AB026P2-14 [SKYWORKS]
Wide Band Medium Power Amplifier, 25000MHz Min, 28000MHz Max, 1 Func,;
| 型号： | AB026P2-14 |
| 厂家： | 
SKYWORKS SOLUTIONS INC. |
| 描述： | Wide Band Medium Power Amplifier, 25000MHz Min, 28000MHz Max, 1 Func, 局域网 射频 微波 |
| 文件： | 总4页 (文件大小：79K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
25–28 GHz Amplifier
AB026P2-14
Features
■ 30 dB Gain
■ +23 dBm Output Power
■ Rugged, Reliable Package
■ Single Voltage Operation
■ 100% RF and DC Testing
Description
The AB026P2-14 is a broadband millimeterwave power
amplifier in a rugged package.The amplifier is designed
for use in millimeterwave communication and sensor
systems as the transmitter front-end or gain stage when
high gain and wide bandwidth are required. The robust
ceramic and metal package provides excellent electrical
performance, excellent thermal performance, and a high
degree of environmental protection for long-term reliability.
A single supply voltage simplifies bias requirements. All
amplifiers are screened at the operating frequencies prior
to shipment for guaranteed performance. Amplifier is
targeted for millimeterwave point-to-point and point-to-
multipoint wireless communications systems.
Pin Out
PIN 1
INDICATOR
RF In
RF Out
Electrical Specifications at 25°C (VD1 = VD2 = VD3 = 5.5 V)
RF
Parameter
Symbol
BW
Min.
25
Typ.
24–29
30
Max.
Unit
GHz
dB
Bandwidth
28
Small Signal Gain
Input Return Loss
Output Return Loss
Output Power at Saturation
G
26
RL
9
dB
I
O
RL
11
dB
P
25
dBm
dBm
dB/C
SAT
1 dB
Output Power at 1 dB Gain Compression
Temperature Coefficient of Gain
P
21
23
dG/dT
-0.054
DC
Parameter
Symbol
Min.
Typ.
80
Max.
Unit
mA
mA
mA
mA
Drain Current 1
Drain Current 2
Drain Current 3
Total Drain Current
I
D1
I
D2
I
D3
260
260
600
I
+ I +I
D2 D3
800
D1
Skyworks Solutions, Inc. [978] 241-7000 • Fax [978] 241-7906 • Email sales@skyworksinc.com • www.skyworksinc.com
1
Specifications subject to change without notice. 2/00A
25–28 GHz Amplifier
AB026P2-14
Typical Performance Data
0
-5
40
-55˚C
30
S11
+25˚C
20
+85˚C
-10
-15
10
S22
0
20
25
30
35
20
25
30
35
Frequency (GHz)
Frequency (GHz)
Gain vs. Frequency
Return Loss vs. Frequency
25
20
15
10
Absolute Maximum Ratings
Characteristic
Value
Operating Temperature (T )
-55°C to +90°C
-65°C to +150°C
C
Storage Temperature (T
)
ST
Bias Voltage (V
)
D1
7 V
7 V
7 V
DC
DC
DC
Bias Voltage (VD )
2
Bias Voltage (VD )
3
Power In (P )
13 dBm
IN
25
26
27
28
29
30
Frequency (GHz)
Output Power vs. Frequency
Outline
0.470 (11.94 mm)
PIN 1
0.235
(5.60 mm)
IDENTIFICATION
0.225
(5.72 mm)
0.008
(0.20 mm)
0.450
(11.43 mm)
0.011
(0.28 mm)
AB026P2-14
YYWW
0.024
(0.61 mm)
0.018 (0.46 mm)
0.025 (0.64 mm)
0.055 (1.40 mm)
0.0265
0.057
(1.45 mm)
(0.67 mm)
TO LAUNCH
SURFACE
2
Skyworks Solutions, Inc. [978] 241-7000 • Fax [978] 241-7906 • Email sales@skyworksinc.com • www.skyworksinc.com
Specifications subject to change without notice. 2/00A
25–28 GHz Amplifier
AB026P2-14
Typical S-Parameters at 25°C (VD1 = VD2 = VD3 = 5.5 V)
S
S
S
12
S
22
11
21
Frequency
(GHz)
Mag.
Ang.
Mag.
Ang.
Mag.
Ang.
Mag.
Ang.
16.0
18.0
20.0
21.0
22.0
23.0
24.0
25.0
26.0
27.0
28.0
29.0
30.0
31.0
32.0
33.0
34.0
36.0
38.0
40.0
-5.91
-5.41
-5.74
-7.76
-8.63
-7.94
-7.34
-6.51
-5.80
-9.62
-17.12
-18.20
-18.58
-13.95
-8.21
-6.96
-6.62
-3.68
1.24
174.5
98.7
-39.13
-16.67
7.73
21.2
-99.0
74.8
-50.93
-66.24
-60.84
-63.18
-63.69
-67.28
-62.54
-56.54
-57.14
-63.29
-54.43
-55.64
-53.84
-54.49
-70.63
-46.39
-46.88
-40.34
-54.31
-57.13
19.5
8.1
-22.81
-20.60
-21.88
-18.28
-14.12
-12.49
-12.51
-12.64
-12.38
-14.67
-13.65
-14.22
-10.25
-12.08
-10.03
-6.72
-49.1
-102.1
-107.0
-112.8
-126.5
-160.2
176.3
151.3
128.9
85.7
-3.2
-124.7
118.9
155.8
90.3
-48.3
-70.7
-100.5
-134.1
-160.2
158.2
85.6
17.98
23.80
25.49
27.15
30.26
32.47
32.65
29.39
26.96
24.87
17.83
-6.06
-54.2
161.4
31.7
-86.0
152.1
19.6
-167.7
-177.8
145.3
158.0
90.2
-122.5
94.3
15.5
79.2
-52.4
-99.8
-89.0
-128.9
-168.4
162.3
118.8
42.4
-33.6
-179.1
-16.4
158.7
110.3
79.9
65.5
68.1
70.1
47.0
43.0
8.0
-8.5
-1.9
-27.77
-38.65
-36.27
-34.84
-34.19
25.5
-44.5
-85.7
-56.3
-119.1
-176.1
-18.1
-130.1
104.0
-118.7
-8.50
-67.2
79.0
-14.54
-6.12
-0.24
-51.8
-116.1
-6.18
Skyworks Solutions, Inc. [978] 241-7000 • Fax [978] 241-7906 • Email sales@skyworksinc.com • www.skyworksinc.com
3
Specifications subject to change without notice. 2/00A
25–28 GHz Amplifier
AB026P2-14
mounted directly to a surface which provides a good
ground plane for the printed circuit board and provides a
good thermal ground.
Co-Planar Millimeterwave Package
Handling and Mounting
Millimeterwave amplifiers require careful mounting design
to maintain optimal performance.
The RF connection on the printed circuit board should
include a microstrip line and two grounded pads, one on
either side of the microstrip line. The RF connection
between the package and the printed circuit board should
be accomplished with three ribbon bonds, one connecting
the RF lines on package and printed circuit board and two
connecting the ground pads on the package and printed
circuit board.
Handling
The co-planar millimeterwave package is very rugged.
However, due to ceramic’s brittle nature one should
exercise care when handling with metal tools. Do not apply
heavy pressure to the lid. Vacuum tools may be used to
pick and place this part.
Only personnel trained in both ESD precautions and
handling precautions should be allowed to handle these
packages.
Mounting the Package
The package should be attached to its mounting surface
using a silver-filled conductive paste epoxy. Care should
be taken to ensure that there are no voids or gaps in the
epoxy underfill so that a good ground contact is
maintained.
Package Construction
The co-planar millimeterwave package is constructed from
metal and ceramic.The base of the package is gold-plated
copper-molybdenum-copper.The lid is unplated alumina.
The lid seal is epoxy.
Screw hardware attachment should be used in addition
to conductive epoxy in situations where additional
mechanical integrity is desired. Care should be exercised
when tightening screws because over-tightening could
deform the package base.
Mounting Design
The co-planar millimeterwave package is mounted by
placing it in a hole cut in a printed circuit board. The RF
interface on the package should be in the same plane as
the surface of the printed circuit board. The hole should
be cut as close as possible to the outer dimensions of the
package to minimize the gap between package and
printed circuit board. The gap should be no more than
0.005" (0.127 mm). The base of the package should be
Connecting the Package
Thermosonic ribbon attachment with 0.00025" x 0.005"
(0.0064 mm x 0.127 mm) gold ribbon is used to make the
connections from the RF and DC package interfaces to
the printed circuit board. Lengths of ribbons should be
minimized.
Printed Circuit Board
Rogers 4003
Ribbon Bonds
0.008" (0.20 mm) Thick
RF Out
Minimize RF
Gap Widths
0–80 Screw
RF In
Electrically & Thermally
Conductive Ground Plane
Grounded Pad on
Printed Circuit Board
DC Lines
Co-Planar Millimeterwave Package Mounting
4
Skyworks Solutions, Inc. [978] 241-7000 • Fax [978] 241-7906 • Email sales@skyworksinc.com • www.skyworksinc.com
Specifications subject to change without notice. 2/00A
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