SUF-6000 [SIRENZA]

2-16 GHz Broadband pHEMT Amplifier; 2-16 GHz的宽带pHEMT制放大器
SUF-6000
型号: SUF-6000
厂家: SIRENZA MICRODEVICES    SIRENZA MICRODEVICES
描述:

2-16 GHz Broadband pHEMT Amplifier
2-16 GHz的宽带pHEMT制放大器

放大器 射频 微波
文件: 总4页 (文件大小:132K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Advanced Information  
SUF-6000  
2-16 GHz Broadband pHEMT Amplifier  
Product Description  
Sirenza Microdevices’ SUF-6000 is a high gain broadband 2-stage  
amplifier covering 2-16 GHz for wideband communication and general  
purpose applications. This pHEMT FET-based amplifier uses a patented  
self-bias Darlington topology featuring a gain and temperature  
compensating active bias network that operates from a single 5V supply.  
Its compact size make it ideal for high-density multi-chip module  
applications.  
Product Features  
Broadband Performance  
High Gain = 17.4 dB @ 14 GHz  
P1dB = 12.0 dBm @ 14 GHz  
IP3 = 24.9 dBm @ 14 GHz  
• 5V Operation, No Dropping Resistor  
Low Gain Variation vs. Temperature  
Patented Thermal Design  
Gain & Return Loss vs. Frequency  
GSG Probe Data  
24  
20  
16  
12  
8
0
Gain  
-5  
Patented Self-Bias Darlington Circuit  
-10  
-15  
-20  
-25  
-30  
ORL  
Applications  
Broadband Communications  
Test Instrumentation  
Military & Space  
LO and IF Mixer Applications  
High IP3 RF Driver Applications  
4
IRL  
0
2
4
6
8
10  
12  
14  
16  
18  
20  
Frequency (GHz)  
Parameters  
Symbol  
Units  
Frequency  
Min.  
Typ.  
Max.  
2 GHz  
6 GHz  
14 GHz  
2 GHz  
6 GHz  
14 GHz  
2 GHz  
6 GHz  
14 GHz  
2 GHz  
6 GHz  
14 GHz  
2 GHz  
6 GHz  
14 GHz  
2 GHz  
6 GHz  
14 GHz  
2 GHz  
6 GHz  
14 GHz  
18.0  
20.5  
17.4  
13.0  
14.0  
12.0  
25.3  
27.5  
24.9  
5.0  
Gp  
Small Signal Power Gain  
dB  
P1dB  
OIP3  
NF  
Output Power at 1dB Compression  
Output Third Order Intercept Point  
Noise Figure  
dBm  
dBm  
dB  
4.7  
6.0  
-14.2  
-19.7  
-12.1  
-26.2  
-19.4  
-11.5  
-36.9  
IRL  
Input Return Loss  
dB  
ORL  
Isol  
Output Return Loss  
dB  
Reverse Isolation  
dB  
-34.4  
-32.6  
5.0  
VD  
ID  
Device Operating Voltage  
Device Operating Current  
V
mA  
107  
Device Gain Temperature Coefficient  
Thermal Resistance (junction-to-backside)  
V= 5 V I = 80 mA Typ.  
dB/°C  
°C/W  
TBD  
TBD  
ΔG/ΔT  
Rth, j-l  
OIPTone Spacing = 1 MHz, Pout per tone = 0 dBm  
Test Conditions:  
Test Conditions: VD = 5.0V, ID = 107mA, OIP3 Tone Spacing = 1MHz, Pout per tone = 0 dBm  
ZS = ZL = 50 Ohms, 25C, GSG Probe Data With Bias Tees  
The information provided herein is believed to be reliable at press time. Sirenza Microdevices assumes no responsibility for inaccuracies or omissions. Sirenza Microdevices assumes no responsibility for the use of this  
information, and all such information shall be entirely at the user’s own risk. Prices and specifications are subject to change without notice. No patent rights or licenses to any of the circuits described herein are implied or  
granted to any third party. Sirenza Microdevices does not authorize or warrant any Sirenza Microdevices product for use in life-support devices and/or systems. Copyright 2007 Sirenza Microdevices, Inc.. All worldwide rights  
reserved.  
303 S. Technology Ct.  
Broomfield, CO 80021  
Phone: (800) SMI-MMIC  
1
http://www.sirenza.com  
EDS-105420 Rev A  
Advanced Information  
SUF-6000 2-16 GHz Broadband pHEMT Amplifier  
Typical Performance (GSG Probe Data)  
|S21| vs. Frequency  
P1dB vs. Frequency  
16  
24  
20  
16  
14  
12  
10  
8
12  
25C  
-20C  
25C  
85C  
-40C  
85C  
8
4
0
6
2
4
6
8
10  
12  
14  
16  
18  
20  
2
4
6
8
10  
12  
14  
16  
18  
Frequency (GHz)  
Frequency (GHz)  
|S22| vs. Frequency  
|S11| vs. Frequency  
0
0
-5  
25C  
-40C  
85C  
-5  
-10  
-15  
-20  
-25  
-30  
-10  
-15  
-20  
-25  
-30  
25C  
-40C  
85C  
2
4
6
8
10  
12  
14  
16  
18  
20  
2
4
6
8
10  
12  
14  
16  
18  
20  
Frequency (GHz)  
Frequency (GHz)  
NF vs. Frequency  
OIP3 vs. Frequency (0dBm/tone, 1MHz spacing)  
10  
8
28  
26  
24  
22  
20  
18  
6
4
-20C  
-20C  
25C  
85C  
25C  
85C  
2
0
2
4
6
8
10  
12  
14  
16  
18  
2
4
6
8
10  
12  
14  
16  
18  
Frequency (GHz)  
Frequency (GHz)  
303 S. Technology Ct.  
Broomfield, CO 80021  
Phone: (800) SMI-MMIC  
2
http://www.sirenza.com  
EDS-105420 Rev A  
Advanced Information  
SUF-6000 2-16 GHz Broadband pHEMT Amplifier  
Typical Performance (GSG Probe Data)  
Freq  
VD  
Current  
Gain  
P1dB  
OIP3  
S11  
S22  
NF  
(GHz)  
2
(V)  
5
(mA)  
107  
107  
107  
107  
107  
107  
107  
107  
107  
(dB)  
18.0  
18.9  
19.6  
20.2  
20.5  
19.6  
18.4  
17.4  
14.5  
(dBm)  
13.0  
13.6  
13.7  
14.1  
14.0  
13.2  
12.9  
12.0  
10.6  
(dBm)  
25.3  
26.1  
26.8  
26.8  
27.5  
26.4  
25.9  
24.9  
23.8  
(dB)  
-14.2  
-16.2  
-18.6  
-20.0  
-19.7  
-26.3  
-19.9  
-12.1  
-7.9  
(dB)  
-26.2  
-32.0  
-32.2  
-26.9  
-19.4  
-13.3  
-12.1  
-11.5  
-12.5  
(dB)  
5.0  
5.0  
5.0  
5.0  
4.7  
5.3  
5.6  
6.0  
7.0  
2.4  
3
5
5
4
5
6
5
10  
12  
5
5
Test Conditions:  
14  
5
16  
5
Test Conditions: GSG Probe Data With Bias Tees, OIP3 Tone Spacing = 1MHz, Pout per tone = 0 dBm, 25°C  
Parameter  
Max Device Current (ID)  
Max Device Voltage (VD)  
Max RF Input Power  
Absolute Limit  
163mA  
5.5V  
10dBm  
Max Dissipated Power  
Max Junction Temperature (TJ)  
Operating Temperature Range (TL)  
Max Storage Temp.  
150C  
-40 to +85C  
-65 to +150C  
Operation of this device beyond any one of these limits may cause  
permanent damage. For reliable continuous operation, the device  
voltage and current must not exceed the maximum operating values  
specified in the table on page one.  
Current Variation vs. Temperature  
Bias Conditions should also satisfy the following expression:  
IDVD < (TJ - TL) / RTH, j-l  
TL=Backside of die  
Current vs. Voltage  
120  
ELECTROSTATIC SENSITIVE DEVICE  
Appropriate precautions in handling, packaging  
and testing devices must be observed.  
115  
110  
105  
100  
95  
-20C  
25C  
85C  
90  
4.75  
4.85  
4.95  
5.05  
5.15  
5.25  
Volatage (V)  
303 S. Technology Ct.  
Broomfield, CO 80021  
Phone: (800) SMI-MMIC  
3
http://www.sirenza.com  
EDS-105420 Rev A  
Advanced Information  
SUF-6000 2-16 GHz Broadband pHEMT Amplifier  
Pad Description  
2
1
Notes:  
Pad #  
1
Function  
Description  
1. All Dimensions in Inches [Millimeters].  
2. No connection required for unlabeled bond pads.  
3. Die Thickness is 0.004 (0.100).  
4. Typical bond pad is 0.004 (0.100) square.  
5. Backside metalization: Gold.  
6. Backside is Ground.  
This pad is DC coupled and matched to 50 Ohms.  
An external DC block is required.  
This pad is DC coupled and matched to 50 Ohms.  
Bias is applied through this pad.  
RFIN  
RFOUT / Bias  
GND  
2
7. Bond pad metalization: Gold.  
Die  
Bottom  
Die bottom must be connected to RF/DC ground  
using silver-filled conductive epoxy.  
Device Assembly  
+5V  
Interconnect  
Wire or Ribbon  
Bypass Cap(s)  
Choke  
50Ω Line  
DC Block  
50Ω Line  
DC Block  
3-5 mil gap  
303 S. Technology Ct.  
Broomfield, CO 80021  
Phone: (800) SMI-MMIC  
4
http://www.sirenza.com  
EDS-105420 Rev A  

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