CXM3593UR-T9 [SONY]

DPDT, 2700MHz Max, 1 Func, 0.7dB Insertion Loss-Max, GAAS;
CXM3593UR-T9
型号: CXM3593UR-T9
厂家: SONY CORPORATION    SONY CORPORATION
描述:

DPDT, 2700MHz Max, 1 Func, 0.7dB Insertion Loss-Max, GAAS

射频 微波 光电二极管
文件: 总11页 (文件大小:335K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
High Power DPDT Switch  
CXM3593UR  
Description  
The CXM3593UR is a high power DPDT switch for wireless communication systems.  
This IC has a 1.8 V CMOS compatible decoder.  
The Sony GaAs junction gate pHEMT (JPHEMT) MMIC process is used for low insertion loss and high linearity.  
(Application: LTE/CDMA/GSM/UMTS Handsets )  
Features  
Low Insertion loss: 0.26dB (Typ.) (Cellular Band )  
0.45 dB (Typ.) (IMT2000 )  
Low voltage operation: VDD = 2.5 V  
No DC blocking capacitors required on RF ports  
2 Control input  
Small package size: UQFN-12 pin (2.0 mm × 2.0 mm)  
Lead-Free and RoHS compliant  
Structure  
GaAs JPHEMT MMIC switch, CMOS decoder  
Moisture Sensitivity  
Moisture Sensitivity Level for this part is MSL= 2 (Tentative)  
Absolute Maximum Ratings  
Bias voltage  
VDD  
Vctl  
4
4
V
V
(Ta = 25 ˚C)  
Control voltage  
(Ta = 25 ˚C)  
Maximum input power  
Operating temperature  
Storage temperature  
36  
dBm  
˚C  
(Duty cycle = 12.5 to 50 %, Ta = 25 ˚C)  
Topr  
Tstg  
35 to +90  
65 to +150  
˚C  
This IC is ESD sensitive device. Special handling precautions are required.  
1
CXM3593UR  
Block Diagram  
DPDT Antenna Switch  
RF3  
RF1  
RF2  
Decoder  
Logic  
RF4  
F4  
VDD  
CTL 1/2  
MMIC Switch  
RF1  
RF3  
F1  
F3  
RF4  
RF2  
F2  
Truth Table  
CTL 1  
L
CTL 2  
H
Active path  
F1,F3  
ON  
F2,F4  
OFF  
RF1-RF4  
RF2-RF3  
RF1-RF3  
RF2-RF4  
H
L
OFF  
ON  
2
CXM3593UR  
Pin Configuration  
(Top View)  
11  
12  
10  
VDD  
CTL2  
CTL1  
1
2
3
RF4  
9
8
7
UQFN-12P PKG  
2.0m x 2.0mm  
GND  
RF1  
5
4
6
DC Bias Condition  
Parameter  
VDD  
Min.  
2.5  
1.35  
0
Typ.  
Max.  
3.3  
Unit  
V
2.85  
1.8  
Vctl (H)  
Vctl (L)  
3.3  
0.45  
3
CXM3593UR  
Target Electrical Characteristics  
(Ta = 25 °C, VDD = 2.5 V, Vctl = 0/1.8 V)  
Item  
Symbol  
Path  
Condition  
Min.  
Typ.  
0.26  
0.45  
0.55  
0.26  
0.45  
0.55  
25  
Max.  
0.36  
0.55  
0.70  
0.36  
0.55  
0.70  
Unit  
*1, *2, *6, *8  
*3, *4, *7, *9  
*5  
RF1-RF4  
RF2-RF3  
Insertion Loss  
IL  
dB  
*1, *2, *6, *8  
*3, *4, *7, *9  
*5  
RF1-RF3  
RF2-RF4  
*1, *2, *6, *8  
*3, *4, *7, *9  
*5  
22  
16  
14  
22  
16  
15  
RF1-RF4  
RF2-RF3  
18  
16  
Isolation  
VSWR  
ISO  
dB  
*1, *2, *6, *8  
*3, *4, *7, *9  
*5  
26  
RF1-RF3  
RF2-RF4  
19  
17  
All ports in  
active paths  
VSWR  
P0.1  
700 to 2700 MHz  
800 to 2200 MHz  
1.5  
P0.1dB  
Compression  
Point  
RF1-RF4, RF3  
RF2-RF3, RF4  
35  
38  
dBm  
2fo  
3fo  
2fo  
3fo  
2fo  
3fo  
IMD2  
-50  
-49  
-60  
-56  
-70  
-68  
41  
41  
45  
45  
50  
50  
108  
*6  
RF1-RF4, RF3  
RF2-RF3, RF4  
Harmonics  
*7  
dBm  
dBm  
*2, *3, *5  
Inter modulation  
distortion in Rx  
Band  
*10, *11, *12, *15, *16, *19, *20, *23, *24  
*10, *13, *14, *17, *18, *21, *22, *25, *26  
RF1-RF4, RF3  
RF2-RF3, RF4  
IMD3  
108  
Switching speed Ts  
50 % Ctl to 90 % RF  
VDD = 2.5 V to 90 % RF, Pin = 0 dBm  
Vctl = 1.8 V  
3
5
20  
5
µs  
µs  
Wakeup time  
Control current  
Supply current  
Twu  
Ictl  
Idd  
1
µA  
mA  
VDD = 2.85 V  
0.15  
0.25  
Electrical characteristics are measured with all RF ports terminated in 50 Ω.  
*1 Pin = 25 dBm, 704 to 787 MHz  
*2 Pin = 26 dBm, 824 to 960 MHz  
(Band 13, Band 17)  
(Band 5, Band 8)  
*3 Pin = 26 dBm, 1710 to 1990 MHz (Band 1 Tx, Band 2 Tx, Band 3 Tx, Band 4 Tx)  
*4 Pin = 10 dBm, 2110 to 2170 MHz (Band 1 Rx, Band 4 Rx)  
*5 Pin = 26 dBm, 2500 to 2690 MHz (Band 7)  
*6 Pin = 35 dBm, 824 to 915 MHz  
*7 Pin = 32 dBm, 1710 to 1910 MHz (GSM1800/1900 Tx)  
*8 Pin = 10 dBm, 869 to 960 MHz (GSM850/900 Rx)  
(GSM850/900 Tx)  
*9 Pin = 10 dBm, 1805 to 1990 MHz (GSM1800/1900 Rx)  
*10 Measured with the recommended circuit.  
4
CXM3593UR  
IMD condition  
IMD Condition  
fTx  
+20 dBm on RF  
[MHz]  
fBlocker  
15 dBm on ANT  
[MHz]  
fRx on RF  
[MHz]  
Band  
IMD2 (fRx fTx)  
190  
4090  
1760  
6040  
80  
*11  
*12  
*13  
*14  
*15  
*16  
*17  
*18  
*19  
*20  
*21  
*22  
*23  
*24  
*25  
*26  
IMD2 (fRx + fTx)  
IMD3 (2fTx fRx)  
IMD3 (2fTx + fRx)  
IMD2 (fRx fTx)  
IMD2 (fRx + fTx)  
IMD3 (2fTx fRx)  
IMD3 (2fTx + fRx)  
IMD2 (fRx fTx)  
IMD2 (fRx + fTx)  
IMD3 (2fTx fRx)  
IMD3 (2fTx + fRx)  
IMD2 (fRx fTx)  
IMD2 (fRx + fTx)  
IMD3 (2fTx fRx)  
IMD3 (2fTx + fRx)  
Band 1  
Band 2  
Band 5  
Band 7  
2140  
1960  
880  
1950  
1880  
835  
3840  
1800  
5720  
45  
1715  
790  
2550  
120  
5190  
2415  
7725  
2655  
2535  
5
CXM3593UR  
Recommended Circuit  
RF3  
11  
10  
12  
VDD  
1
RF4  
RF1  
9
C2  
CTL2  
CTL1  
2
3
8
7
C1  
L1  
5
6
4
L1  
C1  
RF2  
*1 No DC blocking capacitors are required on all RF ports. (Except sourcing DC bias)  
*2 The DC levels of all RF ports are GND.  
*3 L1 (27nH) and C1(12pF) are recommended on Ant port for ESD protection.  
*4 C2(100pF) is recommended on VDD pin for Decoupling Capacitor.  
6
CXM3593UR  
Recommended Land Pattern  
7
CXM3593UR  
Package Outline  
(Unit: mm)  
8
CXM3593UR  
Marking  
9
CXM3593UR  
Tape and Reel Size  
CXM3593UR-T9  
10  
CXM3593UR  
Note  
Sony reserves the right to change products and specifications without prior notice.  
This information does not convey any license by any implication or otherwise under any patents or other right.  
Application circuits shown, if any, are typical examples illustrating the operation of the devices. Sony cannot assume  
responsibility for any problems arising out of the use of these circuits.  
11  

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