AM82731-050 [STMICROELECTRONICS]

RF & MICROWAVE TRANSISTORS S-BAND RADAR APPLICATIONS; 射频与微波晶体管S波段雷达应用
AM82731-050
型号: AM82731-050
厂家: ST    ST
描述:

RF & MICROWAVE TRANSISTORS S-BAND RADAR APPLICATIONS
射频与微波晶体管S波段雷达应用

晶体 射频双极晶体管 微波 雷达 CD 放大器 局域网
文件: 总4页 (文件大小:63K)
中文:  中文翻译
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AM82731-050  
RF & MICROWAVE TRANSISTORS  
S-BAND RADAR APPLICATIONS  
.
.
.
REFRACTORY/GOLD METALLIZATION  
EMITTER SITE BALLASTED  
RUGGEDIZED VSWR 3:1 @ 1 dB OVER-  
DRIVE  
.
.
.
.
.
LOW THERMAL RESISTANCE  
INPUT/OUTPUT MATCHING  
OVERLAY GEOMETRY  
.400 x .400 2LFL (S036)  
METAL/CERAMIC HERMETIC PACKAGE  
POUT = 50 W MIN. WITH 6 dB GAIN  
hermetically sealed  
ORDER CODE  
AM82731-050  
BRANDING  
82731-50  
DESCRIPTION  
PIN CONNECTION  
The AM82731-050 device is a high power silicon  
bipolar NPN transistor specifically designed for S-  
Band radar pulsed output and driver applications.  
The device is capable of operation over a wde  
range of pulse widths, duty cycles and tempera-  
tures and can withstand a 3:1 output VSWR with  
a +1 dB input overdrive. Low RF thermal resist-  
ance, refractory/gold metallization, and compu-  
terized automatic wire bonding techniques ensure  
high reliability and product consistency.  
The AM82731-050 is supplied in the AMPAC  
Hermetic Metal/Ceramic package with internal  
Input/Output impedance matching circuitry, and is  
intended for military and other high reliability ap-  
plications.  
1. Collector  
2. Base  
3. Emitter  
4. Base  
°
= 25 C)  
ABSOLUTE MAXIMUM RATINGS (T  
case  
Symbol  
Parameter  
Value  
Unit  
PDISS  
Power Dissipation*  
Device Current*  
(TC 50°C)  
167  
W
IC  
VCC  
TJ  
8
46  
A
V
Collector-Supply Voltage*  
°
°
Junction Temperature (Pulsed RF Operation)  
Storage Temperature  
250  
C
C
TSTG  
65 to +200  
THERMAL DATA  
RTH(j-c)  
Junction-Case Thermal Resistance*  
1.2  
°C/W  
*Applies only to rated RF amplifier operation  
August 1992  
1/4  
AM82731-050  
°
= 25 C)  
ELECTRICAL SPECIFICATIONS (T  
case  
STATIC  
Value  
Symbol  
BVCBO  
BVEBO  
BVCER  
ICES  
Test Conditions  
IE = 0mA  
Unit  
V
Min. Typ.  
Max.  
IC = 25mA  
IE = 5mA  
55  
3.5  
55  
IC = 0mA  
20  
V
IC = 25mA  
VCE = 40V  
VCE = 5V  
RBE = 10Ω  
V
mA  
hFE  
IC = 3A  
30  
DYNAMIC  
Value  
Symbol  
Test Conditions  
Unit  
W
Min.  
Typ. Max.  
POUT  
f = 2700 — 3100MHz PIN = 12.5W  
f = 2700 — 3100MHz PIN = 12.5W  
f = 2700 — 3100MHz PIN = 12.5W  
VCC = 40V  
VCC = 40V  
VCC = 40V  
50  
56  
35  
η
c
30  
%
GP  
6.0  
6.5  
dB  
Note:  
Pulse Width  
100µS  
10%  
=
=
Duty Cycle  
TYPICAL PERFORMANCE  
COLLECTOR EvFs FFREIQUCENICEY NCY vs  
GAIN vs FREQUENCY  
COLLECTOR EFFICIENCY  
FREQUENCY  
GAIN vs FREQUENCY  
8.00  
7.00  
6.00  
5.00  
4.00  
50  
7.19  
6.93  
C
39.5  
6.43  
O
36.4  
38.0  
L
L
E
C
T
O
R
Upper Window  
Mean  
40  
30  
20  
10  
Upper Window  
Mean  
Lower Window  
G
A
I
Lower Window  
E
F
F
I
N
d
B
C
I
E
N
C
Y
50 Watts Output  
50 Watts Ouput  
@ 100 µS 10% Pulse  
@ 100 µS 10% Pulse  
V
40 Volts  
V
CC  
40 Volts  
CC  
=
=
%
2.7  
2.9  
3.1  
2.7  
2.9  
3.1  
FREQUENCY  
FREQUENCY  
2/4  
AM82731-050  
IMPEDANCE DATA  
TYPICAL INPUT  
IMPEDANCE  
Z
IN  
L
ZIN  
H
H
TYPICAL COLLECTOR  
LOAD IMPEDANCE  
Z
CL  
ZCL  
L
PIN = 12.5 W  
VCC = 40 V  
Z0 = 50 ohms  
FREQ.  
ZIN ()  
ZCL ()  
L = 2.7 GHz  
M = 2.9 GHz  
H = 3.1 GHz  
7.4 + j 5.4  
7.8 + j 3.0  
8.0 + j 2.0  
7.1 j 8.6  
5.4 j 7.4  
4.6 j 2.6  
TEST CIRCUIT  
3/4  
AM82731-050  
PACKAGE MECHANICAL DATA  
Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsability for the  
consequences of use of such information nor for any infringement of patents or other rights of third parties which may results from its use. No  
license is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specificationsmentioned  
in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied.  
SGS-THOMSON Microelectronicsproductsare notauthorized foruse ascritical componentsin life support devices or systems without express  
written approval of SGS-THOMSON Microelectonics.  
1994 SGS-THOMSON Microelectronics - All Rights Reserved  
SGS-THOMSON Microelectronics GROUP OF COMPANIES  
Australia - Brazil - France - Germany - Hong Kong - Italy - Japan - Korea - Malaysia - Malta - Morocco - The Netherlands -  
Singapore - Spain - Sweden - Switzerland - Taiwan - Thailand - United Kingdom - U.S.A  
4/4  

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