BTA24-800BW [STMICROELECTRONICS]
25A TRIACS; 25A双向可控硅型号: | BTA24-800BW |
厂家: | ST |
描述: | 25A TRIACS |
文件: | 总9页 (文件大小:99K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
BTA/BTB24, BTA25, BTA26
and T25 Series
SNUBBERLESS & STANDARD
MAIN FEATURES:
25A TRIACS
A2
Symbol
Value
Unit
A2
A2
G
I
25
A
V
T(RMS)
A1
V
/V
600 and 800
35 to 50
DRM RRM
A1
A2
A1
A2
G
G
I
mA
GT (Q )
1
A2
TO-220AB
(BTB24)
TO-220AB
Insulated
(BTA24)
DESCRIPTION
A1
A2
G
Available either in through-hole of surface and T25
mount packages, the BTA/BTB24-25-26 triac
series is suitable for general purpose AC power
switching. They can be used as an ON/OFF
function in applications such as static relays,
heating regulation, water heaters, induction motor
starting circuits...or for phase control operation in
high power motor speed controllers, soft start
circuits...The snubberless versions (BTA/BTB...W
and T25 series) are specially recommended for
use on inductive loads, thanks to their high
commutation performances.
2
D PAK
(T25G)
A1
A2
G
A1
A2
G
TOP3
RD91
(BTA25)
Insulated
(BTA26)
By using an internal ceramic pad, the BTA series
provides voltage insulated tab (rated at 2500V
RMS) complying with UL standards (File ref.:
E81734).
ABSOLUTE MAXIMUM RATINGS
Symbol
Parameter
RMS on-state current (full sine wave)
Value
Unit
I
A
T(RMS)
D PAK
TO-220AB
Tc = 100°C
Tc = 90°C
25
RD91
TOP3 Ins.
TO-220AB Ins.
F = 60 Hz
Tc = 75°C
t = 16.7 ms
t = 20 ms
I
Non repetitive surge peak on-state
current (full cycle, Tj initial = 25°C)
260
250
A
TSM
F = 50 Hz
tp = 10 ms
450
A s
I t
I t Value for fusing
Critical rate of rise of on-state current
dI/dt
F = 120 Hz
Tj = 125°C
Tj = 25°C
50
/V
A/µs
I
= 2 x I
, tr ≤ 100 ns
G
GT
V
Non repetitive surge peak off-state
voltage
DRM RRM
+ 100
V
/V
tp = 10 ms
V
DSM RSM
I
Peak gate current
tp = 20 µs
Tj = 125°C
Tj = 125°C
4
1
A
GM
P
Average gate power dissipation
W
G(AV)
T
Storage junction temperature range
Operating junction temperature range
- 40 to + 150
- 40 to + 125
stg
°C
T
j
September 2000 - Ed: 3
1/9
BTA/BTB24, BTA25, BTA26 and T25 Series
ELECTRICAL CHARACTERISTICS (Tj = 25°C, unless otherwise specified)
■ SNUBBERLESS (3 Quadrants) T25-G, BTA/BTB24...W, BTA25...W, BTA26...W
Symbol
Test Conditions
Quadrant
T25
BTA/BTB
Unit
T2535
CW
BW
I
(1)
mA
I - II - III
MAX.
35
35
50
GT
V
V
= 12 V
R = 33 Ω
D
D
L
V
V
I - II - III
I - II - III
MAX.
MIN.
1.3
0.2
V
V
GT
= V
R = 3.3 kΩ Tj = 125°C
GD
(2)
DRM
L
I
I = 500 mA
MAX.
MAX.
50
50
75
mA
mA
H
T
I
I
= 1.2 I
GT
I - III
II
70
80
70
80
80
100
1000
22
L
G
dV/dt (2)
V
= 67 % V
gate open Tj = 125°C
Tj = 125°C
MIN.
MIN.
500
13
500
13
V/µs
D
DRM
(dI/dt)c (2) Without snubber
A/ms
■ STANDARD (4 Quadrants): BTA25...B, BTA26...B
Symbol
Test Conditions
Quadrant
Value
Unit
I
(1)
I - II - III
IV
50
100
mA
GT
V
MAX.
V
V
= 12 V
R = 33 Ω
D
D
L
ALL
ALL
MAX.
MIN.
1.3
0.2
V
V
GT
V
= V
R = 3.3 kΩ Tj = 125°C
GD
DRM
L
I
(2)
I = 500 mA
MAX.
MAX.
80
70
mA
mA
H
T
I
I
= 1.2 I
I - III - IV
II
G
GT
L
160
500
10
dV/dt (2)
V
= 67 % V
gate open Tj = 125°C
MIN.
MIN.
V/µs
V/µs
D
DRM
(dV/dt)c (2) (dI/dt)c = 13.3 A/ms
Tj = 125°C
STATIC CHARACTERISTICS
Symbol
Test Conditions
Tj = 25°C
Value
Unit
I
= 35 A
tp = 380 µs
MAX.
MAX.
MAX.
1.55
V
V
(2)
(2)
TM
TM
V
Threshold voltage
Tj = 125°C
Tj = 125°C
Tj = 25°C
Tj = 125°C
0.85
16
5
V
to
R (2)
Dynamic resistance
mΩ
µA
mA
d
I
I
V
= V
DRM RRM
DRM
RRM
MAX.
3
Note 1: minimum IGT is guaranted at 5% of IGT max.
Note 2: for both polarities of A2 referenced to A1
2/9
BTA/BTB24, BTA25, BTA26 and T25 Series
THERMAL RESISTANCES
Symbol
Parameter
Value
Unit
R
Junction to case (AC)
°C/W
th(j-c)
D PAK
TO-220AB
0.8
RD91 (Insulated)
TOP3 Insulated
1.1
TO-220AB Insulated
1.7
45
50
R
Junction to ambient
°C/W
th(j-a)
S = 1 cm
D PAK
TOP3 Insulated
TO-220AB
60
TO-220AB Insulated
S: Copper surface under tab
PRODUCT SELECTOR
Voltage (xxx)
Part Number
Sensitivity
Type
Package
600 V
800 V
BTB24-xxxB
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
50 mA
50 mA
35 mA
50 mA
50 mA
35 mA
50 mA
50 mA
35 mA
Standard
Snubberless
Snubberless
Standard
TO-220AB
TO-220AB
TO-220AB
RD-91
BTA/BTB24-xxxBW
BTA/BTB24-xxxCW
BTA25-xxxB
BTA25-xxxBW
BTA25-xxxCW
BTA26-xxxB
Snubberless
Snubberless
Standard
RD-91
RD-91
TOP3 Ins.
TOP3 Ins.
TOP3 Ins.
BTA26-xxxBW
BTA26-xxxCW
Snubberless
Snubberless
T2535-xxxG
X
X
35 mA
Snubberless
D PAK
BTB: Non insulated TO-220AB package
ORDERING INFORMATION
BT A 24 - 600 BW
TRIAC
SERIES
SENSITIVITY & TYPE
B: 50mA STANDARD
BW: 50mA SNUBBERLESS
CW: 35mA SNUBBERLESS
INSULATION:
A: insulated
B: non insulated
VOLTAGE:
600: 600V
800: 800V
CURRENT:
24: 25A in TO-220AB
25: 25A in Rd91
26: 25A in TOP3
3/9
BTA/BTB24, BTA25, BTA26 and T25 Series
T 25 35 - 600 G
(-TR)
TRIAC
SERIES
PACKAGE:
G: D2PAK
CURRENT: 25A
VOLTAGE:
600: 600V
800: 800V
PACKING MODE:
Blank:Tube
-TR:Tape & Reel
SENSITIVITY:
35: 35mA
OTHER INFORMATION
Part Number
Base
quantity
Packing
mode
Marking
Weight
BTA/BTB24-xxxyz
BTA25-xxxyz
BTA/BTB24xxxyz
BTA25xxxyz
BTA26xxxyz
T2535xxxG
2.3 g
20 g
4.5 g
1.5 g
1.5 g
250
25
Bulk
Bulk
BTA26-xxxyz
120
50
Bulk
T2535-xxxG
Tube
T2535-xxxG-TR
T2535xxxG
1000
Tape & reel
Note: xxx= voltage, y = sensitivity, z = type
4/9
BTA/BTB24, BTA25, BTA26 and T25 Series
Fig. 1: Maximum power dissipation versus RMS
Fig. 2-1: RMS on-state current versus case
on-state current (full cycle).
temperature (full cycle).
P (W)
IT(RMS) (A)
30
30
BTB/T25
25
20
15
10
25
BTA24
20
BTA25/26
15
10
5
5
IT(RMS) (A)
Tc(°C)
0
0
0
25
50
75
100
125
0
5
10
15
20
25
Fig. 2-2: D PAK RMS on-state current versus
ambient temperature (printed circuit board FR4,
copper thickness: 35 µm), full cycle.
Fig. 3: Relative variation of thermal impedance
versus pulse duration.
IT(RMS) (A)
K=[Zth/Rth]
1E+0
4.0
D2PAK
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
(S=1cm2)
Zth(j-c)
1E-1
Zth(j-a)
BTA/BTB24/T25
1E-2
Zth(j-a)
BTA26
Tamb(°C)
50 75
tp (s)
1E-3
1E-3
1E-2
1E-1
1E+0
1E+1
1E+2 5E+2
0
25
100
125
Fig. 4:
values).
On-state characteristics (maximum
Fig. 5: Surge peak on-state current versus
number of cycles.
ITM (A)
ITSM (A)
300
100
300
250
t=20ms
Tj max
One cycle
Non repetitive
200
Tj initial=25°C
150
Repetitive
Tc=75°C
10
Tj=25°C
100
Tj max.
Vto = 0.85 V
Rd = 16 mΩ
50
VTM (V)
Number of cycles
0
1
1
10
100
1000
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5/9
BTA/BTB24, BTA25, BTA26 and T25 Series
Fig. 6: Non-repetitive surge peak on-state
current for a sinusoidal pulse with width
tp < 10ms, and corresponding value of I t.
Fig. 7: Relative variation of gate trigger current,
holding current and latching current versus
junction temperature (typical values).
IGT,IH,IL[Tj] / IGT,IH,IL[Tj=25°C]
ITSM (A), I t (A s)
2.5
3000
Tj initial=25°C
2.0
dI/dt limitation:
50A/µs
IGT
ITSM
1000
1.5
I t
IH & IL
1.0
0.5
tp (ms)
Tj(°C)
100
0.0
0.01
0.10
1.00
10.00
-40 -20
0
20
40
60
80 100 120 140
Fig. 8: Relative variation of critical rate of
decrease of main current versus (dV/dt)c (typical
values).
Fig. 9: Relative variation of critical rate of
decrease of main current versus junction
temperature.
(dI/dt)c [Tj] / (dI/dt)c [Tj specified]
(dI/dt)c [(dV/dt)c] / Specified (dI/dt)c
6
2.4
2.2
2.0
1.8
1.6
1.4
1.2
1.0
0.8
5
4
3
2
BW/CW/T2535
B
1
0.6
Tj (°C)
(dV/dt)c (V/µs)
0.4
0
0.1
1.0
10.0
100.0
0
25
50
75
100
125
Fig. 10: D PAK Thermal resistance junction to
ambient versus copper surface under tab (printed
circuit board FR4, copper thickness: 35 µm).
Rth(j-a) (°C/W)
80
D PAK
70
60
50
40
30
20
10
S(cm )
0
0
4
8
12 16 20 24 28 32 36 40
6/9
BTA/BTB24, BTA25, BTA26 and T25 Series
PACKAGE MECHANICAL DATA
D PAK (Plastic)
DIMENSIONS
REF.
Millimeters
Inches
A
E
Min. Typ. Max. Min. Typ. Max.
C2
L2
A
A1
A2
B
4.30
2.49
0.03
0.70
1.25
0.45
1.21
8.95
10.00
4.88
15.00
1.27
1.40
4.60 0.169
2.69 0.098
0.23 0.001
0.93 0.027
0.181
0.106
0.009
0.037
D
L
B2
C
1.40
0.048 0.055
L3
0.60 0.017
1.36 0.047
9.35 0.352
10.28 0.393
5.28 0.192
15.85 0.590
1.40 0.050
1.75 0.055
0.024
0.054
0.368
0.405
0.208
0.624
0.055
0.069
A1
C2
D
B2
B
R
C
E
G
G
L
A2
2.0 MIN.
FLAT ZONE
L2
L3
R
0.40
0.016
V2
V2
0°
8°
0°
8°
FOOTPRINT DIMENSIONS (in millimeters)
D PAK (Plastic)
16.90
10.30
5.08
1.30
3.70
8.90
7/9
BTA/BTB24, BTA25, BTA26 and T25 Series
PACKAGE MECHANICAL DATA
RD91 (Plastic)
DIMENSIONS
Millimeters
A2
L2
L1
REF.
Inches
Max.
Min.
Max.
Min.
A
A1
A2
B
40.00
30.30
22.00
27.00
16.50
24.00
14.00
3.50
1.575
1.193
0.867
1.063
0.650
0.945
0.551
0.138
0.118
0.035
0.177
0.535
0.138
0.075
43°
B2
B1
29.90
1.177
C
C2
C1
A1
B1
B2
C
13.50
0.531
N2
N1
C1
C2
E3
F
1.95
0.70
4.00
11.20
3.10
1.70
33°
3.00
0.077
0.027
0.157
0.441
0.122
0.067
33°
B
0.90
F
I
4.50
E3
I
13.60
3.50
A
L1
L2
N1
N2
1.90
43°
28°
38°
28°
38°
PACKAGE MECHANICAL DATA
TOP3 (Plastic)
DIMENSIONS
Millimeters
Min. Typ. Max. Min. Typ. Max.
REF.
Inches
A
B
C
D
E
F
4.4
1.45
14.35
0.5
4.6
0.173
0.181
0.061
0.614
0.028
0.114
0.650
0.831
0.610
0.222
0.144
0.164
0.055
1.55 0.057
15.60 0.565
0.7
2.9
0.020
0.106
2.7
15.8
20.4
15.1
5.4
16.5 0.622
21.1 0.815
15.5 0.594
5.65 0.213
3.65 0.134
4.17 0.161
1.40 0.047
G
H
J
K
L
3.4
4.08
1.20
P
R
4.60
0.181
8/9
BTA/BTB24, BTA25, BTA26 and T25 Series
PACKAGE MECHANICAL DATA
TO-220AB (Plastic)
DIMENSIONS
REF.
Millimeters
Inches
B
C
b2
Min. Typ. Max. Min. Typ. Max.
A
a1
a2
B
15.20
15.90 0.598
0.625
L
3.75
0.147
F
I
13.00
10.00
0.61
1.23
4.40
0.49
2.40
2.40
6.20
3.75
14.00 0.511
10.40 0.393
0.88 0.024
1.32 0.048
4.60 0.173
0.70 0.019
2.72 0.094
2.70 0.094
6.60 0.244
3.85 0.147
0.551
0.409
0.034
0.051
0.181
0.027
0.107
0.106
0.259
0.151
A
b1
b2
C
l4
c1
c2
e
c2
a1
l3
l2
a2
F
I
I4
L
15.80 16.40 16.80 0.622 0.646 0.661
2.65
1.14
1.14
2.95 0.104
1.70 0.044
1.70 0.044
0.116
0.066
0.066
b1
M
c1
l2
l3
M
e
2.60
0.102
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of use ofsuch information nor for any infringement of patents or other rights of third parties which may result from its use. No license isgranted
by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject
to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not
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9/9
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