1N5819U [STMICROELECTRONICS]

Aerospace 45 V power Schottky rectifier;


型号：	1N5819U
厂家：	ST
描述：	Aerospace 45 V power Schottky rectifier
文件：	总10页 (文件大小：226K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

1N5819U

Aerospace 45 V power Schottky rectifier

Datasheet - production data

Description

This power Schottky rectifier is designed and

packaged to comply with the ESCC5000

specification for aerospace products. It is housed

in a surface mount hermetically sealed LCC2B

package.

The 1N5819U is suitable for switching mode

power supplies and high frequency DC to DC

converters such as low voltage high frequency

inverter, free wheeling or polarity protection.

Leadless chip carrier 2 (LCC2B)

Features

 Aerospace applications

 Surface mount hermetic package

 High thermal conductivity materials

 Very small conduction losses

 Negligible switching losses

 Extremely fast switching

 Low forward voltage drop

 Package mass: 0.18 g

 Target radiation qualification

– 150 krad (Si) low dose rate

– 3 Mrad (Si) high dose rate

 ESCC qualified

(1)

Table 1. Device summary

ESCC

detailed

specification

Lead

finish

Order code

Quality level

EPPL

I_F(AV)

V_RRM

T_j(max)VF_(max)

1N5819UB1

Engineering model Gold

1N5819U01B 5106/021/02

1N5819U02B 5106/021/03

ESCC

Gold

yes

150

0.49

Solder dip

1. Contact ST sales office for information about the specific conditions for products in die form.

December 2015

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This is information on a product in full production.

www.st.com

Characteristics

1N5819U

Characteristics

Table 2. Absolute ratings (limiting values)

Parameter

Symbol

Value

Unit

V_RRM

I_F(RMS)

I_F(AV)

I_FSM

T_stg

Repetitive peak reverse voltage

Forward rms current

Average forward rectified current

Forward surge current

T_c≥ 142 °Cδ = 0.5

t_p= 10 ms sinusoidal

Storage temperature range

-65 to +150

150

°C

T_j

Maximum operating junction temperature ⁽¹⁾

Maximum soldering temperature ⁽²⁾

T_sol

245

dP_to

dT_j

R_th(j-a)

_____

___

__________

condition to avoid runaway for a diode on its own heatsink

2. Maximum duration 5 s. The same package must not be re-soldered until 3 minutes have elapsed.

Table 3. Thermal resistance

Symbol

Parameter

Value

Unit

R_{th (j-c)}

Junction to case

C/W

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Characteristics

Table 4. Static electrical characteristics

Symbol

Parameter

Test conditions

Min.

Typ.

Max.

Unit

T_j= 25 °C

3.5

µA

V_R= 45 V

T_j= 100 °C

T_j= -55 °C

T_j= 25 °C

T_j= 100 °C

V_R= 45 V

V_R= 40 V

µA

Reverse leakage

current

(1)

V_R= 40 V

I_R

T_j= 100 °C V_R= 35 V

V_R= 24 V

T_j= 100 °C V_R= 12 V

2.5

1.6

1.2

T_j= 100 °C

V_R= 6 V

I_F= 0.1 A

T_j= 100 °C

T_j= 25 °C

350

490

450

650

800

(2)

V_F

Forward voltage drop T_j= 100 °C I_F= 1A

T_j= - 55 °C

T_j= 25 °C

I_F= 3.1 A

1. Pulse test: t_p= 5 ms, δ < 2%

2. Pulse test: t_p= 680 µs, δ < 2%

To evaluate the conduction losses use the following equation:

P = 0.285 x

+ 0.165 x I

IF(AV)

F (RMS )

Table 5. Dynamic characteristics

Test conditions

Symbo

Min Ty Max Uni

Parameter

Diode capacitance

C_j

V_R= 5 V, F = 1 MHz

70 pF

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Characteristics

1N5819U

Figure 1. Average forward power dissipation

versus average forward current

Figure 2. Average forward current versus

ambient temperature ( = 0.5)

I_F(AV)(A)

P_F(AV)(W)

0.9

1.2

0.8

R_th(j-a)= R_th(j-c)

δ = 0.1

δ = 0.2

δ = 0.5

δ = 0.05

δ = 1

1.0

0.8

0.6

0.4

0.7

0.6

0.5

0.4

0.3

0.2

0.1

0.0

t_p

δ =t_p/ T

0.2

0.0

t_p

δ =t_p/ T

I_F(AV)(A)

T_amb(°C)

0.0

0.2

0.4

0.8

1.0

1.2

1.4

1.6

100

125

150

Figure 3. Non repetitive surge peak forward

current versus overload duration (maximum

values)

Figure 4. Relative variation of thermal

impedance junction to case versus pulse

duration

I_M(A)

Z_th(j-c)/ R_th(j-c)

1.0

0.9

0.8

0.7

0.6

0.5

0.4

0.3

0.2

T_C= 25 °C

T_C= 75 °C

Single pulse

T_C= 125 °C

I_M

δ = 0.5

0.1

0.0

t_p(s)

t(s)

1.E-03

1.E-02

1.E+00

1.E-02

1.E-05

1.E-04

1.E-03

1.E-01

1.E+00

1.E+01

1.E-01

Figure 5. Reverse leakage current versus

reverse voltage applied (typical values)

Figure 6. Forward voltage drop versus forward

current (typical values)

I_R(mA)

I_FM(A)

1.E+02

10.00

T = 150 °C

1.E+01

1.E+00

T = 125 °C

T = 100 °C

1.00

T = 75 °C

1.E-01

1.E-02

1.E-03

1.E-04

T_j= 100 °C

T_j= 25 °C

T = 50 °C

0.10

0.01

T = 25 °C

T_j= -55 °C

0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2

V_R(V)

V_FM(V)

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

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Characteristics

Figure 7. Non repetitive surge peak forward current versus number of cycles

I_FSM(A)

F = 50 Hz

T_{j initial}= 25 °C

Number of cycles

100

1000

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Package information

1N5819U

Package information

In order to meet environmental requirements, ST offers these devices in different grades of

ECOPACK packages, depending on their level of environmental compliance. ECOPACK

specifications, grade definitions and product status are available at: www.st.com.

ECOPACK is an ST trademark.

2.1

Leadless chip carrier 2 (LCC2B) package information

Figure 8. Leadless chip carrier 2 (LCC2B) package outline

Note 1

Pin 2 Cathode

Pin 1 Anode

Note 1

1. The anode is identified by metalization in two top internal angles and the index mark.

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Package information

Table 6. Leadless chip carrier 2 (LCC2B) package mechanical data

Dimensions

Ref.

Millimeters

Typ.

2.23

5.4

Inches

Typ.

Min.

Max.

Min.

Max.

A⁽¹⁾

2.04

2.42

0.080

0.088

0.213

0.143

0.075

0.095

5.27

5.6

0.207

0.220

3.49

3.62

1.90

3.76

0.137

0.148

1.71

2.09

0.067

0.082

0.48

0.71

0.019

0.028

1.4

0.055

0.131

0.072

0.006

0.008

3.32

1.82

0.15

0.20

1. Measurement prior to solder coating the mounting pads on bottom of package

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Ordering information

1N5819U

Ordering information

(1)

Table 7. Ordering information

ESCC detailed

specification

Order code

Package

Lead finish

Marking⁽²⁾

EPPL

Mass

Packing

1N5819UB1

1N5819U01B

1N5819U02B

Gold

1N5819UB1

510602102

510602103

5106/021/02

5101/021/03

LCC2B

0.18 g

Waffle pack

Solder dip

1. Contact ST sales office for information about the specific conditions for products in die form.

2. Specific marking only. The full marking includes in addition:

For the engineering models: ST logo, date code, country of origin (FR).

For ESCC flight parts: ST logo, date code, country of origin (FR), ESA logo, serial number of the part within the assembly lot.

Other information

4.1

Date code

Date code is structured as describe below:



EM xyywwz

ESCC flight yywwz

Where:

–

x (EM only): 3, assembly location Rennes (France)

yy: last two digits year

ww: week digits

z: lot index in the week

4.2

Documentation

In Table 8 is a summary of the documentation provided with each type of products.

Table 8. Documentation provided with each type of products

Quality level

Documentation

Engineering model

ESCC flight

Certificate of conformance

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Revision history

Table 9. Document revision history

Changes

Date

Revision

10-Aug-2009

07-Jun-2010

23-Sep-2011

First issue.

Updated ESCC specification codes in Table 1 and Table 7.

Updated Table 1 and Table 7 for ESCC qualification.

Updated Table 1, Table 5 and Table 7 and inserted Other

information.

8-Nov-2013

04-Dec-2015

Updated Table 7 and reformatted to current standard.

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1N5819U

IMPORTANT NOTICE – PLEASE READ CAREFULLY

STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and

improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on

ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order

acknowledgement.

Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or

the design of Purchasers’ products.

No license, express or implied, to any intellectual property right is granted by ST herein.

Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product.

ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners.

Information in this document supersedes and replaces information previously supplied in any prior versions of this document.

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