BAS70-07S [STMICROELECTRONICS]
RF DETECTION DIODE; RF检波二极管![BAS70-07S](http://pdffile.icpdf.com/pdf1/p00105/img/icpdf/BAS70-07S_566496_icpdf.jpg)
型号: | BAS70-07S |
厂家: | ![]() |
描述: | RF DETECTION DIODE |
文件: | 总4页 (文件大小:36K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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BAS70-07S / BAS70-08S
®
RF DETECTION DIODE
FEATURES AND BENEFITS
■
■
■
LOW DIODE CAPACITANCE
LOW SERIES INDUCTANCE AND RESISTANCE
SURFACE MOUNT PACKAGE
DESCRIPTION
Dual and Triple Schottky diode in SOT323-6L
package. This diode is intented to be used in RF
application for signal detection and temperature
compensation.
SOT323-6L
BAS70-08S SCHEMATIC DIAGRAM
BAS70-07S SCHEMATIC DIAGRAM
1
2
3
6
5
4
1
2
3
6
5
4
ABSOLUTE RATINGS (limiting values)
Symbol
VR
Parameter
Value
Unit
V
Continuous reverse voltage
Continuous forward current
Repetitive peak forward current
Surge non repetitive forward current
Power Dissipation
70
IF
70
mA
mA
A
IFRM
IFSM
P
70
tp = 10 ms sinusoidal
Ta = 55°C
1
250
mW
°C
Tstg
Tj
Storage temperature range
Maximum junction temperature
Maximum temperature for soldering
- 65 to +150
150
°C
TL
260
°C
December 2001 - Ed: 2A
1/4
BAS70-07S / BAS70-08S
THERMAL RESISTANCE
Symbol
Parameter
Value
Unit
Rth (j-a) Junction to ambient on printed circuit board FR4
with recommended pad layout
500
°C/W
STATIC ELECTRICAL CHARACTERISTICS (Tj = 25°C otherwise specified)
Symbol
Parameter
Tests Conditions
IF = 1 mA
Min. Typ. Max.
Unit
V
VF
Forward voltage drop
0.41
IF = 10 mA
0.75
V
IF = 15 mA
1
V
IR
Reverse leakage current
Breakdown voltage
VR = 70 V
10
µA
V
VBR
IR = 10 µA
70
ELECTRICAL CHARACTERISTICS
Symbol
Parameter
Tests Conditions
Min. Typ. Max. Unit
C
Junction capacitance
VR = 0 V
IF = 10 mA
F = 1 MHz
2
pF
RF
Differential forward
resistance
F = 100 MHz
30
Ohm
Ls
Series inductance
1.5
nH
2/4
BAS70-07S / BAS70-08S
Fig. 1: Forward voltage drop versus forward
current (typical values).
Fig. 2: Reverse leakage current versus reverse
voltage applied (typical values).
IR(µA)
IFM(mA)
1.E+02
1.E+02
Tj = 150°C
1.E+01
1.E+01
Tj = 85°C
1.E+00
Tj=150°C
1.E-01
Tj=125°C
1.E+00
Tj=85°C
Tj=25°C
Tj = 25°C
1.E-02
VFM(V)
Tj=-40°C
VR(V)
1.E-01
1.E-03
0.0
0.2
0.4
0.6
0.8
1.0
1.2
0
10
20
30
40
50
60
70
Fig. 3: Differential forward resistance versus
forward current (typical values).
Fig. 4: Junction capacitance versus reverse
voltage applied (typical values).
Rf(Ω)
C(pF)
1000
1.5
F = 10kHz
Tj = 25°C
F = 1MHz
Vosc = 30mVRMS
Tj = 25°C
1.4
1.3
1.2
1.1
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
100
VR(V)
IF(mA)
0.1
10
0.0
0.1
1.0
10.0
0
10
20
30
40
50
60
70
Fig. 5: Variation of thermal impedance junction to
ambient versus pulse duration (printed circuit
board, epoxy FR4).
Fig. 6: Thermal resistance junction to ambient
versus copper surface under each lead (printed
circuit board, epoxy FR4).
Zth(j-a)(°C/W)
Rth(j-a)
1000.0
600
550
500
450
400
350
100.0
tp(s)
S(mm²)
10.0
300
1.E-02
1.E-01
1.E+00
1.E+01
1.E+02
0
5
10
15
20
25
30
35
40
45
50
3/4
BAS70-07S / BAS70-08S
PACKAGE MECHANICAL DATA
SOT323-6L
DIMENSIONS
Millimeters Inches
Min.
A2
A
A1
REF.
Min.
0.8
0
Max.
1.1
0.1
1
Max.
0.043
0.004
0.039
0.012
0.007
0.086
0.053
A
A1
A2
b
0.031
0
D
0.8
0.15
0.1
1.8
1.15
0.031
0.006
0.004
0.071
0.045
e
e
0.3
0.18
2.2
1.35
c
D
E
HE
E
e
0.65 Typ.
0.025 Typ.
HE
Q1
1.8
0.1
2.4
0.4
0.071
0.004
0.094
0.016
Q1
c
b
FOOTPRINT DIMENSIONS (millimeters)
0.3mm
1mm
2.9mm
1mm
0.35mm
MARKING
Type
Marking
D32
Package
SOT323-6L
Weight
Base qty
Delivery mode
BAS70-07S
BAS70-08S
0.006g
3000
Tape & reel
D33
■
Epoxy meets UL94, V0
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of
use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by
implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to
change without notice. This publication supersedes and replaces all information previously supplied.
STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written ap-
proval of STMicroelectronics.
The ST logo is a registered trademark of STMicroelectronics
© 2001 STMicroelectronics - Printed in Italy - All rights reserved.
STMicroelectronics GROUP OF COMPANIES
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4/4
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