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ECMF04-4HSM10Y [STMICROELECTRONICS]

Data Line Filter;
ECMF04-4HSM10Y
型号： ECMF04-4HSM10Y
厂家： ST    ST
描述：

Data Line Filter

LTE
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ECMF04-4HSM10Y  
Datasheet  
Automotive common mode filter with ESD protection  
Features  
•
•
AEC-Q101 qualified  
2.2 GHz differential bandwidth to comply with HDMI 1.4, USB 3.1, MIPI, display  
port  
•
Common mode attenuation on LTE, GSM, and GPS frequencies:  
–
–
–
-20 dB at 0.7 GHz  
-25 dB from 0.8 to 0.9 GHz  
-14 dB at 1.5 GHz  
D1+ Con  
D1- Con  
GND  
D1+ IC  
D1- IC  
10  
9
1
2
3
4
5
•
•
•
•
Wettable flank for automatic optical inspection  
Low PCB space consumption: 3.5 mm²  
Thin package for compact applications: 0.75 mm  
RoHS package  
8
GND  
D2+ Con  
D2- Con  
D2+ IC  
D2- IC  
7
Complies with the following standards  
6
•
•
•
•
•
UL94, V0  
J-STD-020 MSL level 1  
J-STD-002  
IPC7531 footprint and JEDEC registered package  
ISO 10605, IEC 61000-4-2, C = 150 pF – R = 330 Ω level 4:  
–
–
8 kV (contact discharge)  
15 kV (air discharge)  
Product status link  
ECMF04-4HSM10Y  
•
ISO 10605, C = 330 pF – R = 330 Ω level 4:  
–
–
8 kV (contact discharge)  
15 kV (air discharge)  
Product summary  
Order code  
ECMF04-4HSM10Y  
Description  
The ECMF04-4HSM10Y is an integrated common mode filter designed to suppress  
EMI/RFI common mode noise on high speed buses HDMI 1.4, USB 3.1 and MIPI. It  
is designed to replace discrete common mode chokes or LTCC.  
The device embeds ESD protections on connector side to meets ISO 10605  
requirements.  
Packaged in QFN-10L with wettable flank, it is compatible with automatic visual  
inspection.  
DS12743 - Rev 2 - December 2019  
For further information contact your local STMicroelectronics sales office.  
www.st.com  
ECMF04-4HSM10Y  
Characteristics  
1
Characteristics  
Table 1. Absolute maximum ratings (Tamb = 25 °C)  
Symbol Parameter  
Value  
Unit  
ISO 10605 (C = 330 pF, R = 330 Ω):  
Contact discharge  
8
kV  
Air discharge  
15  
V
Peak pulse voltage  
PP  
ISO10605 / IEC 61000-4-2 (C = 150 pF, R = 330 Ω):  
Contact discharge  
8
Air discharge  
15  
I
RMS current  
100  
mA  
°C  
RMS  
T
Operating ambient temperature range  
Storage temperature range  
-55 to +125  
-55 to +150  
op  
T
stg  
Figure 1. Electrical characteristics (definitions)  
I
V
V
Maximum stand-off voltage  
RM  
CL  
IPP  
Clamping voltage at peak pulse current I  
PP  
I
I
Leakage current at V  
Peak pulse current  
Breakdown voltage  
DC serial resistance  
RM  
PP  
RM  
IR  
IRM  
V
BR  
V
VCL  
R
DC  
VRM VBR  
f
Differential cut off frequency  
C
Table 2. Electrical characteristics (Tamb = 25 °C)  
Symbol Test conditions  
Min.  
Typ.  
Max.  
Unit  
V
V
I
I
= 1 mA  
= 3 V  
RM  
6
7
BR  
R
V
I
100  
nA  
Ω
RM  
R
= 20 mA  
= -3 dB  
5.5  
2.2  
27  
DC  
DC  
f
S
DD21  
GHz  
V
c
V
8 kV contact discharge after 30 ns, ISO 10605 (150 pF – 330 Ω)  
CL  
DS12743 - Rev 2  
page 2/11  
ECMF04-4HSM10Y  
Characteristics (curves)  
1.1  
Characteristics (curves)  
Figure 2. Differential attenuation versus frequency  
(Z0_diff = 100 Ω)  
Figure 3. Common mode attenuation versus frequency  
(Z0_com = 50 Ω)  
SDD21 (dB)  
0
SCC21 (dB)  
0
-5  
-10  
-15  
-20  
-25  
-30  
-1  
-2  
-3  
-4  
-35  
F (Hz)  
F (Hz)  
-40  
-5  
10M  
30M  
100M  
300M  
1G  
3G  
10M  
30M  
100M  
300M  
1G  
3G  
Figure 5. ISO 10605 - C = 150 pF, R = 330 Ω (-8 kV contact)  
Figure 4. ISO 10605 - C = 150 pF, R = 330 Ω (+8 kV contact)  
Figure 6. TLP characteristic  
I(A)  
20  
15  
10  
5
0
-5  
-10  
-15  
-20  
V(V)  
-40  
-30  
-20  
-10  
0
10  
20  
30  
40  
DS12743 - Rev 2  
page 3/11  
ECMF04-4HSM10Y  
Characteristics (curves)  
Figure 7. HDMI1.4 – 1.485 Gbps eye diagram without  
device  
Figure 8. HDMI1.4 – 1.485 Gbps eye diagram with device  
Figure 9. MIPI - 5.83 Gbps eye diagram without device  
Figure 10. MIPI - 5.83 Gbps eye diagram with device  
Figure 11. USB3.1 – 5 Gbps eye diagram without device  
(with worst cable and equalizer)  
Figure 12. USB3.1 – 5 Gbps eye diagram with device  
(with worst cable and equalizer)  
DS12743 - Rev 2  
page 4/11  
ECMF04-4HSM10Y  
Package information  
2
Package information  
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages,  
depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product  
status are available at: www.st.com. ECOPACK is an ST trademark.  
2.1  
QFN-10L package information  
Figure 13. QFN-10L package outline  
L
A
D
e
A1  
b
A3  
E
CD  
CW  
Table 3. QFN-10L mechanical data  
Dimensions  
Inches(1)  
Typ.  
Ref.  
Millimeters  
Typ.  
Min.  
0.70  
0.00  
Max.  
0.80  
0.05  
Min.  
Max.  
A
A1  
A3  
b
0.75  
0.0275  
0.0000  
0.0295  
0.0008  
0.0079  
0.0079  
0.1024  
0.0531  
0.0197  
0.0197  
0.0020  
0.0315  
0.0020  
0.02  
0.20  
0.15  
2.55  
1.30  
0.20  
0.25  
2.65  
1.40  
0.0059  
0.1003  
0.0511  
0.0099  
0.1044  
0.0552  
D
2.60  
E
1.35  
e
0.50  
L
0.45  
0.01  
0.10  
0.50  
0.55  
0.09  
0.0177  
0.0003  
0.0039  
0.0217  
0.0032  
CW  
CD  
0.05  
1. Value in inches are converted from mm and rounded to 4 decimal digits  
DS12743 - Rev 2  
page 5/11  
 
ECMF04-4HSM10Y  
PCB assembly recommendations  
3
PCB assembly recommendation  
Figure 14. Recommended PCB layout  
Connector  
Host  
5000 µm  
150 µm  
Pad layout  
350 µm  
350 µm  
Differential  
lanes  
Differential  
lanes  
(Z = 100  
)
(Z = 100  
)
0
0
330 µm  
Figure 16. Recommended stencil opening (mm)  
Figure 15. Recommended PCB stack-up  
0.190  
0.500  
2.190  
Stencil opening thickness: 100 µm  
Figure 17. Wettable flank profile  
3.1  
Solder paste  
1.  
2.  
3.  
4.  
Halide-free flux qualification ROL0 according to ANSI/J-STD-004.  
“No clean” solder paste is recommended.  
Offers a high tack force to resist component movement during high speed.  
Use solder paste with fine particles: powder particle size is 20-38 μm.  
DS12743 - Rev 2  
page 6/11  
 
ECMF04-4HSM10Y  
QFN-10L packing information  
3.2  
QFN-10L packing information  
Figure 18. Footprint recommendations (mm)  
Figure 19. Marking  
0.200  
0.500  
XXYM  
Dot indicates pin 1  
XX: Marking  
Y: Year  
2.200  
M: Month  
Figure 21. Tape and reel orientation  
Figure 20. Package orientation in reel  
Pin 1 located according to EIA-481  
Note: Pocket dimensions are not on scale  
Pocket shape may vary depending on package  
Figure 22. Reel dimensions (mm)  
Figure 23. Inner box dimensions (mm)  
30  
Ø 180 max  
14.4  
2±0.5  
Ø 13  
Ø 60  
Ø 20.2 min  
205  
205  
DS12743 - Rev 2  
page 7/11  
ECMF04-4HSM10Y  
Solder reflow  
Figure 24. Tape and reel outline  
Table 4. Tape and reel mechanical data  
Dimensions  
Millimeters  
Ref.  
Min.  
1.40  
0.80  
1.65  
0.85  
3.9  
Typ.  
Max.  
ØD0  
ØD1  
F
1.50  
1.50  
1.75  
0.95  
4.0  
1.85  
1.05  
4.1  
K0  
P0  
P1  
P2  
W
3.9  
4.0  
4.1  
1.95  
7.9  
2.00  
8.0  
2.05  
8.3  
3.3  
Solder reflow  
Figure 25. ST ECOPACK® recommended soldering reflow profile for PCB mounting  
240-245 °C  
Temperature (°C)  
-2 °C/s  
-3 °C/s  
250  
200  
2 - 3 °C/s  
60 sec  
(90m ax)  
150  
100  
50  
-6°C/s  
0.9 °C/s  
Time (s)  
0
30  
60  
90  
120  
150  
180  
210  
240  
270  
300  
Note:  
Minimize air convection currents in the reflow oven to avoid component movement. Maximum soldering profile  
corresponds to the latest IPC/JEDEC J-STD-020.  
DS12743 - Rev 2  
page 8/11  
ECMF04-4HSM10Y  
Ordering information  
4
Ordering information  
Order code  
Marking  
AY(1)  
Package  
Weight  
Base qty.  
Delivery mode  
ECMF04-4HSM10Y  
QFN-10L  
7 mg  
3000  
Tape and reel  
1. The marking can be rotated by 90° to differentiate assembly location  
DS12743 - Rev 2  
page 9/11  
 
ECMF04-4HSM10Y  
Revision history  
Table 5. Document revision history  
Date  
Version  
Changes  
06-Sep-2018  
09-Dec-2019  
1
2
Initial release.  
Added Stencil opening design and Section 3.1 .  
DS12743 - Rev 2  
page 10/11  
ECMF04-4HSM10Y  
IMPORTANT NOTICE – PLEASE READ CAREFULLY  
STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST  
products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST  
products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement.  
Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of  
Purchasers’ products.  
No license, express or implied, to any intellectual property right is granted by ST herein.  
Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product.  
ST and the ST logo are trademarks of ST. For additional information about ST trademarks, please refer to www.st.com/trademarks. All other product or service  
names are the property of their respective owners.  
Information in this document supersedes and replaces information previously supplied in any prior versions of this document.  
© 2019 STMicroelectronics – All rights reserved  
DS12743 - Rev 2  
page 11/11  

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