SFS-34-24T-HP-TNE [SOURCE]
Transceiver, 1290nm Min, 1330nm Max, 1244.16Mbps(Tx), 2488.32Mbps(Rx), SC Connector, Through Hole Mount, ROHS COMPLIANT PACKAGE;型号: | SFS-34-24T-HP-TNE |
厂家: | SOURCE PHOTONICS, INC. |
描述: | Transceiver, 1290nm Min, 1330nm Max, 1244.16Mbps(Tx), 2488.32Mbps(Rx), SC Connector, Through Hole Mount, ROHS COMPLIANT PACKAGE |
文件: | 总12页 (文件大小:757K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
SFX-34-24T-HP-XXE
1310/1490 Integrated Diplexer
Transceiver
Features
• Single Fiber, Integrated Diplexer Transceiver
• 2x5 SFF pinout
2
• 2x10 SFF pinout supports I C digital diagnostics
• Voice/Data FTTx ONT/ONU Applications
• Compliant to FSAN G.984.5 Specifications
• 1244 Mbps Tx, 2488 Mbps Rx Asymmetric Data Rate
• 1310 nm Tx, 1490 nm Rx
• Burst Mode Transmission
• TX Burst Mode Detection, TX_SD (optional)
• Commercial & Industrial temperature versions available
• 28 dB link budget; 20 km reach
• Compliant to IEC-60825 Class 1 laser diode
• SC/APC or SC/UPC fiber connector
• RoHS compliant
- Digital Transmitter: A DFB laser diode is employed for upstream transmission at OC-24 (1244Mbps). The optical transmitter includes a back facet
photodetector to monitor laser power for APC control.
- Digital Receiver: An APD with TIA is employed for downstream data reception at OC-48 (2488Mbps). A post amplifier is also included for CML
output compatibility.
Lim
Amp
.
.
Rx Data
Rx
Section
TIA
1490 nm APD
Receiver
WDM
1310nm Upstream
1490nm Downstream
LDD
Tx Data
Tx
Section
Diplexer
Optical
Block
1310nm
Laser
Diplexer Block Diagram
DS-5714 Rev 05 2010-11-29
SFX-34-24T-HP-XXE
Absolute Maximum Ratings
Usage of this transceiver shall adhere to the following absolute maximum ratings. Stresses beyond those in Table 1 may cause permanent damage to
the unit. These are stress ratings only, and functional operation of the unit at these or any other conditions beyond those indicated in the operational
sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect unit reliability.
Table 1 - Absolute Maximum Ratings
Parameter
Ambient Storage Temperature
Operating Temperature*
Minimum
Maximum
Unit/Conditions
-40
85
ºC
-40
0
85
70
ºC, I-Temp
ºC, C-Temp
Operating Humidity Range
ESD Sensitivity (Human Body Model)
Lead Soldering Temperature
Vcc_Rx
10%
-
90%
1000
non-condensing
V
-
260ºC
10 sec
-0.4
-0.4
+4.2
V
V
Vcc_Tx
Vcc_Rx + 1
*Operating temperature Minimum is ambient; Maximum is module case temperature
Module Characteristics
Table 2 - Module Characteristics
Parameter
Minimum
Typical
Maximum
Unit/Conditions
1310nm Tx to 1490nm Rx Crosstalk
1555nm Rx to 1490nm Isolation
-
-
-
-47
-
dB
dB
30
7
-
-
-
-
dB, 1530 nm to 1539 nm
dB, 1539 nm to 1625 nm
G.984.5 Wavelength Blocking Filter (WBF)
Total TX and RX Supply Current
22
-
-
350
mA
DS-5714 Rev 05 2010-11-29
SFX-34-24T-HP-XXE
Functional Characteristics
The following tables list the performance specifications for the various functional blocks of the integrated optical transceiver module.
Table 3 – Digital Transmitter Specifications
Parameter
Operating Voltage
Minimum
Typical
Maximum
Unit
V
Notes
V
cc
referenced to GND_Tx
3.14
-
3.30
3.46
Data Rate
1244.16
-
5
Mbps
dBm
dBm
dB
Average Optical Output Power, P
0.5
-
-
o
Output Power at Transmit Off
Extinction Ratio
-
-40
-
10
-
PRBS 223-1, NRZ, 50% duty cycle
20% to 80%
Transmitter Output Eye
Optical Rise and Fall Time
Center Wavelength
G.984.2 Figure 3
250
-
-
1330
ps
1290
nm
Differential Input Voltage, Vin
Input Impedance, differential
200
-
1600
mVp-p TXD+/-. DC-coupled
-
100
-
Ω
TXD+/-
GND_Tx +
Vcc - (Vin/2) -
0.1
Common-Mode Input Voltage
-
V
DC coupled
1.4
-
Tx Burst Enable Time
Tx Burst Disable Time
TX_BEN Input Low
TX_BEN Input High
-
-
12.86
12.86
0.8
ns
ns
V
16 bits data @ 1244Mbps
16 bits data @ 1244Mbps
-
0
2.0
Vcc_RX
V
See figure 3. Option for 2x10.
Requires customized part number.
See figure 3. Option for 2x10.
Requires customized part number.
TX_SD timing “D”
TX_SD timing “X”
Jitter Generation
1
µs
ns
UI
100
0.2
-
-
4 kHz to 10 MHz
DS-5714 Rev 05 2010-11-29
SFX-34-24T-HP-XXE
Refer to Figure 1 which schematically describes the high speed data inputs/outputs of the optical transceiver module.
Diplexer
Module
Ω
100
Tx Data
Tx_ENB
TX
Ω
100 Differential
Transmission Line
For CML
Tx/Rx Data
LDD/Post amp.
0.1µF
0.1µF
Rx Data
RX
Ω
100 Differential
Transmission Line
Figure 1 - Schematic representation of the module high speed inputs/outputs
Table 4 – Digital Receiver Specifications
Parameter
Operating Voltage
Minimum
Typical
Maximum
Unit
V
Notes
V
referenced to GND_RX
3.14
-
3.30
3.46
cc
Data Rate
2488.32
-
Mbps
nm
Operational Wavelength Range
Received Optical Power
Data Output Rise and Fall Time
Signal Detect Assertion Level
Signal Detect De-Assertion Level
Signal Detect Hysteresis
Differential Output Voltage
1480
-28.0
-
-
1500
-
-8
dBm
ps
PRBS 223-1, 50% duty cycle
20% to 80%
160
-
-28
-
-
-
-
-
-
dBm
dBm
dB
Transition during increasing light
Transition during decreasing light
-40
0.5
300
-
1200
mV
CML output, ac coupled (0.1µF)
LVTTL with internal 4.7kΩ pull up
resistor. Asserts HIGH when input
data amplitude is above threshold.
LVTTL. De-asserts LOW when input
data amplitude is below threshold .
2x10 only
Signal Detect Output HIGH Voltage
2.4
-
-
V
Signal Detect Output LOW Voltage
-
-
0.6
V
RSSI Range
-28
-3
-
-
-8
dBm
dB
RSSI Accuracy
+3
2x10 only
DS-5714 Rev 05 2010-11-29
SFX-34-24T-HP-XXE
Table 5 - Microcontroller Specifications
Parameter
Minimum
Typical
Maximum
Unit
Notes
Operating Voltage
3.14
3.30
3.46
V
LVTTL, open collector serial data line from the I2C
bus to the on board Microcontroller. 100kbps max.
data rate.
SDAa
-
-
-
-
LVTTL, open collector serial clock line from the I2C
bus to the on board Microcontroller.
SCLb
-
-
-
-
-
-
Reset holdc
30
ms
LVTTL input, internal 50kꢀ pull-up. Active Low
a
I2C SDA and SCL must be open collector or open drain connections.
b
c
Clock stretching, as per paragraph 13.2 of the I2C Bus Standard, must be implemented to operate correctly.
Please see Table 6 and the timing diagram in Figure 2 below for the recommended system start-up sequence.
Table 6 – Suggested Start-up Sequence
Step
Action
1
2
3
4
Power up the host system, with the RESET pin pulled to ground via a ≤4.7kꢀ resistor.
Drive the RESET pin LOW.
Ensure power to the unit is on.
Drive the RESET pin HIGH to release the unit to become operational.
Read byte A2.6E several times. There will be a NACK until the processor is booted, followed by a 01 (DATA READY BAR)
until the A2D data is ready, followed by 00 (assuming TXDIS and TXFAIL are inactive).
5
6
The unit is now ready for normal operation.
Figure 2 - Recommended transceiver module start-up sequence
DS-5714 Rev 05 2010-11-29
SFX-34-24T-HP-XXE
Figure 3 - Timing Diagram
2x5 Pin Definitions
Refer to Table 7 for a description of the function of each I/O pin.
Table 7 - Module Pin Definitions
Pin Number
Label
GND_RX
Vcc_RX
Definition
1
2
Digital Rx Ground
Digital Rx Vcc
Signal Detect output, pull up internally. Asserts high when input optical power level is above
3
SD
threshold
4
5
6
7
8
RxD-
RxD+
RX data bar output, CML. 50ꢀ terminated to Vcc and AC coupled to module output (0.1µF)
RX data output, CML. 50ꢀ terminated to Vcc and AC coupled to module output (0.1µF)
Vcc_TX
GND_TX
TX_ENB
Digital Tx Vcc
Digital Tx Ground
Tx Burst Enable, LVTTL Input
DS-5714 Rev 05 2010-11-29
SFX-34-24T-HP-XXE
Pin Number
Label
TxD+
TxD-
Definition
9
Tx data input, CML. Internally DC coupled. 100ꢀ differential termination.
Tx data bar input, CML. Internally DC coupled. 100ꢀ differential termination.
10
DS-5714 Rev 05 2010-11-29
SFX-34-24T-HP-XXE
2x10 Pin Definitions
Refer to Table 8 for a description of the function of each I/O pin.
Table 8 - Module Pin Definitions
Pin Number
Label
NC
Definition
1
2
3
4
5
6
7
No User Connection
Digital Rx ground
GND_RX
GND_RX
NC
Digital Rx ground
Reserved, No User Connection
Reserved, No User Connection
Digital Rx Ground
NC
GND_RX
Vcc_RX
Digital Rx Vcc
Signal Detect output, pull up internally (4.7kΩ). Asserts high when input optical power level is above
8
SD
threshold
9
RxD-
RxD+
RX data bar output, CML. 50ꢀ terminated to Vcc and AC coupled to module output (0.1µF)
RX data output, CML. 50ꢀ terminated to Vcc and AC coupled to module output (0.1µF)
Digital Tx Vcc
10
11
12
13
14
15
16
17
18
Vcc_TX
GND_TX
TX_ENB
TxD+
Digital Tx Ground
Tx Burst Enable, LVTTL Input. Active high.
Tx data input, CML. Internally DC coupled. 100ꢀ differential termination.
Tx data bar input, CML. Internally DC coupled. 100ꢀ differential termination.
Digital Tx Ground
TxD-
GND_TX
SCL
I2C Clock input
SDA
I2C Data input/output
Module (Micro-Controller Unit) Reset. LVTTL. Internal 10kΩ pull up. Active low. The laser TX is
disabled when RESET is LOW.
19
20
Reset
GND_TX
Digital TX Ground (option for TX_SD)
DS-5714 Rev 05 2010-11-29
SFX-34-24T-HP-XXE
SFF 2x5 Package Diagram
Pin 1
Pin 5
0.400±0.01 [10.16±0.254]
Pin 10
Pin 6
Bottom View
27.2±0.5 [691±12.5]
DS-5714 Rev 05 2010-11-29
SFX-34-24T-HP-XXE
SFF 2x10 Package Diagram
Pin
Pin 10
0.400±0.01 [10.16±0.254]
Pin 20
Pin 11
Bottom View
DS-5714 Rev 05 2010-11-29
SFX-34-24T-HP-XXE
Ordering Information
Table 9 - Ordering Information
Table 10 - Device Handling/ESD Protection
The devices are static sensitive and may easily be damaged if care is not taken during handling. The following handling practices are
recommended.
1
2
3
4
5
6
Devices should be handled on benches with conductive and grounding surfaces.
All personnel, test equipment and tools shall be grounded.
Do not handle the devices by their leads.
Store devices in protective foam or carriers.
Avoid the use of non-conductive plastics, rubber, or silk in the area where the devices are handled
All modules shall be packaged in materials that are anti-static to protect against adverse electrical environments.
Avoid applications of any voltage higher than maximum rated voltages to this part. For proper operation, any VIN or VOUT should be
constrained to the range GND ≤ (VIN or VOUT) ≤ VCC. Unused inputs must always be tied to an appropriate logic voltage (e.g.
either GND or VCC). Unused outputs must be left open.
7
DS-5714 Rev 05 2010-11-29
SFX-34-24T-HP-XXE
Warnings
Handling Precautions: This device is susceptible to damage as a result of electrostatic discharge (ESD). A static free environment is highly
recommended. Follow guidelines according to proper ESD procedures.
Laser Safety: Radiation emitted by laser devices can be dangerous to human eyes. Avoid eye exposure to direct or indirect radiation.
Legal Notice
IMPORTANT NOTICE!
All information contained in this document is subject to change without notice, at Source Photonics’ sole and absolute discretion. Source Photonics
warrants performance of its products to current specifications only in accordance with the company’s standard one-year warranty; however, specifications
designated as “preliminary” are given to describe components only, and Source Photonics expressly disclaims any and all warranties for said products,
including express, implied, and statutory warranties, warranties of merchantability, fitness for a particular purpose, and non-infringement of proprietary
rights. Please refer to the company’s Terms and Conditions of Sale for further warranty information.
Source Photonics assumes no liability for applications assistance, customer product design, software performance, or infringement of patents, services,
or intellectual property described herein. No license, either express or implied, is granted under any patent right, copyright, or intellectual property right,
and Source Photonics makes no representations or warranties that the product(s) described herein are free from patent, copyright, or intellectual property
rights. Products described in this document are NOT intended for use in implantation or other life support applications where malfunction may result in
injury or death to persons. Source Photonics customers using or selling products for use in such applications do so at their own risk and agree to fully
defend and indemnify Source Photonics for any damages resulting from such use or sale.
© Copyright Source Photonics, Inc. 2007~2008
All Rights Reserved.
All information contained in this document is subject to change without notice. The products described in this document are NOT
intended for use in implantation or other life support applications where malfunction may result in injury or death to persons.
The information contained in this document does not affect or change Source Photonics product specifications or warranties. Nothing in
this document shall operate as an express or implied license or indemnity under the intellectual property rights of Source Photonics or
third parties. All information contained in this document was obtained in specific environments, and is presented as an illustration. The
results obtained in other operating environments may vary.
THE INFORMATION CONTAINED IN THIS DOCUMENT IS PROVIDED ON AN ”AS IS” BASIS. In no event will Source Photonics be
liable for damages arising directly from any use of the information contained in this document.
Contact
SOURCE PHOTONICS
20550 NORDHOFF ST.
CHATSWORTH, CA 91311
sales@sourcephotonics.com
Tel: 818-773-9044 Fax: 818-576-9486
Or visit our website: http://www.sourcephotonics.com
DS-5714 Rev 05 2010-11-29
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