BAT54AP6FILM [STMICROELECTRONICS]
Small signal Schottky diodes; 小信号肖特基二极管
| 型号： | BAT54AP6FILM |
| 厂家： | 
ST |
| 描述： | Small signal Schottky diodes |
| 文件： | 总13页 (文件大小：163K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
BAT54 Series
Small signal Schottky diodes
Main product characteristics
BAT54ZFILM
(Single)
IF
300 mA
40 V
VRRM
SOD-123
C (typ)
Tj (max)
7 pF
BAT54JFILM
(Single)
150° C
SOD-323
Features and benefits
BAT54KFILM
(Single)
■ Low conduction and reverse losses
■ Negligible switching losses
■ Low forward and reverse recovery times
■ Extremely fast switching
SOD-523
BAT54FILM
(Single)
■ Surface mount device
BAT54AFILM
(Common anode)
■ Low capacitance diode
SOT-23
BAT54SFILM
(Series)
Description
The BAT54 series uses 40 V Schottky barrier
diodes packaged in SOD- 23, SOD-323,
SOD-523, SOT-23, SOT-323, or SOT-666.
BAT54CFILM
(Common cathode)
BAT54WFILM
(Single)
Order codes
Part Number
Marking
BAT54CWFILM
BAT54FILM
BAT54SFILM
BAT54CFILM
BAT54AFILM
BAT54WFILM
BAT54SWFILM
BAT54CWFILM
BAT54AWFILM
BAT54JFILM
D86
D88
D87
D84
D73
D78
D77
D74
86
(Common cathode)
SOT-323
BAT54AWFILM
(Common anode)
BAT54SWFILM
(Series)
BAT54-07P6FILM
(2 parallel diodes)
BAT54-09P6FILM
(2 opposite diodes)
BAT54KFILM
BAT54-07P6FILM
BAT54-09P6FILM
BAT54ZFILM
86
SOT-666
P4
Q4
Configurations in top view
D72
July 2006
Rev 9
1/13
www.st.com
Characteristics
BAT54 Series
1
Characteristics
Table 1.
Symbol
Absolute ratings (limiting values at Tj = 25° C, unless otherwise specified)
Parameter
Value
Unit
VRRM
IF
Repetitive peak reverse voltage
Continuous forward current
40
300
V
mA
A
IFSM
Tstg
Tj
Surge non repetitive forward current
Storage temperature range
tp = 10 ms Sinusoidal
1
-65 to +150
-40 to +150
260
° C
° C
° C
Operating junction temperature range
Maximum soldering temperature
TL
Table 2.
Symbol
Thermal parameters
Parameter
Value
Unit
SOT-23, SOD-123
500
550
600
°C/W
Rth(j-a)
Junction to ambient(1)
SOT-323, SOD-323,
SOD-523, SOT-666
1. Epoxy printed circuit board with recommended pad layout
Table 3.
Symbol
Static electrical characteristics
Parameter
Test conditions
Min.
Typ
Max.
Unit
Tj = 25° C
1
(1)
IR
Reverse leakage current
VR = 30 V
µA
Tj = 100° C
100
240
320
400
IF = 0.1 mA
IF = 1 mA
mV
(2)
IF = 10 mA
VF
Forward voltage drop
Tj = 25° C
IF = 30 mA
500
900
IF = 100 mA
1. Pulse test: t = 5 ms, δ < 2 %
p
2. Pulse test: t = 380 µs, δ < 2 %
p
Table 4.
Symbol
Dynamic characteristics
Parameter
Diode capacitance
Test conditions
VR = 1 V, F = 1 MHz
Min. Typ Max. Unit
C
7
10
5
pF
ns
IF = 10 mA, IR = 10 mA, Tj = 25° C
Irr = 1 mA, RL = 100 Ω
trr
Reverse recovery time
2/13
BAT54 Series
Characteristics
Figure 1.
Average forward power dissipation Figure 2.
versus average forward current
Average forward current versus
ambient temperature (δ = 1)
I
F(AV)(A)
P(W)
0.35
0.35
0.30
0.25
0.20
0.15
0.10
0.05
0.00
δ=1
δ=0.2
δ=0.5
δ=0.1
δ=0.05
0.30
0.25
0.20
0.15
0.10
0.05
T
T
tp
tp
=tp/T
=tp/T
δ
δ
Tamb(°C)
IF(AV)(A)
0.00
0.00
0
25
50
75
100
125
150
0.05
0.10
0.15
0.20
0.25
0.30
0.35
Figure 3.
Reverse leakage current versus
reverse applied voltage (typical
values)
Figure 4.
Reverse leakage current versus
junction temperature
IR[Tj] / IR[Tj=25°C]
IR(µA)
1.E+02
1.E+01
1.E+00
1.E-01
1.E-02
1.E+04
1.E+03
1.E+02
1.E+01
1.E+00
1.E-01
VR=3V
Tj=100°C
Tj=50°C
Tj=25°C
VR(V)
Tj(°C)
75
0
5
10
15
20
25
30
0
25
50
100
125
150
Figure 5.
Junction capacitance versus
Figure 6.
Forward voltage drop versus
reverse applied voltage (typical
values)
forward current (typical values)
C(pF)
IFM(A)
10
1.E+00
1.E-01
1.E-02
1.E-03
1.E-04
Tj=100°C
F=1MHz
OSC=30mVRMS
Tj=25°C
V
Tj=50°C
Tj=25°C
Tj=-40 °C
VR(V)
VFM(V)
1
1
10
100
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3
3/13
Characteristics
BAT54 Series
Figure 7.
Thermal resistance junction to
Figure 8.
Relative variation of thermal
ambient versus copper surface
under each lead - epoxy FR4 with
recommended pad layout,
impedance junction to ambient
versus pulse duration - epoxy FR4
with recommended pad layout,
eCU = 35 µm (SOD-323)
eCU = 35 µm (SOD-323)
Rth(j-a)(°C/W)
Zth(j-a)/Rth(j-a)
600
500
400
300
200
1.E+00
1.E-01
1.E-02
1.E-03
Single pulse
SOD323
Epoxy FR4
eCU=35 µm
Epoxy FR4
SCU=2.25 mm²
eCU=35 µm
SCU(mm²)
tP(s)
0
5
10
15
20
25
30
35
40
45
50
1.E-03
1.E-02
1.E-01
1.E+00 1.E+01 1.E+02 1.E+03
Figure 9.
Relative variation of thermal
impedance junction to ambient
versus pulse duration -
aluminium oxide substrate
10 mm x 8 mm x 0.5 mm (SOT-23)
Figure 10. Relative variation of thermal
impedance junction to ambient
versus pulse duration - epoxy FR4
with recommended pad layout,
eCU = 35 µm (SOD-523)
Z
th(j-a)/Rth(j-a)
Zth(j-a)/Rth(j-a)
1.E+00
1.E-01
1.E-02
1.E+00
1.E-01
1.E-02
1.E-03
Single pulse
SOT23
Single pulse
SOD523
Alumine substrate
10 x 8 x 0.5 mm
Epoxy FR4
eCU=35 µm
tP(s)
tP(s)
1.E-03
1.E-02
1.E-01
1.E+00
1.E+01
1.E+02
1.E-03
1.E-02
1.E-01
1.E+00
1.E+01
Figure 11. Relative variation of thermal
impedance junction to ambient
versus pulse duration - epoxy FR4
with recommended pad layout,
eCU = 35 µm (SOT-666)
Z
th(j-a)/Rth(j-a)
1.E+00
1.E-01
1.E-02
Single pulse
SOT666
Epoxy FR4
CU=35 µm
e
tP(s)
1.E-03
1.E-02
1.E-01
1.E+00
1.E+01
4/13
BAT54 Series
Ordering information scheme
2
Ordering information scheme
BAT54 xx xx FILM
Signal Schottky diodes
VRRM = 40 V
Configuration
No letter = Single diode
A = Common anode
C = Common cathode
S = Series diodes
07 = Parallel diodes
09 = Opposite diodes
Package
Blank = SOT-23
J = SOD-323
W = SOT-323
K = SOD-523
P6 = SOT-666
Z = SOD-123
Packing
FILM = Tape and reel
5/13
Package information
BAT54 Series
3
Package information
Epoxy meets UL94, V0
Table 5.
SOD-123 dimensions
Dimensions
Millimeters
Ref.
Inches
H
A2
A1
Min.
Max.
Min.
Max.
b
A
A1
A2
b
1.45
0.1
0.057
0.004
0.053
E
0
0
0.85
1.35
0.033
D
A
0.55 Typ.
0.15 Typ.
0.022 Typ.
0.039 Typ.
c
c
D
2.55
2.85
1.7
0.1
0.112
0.067
E
1.4
0.055
0.01
0.14
G
G
H
0.25
3.55
3.95
0.156
Figure 12. SOD-123 footprint (dimensions in mm)
4.45
0.65
0.97
2.51
0.97
6/13
BAT54 Series
Package information
Dimensions
Table 6.
SOD-323 dimensions
Ref.
Millimeters
Inches
H
A1
Min.
Max.
Min.
Max.
b
A
A1
b
1.17
0.1
0.046
0.004
0.017
0.01
E
0
0
0.25
0.1
0.44
0.25
1.8
0.01
A
D
c
0.004
0.06
c
Q1
D
1.52
1.11
2.3
0.071
0.057
0.106
0.02
E
1.45
2.7
0.044
0.09
L
H
L
0.1
0.46
0.41
0.004
0.004
Q1
0.1
0.016
Figure 13. SOD-323 footprint (dimensions in mm)
3.20
0.54
1.06
1.08
1.06
7/13
Package information
Table 7.
BAT54 Series
SOD-523 dimensions
Dimensions
Millimeters
Typ. Max. Min.
Ref.
Inches
0.15
E1
M
C A B
E
B
Min.
Typ. Max.
2xb
D
A
E
0.50
1.50
1.10
0.70
0.25
0.07
0.15
0.10
0.60
1.60
1.20
0.80
0.70 0.020 0.024 0.028
1.70 0.059 0.063 0.067
1.30 0.043 0.047 0.051
0.90 0.028 0.031 0.035
0.20
M
C A B
A
8°
R0.1
E1
D
b
A
c
SEATING PLANE
C
7°
L
0.35 0.010
0.20 0.003
0.014
0.008
c
L1
L
0.20
0.25 0.006 0.008 0.010
0.20 0.004 0.008
L1
Figure 14. SOD-523 footprint (dimensions in mm)
0.7
0.3
2
8/13
BAT54 Series
Package information
Table 8.
SOT-23 dimensions
Dimensions
Millimeters
Ref.
Inches
A
Min.
Max.
Min.
Max.
E
A
A1
B
0.89
0
1.4
0.1
0.035
0
0.055
0.004
0.02
e
0.3
0.51
0.18
3.04
1.05
2.1
0.012
0.003
0.108
0.033
0.067
0.047
0.083
B
D
e1
c
0.085
2.75
0.85
1.7
0.007
0.12
D
e
S
A1
0.041
0.083
0.063
0.108
e1
E
c
1.2
1.6
L
H
H
L
2.1
2.75
0.6 typ.
0.65
0.024 typ.
S
0.35
0.014
0.026
Figure 15. SOT-23 footprint (dimensions in mm)
0.95
0.61
1.26
0.73
3.25
9/13
Package information
Table 9.
BAT54 Series
SOT-323 dimensions
Dimensions
Millimeters
Typ. Max. Min.
Ref.
Inches
A
E
Min.
Typ. Max.
A
A1
b
0.8
0.0
1.1
0.1
0.4
0.031
0.0
0.043
0.004
0.016
0.010
e
D
b
0.25
0.1
0.010
c
0.26 0.004
2.2
A1
D
E
e
1.8
2.0
1.25
0.65
2.1
0.071 0.079 0.086
1.15
1.35 0.045 0.049 0.053
0.026
c
θ
L
H
L
1.8
0.1
0
2.4
0.3
30°
0.071 0.083 0.094
0.004 0.008 0.012
H
0.2
q
0
30°
Figure 16. SOT-323 footprint (dimensions in mm)
0.95
1.0 2.9
0.8
0.50
10/13
BAT54 Series
Package information
Table 10. SOT-666 dimensions
Dimensions
Millimeters
Min. Typ. Max. Min. Typ. Max.
b1
Ref.
Inches
L1
A
0.45
0.60 0.018
0.18 0.003
0.34 0.007
0.024
0.007
0.013
L3
A3 0.08
0.17
b
b
D
E1
E
b1 0.19 0.27 0.34 0.007 0.011 0.013
D
E
1.50
1.50
1.70 0.059
1.70 0.059
1.30 0.043
0.067
0.067
0.051
A
L2
A3
E1 1.10
e
0.50
0.19
0.020
0.007
L1
L2 0.10
L3
0.30 0.004
0.012
e
0.10
0.004
Figure 17. SOT-666 footprint (dimensions in mm)
0.50
0.62
2.60
0.99
0.30
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
11/13
Ordering information
BAT54 Series
4
Ordering information
Part Number
Marking
Package
Weight
Base qty Delivery mode
BAT54FILM
D86
D88
SOT-23 Single
SOT-23 Serial
10 mg
10 mg
3000
3000
Tape and reel
Tape and reel
BAT54SFILM
SOT-23
Common cathode
BAT54CFILM
BAT54AFILM
D87
D84
10 mg
10 mg
3000
3000
Tape and reel
Tape and reel
SOT-23
Common anode
BAT54WFILM
D73
D78
SOT-323 Single
SOT-323 Serial
6 mg
6 mg
3000
3000
Tape and reel
Tape and reel
BAT54SWFILM
SOT-323
Common cathode
BAT54CWFILM
BAT54AWFILM
D77
D74
6 mg
6 mg
3000
3000
Tape and reel
Tape and reel
SOT-323
Common anode
BAT54JFILM
BAT54KFILM
86
86
SOD-323
SOD-523
5 mg
3000
3000
3000
3000
3000
Tape and reel
Tape and reel
Tape and reel
Tape and reel
Tape and reel
1.4 mg
2.9 mg
2.9 mg
10 mg
BAT54-07P6FILM
BAT54-09P6FILM
BAT54ZFILM
P4
SOT-666 Parallel
SOT-666 Opposite
SOD-123
Q4
D72
5
Revision history
Date
Revision
Description of Changes
Jun-1999
8
Last update.
BAT54, A, C, S and BAT54J / W / AW / CW /SW
datasheets merged. ECOPACK statement added. SOD-
123, SOD-523 and SOT-666 packages added.
24-Jul-2006
9
12/13
BAT54 Series
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