SP207EHEA/TR [SIPEX]
Line Transceiver, 3 Func, 5 Driver, 3 Rcvr, CMOS, PDSO24, SSOP-24;型号: | SP207EHEA/TR |
厂家: | SIPEX CORPORATION |
描述: | Line Transceiver, 3 Func, 5 Driver, 3 Rcvr, CMOS, PDSO24, SSOP-24 驱动 光电二极管 接口集成电路 驱动器 |
文件: | 总16页 (文件大小:203K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
®
SP207EH–SP213EH
High Speed +5V High Performance
RS232 Transceivers
■ Single +5V Supply Operation
■ 0.1µF External Charge Pump Capacitors
■ 500Kbps Data Rate Under Load
■ Standard SOIC and SSOP Packages
■ Lower Supply Current Than Competition
(typical 3mA)
■ 1µA Shutdown Mode
■ WakeUp Feature in Shutdown Mode
■ Tri–State Receiver Outputs
■ Ideal for High Speed RS-232 Applications
■ Improved ESD Specifications:
+15kV Human Body Model
+15kV IEC1000-4-2 Air Discharge
+8kV IEC1000-4-2 Contact Discharge
DESCRIPTION
The SP207EH/208EH/211EH/213EH devices are high speed enhanced multi-channel
RS-232 line transceivers with improved electrical performance. The SP207EH/208EH/
211EH/213EH series is a superior drop-in replacement to our previous versions as well as
popular industry standards. All devices feature low-power CMOS construction and the
Sipex-patented (5,306,954) on-board charge pump circuitry that generates the +10V
RS-232 voltage levels using 0.1µF charge pump capacitors. The SP211E and SP213E
devices feature a low-power shutdown mode, which reduces power supply drain to 1µA.
Enhancements to this series include a higher transmission rate of 500Kbps, a lower
power supply current at 3mA typical (no load), and superior ESD performance. The ESD
tolerance has been improved for this series to over +15kV for both Human Body Model and
IEC1000-4-2 Air Discharge test methods.
Nu RS232
No. of Receivers
No. of External
Model
Drivers Receivers
Active in Shutdown 0.1µF Capacitors Shutdown WakeUp TTL Tri–State
SP207EH
SP208EH
SP211EH
SP213EH
5
4
4
4
3
4
5
5
0
0
0
2
4
4
4
4
No
No
No
No
No
No
Yes
Yes
No
Yes
Yes
Yes
Table 1. Model Selection Table
SP207EHDS/08
SP207EH Series High Performance Transceivers
© Copyright 2000 Sipex Corporation
Power Dissipation Per Package
ABSOLUTE MAXIMUM RATINGS
24-pin SSOP (derate 11.2mW/oC above +70oC)....900mW
24-pin PDIP (derate 15.9mW/oC above +70oC)....1300mW
24-pin SOIC (derate 12.5mW/oC above +70oC)...1000mW
28-pin SSOP (derate 11.2mW/oC above +70oC)....900mW
28-pin SOIC (derate 12.7mW/oC above +70oC)...1000mW
These are stress ratings only and functional operation of the device at
these or any other above those indicated in the operation sections of
thespecificationsbelowisnotimplied. Exposuretoabsolutemaximum
rating conditions for extended periods of time may affect reliability.
VCC ............................................................................................ +6V
V+ ................................................................. (VCC – 0.3V) to +13.2V
V– ........................................................................................... 13.2V
Input Voltages
TIN ................................................................... –0.3V to (VCC +0.3V)
RIN ........................................................................................... ±20V
Output Voltages
T
OUT .......................................................... (V+, +0.3V) to (V–, –0.3V)
ROUT ................................................................. –0.3V to (VCC +0.3V)
Short Circuit Duration on TOUT ....................................... Continuous
Power Dissipation
Plastic DIP .......................................................................... 375mW
(derate 7mW/°C above +70°C)
Small Outline ...................................................................... 375mW
(derate 7mW/°C above +70°C)
SPECIFICATIONS
VCC at nominal ratings; 0.1µF charge pump capacitors; TMIN to TMAX, unless otherwise noted.
PARAMETER
MIN.
TYP.
MAX.
UNIT
CONDITIONS
TIN, EN, SD
TTL INPUTS
Logic Threshold
VIL
0.8
Volts
Volts
µA
VIH
2.0
Logic Pullup Current
15
200
TIN = 0V
Maximum Transmission Rate 480
Kbps
CL = 1000pF, RL = 3KΩ
TTL OUTPUTS
Compatibility
VOL
TTL/CMOS
0.05
0.4
Volts
Volts
µA
IOUT = 3.2mA; VCC = +5V
IOUT = –1.0mA
0V ≤ ROUT ≤ VCC ; SP211 EN = 0V;
VOH
3.5
Leakage Current
+10
SP213 EN = VCC
TA = +25°C
RS232 OUTPUT
Output Voltage Swing
+5
+7
Volts
All transmitter outputs loaded
with 3KΩ to ground
Output Resistance
300
Ω
VCC = 0V; VOUT = +2V
Output Short Circuit Current
+25
mA
Infinite duration, VOUT = 0V
RS232 INPUT
Voltage Range
Voltage Threshold
Low
High
Hysteresis
Resistance
–15
0.8
+15
Volts
1.2
1.7
0.5
5
Volts
Volts
Volts
kΩ
VCC = 5V, TA = +25°C
VCC = 5V, TA = +25°C
VCC = +5V
2.8
1.0
7
0.2
3
VIN =+15V; TA = +25°C
DYNAMIC CHARACTERISTICS
Driver Propagation Delay
Receiver Propagation Delay
Instantaneous Slew Rate
250
200
ns
ns
V/µs
TTL–to–RS-232
RS-232–to–TTL
500
TBD
CL = 50pF, RL = 3–7KΩ;
TA = +25°C; from +3V
CL = 2,500pF, RL = 3KΩ;
measured from +3V to –3V
or –3V to +3V
Transition Time
TBD
µs
Output Enable Time
Output Disable Time
400
250
ns
ns
SP207EHDS/08
SP207EH Series High Performance RS232 Transceivers
© Copyright 2000 Sipex Corporation
2
SPECIFICATIONS
VCC at nominal ratings; 0.1µF charge pump capacitors; TMIN to TMAX, unless otherwise noted.
PARAMETER
MIN.
TYP.
MAX.
UNIT
CONDITIONS
POWER REQUIREMENTS
VCC
SP207EH
All other parts
ICC
4.75
4.50
5.00
5.00
5.25
5.50
Volts
Volts
TA = +25°C
3
15
1
6
mA
mA
µA
No load; VCC = ±10%
All transmitters RL = 3KΩ
TA = +25°C
Shutdown Current
10
ENVIRONMENTAL AND MECHANICAL
Operating Temperature
Commercial, –C
Extended, –E
Storage Temperature
0
–40
–65
+70
+85
+125
°C
°C
°C
Package
–A
–T
Shrink (SSOP) small outline
Wide (SOIC) small outline
–P
Narrow (PDIP) Plastic Dual-In-Line
Transmitter Output @ 240Kbps RL = 3KΩ, CL = 1,000pF
Transmitter Output @ 500Kbps RL = 3KΩ, CL = 1,000pF
SP207EHDS/08
SP207EH Series High Performance Transceivers
© Copyright 2000 Sipex Corporation
3
PINOUT
T
3 OUT
T
4 OUT
T2 OUT
T1OUT
R2IN
T3 OUT
R3IN
24
23
22
21
20
19
18
17
16
15
14
13
24
23
22
21
20
19
18
17
16
15
14
13
1
2
1
2
T1OUT
R2IN
T2OUT
R1IN
R2OUT
T5IN
R3OUT
T4IN
3
3
R2OUT
T1IN
4
4
R1OUT
T2IN
T5OUT
T4IN
T4OUT
T3IN
5
5
R1OUT
R1IN
6
6
T1IN
T3IN
T2IN
7
7
GND
VCC
R3OUT
R3IN
GND
R4OUT
R4IN
8
8
VCC
9
9
+
C1
–
+
C1
–
V
V
10
11
12
10
11
12
+
–
+
–
C2
V
C2
V
–
C1
+
–
C1
+
C2
C2
T3 OUT
T1OUT
T2OUT
R2IN
T4 OUT
T3 OUT
T1OUT
T2OUT
R2IN
T4 OUT
28
27
26
25
24
23
22
21
20
19
18
17
16
15
1
2
28
27
26
25
24
23
22
21
20
19
18
17
16
15
1
2
R3IN
R3IN
R3OUT
SHUTDOWN (SD)
EN
R3OUT
SHUTDOWN (SD)
EN
3
3
4
4
R2OUT
T2IN
R2OUT
T2IN
5
5
R4IN
R4IN
6
6
T1IN
R4OUT
T4IN
T1IN
R4OUT
T4IN
7
7
R1OUT
R1IN
R1OUT
R1IN
8
8
T3IN
T3IN
9
9
GND
R5OUT
R5IN
GND
R5OUT
R5IN
10
11
12
13
14
10
11
12
13
14
VCC
VCC
+
C1
–
+
C1
–
V
V
+
–
C2
+
–
C2
V
V
–
C1
+
C2
–
C1
+
C2
SP207EHDS/08
SP207EH Series High Performance RS232 Transceivers
© Copyright 2000 Sipex Corporation
4
FEATURES
Charge–Pump
As in the original RS-232 multi-channel
products, the SP207EH Series high speed
multi-channel RS-232 line transceivers provide
a variety of configurations to fit most designs,
especially high speed applications where +12V
is not available. The SP207EH Series is a
superior high speed drop-in replacement to our
previous versions as well as popular industry
standards.
The charge pump is a Sipex–patented design
(5,306,954) and uses a unique approach
compared to older less–efficient designs. The
chargepumpstillrequiresfourexternalcapacitors,
but usesa four–phase voltage shiftingtechnique
to attain symmetrical 10V power supplies.
Figure 3a shows the waveform found on the
positive side ofcapacitorC , andFigure 3b shows
the negative side of cap2acitor C2. There is a
free–running oscillator that controls the four
phases of the voltage shifting. A description of
each phase follows.
All devices in this series feature low-power
CMOS construction and Sipex's proprietary
on-board charge pump circuitry to generate the
+10V RS-232 voltage levels. The ability to
use 0.1µF charge pump capacitors saves
board space and reduces production costs.
The devices in this series provide different
driver/receiver combinations to match any
application requirement.
Phase 1
—VSS chargestorage—Duringthisphaseofthe
clock cycle, the positive side of capacitors C1
and C2 are initially charged to +5V. Cl+ is then
switched to ground and the charge in C1– is
–
transferred to C . Since C + is connected to
+5V, the voltage2potential ac2ross capacitor C2 is
now 10V.
The SP211EH and SP213EH models feature a
low–power shutdown mode, which reduces
power supply drain to 1µA. The SP213EH
includes a Wake-Up function which keeps two
receivers active in the shutdown mode, unless
disabled by the EN pin.
Phase 2
— VSS transfer — Phase two of the clock
connects the negative terminal of C to the VSS
storage capacitor and the positive ter2minal of C2
to ground, and transfers the generated –l0V to
C . Simultaneously, the positive side of capacitor
C3 is switched to +5V and the negative side is
co1nnected to ground.
The family is available in 28–pin SO (wide) and
SSOP (shrink) small outline packages. Devices
can be specified for commercial (0°C to +70°C)
and industrial/extended (–40°C to +85°C) oper-
ating temperatures.
Phase 3
— VDD charge storage — The third phase of the
clock is identical to the first phase — the charge
transferred in C1 produces –5V in the negative
terminal of C1, which is applied to the negative
side of capacitor C . Since C2+ is at +5V, the
voltage potential acr2oss C2 is l0V.
THEORY OF OPERATION
The SP207EH Series devices are made up of
three basic circuit blocks — 1) transmitter/
driver, 2) receiver and 3) the SIPEX–propri-
etary charge pump. Each model within the
Series incorporates variations of these circuits
to achieve the desired configuration and
performance.
V
= +5V
CC
C
4
+5V
+
–
+
V
V
Storage Capacitor
Storage Capacitor
DD
SS
+
–
+
–
C
C
2
1
–
C
–5V
–5V
3
Figure 1. Charge Pump — Phase 1
SP207EHDS/08
SP207EH Series High Performance Transceivers
© Copyright 2000 Sipex Corporation
5
V
= +5V
CC
C
4
+
–
+
V
V
Storage Capacitor
Storage Capacitor
DD
SS
+
–
+
–
C
C
2
1
–
C
–10V
3
Figure 2. Charge Pump — Phase 2
Phase 4
designs in personal computer peripherals and
LAN applications that demand high speed
performance.
— V transfer — The fourth phase of the clock
connDeDcts the negative terminal of C2 to ground,
and transfers the generated l0V across C2 to C ,
theV storagecapacitor.Again,simultaneousl4y
with DthDis, the positive side of capacitor C1 is
switched to +5V and the negative side is
connectedtoground, andthecyclebeginsagain.
The drivers are inverting transmitters, which
accept either TTL or CMOS inputs and output the
RS-232 signals with an inverted sense relative to
the input logic levels. Typically, the RS-232
outputvoltageswingis+9Vwithnoload,and+5V
minimum with full load. The transmitter outputs
are protected against infinite short–circuits to
ground without degradation in reliability. The
drivers of the SP211EH, and SP213EH can be
tri–stated by using the SHUTDOWN function.
Since both V+ and V– are separately generated
from VCC; in a no–load condition V+ and V– will
be symmetrical. Older charge pump approaches
that generate V– from V+ will show a decrease in
the magnitude of V– compared to V+ due to the
inherent inefficiencies in the design.
Inthe“power-off”state,theoutputimpedancewill
remaingreaterthan300ohms, againsatisfyingthe
RS-232 specifications. Should the input of the
driver be left open, an internal 400Kohm pullup
resistor to VCC forces the input high, thus commit-
ting the output to a low state. The slew rate of the
transmitter output is internally limited to a maxi-
mumof30V/µsinordertomeettheEIAstandards
(EIA RS-232D 2.1.7, Paragraph 5). The transition
of the loaded output from high to low also meets
the monotonicity requirements of the standard.
The clock rate for the charge pump typically
operates at 15kHz. The external capacitors can
be as low as 0.1µF with a 16V breakdown
voltage rating.
Transmitter/Driver
The drivers of the SP207EH Series can maintain
a typical data rate of 500Kbps. This superior
RS-232 data transmission rate makes the
SP207EH Series an ideal match for many
+10V
a) C2+
GND
GND
b) C2–
–10V
Figure 3. Charge Pump Waveforms
SP207EHDS/08
SP207EH Series High Performance RS232 Transceivers
© Copyright 2000 Sipex Corporation
6
V
= +5V
CC
C
+5V
4
+
–
+
V
V
Storage Capacitor
Storage Capacitor
DD
+
–
+
–
C
C
2
1
–
SS
C
–5V
–5V
3
Figure 4. Charge Pump — Phase 3
V
= +5V
CC
C
+10V
4
+
–
V
V
Storage Capacitor
Storage Capacitor
DD
SS
+
–
+
–
C
C
2
1
+
3
–
C
Figure 5. Charge Pump — Phase 4
Receivers
ThehighperformancereceiversoftheSP207EH
Series can accept input signals at a typical data
rate of 500Kbps. The receivers convert RS-232
input signals to inverted TTL signals. The
receivers convert RS-232 input signals to
inverted TTL signals. Since the input is usually
fromatransmissionlinewherelongcablelengths
and system interference can degrade the signal,
the inputs have a typical hysteresis margin of
500mV. This ensures that the receiver is
virtually immune to noisy transmission lines.
Should an input be left unconnected, a 5kΩ
pulldown resistor to ground will commit the
output of the receiver to a high state.
For complete shutdown to occur and the 10µA
power drain to be realized, the following
conditions must be met:
SP211EH:
• +5V must be applied to the SD pin
• ENABLE must be either 0V, +5.0V or not
connected
• the transmitter inputs must be either +5.0V
or not connected
• VCC must be +5V
• Receiver inputs must be >0V and <+5V
SP213EH:
• 0V must be applied to the SD pin
SHUTDOWN MODE
The SP211EH, and SP213EH all feature a
control input which will disable the device and
reduce the power supply current to less than
10µA, making the parts ideal for battery–
powered systems. In the “shutdown” mode the
receiversandtransmitterswillbothbetri–stated.
TheV+ outputofthechargepumpwilldischarge
to VCC, and the V– output will discharge to
ground. Products with the Wake-Up function
can enable or disable the receivers during
shutdown.
• ENABLE must be either 0V, +5.0V or not
connected
• the transmitter inputs must be either +5.0V
or not connected
• VCC must be +5V
• Receiver inputs must be >0V and <+5V
SP207EHDS/08
SP207EH Series High Performance Transceivers
© Copyright 2000 Sipex Corporation
7
ENABLE
SP213EH Only Power
Receiver
Outputs
The SP211EH and SP213EH all feature an
enable input, which allows the receiver outputs
to be either tri–stated or enabled. This can be
especially useful when the receiver is tied di-
rectly to a microprocessor data bus. For the
SP211EH, enable is active low; that is, 0V
applied to the ENABLE pin will enable the
receiver outputs. For the SP213EH, enable is
activehigh;thatis, +5VappliedtotheENABLE
pin will enable the receiver outputs.
SD EN SD
EN
1
Up/Down
Up
0
0
1
1
0
1
0
1
1
1
0
0
Enable
Tri–state
Enable
0
Up
1
Down
Down
0
Tri–state
Table 2. Wake–Up Truth Table
POWER UP WITH SD ACTIVE (Charge pump in shutdown mode)
t
0 (POWERUP)
+5V
DATA VALID
R
OUT
0V
t
WAIT
ENABLE
SD
DISABLE
POWER UP WITH SD DISABLED (Charge pump in active mode)
t
0 (POWERUP)
+5V
DATA VALID
R
OUT
0V
t
ENABLE
ENABLE
SD
DISABLE
EXERCISING WAKE–UP FEATURE
t
0 (POWERUP)
+5V
DATA VALID
DATA VALID
DATA VALID
R
OUT
0V
t
t
t
ENABLE
ENABLE
ENABLE
SD
DISABLE
ENABLE
DISABLE
t
WAIT
V
= +5V ±10%; T = 25°C
A
CC
t
t
= 2ms typical, 3ms maximum
WAIT
ENABLE
= 1ms typical, 2ms maximum
Figure 6. Wake–Up Timing
SP207EHDS/08
SP207EH Series High Performance RS232 Transceivers
© Copyright 2000 Sipex Corporation
8
WAKEUP FUNCTION
There are different methods of ESD testing
applied:
The SP213EH has a wake–up feature that keeps
two receivers (R4 and R5) in an enabled state
when the device is in the shutdown mode. With
only the receivers active during shutdown, the
devices draw 5–10µA of supply current.
a) MIL-STD-883, Method 3015.7
b) IEC1000-4-2 Air-Discharge
c) IEC1000-4-2 Direct Contact
The Human Body Model has been the generally
acceptedESDtestingmethodforsemiconductors.
This method is also specified in MIL-STD-883,
Method 3015.7 for ESD testing. The premise of
this ESD test is to simulate the human body’s
potentialtostoreelectro-staticenergyanddischarge
it to an integrated circuit. The simulation is
performed by using a test model as shown
in Figure 7. This method will test the IC’s
capability to withstand an ESD transient during
normal handling such as in manufacturing areas
where the ICs tend to be handled frequently.
A typical application of this function would be
where a modem is interfaced to a computer in a
power–down mode. The ring indicator signal
from the modem could be passed through an
active receiver in the SP213EH that is itself in
the shutdown mode. The ring indicator signal
would propagate through the SP213EH to the
power management circuitry of the computer to
power up the microprocessor and the SP213EH
drivers.AfterthesupplyvoltagetotheSP213EH
reaches +5.0V, the SHUTDOWN pin can be
disabled, taking the SP213EH out of the
shutdown mode.
TheIEC-1000-4-2,formerlyIEC801-2,isgenerally
used for testing ESD on equipment and systems.
For system manufacturers, they must guarantee a
certainamountofESDprotectionsincethesystem
itself is exposed to the outside environment and
human presence. The premise with IEC1000-4-2
is that the system is required to withstand an
amountofstaticelectricitywhenESDisappliedto
points and surfaces of the equipment that are
accessible to personnel during normal usage. The
transceiver IC receives most of the ESD current
when the ESD source is applied to the connector
pins. The test circuit for IEC1000-4-2 is shown
on Figure 8. There are two methods within
IEC1000-4-2, the Air Discharge method and the
Contact Discharge method.
All receivers that are active during shutdown
maintain 500mV (typical) of hysteresis.
ESD TOLERANCE
The SP207EH Family incorporates ruggedized
ESD cells on all driver output and receiver input
pins. The ESD structure is improved over our
previous family for more rugged applications
and environments sensitive to electro-static dis-
chargesandassociatedtransients. Theimproved
ESDtoleranceisatleast+15kVwithoutdamage
nor latch-up.
R
R
S
S
R
R
C
C
SW2
SW2
SW1
SW1
Device
Under
Test
DC Power
Source
C
C
S
S
Figure 7. ESD Test Circuit for Human Body Model
SP207EHDS/08
SP207EH Series High Performance Transceivers
© Copyright 2000 Sipex Corporation
9
Contact-Discharge Module
Contact-Discharge Module
R
R
R
R
S
S
R
R
V
V
C
C
SW2
SW2
SW1
SW1
Device
Under
Test
DC Power
Source
C
C
S
S
R
R
and R add up to 330Ω for IEC1000-4-2.
and R add up to 330Ω for IEC1000-4-2.
S
S
V
V
Figure 8. ESD Test Circuit for IEC1000-4-2
WiththeAirDischargeMethod,anESDvoltageis
appliedtotheequipmentundertest(EUT)through
air. This simulates an electrically charged person
readytoconnectacableontotherearofthesystem
only to find an unpleasant zap just before the
person touches the back panel. The high energy
potential on the person discharges through an
arcingpathtotherearpanelofthesystembeforehe
or she even touches the system. This energy,
whether discharged directly or through air, is
predominantly a function of the discharge current
rather than the discharge voltage. Variables with
an air discharge such as approach speed of the
object carrying the ESD potential to the system
and humidity will tend to change the discharge
current. Forexample,therisetimeofthedischarge
current varies with the approach speed.
30A
15A
0A
t=0ns
t=30ns
t ➙
Figure 9. ESD Test Waveform for IEC1000-4-2
The circuit model in Figures 7 and 8 represent the
typical ESD testing circuit used for all three
methods. The CS is initially charged with the DC
power supply when the first switch (SW1) is on.
Now that the capacitor is charged, the second
switch (SW2) is on while SW1 switches off. The
voltage stored in the capacitor is then applied
through RS, the current limiting resistor, onto the
device under test (DUT). In ESD tests, the SW2
switch is pulsed so that the device under test
receives a duration of voltage.
The Contact Discharge Method applies the ESD
current directly to the EUT. This method was
devised to reduce the unpredictability of the ESD
arc. The discharge current rise time is constant
since the energy is directly transferred without the
air-gaparc. Insituationssuchashandheldsystems,
the ESD charge can be directly discharged to the
equipment from a person already holding the
equipment. The current is transferred on to the
keypad or the serial port of the equipment directly
andthentravelsthroughthePCBandfinallytotheIC.
SP207EHDS/08
SP207EH Series High Performance RS232 Transceivers
© Copyright 2000 Sipex Corporation
10
For the Human Body Model, the current limiting
resistor (RS) and the source capacitor (CS) are
1.5kΩan100pF, respectively. ForIEC-1000-4-2,
the current limiting resistor (RS) and the source
capacitor (CS) are 330Ω an 150pF, respectively.
EIA STANDARDS
The Electronic Industry Association (EIA)
developed several standards of data transmission
which are revised and updated in order to meet
the requirements of the industry. In data
processing, there are two basic means of
communicatingbetweensystemsandcomponents.
The RS-232 standard was first introduced in
1962 and, since that time, has become an
industry standard.
The higher C value and lower RS value in the
IEC1000-4-2 Smodel are more stringent than the
HumanBodyModel. Thelargerstoragecapacitor
injectsahighervoltagetothetestpointwhenSW2
is switched on. The lower current limiting resistor
increases the current charge onto the test point.
The RS-232 is a relatively slow data exchange
protocol, with a maximum baud rate of only
20kbps, which can be transmitted over a
maximum copper wire cable length of 50 feet.
The SP207EHthroughSP213EHSeriesofdata
communications interface products have been
designed to meet both the EIA protocol
standards, and the needs of the industry.
DEVICE PIN
TESTED
HUMAN BODY
MODEL
IEC1000-4-2
Air Discharge Direct Contact
Level
Driver Outputs
Receiver Inputs
+15kV
+15kV
+15kV
+15kV
+8kV
+8kV
4
4
Table 3. Transceiver ESD Tolerance Levels
Specification
RS–232D
RS–423A
RS–422
RS–485
RS–562
Mode of Operation
Single–Ended
Single–Ended
Differential
Differential
Single–Ended
No. of Drivers and Receivers
Allowed on One Line
1 Driver
1 Receiver
1 Driver
10 Receivers
1 Driver
10 Receivers
32 Drivers
32 Receivers
1 Driver
1 Receiver
Maximum Cable Length
50 feet
4,000 feet
4,000 feet
4,000 feet
C ≤ 2,500pF @ <20Kbps;
C ≤1,000pF @ >20Kbps
64Kb/s
Maximum Data Rate
20Kb/s
100Kb/s
10Mb/s
10Mb/s
Driver output Maximum Voltage
±25V
±6V
–0.25V to +6V
–7V to +12V
–3.7V to +13.2V
Driver Output Signal Level
Loaded
±5V
±15V
±3.6V
±6V
±2V
±5V
±1.5V
±5V
±3.7V
±13.2V
Unloaded
Driver Load Impedance
3 – 7Kohm
450 ohm
100 ohm
54 ohm
3–7Kohm
Max. Driver Output Current
(High Impedance State)
Power On
±100µA
±100µA
Power Off
V
/300
100µA
Controls Provided
±12V
±100µA
MAX
Slew Rate
30V/µs max.
±15V
30V/µs max.
±15V
Receiver Input Voltage Range
Receiver Input Sensitivity
Receiver Input Resistance
–7V to +7V
±200mV
–7V to +12V
±200mV
±3V
±200mV
±3V
3–7Kohm
4Kohm min.
4Kohm min.
12Kohm min.
3–7Kohm
Table 4. EIA Standard Definitions
SP207EHDS/08
SP207EH Series High Performance Transceivers
© Copyright 2000 Sipex Corporation
11
TYPICAL APPLICATION CIRCUITS...SP207EH TO SP213EH
+5V INPUT
+5V INPUT
0.1µF
6.3V
9
0.1µF
6.3V
9
10
+
0.1µF
6.3V
C1
+
10
+
0.1µF
6.3V
VCC
11
15
C1
+
+
+
0.1µF
6.3V
VCC
V +
V –
11
15
+
+
0.1µF
6.3V
V +
V –
12
13
0.1µF
16V
+
C1
C2
–
+
12
13
0.1µF
16V
+
C1
C2
–
+
0.1µF
16V
SP207EH
400KOHM
400KOHM
400KOHM
400KOHM
400KOHM
0.1µF
16V
SP208EH
400KOHM
400KOHM
400KOHM
400KOHM
14
C2
–
14
C2
–
7
6
2
5
18
19
21
2
T1
T2
T3
T4
T5
T1 IN
T1 OUT
T2 OUT
T3 OUT
T4 OUT
T5 OUT
T1
T2
T3
T4
T1 IN
T1 OUT
3
1
T2 IN
T3 IN
T4 IN
T5 IN
T2 IN
T3 IN
T4 IN
T2 OUT
1
18
19
21
24
20
T3 OUT
24
20
T4 OUT
6
4
7
R1
R
1 OUT
R1 IN
R2 IN
R3 IN
5KOHM
5KOHM
5KOHM
5KOHM
5
22
17
4
3
R1
R
1 OUT
R1 IN
R2 IN
R3 IN
R2
R3
R2 OUT
R3 OUT
5KOHM
5KOHM
5KOHM
23
16
22
23
R2
R3
R2 OUT
R3 OUT
17
16
R4
R
4 OUT
R4 IN
8
8
GND
GND
+5V INPUT
+5V INPUT
0.1µF
6.3V
11
0.1µF
6.3V
11
VCC
12
+
0.1µF
6.3V
12
C1
+
+
0.1µF
6.3V
C1
+
VCC
13
+
+
0.1µF
6.3V
13
V +
+
+
0.1µF
6.3V
V +
V –
14
15
0.1µF
16V
+
14
15
C1
C2
–
+
0.1µF
16V
+
C1
C2
–
+
17
17
V –
0.1µF
16V
0.1µF
16V
SP211EH
400KOHM
400KOHM
400KOHM
400KOHM
SP213EH
400KOHM
400KOHM
400KOHM
400KOHM
16
16
C2
–
C2
–
7
6
2
7
6
2
T1
T2
T3
T4
T1 IN
T2 IN
T3 IN
T4 IN
T1 OUT
T1
T2
T3
T4
T1 IN
T1 OUT
3
3
T2 OUT
T2 IN
T3 IN
T4 IN
T2 OUT
T3 OUT
T4 OUT
1
20
21
1
20
21
T
3 OUT
28
28
T4 OUT
8
5
9
8
5
9
R1
R1
R
1 OUT
R1 IN
R2 IN
R3 IN
R
1 OUT
R1 IN
R2 IN
R3 IN
5KOHM
5KOHM
5KOHM
5KOHM
5KOHM
5KOHM
5KOHM
5KOHM
5KOHM
5KOHM
4
4
R2
R3
R2
R3
R2 OUT
R3 OUT
R2 OUT
R3 OUT
26
27
26
27
22
23
22
23
18
25
R4
R5
R4 OUT*
R4IN*
R5 IN*
SD
R4
R5
R4 OUT
R4IN
R5 IN
SD
19
24
18
25
19
24
R5 OUT*
EN
R5 OUT
EN
10
GND
10
GND
*Receivers active during shutdown
SP207EHDS/08
SP207EH Series High Performance RS232 Transceivers
© Copyright 2000 Sipex Corporation
12
PACKAGE: PLASTIC SHRINK
SMALL OUTLINE
(SSOP)
E
H
D
A
Ø
A1
L
e
B
DIMENSIONS (Inches)
Minimum/Maximum
(mm)
24–PIN
28–PIN
A
A1
B
D
E
0.068/0.078
(1.73/1.99)
0.068/0.078
(1.73/1.99)
0.002/0.008
(0.05/0.21)
0.002/0.008
(0.05/0.21)
0.010/0.015
(0.25/0.38)
0.010/0.015
(0.25/0.38)
0.317/0.328
(8.07/8.33)
0.397/0.407
(10.07/10.33)
0.205/0.212
(5.20/5.38)
0.205/0.212
(5.20/5.38)
e
0.0256 BSC
(0.65 BSC)
0.0256 BSC
(0.65 BSC)
H
L
0.301/0.311
(7.65/7.90)
0.301/0.311
(7.65/7.90)
0.022/0.037
(0.55/0.95)
0.022/0.037
(0.55/0.95)
Ø
0°/8°
(0°/8°)
0°/8°
(0°/8°)
SP207EHDS/08
SP207EH Series High Performance Transceivers
© Copyright 2000 Sipex Corporation
13
PACKAGE: PLASTIC
SMALL OUTLINE (SOIC)
(WIDE)
E
H
D
A
Ø
A1
L
e
B
DIMENSIONS (Inches)
Minimum/Maximum
(mm)
24–PIN
28–PIN
0.093/0.104
A
A1
B
D
E
0.093/0.104
(2.352/2.649) (2.352/2.649)
0.004/0.012
(0.102/0.300) (0.102/0.300)
0.004/0.012
0.013/0.020
(0.330/0.508) (0.330/0.508)
0.013/0.020
0.599/0.614 0.697/0.713
(15.20/15.59) (17.70/18.09)
0.291/0.299 0.291/0.299
(7.402/7.600) (7.402/7.600)
e
0.050 BSC
(1.270 BSC)
0.050 BSC
(1.270 BSC)
H
L
0.394/0.419
0.394/0.419
(10.00/10.64) (10.00/10.64)
0.016/0.050
(0.406/1.270) (0.406/1.270)
0.016/0.050
Ø
0°/8°
(0°/8°)
0°/8°
(0°/8°)
SP207EHDS/08
SP207EH Series High Performance RS232 Transceivers
© Copyright 2000 Sipex Corporation
14
PACKAGE: PLASTIC
DUAL–IN–LINE
(NARROW)
E1
E
D1 = 0.005" min.
(0.127 min.)
A1 = 0.015" min.
(0.381min.)
D
A = 0.210" max.
(5.334 max).
C
A2
Ø
L
B1
B
e
= 0.300 BSC
(7.620 BSC)
e = 0.100 BSC
(2.540 BSC)
A
ALTERNATE
END PINS
(BOTH ENDS)
DIMENSIONS (Inches)
Minimum/Maximum
(mm)
24–PIN
0.115/0.195
(2.921/4.953)
A2
0.014/0.022
(0.356/0.559)
B
0.045/0.070
B1
C
(1.143/1.778)
0.008/0.014
(0.203/0.356)
1.230/1.280
(31.24/32.51)
D
0.300/0.325
(7.620/8.255)
E
0.240/0.280
E1
L
(6.096/7.112)
0.115/0.150
(2.921/3.810)
0°/ 15°
(0°/15°)
Ø
SP207EHDS/08
SP207EH Series High Performance Transceivers
© Copyright 2000 Sipex Corporation
15
ORDERING INFORMATION
RS232 Transceivers:
Model .................... Drivers .......................... Receivers ..................................... Temperature Range ................................. Package Type
SP207EHCA .............. 5 ....................................... 3 ................................................... 0°C to +70°C ............................................... 24–pin SSOP
SP207EHCP .............. 5 ....................................... 3 ................................................... 0°C to +70°C ....................................... 24–pin Plastic DIP
SP207EHCT ............... 5 ....................................... 3 ................................................... 0°C to +70°C ................................................ 24–pin SOIC
SP207EHEA .............. 5 ....................................... 3 ............................................... –40°C to +85°C ............................................... 24–pin SSOP
SP207EHEP ............... 5 ....................................... 3 ............................................... –40°C to +85°C ....................................... 24–pin Plastic DIP
SP207EHET ............... 5 ....................................... 3 ............................................... –40°C to +85°C ................................................ 24–pin SOIC
SP208EHCA .............. 4 ....................................... 4 ................................................... 0°C to +70°C ............................................... 24–pin SSOP
SP208EHCP .............. 4 ....................................... 4 ................................................... 0°C to +70°C ....................................... 24–pin Plastic DIP
SP208EHCT ............... 4 ....................................... 4 ................................................... 0°C to +70°C ................................................ 24–pin SOIC
SP208EHEA .............. 4 ....................................... 4 ............................................... –40°C to +85°C ............................................... 24–pin SSOP
SP208EHEP ............... 4 ....................................... 4 ............................................... –40°C to +85°C ....................................... 24–pin Plastic DIP
SP208EHET ............... 4 ....................................... 4 ............................................... –40°C to +85°C ................................................ 24–pin SOIC
RS232 Transceivers with Low–Power Shutdown and Tri–state Enable:
Model .................... Drivers .......................... Receivers ..................................... Temperature Range ................................. Package Type
SP211EHCA .............. 4 ....................................... 5 ................................................... 0°C to +70°C ............................................... 28–pin SSOP
SP211EHCT ............... 4 ....................................... 5 ................................................... 0°C to +70°C ................................................ 28–pin SOIC
SP211EHEA .............. 4 ....................................... 5 ............................................... –40°C to +85°C ............................................... 28–pin SSOP
SP211EHET ............... 4 ....................................... 5 ............................................... –40°C to +85°C ................................................ 28–pin SOIC
RS232 Transceivers with Low–Power Shutdown, Tri–state Enable, and Wake–Up Function:
Model .................... Drivers .......................... Receivers ..................................... Temperature Range ................................. Package Type
SP213EHCA .............. 4 ................. 5, with 2 active in Shutdown ............................ 0°C to +70°C ............................................... 28–pin SSOP
SP213EHCT ............... 4 ................. 5, with 2 active in Shutdown ............................ 0°C to +70°C ................................................ 28–pin SOIC
SP213EHEA .............. 4 ................. 5, with 2 active in Shutdown ........................ –40°C to +85°C ............................................... 28–pin SSOP
SP213EHET ............... 4 ................. 5, with 2 active in Shutdown ........................ –40°C to +85°C ................................................ 28–pin SOIC
Please consult the factory for pricing and availability on a Tape-On-Reel option.
Co rp o ra tio n
SIGNAL PROCESSING EXCELLENCE
Sipex Corporation
Headquarters and
Sales Office
22 Linnell Circle
Billerica, MA 01821
TEL: (978) 667-8700
FAX: (978) 670-9001
e-mail: sales@sipex.com
Sales Office
233 South Hillview Drive
Milpitas, CA 95035
TEL: (408) 934-7500
FAX: (408) 935-7600
Sipex Corporation reserves the right to make changes to any products described herein. Sipex does not assume any liability arising out of the
application or use of any product or circuit described herein; neither does it convey any license under its patent rights nor the rights of others.
SP207EHDS/08
SP207EH Series High Performance RS232 Transceivers
© Copyright 2000 Sipex Corporation
16
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