Stacked Multi-Chip Package (MCP) Flash Memory and SRAM 32 Megabit (4 M x 8-Bit/2 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous3.0伏只堆叠多芯片封装( MCP )闪存和SRAM 32兆位( 4米×8位/ 2的M× 16位) CMOS ,同时