR M24128-BF M24128-DF
Figure 18. M24128-DFCS6TP/K, WLCSP 8-bump wafer-level chip
scale package outline
bbb
Z
e2
D
Y
X
e
F
Detail A
E
e1
H
e3
aaa
A
A2
G
Reference
(4X)
Orientation
Wafer back side
Side view
Bumps side
Bump
A1
eee
Z
Z
b
Seating plane
Øccc M
X Y
Z
Z
Øddd M
Detail A
Rotated 90 °
1Ch_ME_V1
36/40
DocID16892 Rev 23
M24128-BW M24128-BR M24128-BF M24128-DF
Package mechanical data
Table 22. M24128-DFCS6TP/K, WLCSP 8-bump wafer-level chip scale package
mechanical data
millimeters
Min
inches(1)
Symbol
Typ
Max
Typ
Min
Max
A
0.540
0.190
0.350
0.270
1.271
1.081
0.800
0.693
0.400
0.400
0.184
0.236
0.194
8
0.500
0.580
0.0213
0.0075
0.0138
0.0106
0.0500
0.0425
0.0315
0.0273
0.0157
0.0157
0.0072
0.0093
0.0076
8
0.0197
0.0228
A1
A2
b
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
D
E
e
e1
e2
e3
F
G
H
N (number of terminals)
aaa
bbb
ccc
ddd
eee
0.110
0.110
0.110
0.060
0.060
0.0043
0.0043
0.0043
0.0024
0.0024
1. Values in inches are converted from mm and rounded to four decimal digits.
DocID16892 Rev 23
37/40
Part numbering
M24128-BW M24128-BR M24128-BF M24128-DF
10
Part numbering
Table 23. Ordering information scheme
M24128 - D
Example:
W
MN 6
T
P /K
Device type
M24 = I2C serial access EEPROM
Device function
128 = 128 Kbit (16 K x 8)
Device family
B = Without Identification page
D = With additional Identification page
Operating voltage
W = VCC = 2.5 V to 5.5 V
R = VCC = 1.8 V to 5.5 V
F = VCC = 1.7 V to 5.5 V
Package
MN = SO8 (150 mil width)(1)
DW = TSSOP8 (169 mil width)(1)
MC = UFDFPN8 (MLP8)(1)
CS = 8-bump WLCSP(1)
Device grade
6 = Industrial: device tested with standard test flow over –40 to 85 °C
Option
blank = standard packing
T = Tape and reel packing
Plating technology
P or G = ECOPACK® (RoHS compliant)
Process(2)
/K = Manufacturing technology code
1. RoHS-compliant and halogen-free (ECOPACK2®)
2. The process letters apply to WLCSP devices only. The process letters appear on the device
package (marking) and on the shipment box. Please contact your nearest ST Sales Office for
further information.
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M24128-BW M24128-BR M24128-BF M24128-DF
Revision history
11
Revision history
Table 24. Document revision history
Changes
Date
Revision
12-Jan-2010
23-Mar-2010
18
19
Section 4.9: ECC (error correction code) and write cycling modified.
Removed PDIP package.
Updated UFDFPN8 silhouette on cover page, Figure 16: UFDFPN8
(MLP8) – 8-lead ultra thin fine pitch dual flat package no lead 2 × 3mm,
package outline and Table 19: UFDFPN8 (MLP8) 8-lead ultra thin fine
pitch dual flat package no lead 2 x 3 mm, mechanical data to add MC
version.
21-Nov-2011
20
Renamed Figure 2: 8-pin package connections.
Removed “Available M24128 products“ table.
Updated disclaimer on last page.
Datasheet revision 20 split into:
– M24128-125 datasheet for automotive products (range 3),
– M24128-BW M24128-BR M24128-BF M24128-DF (this datasheet) for
standard products (range 6).
Updated
– Cycling: 4 million cycles
– Data retention: 200 years
– Table 17: tCLQX, tNS
Added
20-Jul-2012
21
– Identification page (for M24128-D devices)
– Table 17: tWLDL and tDHWH
– Table 18 (1 MHz)
20-Nov-2012
04-Apr-2013
22
23
Corrected “Device family” data in Table 23: Ordering information scheme.
Document reformatted.
Removed footnote “3” in Table 2: Device select code.
Renamed Figure 17: UFDFPN8 (MLP8) – package outline (UFDFPN:
Ultra thin Fine pitch Dual Flat Package, No lead) and Table 21: UFDFPN8
(MLP8) – package dimensions (UFDFPN: Ultra thin Fine pitch Dual Flat
Package, No lead).
Updated package information in Table 23: Ordering information scheme.
DocID16892 Rev 23
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M24128-BW M24128-BR M24128-BF M24128-DF
Please Read Carefully:
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