EMIF01-1003M3_10 [STMICROELECTRONICS]
1 line IPADâ¢, EMI filter and ESD protection in Micro QFN package; 1号线IPADâ ?? ¢ ， EMI滤波器和ESD保护微型QFN封装
| 型号： | EMIF01-1003M3_10 |
| 厂家： | 
ST |
| 描述： | 1 line IPADâ¢, EMI filter and ESD protection in Micro QFN package |
| 文件： | 总11页 (文件大小：136K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
EMIF01-1003M3
1 line IPAD™, EMI filter and ESD protection in Micro QFN package
Features
■ Single line EMI symmetrical (I/O) low-pass filter
■ High efficiency in EMI filtering
■ Very low PCB space consumption:
– 1.0 mm x 0.6 mm
■ Very thin package: 0.6 mm max
SOT-883
(JEDEC MO-236AA compliant)
■ High efficiency in ESD suppression
(IEC 61000-4-2 level 4)
■ High reliability offered by monolithic integration
Figure 1.
Pin configuration (top view)
■ High reduction of parasitic elements through
integration and wafer level packaging
IN
OUT
■ Lead free package
■ Easy layout and flexibility due to single line
topology
■ Low capacitance
GND
Complies with following standards
■ IEC 61000-4-2 level 4 input and output pins:
– 15 kV (air discharge)
Figure 2.
Basic cell configuration
– 8 kV (contact discharge)
■ MIL STD 883G - Method 3015-7 Class 3B (all
Input
Output
pins)
R = 100 Ω
= 30 pF typ. @ 0 V
C
LINE
Applications
Where EMI filtering in ESD sensitive equipment is
required:
■ Keyboard for mobile phones
■ Computers and printers
■ Communication systems
■ MCU boards
Description
The EMIF01-1003M3 is a 1 line highly integrated
device designed to suppress EMI/RFI noise in all
systems exposed to electromagnetic interference.
This filter includes ESD protection circuitry, which
prevents damage to the application when
subjected to ESD surges up to 15 kV on all pins.
TM: IPAD is a trademark of STMicroelectronics
November 2010
Doc ID 13976 Rev 2
1/11
www.st.com
11
Characteristics
EMIF01-1003M3
1
Characteristics
Table 1.
Symbol
Absolute ratings (limiting values at T
= 25° C unless otherwise specified)
amb
Parameter
Value
Unit
ESD discharge IEC 61000-4-2 air discharge on input and output pins
ESD discharge IEC 61000-4-2 contact discharge on input and output pins
15
8
VPP
kV
Tj
Junction temperature
125
°C
°C
°C
Top
Tstg
Operating temperature range
Storage temperature range
-40 to + 85
-55 to +150
Figure 3.
Electrical characteristics (definitions)
I
Symbol
Parameter
Breakdown voltage
IF
VBR
IRM
VRM
VCL
RD
IPP
IR
Cline
FO
=
=
=
=
=
=
=
=
=
Leakage current @ VRM
Stand-off voltage
Clamping voltage
Dynamic resistance
Peak pulse current
Breakdown current
Line capacitance
VF
V
CL VBR VRM
V
IRM
IR
Cut-off frequency
IPP
Table 2.
Symbol
Electrical characteristics (T
= 25° C)
amb
Test conditions
Min.
Typ.
Max.
Unit
VBR
IRM
IR = 1 mA
5
6.5
8
V
VRM = 3 V per line
Tolerance 10%
100
nA
Ω
RI/O
Cline
S21
100
30
VR= 0 VDC, VOSC = 30 mV, F = 1 MHz
F = 900 MHz
39
pF
dB
-25
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Doc ID 13976 Rev 2
EMIF01-1003M3
Characteristics
Figure 4.
S21 attenuation measurement
Figure 5.
Line capacitance versus reverse
voltage applied (typical value)
(V
= 0 V)
bias
dB
0.00
CLINE (pF)
3.50E+01
3.00E+01
2.50E+01
2.00E+01
1.50E+01
1.00E+01
5.00E+00
0.00E+00
-5.00
-10.00
-15.00
-20.00
-25.00
-30.00
VR (V)
F (Hz)
0
1
2
3
4
5
100.0k
1.0M
I-O
10.0M
100.0M
1.0G
Figure 6.
ESD response to IEC 61000-4-2
(+15 kV air discharge)
Figure 7.
ESD response to IEC 61000-4-2
(- 15 kV air discharge)
INPUT
INPUT
OUTPUT
OUTPUT
Doc ID 13976 Rev 2
3/11
Application schematic
EMIF01-1003M3
2
Application schematic
Figure 8.
Application schematic
Keypad protection
Key_Row_1
IN
OUT
GND
Key_Row_2
IN
OUT
GND
Key_Col_y
IN
OUT
GND
4/11
Doc ID 13976 Rev 2
EMIF01-1003M3
Ordering information
3
Ordering information
Figure 9.
Ordering information scheme
EMIF yy
-
xxx z Mx
EMI Filter
Number of lines
Information
x = resistance value (Ohms)
z = capacitance value / 10(pF)
Package
M3 = SOT-883
Doc ID 13976 Rev 2
5/11
Package information
EMIF01-1003M3
4
Package information
●
●
Epoxy meets UL94, V0
Lead-free packages
In order to meet environmental requirements, ST offers these devices in different grades of
®
®
ECOPACK packages, depending on their level of environmental compliance. ECOPACK
specifications, grade definitions and product status are available at: www.st.com.
®
ECOPACK is an ST trademark.
Table 3.
SOT-883 dimensions
Dimensions
Millimeters
Min. Typ. Max. Min. Typ. Max.
E
Ref.
Inches
D
A
0.45
0.50 0.18
0.05 0.00
0.2
A1 0.00
0.02
b
0.10 0.15 0.20 0.04 0.06 0.08
A
A1
b1 0.45 0.50 0.55 0.18 0.20 0.22
D
E
0.60
1.00
0.35
0.65
0.24
0.39
0.14
0.26
L
L1
2
1
b
e
3
e
b1
e1
L
0.20 0.25 0.30 0.08 0.10 0.12
e1
L1 0.20 0.25 0.30 0.08 0.10 0.12
Figure 10. Footprint (dimensions in mm) Figure 11. Marking
0.40
0.40
2
1
0.50
0.20
3
F
0.15
0.40
6/11
Doc ID 13976 Rev 2
EMIF01-1003M3
Figure 12. Tape and reel specification
Package information
Ø 1.55 0.05
4.0 0.1
2.0 0.05
0.55 0.05
0.70 0.05
2.0 0.1
User direction of unreeling
All dimensions in mm
Note:
Product marking may be rotated by 90° for assembly plant differentiation. In no case should
this product marking be used to orient the component for its placement on a PCB. Only pin
1 mark is to be used for this purpose.
Doc ID 13976 Rev 2
7/11
Recommendation on PCB assembly
EMIF01-1003M3
5
Recommendation on PCB assembly
5.1
Stencil opening design
1. General recommendation on stencil opening design
a) Stencil opening dimensions: L (Length), W (Width), T (Thickness).
Figure 13. Stencil opening dimensions
L
T
W
b) General Design Rule
Stencil thickness (T) = 75 ~ 125 µm
W
-----
Aspect Ratio =
≥ 1.5
T
L × W
---------------------------
Aspect Area =
≥ 0.66
2T(L + W)
2. Reference design
a) Stencil opening thickness: 100 µm
b) Stencil opening for leads: Opening to footprint ratio is 90%.
5.2
Solder paste
1. Halide-free flux qualification ROL0 according to ANSI/J-STD-004.
2. “No clean” solder paste is recommended.
3. Offers a high tack force to resist component movement during high speed
4. Solder paste with fine particles: powder particle size is 20-45 µm.
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EMIF01-1003M3
Recommendation on PCB assembly
5.3
Placement
1. Manual positioning is not recommended.
2. It is recommended to use the lead recognition capabilities of the placement system, not
the outline centering
3. Standard tolerance of 0.05 mm is recommended.
4. 3.5 N placement force is recommended. Too much placement force can lead to
squeezed out solder paste and cause solder joints to short. Too low placement force
can lead to insufficient contact between package and solder paste that could cause
open solder joints or badly centered packages.
5. To improve the package placement accuracy, a bottom side optical control should be
performed with a high resolution tool.
6. For assembly, a perfect supporting of the PCB (all the more on flexible PCB) is
recommended during solder paste printing, pick and place and reflow soldering by
using optimized tools.
5.4
5.5
PCB design preference
1. To control the solder paste amount, the closed via is recommended instead of open
vias.
2. The position of tracks and open vias in the solder area should be well balanced. The
symmetrical layout is recommended, in case any tilt phenomena caused by
asymmetrical solder paste amount due to the solder flow away.
Reflow profile
Figure 14. ST ECOPACK® recommended soldering reflow profile for PCB mounting
Temperature (°C)
260°C max
255°C
220°C
180°C
2°C/s recommended
125 °C
6°C/s max
3°C/s max
0
0
1
2
3
4
5
6
7
Time (min)
10-30 sec
90 to 150 sec
90 sec max
Note:
Minimize air convection currents in the reflow oven to avoid component movement.
Doc ID 13976 Rev 2
9/11
Ordering information
EMIF01-1003M3
6
Ordering information
Table 4.
Ordering information
Part number
Marking
Package
SOT-883
Weight
Base qty
Delivery mode
EMIF01-1003M3
F(1)
0.96 mg
12000
Tape and reel (7”)
1. The marking can be rotated by 90° to diferentiate assembly location
7
Revision history
Table 5.
Date
Document revision history
Revision
Changes
07-Oct-2007
03-Nov-2010
1
2
Initial release.
Updated base quantity Table 4.
10/11
Doc ID 13976 Rev 2
EMIF01-1003M3
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Doc ID 13976 Rev 2
11/11
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