USB2230 [SMSC]
5TH GENERATION HI-SPEED USB FLASH MEDIA & IrDA CONTROLLER WITH INTEGRATED CARD POWER FETs; 第5代高速USB闪存介质和红外控制器，集成卡功率场效应管
| 型号： | USB2230 |
| 厂家： | 
SMSC CORPORATION |
| 描述： | 5TH GENERATION HI-SPEED USB FLASH MEDIA & IrDA CONTROLLER WITH INTEGRATED CARD POWER FETs |
| 文件： | 总27页 (文件大小：1010K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
USB2229/USB2230
5th Generation Hi-Speed
USB Flash Media & IrDA
Controller with
Integrated Card Power
FETs
Datasheet
PRODUCT FEATURES
IrDA Controller
■ IrDA v1.1 FIR and SIR Compliant Controller, with
9.6K, 19.2K, 38.4K, 57.6K, 115.2K, 0.576Mbps,
1.152Mpbs and 4Mbps data rate support.
Flash Media Controller
—
—
12K Bytes of internal SRAM for general purpose
scratchpad
768 Bytes of internal SRAM for general purpose
scratchpad or program execution while re-flashing
external ROM
Two, Double Buffered Bulk Endpoints
Two, Bi-directional 512 Byte Buffers for Bulk Endpoints
64 Byte RX Control Endpoint Buffer
64 Byte TX Control Endpoint Buffer
—
—
—
—
■ Complete System Solution for interfacing
SmartMediaTM (SM) or xD Picture CardTM (xD)1,
Memory StickTM (MS), High Speed Memory Stick
(HSMS), Memory Stick PRO (MSPRO), MS DuoTM
Secure Digital (SD), High Speed SD, Mini-Secure
Digital (Mini-SD), TransFlash (SD),
,
■ Internal or External Program Memory Interface
—
76K Byte Internal Code Space or Optional 128K Byte
External Code Space using Flash, SRAM or EPROM
memory.
MultiMediaCardTM (MMC), Reduced Size
MultiMediaCard (RS-MMC), NAND Flash, Compact
FlashTM (CF) and CF UltraTM I & II, and CF form-
factor ATA hard drives to Hi-Speed USB
■ On Board 24Mhz Crystal Driver Circuit
■ Can be clocked by 48MHz external source
■ On-Chip 1.8V Regulator for Low Power Core
Operation
■ Internal PLL for 480Mhz Hi-Speed USB Sampling,
Configurable MCU clock
—
Supports USB Bulk Only Mass Storage Compliant
Bootable BIOS
■ Support for simultaneous operation of all above
devices. (only one at a time of each of the following
groups supported: CF or ATA drive, SM or XD or
NAND, SD or MMC)
■ Supports firmware upgrade via USB bus if “boot
block” Flash program memory is used
■ 12 GPIOs for special function use: LED indicators,
button inputs, power control to memory devices, etc.
■ On-Chip 4-Bit High Speed Memory Stick and MS
PRO Hardware Circuitry
—
Inputs capable of generating interrupts with either edge
sensitivity
■ On-Chip firmware reads and writes High Speed
Memory Stick and MS PRO
■ Attribute bit controlled features:
■ 1-bit ECC correction performed in hardware for
maximum efficiency
—
—
—
—
—
—
Activity LED polarity/operation/blink rate
Full or Partial Card compliance checking
Bus or Self Powered
■ Hardware support for SD Security Command
Extensions
LUN configuration and assignment
Write Protect Polarity
■ On-chip power FETs with short circuit protection for
supplying flash media card power
SmartDetachTM - Detach from USB when no Card
Inserted for Notebook apps
■ USB Bus Power Certified
—
—
—
—
—
—
Cover Switch operation for xD compliance
Inquiry Command operation
■ 3.3 Volt I/O with 5V input tolerance on VBUS/GPIO3
■ Complete USB Specification 2.0 Compatibility for Bus
Powered Operation
SD Write Protect operation
Older CF card support
—
—
Includes Hi-Speed USB Transceiver
A Bi-directional Control and two Bi-directional Bulk
Endpoints are provided.
Force USB 1.1 reporting
Internal or External Power FET operation
■ Compatible with Microsoft WinXP, WinME, Win2K
SP3, Apple OS10, Softconnex, and Linux Multi-LUN
Mass Storage Class Drivers
■ 8051 8 bit microprocessor
—
—
Provides low speed control functions
30 Mhz execution speed at 1 clock per instruction cycle
average
■ Win2K, Win98/98SE and Apple OS8.6 and OS9
Multi-LUN Mass Storage Class Drivers available from
SMSC
■ 128 Pin TQFP Package (1.0mm height, 14mmx14mm
footprint); green, lead-free package also available.
1.xD Picture Card not applicable to USB2229.
SMSC USB2229/USB2230
DATASHEET
Revision 1.2 (05-09-05)
5th Generation Hi-Speed USB Flash Media & IrDA Controller with Integrated Card Power FETs
Datasheet
ORDER NUMBER(S):
USB2229/USB2230-NE-03 FOR 128 PIN, TQFP PACKAGE; USB2229/USB2230-NU-03 FOR 128 PIN, TQFP
PACKAGE (GREEN, LEAD-FREE) PACKAGE
80 Arkay Drive
Hauppauge, NY 11788
(631) 435-6000
FAX (631) 273-3123
Copyright © SMSC 2005. All rights reserved.
Circuit diagrams and other information relating to SMSC products are included as a means of illustrating typical applications. Consequently,
complete information sufficient for construction purposes is not necessarily given. Although the information has been checked and is believed to be
accurate, no responsibility is assumed for inaccuracies. SMSC reserves the right to make changes to specifications and product descriptions at any
time without notice. Contact your local SMSC sales office to obtain the latest specifications before placing your product order. The provision of this
information does not convey to the purchaser of the described semiconductor devices any licenses under any patent rights or other intellectual
property rights of SMSC or others. All sales are expressly conditional on your agreement to the terms and conditions of the most recently dated
version of SMSC's standard Terms of Sale Agreement dated before the date of your order (the "Terms of Sale Agreement"). The product may
contain design defects or errors known as anomalies which may cause the product's functions to deviate from published specifications. Anomaly
sheets are available upon request. SMSC products are not designed, intended, authorized or warranted for use in any life support or other
application where product failure could cause or contribute to personal injury or severe property damage. Any and all such uses without prior written
approval of an Officer of SMSC and further testing and/or modification will be fully at the risk of the customer. Copies of this document or other
SMSC literature, as well as the Terms of Sale Agreement, may be obtained by visiting SMSC’s website at http://www.smsc.com. SMSC is a
registered trademark of Standard Microsystems Corporation (“SMSC”). Product names and company names are the trademarks of their respective
holders.
SMSC DISCLAIMS AND EXCLUDES ANY AND ALL WARRANTIES, INCLUDING WITHOUT LIMITATION ANY AND ALL IMPLIED
WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, TITLE, AND AGAINST INFRINGEMENT AND THE LIKE,
AND ANY AND ALL WARRANTIES ARISING FROM ANY COURSE OF DEALING OR USAGE OF TRADE.
IN NO EVENT SHALL SMSC BE LIABLE FOR ANY DIRECT, INCIDENTAL, INDIRECT, SPECIAL, PUNITIVE, OR CONSEQUENTIAL
DAMAGES; OR FOR LOST DATA, PROFITS, SAVINGS OR REVENUES OF ANY KIND; REGARDLESS OF THE FORM OF ACTION,
WHETHER BASED ON CONTRACT; TORT; NEGLIGENCE OF SMSC OR OTHERS; STRICT LIABILITY; BREACH OF WARRANTY; OR
OTHERWISE; WHETHER OR NOT ANY REMEDY OF BUYER IS HELD TO HAVE FAILED OF ITS ESSENTIAL PURPOSE, AND WHETHER
OR NOT SMSC HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES.
Revision 1.2 (05-09-05)
2
SMSC USB2229/USB2230
DATASHEET
5th Generation Hi-Speed USB Flash Media & IrDA Controller with Integrated Card Power FETs
Datasheet
Table of Contents
Chapter 1 General Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Chapter 2 Acronyms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Chapter 3 Pin Table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
3.1
3.2
128-Pin Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
128-Pin List Table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Chapter 4 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Chapter 5 Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Chapter 6 Pin Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
6.1
6.2
PIN Descriptions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Buffer Type Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Chapter 7 DC Parameters. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
7.1
7.2
7.3
Maximum Guaranteed Ratings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
DC Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Capacitance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Chapter 8 Packaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Chapter 9 GPIO Usage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
SMSC USB2229/USB2230
3
Revision 1.2 (02-21-05)
DATASHEET
5th Generation Hi-Speed USB Flash Media & IrDA Controller with Integrated Card Power FETs
Datasheet
List of Figures
Figure 5.1 USB2229/USB2230 128-Pin TQFP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Figure 8.1 USB2229/USB2230 128-Pin TQFP Package Outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Revision 1.2 (02-21-05)
4
SMSC USB2229/USB2230
DATASHEET
5th Generation Hi-Speed USB Flash Media & IrDA Controller with Integrated Card Power FETs
Datasheet
List of Tables
Table 3.1 USB2229/USB2230 128-Pin Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Table 3.2 USB2229/USB2230 128-Pin TQFP. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Table 6.1 USB2229/USB2230 Pin Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Table 6.2 USB2229/USB2230 Buffer Type Descriptions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Table 8.1 USB2229/USB2230 128-Pin TQFP Package Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Table 9.1 GPIO Usage (ROM Rev 0x00) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
SMSC USB2229/USB2230
5
Revision 1.2 (02-21-05)
DATASHEET
5th Generation Hi-Speed USB Flash Media & IrDA Controller with Integrated Card Power FETs
Datasheet
Chapter 1 General Description
The USB2229/USB2230 is a Hi-Speed USB IrDA and Bulk Only Mass Storage Class Peripheral
Controller. The Bulk Only Mass Storage Class Peripheral Controller supports CompactFlash (CF) in
True IDE Mode only, SmartMedia (SM), Memory Stick (MS) including both serial and parallel interface
and Secure Digital/MultiMediaCard (SD/MMC) flash memory devices. It provides a single chip solution
for the most popular flash memory cards in the market. In addition, the IrDA controller consists of the
SMSC IrCC block, which includes a Synchronous Communications Engine (SCE).
The IrCC SCE supports FIR and SIR IrDA. The IrCC offers flexible signal routing and programmable
output control through the Raw mode interface, General Purpose Data pins and Output Multiplexer.
Chip-level address decoding is required to access the IrCC register set.
The device consists of a USB 2.0 PHY and SIE, buffers, Fast 8051 microprocessor with expanded
scratchpad, and program SRAM, and IrDA, CF, MS, SM and SD controllers. The SD controller supports
both SD and MMC devices.
Provisions for external Flash Memory up to 128K bytes for program storage is provided (note: when
Bank switching is enabled the upper 64K will map into the 8051 ROM space, otherwise, only the first
64K bytes is used).
12K bytes of scratchpad SRAM and 768Bytes of program SRAM are also provided.
Twelve GPIO pins are provided for indicators, external serial EEPROM for OEM ID and system
configuration information, and other special functions.
Internal power FETs are provided to directly supply power to the xD/SM, MMC/SD and MS/MSPro
cards.
The internal ROM program is capable of implementing any combination of single or multi-LUN
CF/SD/MMC/SM/MS reader functions with individual card power control and activity indication. SMSC
also provides licenses** for Win98 and Win2K drivers and setup utilities. Note: Please check with
SMSC for precise features and capabilities for the current ROM code release.
*Note: In order to develop, make, use, or sell readers and/or other products using or incorporating any of the SMSC devices made
the subject of this document or to use related SMSC software programs, technical information and licenses under patent and other
intellectual property rights from or through various persons or entities, including without limitation media standard companies,
forums, and associations, and other patent holders may be required. These media standard companies, forums, and associations
include without limitation the following: Sony Corporation (Memory Stick, Memory Stick Pro); SD3 LLC (Secure Digital); MultiMedia
Card Association (MultiMediaCard); the SSFDC Forum (SmartMedia); the Compact Flash Association (Compact Flash); and Fuji
Photo Film Co., Ltd., Olympus Optical Co., Ltd., and Toshiba Corporation (xD-Picture Card). SMSC does not make such licenses
or technical information available; does not promise or represent that any such licenses or technical information will actually be
obtainable from or through the various persons or entities (including the media standard companies, forums, and associations), or
with respect to the terms under which they may be made available; and is not responsible for the accuracy or sufficiency of, or
otherwise with respect to, any such technical information.
SMSC's obligations (if any) under the Terms of Sale Agreement, or any other agreement with any customer, or otherwise, with
respect to infringement, including without limitation any obligations to defend or settle claims, to reimburse for costs, or to pay
damages, shall not apply to any of the devices made the subject of this document or any software programs related to any of such
devices, or to any combinations involving any of them, with respect to infringement or claimed infringement of any existing or future
patents related to solid state disk or other flash memory technology or applications ("Solid State Disk Patents"). By making any
purchase of any of the devices made the subject of this document, the customer represents, warrants, and agrees that it has
obtained all necessary licenses under then-existing Solid State Disk Patents for the manufacture, use and sale of solid state disk
and other flash memory products and that the customer will timely obtain at no cost or expense to SMSC all necessary licenses
under Solid State Disk Patents; that the manufacture and testing by or for SMSC of the units of any of the devices made the subject
of this document which may be sold to the customer, and any sale by SMSC of such units to the customer, are valid exercises of
the customer's rights and licenses under such Solid State Disk Patents; that SMSC shall have no obligation for royalties or otherwise
under any Solid State Disk Patents by reason of any such manufacture, use, or sale of such units; and that SMSC shall have no
obligation for any costs or expenses related to the customer's obtaining or having obtained rights or licenses under any Solid State
Disk Patents.
SMSC MAKES NO WARRANTIES, EXPRESS, IMPLIED, OR STATUTORY, IN REGARD TO INFRINGEMENT OR OTHER
VIOLATION OF INTELLECTUAL PROPERTY RIGHTS. SMSC DISCLAIMS AND EXCLUDES ANY AND ALL WARRANTIES
AGAINST INFRINGEMENT AND THE LIKE.
No license is granted by SMSC expressly, by implication, by estoppel or otherwise, under any patent, trademark, copyright, mask
work right, trade secret, or other intellectual property right.
**To obtain this software program the appropriate SMSC Software License Agreement must be executed and in effect. Forms of
these Software License Agreements may be obtained by contacting SMSC.
Revision 1.2 (02-21-05)
6
SMSC USB2229/USB2230
DATASHEET
5th Generation Hi-Speed USB Flash Media & IrDA Controller with Integrated Card Power FETs
Datasheet
Chapter 2 Acronyms
SM: SmartMedia
SMC: SmartMedia Controller
FM: Flash Media
FMC: Flash Media Controller
CF: Compact Flash
CFC: CompactFlash Controller
SD: Secure Digital
SDC: Secure Digital Controller
MMC: MultiMediaCard
MS: Memory Stick
MSC: Memory Stick Controller
TPC: Transport Protocol Code.
ECC: Error Checking and Correcting
CRC: Cyclic Redundancy Checking
SMSC USB2229/USB2230
7
Revision 1.2 (02-21-05)
DATASHEET
5th Generation Hi-Speed USB Flash Media & IrDA Controller with Integrated Card Power FETs
Datasheet
Chapter 3 Pin Table
3.1
128-Pin Package
Table 3.1 USB2229/USB2230 128-Pin Package
CompactFlashINTERFACE (28 Pins)
CF_D0
CF_D4
CF_D1
CF_D5
CF_D2
CF_D6
CF_D3
CF_D7
CF_D8
CF_D9
CF_D10
CF_D14
CF_IRQ
CF_nCS1
CF_nCD1
CF_D11
CF_D12
CF_nIOR
CF_IORDY
CF_SA1
CF_D13
CF_nIOW
CF_nCS0
CF_SA2
CF_D15
CF_nRESET
CF_SA0
CF_nCD2
SmartMedia INTERFACE (17 Pins)
SM_D0
SM_D4
SM_D1
SM_D5
SM_D2
SM_D3
SM_D7
SM_D6
SM_nRE
SM_nCE
SM_ALE
SM_nWP
SM_nWPS
SM_CLE
SM_nB/R
SM_nWE
SM_nCD
Memory Stick INTERFACE (7 Pins)
MS_BS
MS_D1
MS_SDIO/MS_D0
MS_D2
MS_SCLK
MS_INS
MS_D3
SD INTERFACE (7 Pins)
SD_CMD
SD_DAT2
SD_CLK
SD_DAT0
SD_nWP
SD_DAT1
SD_DAT3
USB INTERFACE (10 Pins)
USBDP
USBDM
VSSPLL
XTAL2
ATEST
RBIAS
VSSA
VDD18PLL
XTAL1/CLKIN
VDDA33
Revision 1.2 (02-21-05)
8
SMSC USB2229/USB2230
DATASHEET
5th Generation Hi-Speed USB Flash Media & IrDA Controller with Integrated Card Power FETs
Datasheet
Table 3.1 USB2229/USB2230 128-Pin Package (continued)
MEMORY/IO INTERFACE (27 Pins)
MA0/CLK_SEL0
MA4
MA1/CLK_SEL1
MA5
MA2/SEL_CLKDRV
MA3/TX_POL
MA7
MA6
MA10
MA14
MD2
MA8
MA9
MA11
MA12
MA13
MA15
MD0
MD1
MD3
MD4
MD5
MD6
MD7
nMRD
nMWR
nMCE
MISC (15 Pins)
GPIO1
GPIO5
GPIO2
GPIO3
GPIO7
GPIO4
GPIO6/ROMEN/MA16
GPIO8/
CRD_PWR0
GPIO9
GPIO10/
GPIO11/
GPIO12
CRD_PWR1
CRD_PWR2
nTEST0
nTEST1
nRESET
IrDA (3 PINS)
IR_RXD/RX
IR_TXD/TX
(5)VDD33
IR_MODE
DIGITAL, POWER, GROUND & NC (14 Pins)
(2)VDD18 (7)VSS
Total 128
3.2
128-Pin List Table
Table 3.2 USB2229/USB2230 128-Pin TQFP
PIN
#
NAME
MA
PIN
#
NAME
MA PIN
#
NAME
MA
PIN
#
NAME
MA
1
2
3
4
5
6
MA13
MA14
VDD33
MA15
MD0
8
8
-
33
34
35
36
37
38
CF_D1
CF_D2
CF_D3
CF_D4
CF_D5
CF_D6
8
8
8
8
8
8
65
66
67
68
69
70
SM_D0
SM_D1
SM_D2
SM_D3
SM_D4
SM_D5
8
8
8
8
8
8
97
98
VSS
RBIAS
-
-
-
-
-
-
99
ATEST
8
8
8
100
101
102
VDD33
VDD18PLL
MD1
XTAL1/
CLKIN
7
8
MD2
MD3
8
8
39
40
CF_D7
CF_D8
8
8
71
72
SM_D6
SM_D7
8
8
103
104
XTAL2
-
-
VSSPLL
SMSC USB2229/USB2230
9
Revision 1.2 (02-21-05)
DATASHEET
5th Generation Hi-Speed USB Flash Media & IrDA Controller with Integrated Card Power FETs
Datasheet
Table 3.2 USB2229/USB2230 128-Pin TQFP (continued)
PIN
#
NAME
MA
PIN
#
NAME
MA PIN
#
NAME
MA
PIN
#
NAME
MA
9
MD4
MD5
8
8
41
42
CF_D9
8
8
73
74
SM_ALE
SM_nWP
8
8
105
106
GPIO9
VDD18
8
-
10
GPIO8/
CRD_PWR0
11
12
MD6
MD7
8
8
43
44
VDD33
-
75
76
SM_CLE
8
-
107
108
GPIO7
VDD33
8
-
GPIO11/
8
SM_nWPS
CRD_PWR2
13
nMRD
8
45
CF_D10
8
77
SM_nB/R
-
109
GPIO6/
ROMEN/
MA16
8
14
15
nMWR
VSS
8
-
46
47
CF_D11
VSS
8
-
78
79
SM_nCD
-
110
111
GPIO5
GPIO4
8
8
GPIO10/
8
CRD_PWR1
16
17
18
19
VSS
nMCE
-
8
-
48
49
50
51
CF_D12
VDD18
8
-
80
81
82
83
VDD33
SM_nRE
SM_nWE
SM_nCE
-
112
113
114
115
VSS
nRESET
GPIO2
GPIO1
-
8
8
-
8
8
8
MS_INS
CF_D13
CF_D14
8
8
MS_D0/
8
MS_SDIO
20
21
22
MS_D1
MS_D2
MS_D3
8
8
8
52
53
54
CF_D15
CF_nCD1
CF_nCD2
8
-
84
85
86
VSS
VSS
-
-
-
116
117
118
MA0/
8
8
8
CLK_SEL0
MA1/
CLK_SEL1
-
VSSA
MA2/
SEL_
CLKDRV
23
MS_
8
55
CF_IRQ
8
87
USBDM
-
119
MA3/
8
SCLK
TX_POL
24
25
26
27
28
29
30
31
32
MS_BS
SD_nWP
SD_DAT0
SD_DAT1
SD_DAT2
SD_DAT3
SD_CMD
SD_CLK
CF_D0
8
-
56
57
58
59
60
61
62
63
64
CF_IORDY
CF_nIOR
CF_nIOW
CF_nRESET
CF_nCS0
CF_nCS1
CF_SA0
8
8
8
8
8
8
8
8
-
88
89
90
91
92
93
94
95
96
USBDP
VDDA33
IR_MODE
IR_RXD/RX
IR_TXD/TX
GPIO12
-
-
120
121
122
123
124
125
126
127
128
MA4
MA5
8
8
8
8
8
8
8
8
8
8
8
8
8
8
-
8
8
8
8
8
-
MA6
MA7
MA8
MA9
GPIO3
MA10
MA11
MA12
CF_SA1
nTEST1
8
CF_SA2
nTEST0
-
Revision 1.2 (02-21-05)
SMSC USB2229/USB2230
DATA1S0HEET
Chapter 4 Block Diagram
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5th Generation Hi-Speed USB Flash Media & IrDA Controller with Integrated Card Power FETs
Datasheet
Chapter 5 Pin Configuration
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Figure 5.1 USB2229/USB2230 128-Pin TQFP
Revision 1.2 (02-21-05)
SMSC USB2229/USB2230
DATA1S2HEET
5th Generation Hi-Speed USB Flash Media & IrDA Controller with Integrated Card Power FETs
Datasheet
Chapter 6 Pin Descriptions
This section provides a detailed description of each signal. The signals are arranged in functional
groups according to their associated interface.
The “n” symbol in the signal name indicates that the active, or asserted state occurs when the signal
is at a low voltage level. When “n” is not present before the signal name, the signal is asserted when
at the high voltage level.
The terms assertion and negation are used exclusively. This is done to avoid confusion when working
with a mixture of “active low” and “active high” signal. The term assert, or assertion indicates that a
signal is active, independent of whether that level is represented by a high or low voltage. The term
negate, or negation indicates that a signal is inactive.
6.1
PIN Descriptions
Table 6.1 USB2229/USB2230 Pin Descriptions
BUFFER
TYPE
NAME
SYMBOL
DESCRIPTION
CompactFlash (In True IDE mode) INTERFACE
CF Chip Select 1
CF Chip Select 0
CF_nCS1
O8PU
O8PU
O8
This pin is the active low chip select 1 signal for the CF
ATA device
CF_nCS0
CF_SA2
CF_SA1
CF_SA0
CF_IRQ
This pin is the active low chip select 0 signal for the task
file registers of CF ATA device in the True IDE mode.
CF Register
Address 2
This pin is the register select address bit 2 for the CF
ATA device.
CF Register
Address 1
O8
This pin is the register select address bit 1 for the CF
ATA device
CF Register
Address 0
O8
This pin is the register select address bit 0 for the CF
ATA device.
CF Interrupt
IPD
This is the active high interrupt request signal from the
CF device.
CF
CF_D[15:8]
I/O8PD
The bi-directional data signals CF_D15-CF_D8 in True
IDE mode data transfer.
Data 15-8
In the True IDE Mode, all of task file register operation
occur on the CF_D[7:0], while the data transfer is on
CF_D[15:0].
The bi-directional data signal has an internal weak pull-
down resistor.
CF
CF_D[7:0]
I/O8PD
IPU
The bi-directional data signals CF_D7-CF_D0 in the
True IDE mode data transfer.
Data7-0
In the True IDE Mode, all of task file register operation
occur on the CF_D[7:0], while the data transfer is on
CF_D[15:0].
The bi-directional data signal has an internal weak pull-
down resistor.
IO Ready
CF_IORDY
This pin is active high input signal.
This pin has an internally controlled weak pull-up
resistor.
SMSC USB2229/USB2230
Revision 1.2 (02-21-05)
DATA1S3HEET
5th Generation Hi-Speed USB Flash Media & IrDA Controller with Integrated Card Power FETs
Datasheet
Table 6.1 USB2229/USB2230 Pin Descriptions
BUFFER
NAME
SYMBOL
TYPE
DESCRIPTION
CF
CF_nCD2
IPU
This card detection pin is connected to the ground on
the CF device, when the CF device is inserted.
Card Detection2
This pin has an internally controlled weak pull-up
resistor.
CF
CF_nCD1
IPU
This card detection pin is connected to ground on the
CF device, when the CF device is inserted.
Card Detection1
This pin has an internally controlled weak pull-up
resistor.
CF
CF_nRESET
CF_nIOR
O8
O8
O8
This pin is an active low hardware reset signal to CF
device.
Hardware Reset
CF
This pin is an active low read strobe signal for CF
device.
IO Read
CF
CF_nIOW
This pin is an active low write strobe signal for CF
device.
IO Write Strobe
SmartMedia INTERFACE
SM
SM_nWP
SM_ALE
SM_CLE
SM_D[7:0]
SM_nRE
O8PD
O8PD
O8PD
I/O8PD
08PU
This pin is an active low write protect signal for the SM
device.
Write Protect
This pin has a weak pull-down resistor that is
permanently enabled
SM
This pin is an active high Address Latch Enable signal
for the SM device.
Address Strobe
This pin has a weak pull-down resistor that is
permanently enabled
SM
This pin is an active high Command Latch Enable signal
for the SM device.
Command Strobe
This pin has a weak pull-down resistor that is
permanently enabled
SM
These pins are the bi-directional data signal SM_D7-
SM_D0.
Data7-0
The bi-directional data signal has an internal weak pull-
down resistor.
SM
This pin is an active low read strobe signal for SM
device.
Read Enable
When using the internal FET, this pin has an internal
weak pull-up resistor that is tied to the output of the
internal Power FET.
08
If an external FET is used (Internal FET is disabled),
then the internal pull-up is not available (external pull-
ups must be used, and should be connected to the
applicable Card Power Supply).
Revision 1.2 (02-21-05)
SMSC USB2229/USB2230
DATA1S4HEET
5th Generation Hi-Speed USB Flash Media & IrDA Controller with Integrated Card Power FETs
Datasheet
Table 6.1 USB2229/USB2230 Pin Descriptions
BUFFER
NAME
SYMBOL
TYPE
DESCRIPTION
SM
SM_nWE
O8PU
This pin is an active low write strobe signal for SM
device.
Write Enable
When using the internal FET, this pin has an internal
weak pull-up resistor that is tied to the output of the
internal Power FET.
08
IPU
I
If an external FET is used (Internal FET is disabled),
then the internal pull-up is not available (external pull-
ups must be used, and should be connected to the
applicable Card Power Supply).
SM
SM_nWPS
SM_nB/R
A write-protect seal is detected, when this pin is low.
Write Protect Switch
This pin has an internally controlled weak pull-up
resistor.
SM
This pin is connected to the BSY/RDY pin of the SM
device.
Busy or Data Ready
An external pull-up resistor is required on this signal.
The pull-up resistor must be pulled up to the same
power source that powers the SM/NAND flash device.
SM
SM_nCE
O8PU
This pin is the active low chip enable signal to the SM
device.
Chip Enable
When using the internal FET, this pin has an internal
weak pull-up resistor that is tied to the output of the
internal Power FET.
08
If an external FET is used (Internal FET is disabled),
then the internal pull-up is not available (external pull-
ups must be used, and should be connected to the
applicable Card Power Supply).
SM
SM_nCD
MS_BS
IPU
This is the card detection signal from SM device to
indicate if the device is inserted.
Card Detection
This pin has an internally controlled weak pull-up
resistor.
MEMORY STICK INTERFACE
MS
O8
This pin is connected to the BS pin of the MS device.
Bus State
It is used to control the Bus States 0, 1, 2 and 3 (BS0,
BS1, BS2 and BS3) of the MS device.
MS
MS_SDIO/MS_
D0
I/O8PD
This pin is a bi-directional data signal for the MS device.
System
Most significant bit (MSB) of each byte is transmitted
first by either MSC or MS device.
Data In/Out
The bi-directional data signal has an internal weak pull-
down resistor.
MS
MS_D[3:1]
I/O8PD
This pin is a bi-directional data signal for the MS device.
System
The bi-directional data signals have internal weak pull-
down resistors.
Data In/Out
SMSC USB2229/USB2230
Revision 1.2 (02-21-05)
DATA1S5HEET
5th Generation Hi-Speed USB Flash Media & IrDA Controller with Integrated Card Power FETs
Datasheet
Table 6.1 USB2229/USB2230 Pin Descriptions
BUFFER
NAME
SYMBOL
TYPE
DESCRIPTION
MS
MS_INS
IPU
This pin is the card detection signal from the MS device
to indicate, if the device is inserted.
Card Insertion
This pin has an internally controlled weak pull-up
resistor.
MS
MS_SCLK
O8
This pin is an output clock signal to the MS device.
The clock frequency is software configurable.
System CLK
SD INTERFACE
SD
SD_DAT[3:0]
I/O8PU
These are bi-directional data signals.
Data3-0
These pins have internally controlled weak pull-up
resistors.
SD Clock
SD_CLK
SD_CMD
O8
This is an output clock signal to SD/MMC device.
The clock frequency is software configurable.
SD Command
I/O8PU
This is a bi-directional signal that connects to the CMD
signal of SD/MMC device.
This pin has an internally controlled weak pull-up
resistor.
SD
SD_nWP
IPD
This pin is an input signal with an internal weak pull-
down.
Write Protected
This pin has an internally controlled weak pull-down
resistor.
USB INTERFACE
USB Bus Data
USBDM
USBDP
IO-U
These pins connect to the USB bus data signals.
USB Transceiver
Bias
RBIAS
I
A 12.0kΩ, ± 1.0% resistor is attached from VSSA to this
pin, in order to set the transceiver’s internal bias
currents.
Analog Test
ATEST
AIO
This signal is used for testing the analog section of the
chip and should be connected to VDDA33 for normal
operation.
1.8v PLL Power
VDD18PLL
VSSPLL
1.8v Power for the PLL
PLL Ground
Reference
Ground Reference for 1.8v PLL power
3.3v Analog Power
VDDA33
VSSA
3.3v Analog Power
Analog Ground
Reference
Analog Ground Reference for 3.3v Analog Power.
Crystal
Input/External Clock
Input
XTAL1/
CLKIN
ICLKx
24Mhz Crystal or external 24/48 MHz clock input.
This pin can be connected to one terminal of the crystal
or can be connected to an external 24/48Mhz clock
when a crystal is not used.
Note:
The ‘MA[2:0] pins will be sampled while
nRESET is asserted, and the value will be
latched upon nRESET negation. This will
determine the clock source and value.
Revision 1.2 (02-21-05)
SMSC USB2229/USB2230
DATA1S6HEET
5th Generation Hi-Speed USB Flash Media & IrDA Controller with Integrated Card Power FETs
Datasheet
Table 6.1 USB2229/USB2230 Pin Descriptions
BUFFER
NAME
SYMBOL
TYPE
DESCRIPTION
Crystal Output
XTAL2
OCLKx
24Mhz Crystal
This is the other terminal of the crystal, or left open
when an external clock source is used to drive
XTAL1/CLKIN. It may not be used to drive any external
circuitry other than the crystal circuit.
MEMORY/IO INTERFACE
Memory Data Bus
MD[7:0]
IO8
When ROMEN bit of GPIO_IN1 register = 0, these
signals are used to transfer data between the internal
CPU and the external program memory.
These pins have internally controlled weak pull-up
resistors.
Memory Address
Bus
MA[15:3]
O8
These signals address memory locations within the
external memory.
Memory Address
Bus
MA3/
I/O8PU
MA3 Addresses memory locations within the external
memory.
TX_POL
During nRESET assertion, TX_POL will select the
operating polarity of the IR LED (active high or active
low) and the weak pull-up resistor will be enabled.
When nRESET is negated, the value on this pin will be
internally latched and this pin will revert to MA3
functionality, the internal pull-up will be disabled.
Memory Address
Bus
MA2/
I/O8PD
MA2 Addresses memory locations within the external
memory.
SEL_CLKDRV
SEL_CLKDRV. During nRESET assertion, this pins will
select the operating clock mode (crystal or externally
driven clock source), and a weak pull-down resistor is
enabled. When nRESET is negated, the value will be
internally latched and this pin will revert to MA2
functionality, the internal pull-down will be disabled.
‘0’ = Crystal operation (24MHz only)
‘1’ = Externally driven clock source (24MHz or 48MHz)
Note:
If the latched value is ‘1’, then the MA2 pin is
tri-stated when the following conditions are
true:
1. IDLE bit (PCON.0) is 1.
2. INT2 is negated
3. SLEEP bit of CLOCK_SEL is 1.
If the latched value is ‘0’, then the MA2 pin will function
identically to the MA[15:3] pins at all times (other than
during nRESET assertion).
SMSC USB2229/USB2230
Revision 1.2 (02-21-05)
DATA1S7HEET
5th Generation Hi-Speed USB Flash Media & IrDA Controller with Integrated Card Power FETs
Datasheet
Table 6.1 USB2229/USB2230 Pin Descriptions
BUFFER
NAME
SYMBOL
TYPE
DESCRIPTION
Memory Address
Bus
MA[1:0]/CLK_S
EL[1:0]
I/O8PD
MA[1:0], These signals address memory locations
within the external memory.
SEL[1:0]. During nRESET assertion, these pins will
select the operating frequency of the external clock, and
the corresponding weak pull-down resistors are
enabled. When nRESET is negated, the value on these
pins will be internal latched and these pins will revert to
MA[1:0] functionality, the internal pull-downs will be
disabled.
SEL[1:0] = ‘00’. 24MHz
SEL[1:0] = ‘01’. RESERVED
SEL[1:0] = ‘10’. RESERVED
SEL[1:0] = ‘11’. 48MHz
Note:
If the latched value is ‘1’, then the
corresponding MA pin is tri-stated when the
following conditions are true:
1. IDLE bit (PCON.0) is 1.
2. INT2 is negated
3. SLEEP bit of CLOCK_SEL is 1.
If the latched value is ‘0’, then the corresponding MA pin
will function identically to the MA[15:3] pins at all times
(other than during nRESET assertion).
Memory Write
Strobe
nMWR
nMRD
nMCE
O8
O8
O8
Program Memory Write; active low
Program Memory Read; active low
Program Memory Chip Enable; active low.
Memory Read
Strobe
Memory Chip
Enable
This signal is asserted, when any of the following
conditions are no longer met:
1. IDLE bit (PCON.0) is 1.
2. INT2 is negated
3. SLEEP bit of CLOCK_SEL is 1.
Note:
This signal is held to a logic ‘high’ while
nRESET is asserted.
MISC
General Purpose
I/O
GPIO1
GPIO2
GPIO3
GPIO4
GPIO5
I/O8
I/O8
I/O8
I/O8
I/O8
This pin may be used either as input, edge sensitive
interrupt input, or output.
General Purpose
I/O
This pin may be used either as input, edge sensitive
interrupt input, or output.
General Purpose
I/O
This pin may be used either as input, edge sensitive
interrupt input, or output.
General Purpose
I/O
This pin may be used either as input, edge sensitive
interrupt input, or output.
General Purpose
I/O
This pin may be used either as input, edge sensitive
interrupt input, or output.
Revision 1.2 (02-21-05)
SMSC USB2229/USB2230
DATA1S8HEET
5th Generation Hi-Speed USB Flash Media & IrDA Controller with Integrated Card Power FETs
Datasheet
Table 6.1 USB2229/USB2230 Pin Descriptions
BUFFER
NAME
SYMBOL
TYPE
DESCRIPTION
GPIO6, ROMEN,
GPIO6/ROMEN
/MA16
IPU
This pin has an internal weak pull-up resistor that is
enabled or disabled by the state of nRESET.
The pull-up is enabled when nRESET is active.
The pull-up is disabled, when the nRESET is inactive
(some clock cycles later, after the rising edge of
nRESET).
Memory Address 16
The state of this pin is latched internally on the rising
edge of nRESET to determine if internal or external
program memory is used.
The state latched is stored in ROMEN bit of GPIO_IN1
register.
I/O8
After the rising edge of nRESET, this pin may be used
as GPIO6 or RXD.
When pulled low via an external weak pull-down
resistor, an external program memory should be
connected to the memory data bus. The
USB2229/USB2230 uses this external bus for program
execution.
When this pin is left unconnected or pulled high by a
weak pull-up resistor, the USB2229/USB2230 uses the
internal ROM for program execution.
I/O8
For Bank Switching support, MA16 addresses the
external 128k memory above the standard 64k range
(the upper 64k is mapped into the 64k addressable
ROM space)
General Purpose
I/O
GPIO7
I/O8
I/O8
This pin may be used either as input, edge sensitive
interrupt input, or output.
General Purpose
GPIO8/
GPIO: This pin may be used either as input, edge
sensitive interrupt input, or output.
I/O
Or
CRD_PWR0
CRD_PWR: Card Power drive of 3.3V @ 100mA.
Card Power
General Purpose
I/O
GPIO9
I/O8
I/O8
This pin may be used either as input, edge sensitive
interrupt input, or output.
General Purpose
GPIO10/
GPIO: This pin may be used either as input, edge
sensitive interrupt input, or output.
I/O
Or
CRD_PWR1
CRD_PWR: Card Power drive of 3.3V @ 100mA.
Card Power
General Purpose
GPIO11/
I/O8
GPIO: This pin may be used either as input, edge
sensitive interrupt input, or output.
I/O
Or
CRD_PWR2
CRD_PWR: Card Power drive of 3.3V @ 200mA.
These pins may be used either as input, or output.
Card Power
General Purpose
I/O
GPIO12
nRESET
I/O8
IS
I
RESET input
This active low signal is used by the system to reset the
chip. The active low pulse should be at least 1µs wide.
TEST Input
nTEST[1:0]
These signals are used for testing the chip. User should
normally tie them high externally, if the test function is
not used.
SMSC USB2229/USB2230
Revision 1.2 (02-21-05)
DATA1S9HEET
5th Generation Hi-Speed USB Flash Media & IrDA Controller with Integrated Card Power FETs
Datasheet
Table 6.1 USB2229/USB2230 Pin Descriptions
BUFFER
NAME
SYMBOL
TYPE
DESCRIPTION
IrDA
IR MODE
IR_MODE
O8
I
IR_MODE, declares the operating speed of the IR link.
IR Receive Data or
UART RX
IR_RXD/RX
IR_RXD, can be used as IR receiver or as the UART
RX line.
IR Transmit Data or
UART TX
IR_TXD/TX
O8
IR_TXD, can be used as IR transmitter or as the UART
TX line.
DIGITAL POWER, GROUNDS, and NO CONNECTS
1.8v Digital Core
Power
VDD18
VDD33
VSS
+1.8V Core power
All VDD18 pins must be connected together on the
circuit board.
3.3v Power & &
Voltage Regulator
Input
3.3V Power & Regulator Input.
Pins 100 & 108 supply 3.3V power to the internal 1.8V
regulators.
Ground
Ground Reference
Notes:
■
Hot-insertion capable card connectors are required for all flash media. It is required for SD
connector to have Write Protect switch. This allows the chip to detect MMC card.
■
nMCE is normally asserted except when the 8051 is in standby mode.
6.2
Buffer Type Descriptions
Table 6.2 USB2229/USB2230 Buffer Type Descriptions
BUFFER
DESCRIPTION
I
Input
IPU
Input with internal weak pull-up resistor.
IPD
Input with internal weak pull-down resistor.
IS
Input with Schmitt trigger
I/O8
I/O8PU
I/O8PD
Input/Output buffer with 8mA sink and 8mA source.
Input/Output buffer with 8mA sink and 8mA source, with an internal weak pull-up resistor.
Input/Output buffer with 8mA sink and 8mA source, with an internal weak pull-down
resistor.
O8
Output buffer with 8mA sink and 8mA source.
O8PU
O8PD
ICLKx
Output buffer with 8mA sink and 8mA source, with an internal weak pull-up resistor.
Output buffer with 8mA sink and 8mA source, with an internal weak pull-down resistor.
XTAL clock input
Revision 1.2 (02-21-05)
SMSC USB2229/USB2230
DATA2S0HEET
5th Generation Hi-Speed USB Flash Media & IrDA Controller with Integrated Card Power FETs
Datasheet
Table 6.2 USB2229/USB2230 Buffer Type Descriptions (continued)
DESCRIPTION
BUFFER
OCLKx
I/O-U
AIO
XTAL clock output
Analog Input/Output Defined in USB specification
Analog Input/Output
SMSC USB2229/USB2230
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DATA2S1HEET
5th Generation Hi-Speed USB Flash Media & IrDA Controller with Integrated Card Power FETs
Datasheet
Chapter 7 DC Parameters
7.1
Maximum Guaranteed Ratings
Operating Temperature Range ............................................................................................0oC to +70oC
Storage Temperature Range.............................................................................................-55o to +150oC
Lead Temperature Range (soldering, 10 seconds)...................................................................... +325oC
Positive Voltage on GPIO3, with respect to Ground......................................................................... 5.5V
Positive Voltage on any signal pin, with respect to Ground ............................................................. 4.6V
Positive Voltage on XTAL1, with respect to Ground......................................................................... 4.0V
Positive Voltage on XTAL2, with respect to Ground......................................................................... 2.5V
Negative Voltage on GPIO8, 10 & 11, with respect to Ground (see Note 7.2)...............................-0.5V
Negative Voltage on any pin, with respect to Ground .....................................................................-0.5V
Maximum VDD18, VDD18PLL .............................................................................................................. +2.5V
Maximum VDD33, VDDA33 ................................................................................................................. +4.6V
*Stresses above the specified parameters could cause permanent damage to the device. This is a
stress rating only and functional operation of the device at any other condition above those indicated
in the operation sections of this specification is not implied.
Note 7.1 When powering this device from laboratory or system power supplies, it is important that
the Absolute Maximum Ratings not be exceeded or device failure can result. Some power
supplies exhibit voltage spikes on their outputs when the AC power is switched on or off.
In addition, voltage transients on the AC power line may appear on the DC output. When
this possibility exists, it is suggested that a clamp circuit be used.
Note 7.2 When internal power FET operation of these pins is enabled, these pins may be
simultaneously shorted to ground or any voltage up to 3.63V indefinitely, without damage
to the device as long as VDD33 and VDDA33 are less than 3.63V and TA is less than 70°C.
7.2
DC Electrical Characteristics
(TA = 0°C - 70°C, VDD33, VDDA33 = +3.3 V ± 0.3 V, VDD18, VDD18PLL = +1.8 V ± 10%,)
PARAMETER
SYMBOL
MIN
TYP
MAX
UNITS
COMMENTS
I,IPU & IPD Type Input Buffer
Low Input Level
High Input Level
Pull Down
VILI
VIHI
PD
PU
0.8
V
V
TTL Levels
2.0
72
58
µA
µA
Pull Up
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SMSC USB2229/USB2230
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5th Generation Hi-Speed USB Flash Media & IrDA Controller with Integrated Card Power FETs
Datasheet
PARAMETER
IS Type Input Buffer
Low Input Level
SYMBOL
MIN
TYP
MAX
UNITS
COMMENTS
VILI
VIHI
0.8
V
V
TTL Levels
High Input Level
2.0
Hysteresis
VHYSI
500
mV
ICLK Input Buffer
Low Input Level
High Input Level
VILCK
VIHCK
0.4
V
V
2.2
Input Leakage
(All I and IS buffers)
Low Input Leakage
High Input Leakage
IIL
-10
-10
+10
+10
µA
VIN = 0
IIH
mA
VIN = VDD33
O8. O8PU & 08PD Type
Buffer
Low Output Level
VOL
0.4
V
V
IOL = 8 mA @
VDD33= 3.3V
High Output Level
VOH
VDD33
- 0.4
IOH = -8mA @
VDD33= 3.3V
Output Leakage
Pull Down
Pull Up
IOL
PD
PU
-10
+10
µA
µA
µA
VIN = 0 to VDD33
(Note 7.3)
72
58
I/O8, I/O8PU & I/O8PD Type
Buffer
Low Output Level
VOL
0.4
V
V
IOL = 8 mA @
VDD33= 3.3V
High Output Level
VOH
VDD33
–
IOH = -8 mA @
VDD33= 3.3V
0.4
Output Leakage
Pull Down
IOL
PD
PU
-10
+10
µA
µA
µA
VIN = 0 to VDD33
(Note 7.3)
72
58
Pull Up
SMSC USB2229/USB2230
Revision 1.2 (02-21-05)
DATA2S3HEET
5th Generation Hi-Speed USB Flash Media & IrDA Controller with Integrated Card Power FETs
Datasheet
PARAMETER
SYMBOL
MIN
TYP
MAX
UNITS
COMMENTS
IO-U
(Note 7.4)
Integrated Power FET for
GPIO8 & GPIO10
Output Current
IOUT
100
mA
mA
Ω
GPIO8 or 10;
VdropFET = 0.23V
Short Circuit Current Limit
On Resistance
ISC
140
2.1
GPIO8 or 10;
VoutFET = 0V
RDSON
GPIO8 or 10;
IFET = 70mA
Output Voltage Rise Time
tDSON
800
µs
GPIO8 or 10;
CLOAD = 10µF
Integrated Power FET for
GPIO11)
Output Current
IOUT
200
mA
mA
Ω
GPIO11;
VdropFET = 0.46V
Short Circuit Current Limit
On Resistance
ISC
181
2.1
GPIO11;
VoutFET = 0V
RDSON
GPIO11;
IFET = 70mA
Output Voltage Rise Time
tDSON
800
60
µs
GPIO11;
CLOAD = 10µF
Supply Current Unconfigured
ICCINIT
45
mA
@ VDD18, VDD18PLL
1.8V
=
=
=
=
@ VDD33, VDDA33
3.3V
=
10
35
20
60
mA
mA
Supply Current Active
(Full Speed)
ICC
@ VDD18, VDD18PLL
1.8V
@ VDD33, VDDA33
3.3V
=
15
45
30
70
mA
mA
Supply Current Active
(High Speed)
ICC
@ VDD18, VDD18PLL
1.8V
@ VDD33, VDDA33
3.3V
=
15
30
mA
µA
Supply Current Standby
ICSBY
160
180
@ VDD18, VDD18PLL
1.8V
@ VDD33, VDDA33
3.3V
=
215
240
µA
Note 7.3 Output leakage is measured with the current pins in high impedance.
Note 7.4 See Appendix A for USB DC electrical characteristics.
Note 7.5 The Maximum power dissipation parameters of the package should not be exceeded
Revision 1.2 (02-21-05)
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5th Generation Hi-Speed USB Flash Media & IrDA Controller with Integrated Card Power FETs
Datasheet
Note 7.6 The assignment of each Integrated Card Power FET to a designated Card Connector is
controlled by both firmware and the specific board implementation. Firmware will default to
the settings listed in Table 9.1, “GPIO Usage (ROM Rev 0x00),” on page 27
7.3
Capacitance
TA = 25°C; fc = 1MHz; VDD18, VDD18PLL = 1.8V
LIMITS
TYP
PARAMETER
SYMBOL
MIN
MAX
UNIT
TEST CONDITION
Clock Input Capacitance
CIN
20
pF
All pins except USB pins
(and pins under test tied to
AC ground)
Input Capacitance
Output Capacitance
CIN
10
20
pF
pF
COUT
SMSC USB2229/USB2230
Revision 1.2 (02-21-05)
DATA2S5HEET
5th Generation Hi-Speed USB Flash Media & IrDA Controller with Integrated Card Power FETs
Datasheet
Chapter 8 Packaging
Figure 8.1 USB2229/USB2230 128-Pin TQFP Package Outline
Table 8.1 USB2229/USB2230 128-Pin TQFP Package Parameters
MIN
NOMINAL
MAX
REMARKS
A
A1
A2
D
D1
E
E1
H
L
L1
e
q
W
R1
R2
ccc
~
~
~
~
~
~
~
~
~
1.20
0.15
1.05
16.20
14.20
16.20
14.20
0.20
0.75
~
Overall Package Height
Standoff
0.05
0.95
15.80
13.80
15.80
13.80
0.09
0.45
~
Body Thickness
X Span
X body Size
Y Span
Y body Size
Lead Frame Thickness
Lead Foot Length
Lead Length
0.60
1.00
0.40 Basic
Lead Pitch
Lead Foot Angle
Lead Width
0o
0.13
0.08
0.08
~
~
0.18
~
~
~
7o
0.23
~
0.20
0.08
Lead Shoulder Radius
Lead Foot Radius
Coplanarity
Notes:
1. Controlling Unit: millimeter.
2. Tolerance on the true position of the leads is ± 0.035 mm maximum.
Package body dimensions D1 and E1 do not include the mold protrusion.
3. Maximum mold protrusion is 0.25 mm.
4. Dimension for foot length L measured at the gauge plane 0.25 mm above the seating plane.
5. Details of pin 1 identifier are optional but must be located within the zone indicated.
Revision 1.2 (02-21-05)
SMSC USB2229/USB2230
DATA2S6HEET
5th Generation Hi-Speed USB Flash Media & IrDA Controller with Integrated Card Power FETs
Datasheet
Chapter 9 GPIO Usage
Table 9.1 GPIO Usage (ROM Rev 0x00)
ACTIVE
NAME
LEVEL
SYMBOL
DESCRIPTION AND NOTE
GPIO1
H
Flash Media Activity LED/
xD_Door
Indicates media activity. Media or USB
cable must not be removed with LED lit.
Also may be used for xD Door
functionality
GPIO2
GPIO3
GPIO4
H
H
H
EE_CS
Serial EE PROM chip select
USB V bus detect
V_BUS
EE_DIN/EE_DOUT/xDID
Serial EE PROM input/output and xD
Identify
GPIO5
GPIO6
GPIO7
GPIO8
H
H
H
L
HS_IND/SD_CD
A16/ROMEN
HS Indicator LED or SD Card Detect
Switch input
A16 address line connect for DFU or
debug LED indicator optional.
EE_CLK/
Serial EE PROM clock output or
Unconfigured LED.
UNCONF_LED
MS_PWR_CTRL/
CRD_PWR0
Memory Stick Card Power Control, or
Internal Power FET0.
GPIO9
L
L
CF_PWR_CTRL
CompactFlash Card Power Control
GPIO10
SM_PWR_CTRL/
CRD_PWR1
SmartMedia Card Power Control, or
Internal Power FET1.
GPIO11
GPIO12
L
SD/MMC_PWR_CTRL/
CRD_PWR2
SD/MMC Card Power Control, or
Internal Power FET2.
H
MS_ACT_IND/
Media Activity
Memory Stick Activity Indicator, or
Media Activity LED.
SMSC USB2229/USB2230
Revision 1.2 (02-21-05)
DATA2S7HEET
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