ZM5304 [SILICON]
FULLY INTEGRATED Z-WAVE® WIRELESS MODEM WITH ON-BOARD ANTENNA;型号: | ZM5304 |
厂家: | SILICON |
描述: | FULLY INTEGRATED Z-WAVE® WIRELESS MODEM WITH ON-BOARD ANTENNA |
文件: | 总39页 (文件大小:3451K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
DATASHEET: ZM5304
Features
FULLY INTEGRATED Z-WAVE® WIRELESS MODEM WITH
ON-BOARD ANTENNA
•
Complete Z-Wave stack available over
UART or USB
•
•
•
Firmware upgradeable via UART or USB
32kB of byte addressable NVM memory
Fully Integrated crystal, EEPROM, SAW
filter, matching circuit, and antenna
No external components required
FCC modular transmitter approval
ITU G.9959 compliant
•
•
•
Modem
•
•
•
UART speed up to 230.4kbps
USB 2.ull speed
Z-Wave serial API accessed over UART or
USB
•
•
•
•
ADC for internal battery monitoring
Hardware AES-128 security engine
Power-On-Reset / Brown-out Detector
Supply voltage range from 2.3V to 3.6V for
optional battery operation
TX mode current typ. 36mA @ 0dBm
RX mode current typ. 33mA
Normal mode current typ. 15mA
Sleep mode current typ. 2µA
Less than 1ms cold start-up time
The Silicon Labs ZM5304 Modem is a fully integrated Z-Wave modem
module in a small 27mm x 15.2mm x 5.5mm form factor. It ideal
solution for home control applications such as access conol, appliance
control, AV control, building automation, energy manement, lighting,
security, and sensor networks in the “Internet of Thing
•
•
•
•
•
A baseband controller, sub-1 GHz radio traneiver, crystal, decoupling,
SAW filter, matching, and the antenna is included to provide a complete
Z-Wave solution to an application executing in an external host
microcontroller. The ZM5304 Modem is certified with the FCC modular
transmitter approval, ready to be used in any product without additional
testing and license costs.
Radio Transceiver
•
•
Receiver sensitivity with SAW filter down
to -103dBm @ 9.6kbps
Transmit power with SAW filter up to
+4dBm
Z-Wave 9.6/40/100kbps data rates
Supports all Z-Wave sub-1 GHz frequency
bands (865.2MHz to 926.3MHz)
Supports multi-channel frequency agility
and listen before talk
The ZM5304 Modem is based on an 8-bit 8051 CPU core, which is
optimized to handle the data and link management requirements of a
Z-Wave node. The UART0 or USB interface can be used to access the
Z-Wave stavailable in the on-chip Flash memory, or to easily upgrade
the modem firmware.
•
•
•
•
FCC
IC ID
D87-ZM5304-U
11263A-ZM5304
Regulatory Compliance
ACMA: AS/NZS 4268
CE: EN 300 220/489
FCC: CFR 47 Part 15
IC: RSS-GEN/210
MIC: ARIB STD-T108
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Datasheet: ZM5304
1
2
CONTENT
OVERVIEW.......................................................................................................................................................................... 4
2.1
PERIPHERALS........................................................................................................................................................................... 4
Advanced Encryption Standard Security Processor..................................................................................................... 4
Analog-to-Digital Converter ........................................................................................................................................ 5
Brown-Out Detector / Power-On-Reset....................................................................................................................... 5
Crystal Driver and System Clock.......................................................................................................................... 5
Universal Asynchronous Receiver / Transmitter ......................................................................................................... 5
Universal Serial Bus..................................................................................................................................................... 5
Watchdog................................................................................................................................................................ 6
Wireless Transceiver........................................................................................................................................ 6
MEMORY MAP.................................................................................................................................................................. 6
MODULE PROGRAMMING.......................................................................................................................................................... 7
Entering In-System Programming Mode..................................................................................................................... 7
Entering Auto Programming Mode......................................................................................................................... 7
POWER SUPPLY REGULATOR ...................................................................................................................................................... 7
2.1.1
2.1.2
2.1.3
2.1.4
2.1.5
2.1.6
2.1.7
2.1.8
2.2
2.3
2.3.1
2.3.2
2.4
3
4
TYPICAL APPLICATION ........................................................................................................................................................ 8
PIN CONFIGURATION.......................................................................................................................................................... 9
4.1
PIN FUNCTIONALITY........................................................................................................................................................... 9
5
ELECTRICAL CHARACTERISTICS.......................................................................................................................................... 11
5.1
TEST CONDITIONS ............................................................................................................................................................ 11
Typical Values......................................................................................................................................................... 11
Minimum and Maximum Values........................................................................................................................ 11
ABSOLUTE MAXIMUM RATINGS................................................................................................................................................ 12
GENERAL OPERATING RATINGS................................................................................................................................................. 12
CURRENT CONSUMPTION .................................................................................................................................................... 12
SYSTEM TIMING.................................................................................................................................................................... 13
NON-VOLATILE MEMORY RELIABILTY........................................................................................................................................ 14
ANALOG-TO-DIGITAL CONVERTER ............................................................................................................................................. 14
DC CHARACTERISTICS ............................................................................................................................................................. 15
RF CHARACTERISTICS....................................................................................................................................................... 16
Transceiver ................................................................................................................................................................ 16
Antenna..................................................................................................................................................................... 16
Regatory Compliance ............................................................................................................................................. 23
5.1.1
5.1.2
5.2
5.3
5.4
5.5
5.6
5.7
5.8
5.9
5.9.1
5.9.2
5.9.3
6
7
Z-WAVFREQUENCIES...................................................................................................................................................... 24
MODULE INFORMATION................................................................................................................................................... 25
7
7.2
MODULE MARKING................................................................................................................................................................ 25
MODULE DIMENSIONS............................................................................................................................................................ 25
8
9
PROCESS SPECIFICATION................................................................................................................................................... 26
PCB MOUNTING AND SOLDERING..................................................................................................................................... 26
9.1
9.2
9.3
PCB MOUNTING PATTERN ...................................................................................................................................................... 26
RECOMMENDED PLACEMENT ON PCB ....................................................................................................................................... 27
SOLDERING INFORMATION....................................................................................................................................................... 27
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Datasheet: ZM5304
9.4
VISUAL INFORMATION........................................................................................................................................................... 28
ORDERING INFORMATION ............................................................................................................................................ 29
10
10.1 TAPE AND REEL INFORMATION ................................................................................................................................................. 30
10.2 CANADA IC STATEMENT .......................................................................................................................................................... 32
11
12
13
ABBREVIATIONS............................................................................................................................................................ 34
REVISION HISTORY.................................................................................................................................................... 36
REFERENCES.................................................................................................................................................................. 38
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Datasheet: ZM5304
2
OVERVIEW
The ZM5304 Modem is a fully integrated module with an on-board antenna that allows the establishment of a Z-Wave network
with minimum risk. The SD3503 modem chip is used with an external NVM (EEPROM), 32MHz crystal, power supply decoupling,
SAW filter, matching circuit, and a helical antenna. Figure 2.1 shows the main blocks of the ZM5304 Modem, while Figure 2.2
illustrates the firmware stack of an example application.
ZM5304
EEPROM
Memory
SPI
SD3503
Voltage
Regulator
VDD
Decoupling
ADC
AES
Helical
Antenna
RESET_N
POR / BOD
Sub-1 GHz
Radio
SAlter &
ching
UART0 RX
UART0 TX
Transceiver
UART
USB
8051 CPU
USB_DP
USB_DM
Flash
Memory
32MHz
XTAL
Figure 2.1: Functiolock diagram
HOST
Application
UART0 / USB
ZM5304
Z-Wave Serial API
Z-Wave Protocol Stack
Network Layer
MAC Layer
ITU G.9959
PHY Layer
Figure 2.2: Firmware stack
2.1 PERIPHERALS
2.1.1 ADVANCED ENCRYPTION STANDARD SECURITY PROCESSOR
The Z-Wave protocol specifies the use of Advanced Encryption Standard (AES) 128-bit block encryption for secure applications.
The built-in Security Processor is a hardware accelerator that encrypts and decrypts data at a rate of 1 byte per 1.5µs. It encodes
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Datasheet: ZM5304
the frame payload and the message authentication code to ensure privacy and authenticity of messages. The processor supports
Output FeedBack (OFB), Cipher-Block Chaining (CBC), and Electronic CodeBook (ECB) modes to target variable length messages.
Payload data is streamed in OFB mode, and authentication data is processed in CBC mode as required by the Z-Wave protocol.
The processor implements two efficient access methods: Direct Memory Access (DMA) and streaming through Special Function
Register (SFR) ports. The processor functionality is exposed via the Z-Wave API for application use.
2.1.2 ANALOG-TO-DIGITAL CONVERTER
The Analog-to-Digital Converter (ADC) is capable of sampling an input voltage source and returns an 8- or 12-bit unsigned
representation of the input scaled relative to the selected reference voltage. It can be configured to implement a battery
monitor, as described by the formula below.
ꢆꢇꢈ
ꢀꢁꢂꢃꢄꢅ
=
× 2ꢊꢋꢌꢍꢎꢏ ꢐꢑ ꢍꢒꢓꢔ
ꢆꢉꢉ
The ADC is capable of operating rail to rail, where the built-in Band-gap VBG = 1.25V and VDD is the supply voltage. When the
supply voltage crosses a predefined lower or upper voltage threshold, an interrupt can be ggered.
2.1.3 BROWN-OUT DETECTOR / POWER-ON-RESET
When a cold start-up occurs, an internal Power-On-Reset (POR) circuit ensures that code execution does not begin unless the
supply voltage is sufficient. After which, an internal Brown-Out DetectoD) circuit guarantees that faulty code execution
does not occur by entering the reset state, if the supply voltage drops below the minimum operating level. These guarantees
apply equally in both the active and sleep modes.
2.1.4 CRYSTAL DRIVER AND SYSTEM CLOCK
The system clock and RF frequencies are derived from the module mounted 32MHz crystal (XTAL), which internal system
performance is factory trimmed to guarantee initial RF frequency precision.
2.1.5 UNIVERSAL ASYNCHRONOUS RECEIVER / TRANSMITTER
The Universal Asynchronous Recever / Transmitter (UART) is a hardware block operating independently of the 8051 CPU. It
offers full-duplex data exchange, up to 230.4kbps, with an external host microcontroller requiring an industry standard NRZ
asynchronous serial data fo. The UART0 interface is available over pin 4 and pin 5 (refer section 4). A data byte is shifted as
a start bit, 8 data bits (lsb first), and a stop bit, respectively, with no parity and hardware handshaking. Figure 2.3 shows the
waveform of a single serial byte. UART0 is compliant with RS-232 when an external level converter is used.
START
BIT
STOP
BIT
D0
D1
D2
D3
D4
D5
D6
D7
Figure 2.3: UART0 waveform
2.1.6 UNIVERSAL SERIAL BUS
A Universal Serial Bus (USB) 2.0 full speed interface is available over pin 6 and pin 7 (refer section 4). The Communication Device
Class / Abstract Control Mode (CDC/ACM) provides an emulated virtual COM port to a host. This makes it easy to migrate from
legacy RS-232 communication to USB communication. Figure 2.4 shows the two termination resistors necessary to maintain
signal integrity of the differential pair and a single pull-up resistor on USB_DP, which indicates a full speed device to the host.
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Datasheet: ZM5304
ZM5304
1.5kΩ
22Ω
22Ω
USB_DP
USB_DM
Host
Figure 2.4: USB interface
The controller supports USB suspend mode and remote wake-up. During suspend mode, except for the crystal oscillator clocking
at a slower rate and the active USB controller, the entire CPU is powered off. The USB controller uses thDMA for fast data
transfer and automatic data retransmissions/CRC to maintain data integrity.
2.1.7 WATCHDOG
The watchdog helps prevents the CPU from entering a deadlock state. A timer that inabled by default achieves this by
triggering a reset event in case it overflows. The timer overflows in 1 second, therefore it is essential that the software clear the
timer periodically. The watchdog is disabled when the chip is in power down mode, and automatically restarts with a cleared
timer when waking up to the active mode.
2.1.8 WIRELESS TRANSCEIVER
The wireless transceiver is a sub-1 GHz ISM narrowband FSK rio, a modem, and a baseband controller. This architecture
provides an all-digital direct synthesis transmitter and a low IF ital receiver. The Z-Wave protocol currently utilizes 2-key
FSK/GFSK modulation schemes at 9.6/40/100 kbps data rtes throughout a span of carrier frequencies from 865.2MHz to
926.3MHz.
The output power of the transmitter is configurable in the range -26dBm to +4dBm (VDD = +2.3V to +3.6V, TA = -10°C to +85°C).
2.2 MEMORY MAP
An application executing on an external host microcontroller can access the higher address space of the integrated EEPROM via
the serial API. As shown in Figure 2.5, the protocol data is stored in the lower address space. A serial API function returns the
size of the application data sce. [1][2]
EEPROM Memory
(Byte addressable)
0x7FFF
Application Data
(Available to Host)
Offset
Protocol Data
(Reserved for Modem)
0x0000
0
Figure 2.5: EEPROM memory map
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2.3 MODULE PROGRAMMING
The firmware of the ZM5304 Modem can be upgraded either via UART0 or USB interface. [3] In-System Programming is the
default mode delivered from the factory.
2.3.1 ENTERING IN-SYSTEM PROGRAMMING MODE
The module can be placed into the UART0 In-System Programming (ISP) mode by asserting the active low RESET_N signal for
5.2ms. The programming unit of the module then waits for the “Interface Enable” serial command beforctivating the ISP
mode over UART0.
2.3.2 ENTERING AUTO PROGRAMMING MODE
Alternatively, the module can be placed into the Auto Programming Mode (APM) by calling a serial API function. The
programming unit of the module will enter APM immediately after a hardware or softwe reset. Once the module is in APM,
the firmware can be written to the internal flash using either the UART0 or USB interface
2.4 POWER SUPPLY REGULATOR
While the supply to the digital I/O circuits is unregulated, on-chip low-dropout regulators derive all the 1.5 V and 2.5 V internal
supplies required by the Micro-Controller Unit (MCU) core logic, non-volatile data registers, flash, and the analogue circuitry.
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Datasheet: ZM5304
3
TYPICAL APPLICATION
An illustration of two application examples using the ZM5304 Modem implementation follows. The host application located on
an external microcontroller accesses the Z-Wave stack via the serial API. Figure 3.1 depicts the scenario when UART0 is used as
the primary interface to the ZM5304 Modem, while Figure 3.2 shows the scenario when the USB1 is used. In the latter scenario,
UART0 must be routed out to test points in order to program the initial firmware during production. It is strongly recommended
that the power supply is decoupled sufficiently.
3V3
3V3
VDD
GPIO
TXD
RESET_N
UART0 RX
UART0 TX
Host
ZM5304
RXD
GND
Figure 3.1: Example of a host microcontroller based application using UART0
3V3
3V3
3V3
VDD
RESET_N
UART0 RX
UART0 TX
TP1
TP2
TP3
1.5kΩ±5%
22Ω±5%
22Ω±5%
USB_DP
USB_DM
USB_DP
USB_DM
Host
ZM5304
GND
Figure 3.2: Example of a host microcontroller based application using the USB
1 Firmware upgrades can be performed only when the ZM5304 Modem is placed in APM.
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4
PIN CONFIGURATION
The layout of the pins on the ZM5304 Modem is shown in Figure 4.1.
14.50
B
O
A
R
D
GND
RESET_N
NC
1
2
34
33
32
31
30
29
28
27
26
25
GND
NC
12.10
11.10
10.10
9.10
8.10
7.10
6.10
5.10
4.10
3.10
3
NC
UART0 TX
UART0 RX
USB_DM
USB_DP
GND
4
NC
5
GND
NC
Copper
Free
Ground Plane
(Top View)
C
U
T
O
U
T
6
7
GND
NC
8
VDD
9
NC
GND
10
GND
0.70
0
0
0.6
P
I
N
* All dimensions are in millimeters (mm)
Figure 4.1: Pin layout (top view)
4.1 PIN FUNCTIONALITY
Table 4.1: Power, ground, and no connect signals
Pin Name
VDD
GND
Pin Location
Type2
S
S
Function
Module power supply.
Ground. Must be connected to the ground
9
8, 1, 11, 24, 25, 28, 30, 34, 35, 48
plane.
NC
3, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 26, 27, 29,
31, 32, 33, 36, 37, 38, 39, 40, 41, 42, 43, 44, 45, 46, 47
-
Placement pins for mechanical stability.
Leave unconnected.
2 I = Input, O = Output, D+ = Differential Plus, D- = Differential Minus, S = Supply
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Datasheet: ZM5304
Table 4.2: Module control signals
Pin Name
RESET_N
Pin Location
Type
I
Function
Active low signal that places the module in
a reset state.
2
Table 4.3: UART0 interface signals
Pin Name Pin Location
Type
I
Function in Reset State
Waits for the “Interface Enable” serial
command after 5.2ms. Enters UART0 ISP
mode after command is received from the
host.
Function in Active State
Receive data from host serial port.
UART0 RX
5
UART0 TX
4
O
Serial data transmit when in UART0 ISP
mode, high impedance with internal pull-
up otherwise.
Transmit data to host serial port.
Table 4.4: USB interface signals
Pin Name Pin Location
Type
D+
Function in Reset State
ISP when in APM mode, high impee
with internal pull-up otherwise.
Function in Active State
USB 2.0 full-speed positive differential
signal.
USB_DP
7
USB_DM
6
D-
ISP when in APM mode, hih impedance
with internal pull-up othee.
USB 2.0 full-speed negative differential
signal.
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5
ELECTRICAL CHARACTERISTICS
This section describes the electrical parameters of the ZM5304 Modem module.
5.1 TEST CONDITIONS
Characterization in Lab
(TA=-10°C to +85°C, VDD=+2.3V to +3.6V)
Sorting criterion
specified with Min and
Max values
Statistics with Min,
Typ, and Max values
Manufactured
Modules
Tested
odules
Final Test in Production
(TA=+25°C, VDD=+3.3V)
Figure 5.1: Testing flow
The following conditions apply for characterization in the lab, unless othenoted.
1. Ambient temperature TA = -10°C to +85°C
2. Supply voltage VDD = +2.3V to +3.6V
3. All tests are carried out on the ZDB5304 Z-Wave Deopment Board. [4]
4. Total radiated power is measured for 868.4, 9084, and 921.4MHz
The following conditions apply for the final test in production, unless otherwise noted.
1. Ambient temperature TA = +25°C
2. Supply voltage VDD = +3.3V
3. Near-field radiated transmission power is measured for 868.4, 908.4, and 921.4MHz
4. Near-field radiated receiver sensitivity is measured for 868.4, 908.4, and 921.4MHz
5.1.1 TYPICAL VALUE
Unless otherwise specified, typical data refer to the mean of a data set measured at an ambient temperature of TA=25°C and
supply voltage of VD=+3.3V.
5.1.2 MINIMUM AND MAXIMUM VALUES
Unltherwise specified the minimum and maximum values are guaranteed in the worst conditions of ambient temperature,
supply voltage and frequencies by a final test in production on 100% of the devices at an ambient temperature of TA=25°C and
supply voltage of VDD=+3.3V.
For data based on measurements, the minimum and maximum values represent the mean value plus or minus three times the
standard deviation (µ±3σ).
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Datasheet: ZM5304
5.2 ABSOLUTE MAXIMUM RATINGS
The absolute ratings specify the limits beyond which the module may not be functional. Exposure to absolute maximum
conditions for extended periods may cause permanent damage to the module.
Table 5.1: Voltage characteristics
Symbol
VDD
Description
Min
Max
+3.
Unit
V
Main supply voltage
-0.3
VIN
IIN
ESDHBM
ESDMM
ESDCDM
Voltage applied on any I/O pin
-0.3
+3.6
+20.0
+2000.0
+200.0
+500.0
V
mA
V
V
V
Current limit when over driving the input (VIN > VDD
JEDEC JESD22-A114F Human Body Model
JEDEC JESD22-A115C Machine Model
)
-
-
JEDEC JESD22-C101E Field-Induced Charged-Device Model
Table 5.2: Current characteristics
Symbol
IVDD
IGND
Description
Current into VDD power supply pin
Sum of the current out of all GND ground pins
Min
Max
+120
-
Unit
mA
mA
-
-120
Table 5.3: Thermal characteristics
Symbol
Description
Min
Max
Unit
TJ
Junction temperature
-55
+125
°C
5.3 GENERAL OPERATING RATINGS
The operating ratings indicate the conditions where the module is guaranteed to be functional.
Table 5.4: Recommended operating conditions
Symbol
VDD
VDD_USB
fSYS
Description
Standard operating supply voltage
Standard operating supply voltage when USB PHY is used
Interl clock frequency
bient operating temperature
Min
+2.3
Typ
+3.3
+3.3
32.0
+25.0
Max
Unit
V
V
MHz
°C
+3.6
+3.6
-
+3.0
-
TA
-10.0
+85.0
5.4 URRENT CONSUMPTION
Measured at an ambient temperature of TA=-10°C to +85°C and a supply voltage of VDD=+2.3V to +3.6V.
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Table 5.5: Current consumption in active modes
Description Min
MCU running at 32MHz
MCU and radio receiver active
Symbol
Typ
14.8
32.7
27.7
42.7
Max
15.8
Unit
mA
mA
mA
mA
IDD_ACTIVE
IDD_RX
IDD_TX_01
IDD_TX_63
-
-
-
-
35.0
MCU and radio transmitter active, RFPOW=01
MCU and radio transmitter active, RFPOW=63
-
-
Table 5.6: Current consumption in power saving modes
Description Min
Symbol
IDD_SLEEP
IUSB_SLEEP
Typ
ax
Unit
µA
mA
Module in sleep state
USB suspend mode with state persistency, and system clock
-
-
1
2.
3.7
2.3
Table 5.7: Current consumption during programmin
Description Min
Symbol
IDD_PGM_UART0
IDD_PGM_USB
Typ
Max
Unit
mA
mA
Programming via UART0
-
15
15
-
-
Programming via USB
-
5.5 SYSTEM TIMING
Measured at an ambient temperature of TA=-10°C to +85°C d a supply voltage of VDD=+2.3V to +3.6V.
Table 5.8: Transn between operating modes
Symbol
tACTIVE_SLEEP
tSLEEP_ACTIVE
Dcription
Min
Typ
Max
Unit
ns
µs
Transition time from the ative state to the sleep state
Transition time from the sleep state to the active state ready
to execute code
-
-
-
-
125
160
Table 5.9: System start-up time
Symbol
Description
Min
Typ
Max
+2.3
Unit
V
VPOR
Power-on-Reset (POR) threshold on rising supply voltage at
which the reset signal is deasserted
Transition time from the reset state to the active state ready
to execute code with a power rise time not exceeding 10µs
-
-
-
-
tRESET_ACTIVE
1.0
ms
Table 5.10: Reset timing requirements
Symbol
tRST_PULSE
Description
Min
Typ
Max
Unit
ns
Duration to assert RESET_N to guarantee a full system reset
20
-
-
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Datasheet: ZM5304
Table 5.11: Programming time
Description
Time taken to erase the entire flash memory
Time taken to program the entire flash memory over UART0
including a full erase
Symbol
tERASE_FULL
tPGM_FULL_UART0
Min
Typ
Max
44.1
16.2
Unit
ms
s
-
-
-
-
5.6 NON-VOLATILE MEMORY RELIABILITY
Qualified for an ambient temperature of TA=+25°C and a supply voltage of VDD=+3.3V. The on-chip mory is based on
SuperFlash® technology.
Table 5.12: On-chip flash
Symbol
ENDFLASH
RETFLASH-LT
RETFLASH-HT
Description
Endurance, erase cycles before failure
Data retention
Data retention (Qualified for a junction temperature of
TJ=-10°C to +85°C)
Min
100
00
Typ
Typ
Typ
Max
Max
Max
Unit
cycles
years
years
-
-
-
-
-
-
10
Table 5.13: On-chip high endurance NVM
Symbol
ENDNVM
RETNVM-LT
RETNVM-HT
Description
Endurance, erase cycles before failure
Data retention
Data retention (Qualified for a juntemperature of
TJ=-10°C to +85°C)
Min
100000
100
Unit
cycles
years
years
-
-
-
-
-
-
10
Table 5.14: EEPROM
Symbol
ENDEEPROM
RETEEPROM
Description
Endurance, erase cycles before failure
Data retion
Min
1Mil
100
Unit
cycles
years
-
-
-
-
5.7 ANAG-TO-DIGITAL CONVERTER
Measured at an ambient temperature of TA=-10°C to +85°C and a supply voltage of VDD=+2.3V to +3.6V.
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Table 5.15: 12-bit ADC characteristics
Description
Symbol
VBG
DNLADC
ACC8b
ACC12b
fS-8b
Min
+1.20
Max
+1.30
Unit
V
Internal reference voltage
Differential non-linearity
-1.00
-2.00
-5.00
-
+1.00 LSB
2.00 LSB
5.00 LSB
0.02 Msps
0.0Msps
Accuracy when sampling 20ksps with 8-bit resolution
Accuracy when sampling 10ksps with 12-bit resolution
8-bit sampling rate
fS-12b
12-bit sampling rate
-
5.8 DC CHARACTERISTICS
Measured at an ambient temperature of TA=-10°C to +85°C.
Table 5.16: Digital input characteristics, supply voltage of VDD=+2.3V to +3.0V
Symbol
Description
Logical 1 input voltage high level
Logical 0 input voltage low level
Falling input trigger threshold
Rising edge trigger threshold
Min
+1.85
Max
Unit
V
V
V
V
VIH
VIL
VIF
VIR
-
+0.75
+1.05
+1.85
+0.85
+7.00
-
+90.00
30.00
15.00
-
+0.75
+1.35
+0.55
-
-7.00
+35.00
20.00
-
VHYS
IIH
IIL-NPU
IIL-PU
PUIN
CIN
Schmitt trigger voltage hysteresis
V
Logical 1 input high level current leakage
Logical 0 input low level current leakage (no internal pull-up resistor)
Logical 0 input low level current leakage (with inal pull-up resistor)
Internal pull-up resistance (TA=+25°C)
Pin input capacitance
µA
µA
µA
kΩ
pF
Table 5.17: Digital out characteristics, supply voltage of VDD=+2.3V to +3.0V
Symbol
VOH
VOL
IOH-LP
IOL-LP
Description
Logical 1 output voltage high level
Logical 0 output voltage low level
Logical 1 output high level current sourcing
Logical 0 out low level current sinking
Min
Max
Unit
V
V
mA
mA
+1.9
-
+0.4
+6.0
-
-
-
-6.0
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Datasheet: ZM5304
Table 5.18: Digital input characteristics, supply voltage of VDD=+3.0V to +3.6V
Symbol
Description
Logical 1 input voltage high level
Min
+2.10
Max
Unit
V
VIH
VIL
VIF
VIR
VHYS
IIH
IIL-NPU
IIL-PU
PUIN
CIN
-
Logical 0 input voltage low level
Falling input trigger threshold
Rising edge trigger threshold
Schmitt trigger voltage hysteresis
Logical 1 input high level current leakage
Logical 0 input low level current leakage (no internal pull-up resistor)
Logical 0 input low level current leakage (with internal pull-up resistor)
Internal pull-up resistance (TA=+25°C)
Pin input capacitance
-
+0.90
+1.60
+0.65
-
-10.00
+40.00
15.00
-
+0.90
+1.30
+2.10
+0.95
+10.0
-
+120.00
20.00
15.00
V
V
V
V
µA
µA
µA
kΩ
pF
Table 5.19: Digital output characteristics, supply voltage of VDD=+3.0V to +3.6V
Symbol
VOH
Description
Logical 1 output voltage high level
Min
Max
-
Unit
V
+2.4
VOL
IOH-LP
IOL-LP
Logical 0 output voltage low level
Logical 1 output high level current sourcing
Logical 0 output low level current sinking
-
-
+0.4
+8.0
-
V
mA
mA
-8.0
5.9 RF CHARACTERISTICS
5.9.1 TRANSCEIVER
The radio transceiver of the ZM5304 is based on the SD3503 modem chip and an external SAW filter. Refer to [5] for
measurements on the conducted performancof the SD3503. Although the crystal is factory calibrated, it is mandatory to
calibrate the transmitter in production. Refer to [6] for more information.
5.9.2 ANTENNA
The radiation measurements for the ZM5304 were performed on the ZDP03A Z-Wave Development Platform. [7] The
orientation of the ZM5304 g the measurements is shown in Figure 5.2.
Y
X
Z
Figure 5.2: Measurement orientation
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Datasheet: ZM5304
5.9.2.1 REGION E
Table 5.20: Region E performance
Description
Symbol
Min
Typ
Max
Unit
MHz
dBm
dB
Bi
dBi
fC
Carrier frequency
-
-
-
-
-
868.40
-3.05
-7.05
3.47
-
-
-
-
-
TRP
εR
D
Total radiated power
Radiation efficiency
Directivity
G
Peak gain
-3.58
Figure 5.4: YZ plane (X back view)
Figure 5.3: YZ plane (X front vie
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Datasheet: ZM5304
Figure 5.5: XZ plane (Y front view)
Figure 5.6: XZ plane (Y back view)
Figu5.7: XY plane, (Z front view)
Figure 5.8: XY plane, (Z back view)
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Datasheet: ZM5304
5.9.2.2 REGION U
Table 5.21: Region U performance
Description
Symbol
Min
Typ
Max
Unit
MHz
dBm
dB
Bi
dBi
fC
Carrier frequency
-
-
-
-
-
908.40
-3.95
-7.95
4.21
-
-
-
-
-
TRP
εR
D
Total radiated power
Radiation efficiency
Directivity
G
Peak gain
-3.74
Figure 5.10: YZ plane (X back view)
Figure 5.9: YZ plane (X front view)
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Datasheet: ZM5304
Figure 5.11: XZ plane (Y front view)
Figure 5.12XZ plane (Y back view)
Figure 5.14: XY plane (Z back view)
Figure .13: XY plane (Z front view)
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Datasheet: ZM5304
5.9.2.3 REGION H
Table 5.22: Region H performance
Description
Symbol
Min
Typ
Max
Unit
MHz
dBm
dB
Bi
dBi
fC
Carrier frequency
-
-
-
-
-
921.40
-7.73
-11.73
4.26
-
-
-
-
-
TRP
εR
D
Total radiated power
Radiation efficiency
Directivity
G
Peak gain
-7.47
Figure 5.15: YZ plane (X front vie
Figure 5.16: YZ plane (X back view)
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Datasheet: ZM5304
Figure 5.17: XZ plane (Y front view)
Figure 5.18: XZ plane (Y back view)
Figur.19: XY plane (Z front view)
Figure 5.20: XY plane (Z back view)
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Datasheet: ZM5304
5.9.3 REGULATORY COMPLIANCE
The ZM5304 has been tested on the ZDP03A Z-Wave Development Platform to be compliant with the following regulatory
standards.
•
ACMA COMPLIANCE
o
o
AS/NZS 4268
CISPR 22
•
CE COMPLIANCE
o
o
o
o
o
o
EN 300 220-1/2
EN 301 489-1/3
EN 55022
EN 60950-1
EN 61000-4-2/3
EN 62479
•
•
FCC COMPLIANCE
o
FCC CFR 47 Part 15 Subpart C §15.212
IC COMPLIANCE3
o
o
o
RSS-GEN
RSS-210
ANSI C63.10
•
MIC COMPLIANCE
o
ARIB STD-T108
o
3 This module complies with RSS-210 of the Industry Canada Rules. Operation is subject to the following two conditions: (1) This
devimay not cause harmful interference, and (2) this device must accept any interference received, including interference
that y cause undesired operation. This device is intended only for OEM integrators under the following conditions:
•
•
The antenna must be installed such that 20 cm is maintained between the antenna and users, and
The transmitter module may not be co-located with any other transmitter or antenna.
As long as 2 conditions above are met, further transmitter test will not be required. However, the OEM integrator is still
responsible for testing their end-product for any additional compliance requirements required with this module installed
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Datasheet: ZM5304
6
Z-WAVE FREQUENCIES
Table 6.1: Z-Wave RF specification
Data rate
Modulation
Frequency deviation
Coding
9.6kbps
40kbps
100kbps
Gaussian Frequency Shift Keying (GFSK)
fC±29.3kHz
Frequency Shift Keying (FSK)
FSK
fC±20kHz
fC±20kHz
Manchester encoded
Non-return to Zero (NRZ)
NRZ
E
H
H
U
U
E
United Arab Emirates
Australia
Brazil
868.42 MHz
868.40 MHz
869.85 MHz
919.80 MHz
919.8Hz
916.z
916.00 MHz
869.85 MHz
869.85 MHz
919.80 MHz
-
921.42 MHz
921.40 MHz
921.42 MHz
921.40 MHz
Canada
908.42 MHz
908.40 MHz
Chile
908.42 MHz
908.40 MHz
China
868.42 MHz
868.40 MHz
E
European Union
Hong Kong
Israel
868.42 MHz
868.40 MHz
H
U
E
919.82 MHz
919.80 MHz
916.02 MHz
916.00 MHz
India
865.20 MHz
865.20 MHz
865.20 MHz
922.50 MHz
923.90 MHz
926.30 MHz
920.90 MHz
921.70 MHz
923.10 MHz
916.00 MHz
868.10 MHz
919.80 MHz
-
H
H
H
H
H
H
U
E
Japan
-
-
-
-
-
-
Korea
-
-
-
-
-
Mexico
908.42 MHz
868.12 MHz
921.42 MHz
869.02 MHz
868.42 MHz
-
908.40 MHz
868.10 MHz
921.40 MHz
869.00 MHz
868.40 MHz
-
Malaysia
New Zealand
Russia
H
E
E
Singapore
Taiwan
869.85 MHz
922.50 MHz
923.90 MHz
926.30 MHz
916.00 MHz
869.85 MHz
H
H
H
U
E
-
-
-
-
United States
South Africa
908.42 MHz
868.42 MHz
908.40 MHz
868.40 MHz
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Datasheet: ZM5304
7
MODULE INFORMATION
7.1 MODULE MARKING
Table 7.1: Marking description
A
N
T
REGION
E
E
N
N
A
Model: ZM5304-
FCC ID: D5304-U
IC: 11263A304
H
Figure 7.1: Marking placement
NB: The shield is only mounted on the U regional module.
7.2 MODULE DIMENSIONS
15.20 +/- 0.3
A
N
T
E
N
N
A
0
* All dimensions are in millimeters (mm)
Figure 7.2: Top view of module
5.5 +/- 0.6
3.8 +/- 0.6
ANTENNA
Shield
GND Plane
Copper Free
0
0
* All dimensions are in millimeters (mm)
Figure 7.3: Side view of module
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Datasheet: ZM5304
8
PROCESS SPECIFICATION
Specification
Description
MSL 3
Moisture Sensitivity Level designed and manufactured according to JEDEC J-STD-020C
REACH
REACH is a European Community Regulation on chemicals and their safe use (EC 1907/2006).
It deals with the Registration, Evaluation, Authorisation and Restriction of Chemical
substances
RoHS
Designed in compliance with The Restriction of Hazardous Substances Directive (RoH)
9
PCB MOUNTING AND SOLDERING
9.1 PCB MOUNTING PATTERN
The land pattern is required to include two drilled holes of diameter 1.8mm at the posions indicated, to ensure clearance to
antenna structures.
The recommended land pattern includes a layout of 48 pads of size 1.70 mm x 0.65 mm positioned as indicated in the figure.
All coordinates are relative to the centre of pad 11.
1.70mm
1
2
3
4
5
6
7
8
9
34
33
32
31
30
29
28
27
26
25
Ø1.8mm
24.40mm
13.3mm
-0.3mm
-0.98mm
0
1
2
3
13.00mm
19.60mm
Figure 9.1: Top view of land pattern
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Datasheet: ZM5304
9.2 RECOMMENDED PLACEMENT ON PCB
Recommended metal free space
> 55mm
recommended
> 5mm
recommended
1
2
3
4
5
6
7
8
9
34
33
32
31
30
29
28
27
26
25
> 50mm
recommended
10
> 55mm
recommended
> 50mm
recommended
PCB ground plane with components
Copper free PCB
Figure 9.2: Top view of remmended placement of module on PCB
9.3 SOLDERING INFORMATION
The soldering details to properly solder the ZM5304 module on standard PCBs are described below. The information provided is
intended only as a guideline and Silicon Labs is not liable if a selected profile does not work.
See IPC/JEDEC J-STD-020D.more information.
Table 9.1: Soldering details
PCB solder k expansion from landing pad edge
PCB paste msk expansion from landing pad edge
PCB process
PCB finish
Steperture
Stencil thickness
Solder paste used
Flux cleaning process
0.1 mm
0.0 mm
Pb-free (Lead free for RoHS4 compliance)
Defined by the manufacturing facility (EMS) or customer
Defined by the manufacturing facility (EMS) or customer
Defined by the manufacturing facility (EMS) or customer
Defined by the manufacturing facility (EMS) or customer
Defined by the manufacturing facility (EMS) or customer
4 RoHS = Restriction of Hazardous Substances Directive, EU
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Datasheet: ZM5304
Figure 9.3: Typical reflow pile
9.4 VISUAL INFORMATION
The modules visual appearance can be differefrom the picture on the front page of this datasheet. I.e. colour of antenna and
PCB is allowed to vary. Other visual elements like batch numbers and revisions may vary too. Functional and electrical
performance will not be affected.
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Datasheet: ZM5304
10 ORDERING INFORMATION
Table 10.1: Ordering codes
Minimum Order
Package
Type
Orderable Device
Status
Pins
Description
Quantity
ZM5304AE-CME3R ACTIVE
ZM5304AU-CME3R ACTIVE
ZM5304AH-CME3R ACTIVE
SOM
48
48
48
500 pcs.
ZM5304 Modem Module, No Shield, RevA,
868MHz Band, Tape and Reel
ZM5304 Modem Module, With ShieldA,
908MHz Band, Tape and Reel
ZM5304 Modem Module, No Shield, RevA,
921MHz Band, Tape and Re
SOM
SOM
500 pcs.
500 pcs.
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Datasheet: ZM5304
10.1 TAPE AND REEL INFORMATION
Figure 10.1: Tape information
30
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Datasheet: ZM5304
Figure 10.2: Reel information
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Datasheet: ZM5304
Parameter
Value
Pin 1 Quadrant
Pocket Quadrant Q1
10.2 CANADA IC STATEMENT
This device complies with RSS-210 of the Industry Canada Rules. Operation is subject to he following two conditions: (1) This
device may not cause harmful interference, and (2) this device must accept any interference received, including interference
that may cause undesired operation.
Ce dispositif est conforme à la norme CNR-210 d'Industrie Canada apble aux appareils radio exempts de licence. Son
fonctionnement est sujet aux deux conditions suivantes: (1) le dispositif ne doit pas produire de brouillage préjudiciable, et (2)
ce dispositif doit accepter tout brouillage reçu, y compris un brouilage susceptible de provoquer un fonctionnement indésirable.
THIS DEVICE IS INTENDED ONLY FOR OEM INTATORS UNDER THE FOLLOWING CONDITIONS: (FOR
MODULE DEVICE USE)
1) The antenna must be installed such that 20 m is maintained between the antenna and users, and
2) The transmitter module may not be o-located with any other transmitter or antenna.
As long as 2 conditions above are met, further transmitter test will not be required. However, the OEM integrator is still
responsible for testing their end-product for any additional compliance requirements required with this module installed.
CET APPAREIL ET CONÇU UNIQUEMENT POUR LES INTÉGRATEURS OEM DANS LES CONDITIONS
SUIVANT(POUR UTILISATION DE DISPOSITIF MODULE)
1) L'antenne doit être installée de telle sorte qu'une distance de 20 cm est respectée entre l'antenne et les utilisateurs, et
2) module émetteur peut ne pas être coïmplanté avec un autre émetteur ou antenne.
Tat que les 2 conditions ci-dessus sont remplies, des essais supplémentaires sur l'émetteur ne seront pas nécessaires.
Toutefois, l'intégrateur OEM est toujours responsable des essais sur son produit final pour toutes exigences de conformité
supplémentaires requis pour ce module installé.
IMPORTANT NOTE:
In the event that these conditions can not be met (for example certain laptop configurations or co-location with another
transmitter), then the Canada authorization is no longer considered valid and the IC ID can not be used on the final product. In
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Datasheet: ZM5304
these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and
obtaining a separate Canada authorization.
NOTE
IMPORTANTE:
Dans le cas où ces conditions ne peuvent être satisfaites (par exemple pour certaines configurations d'ordinateur portable ou de
certaines co-localisation avec un autre émetteur), l'autorisation du Canada n'est plus considéré comme valide et l'ID IC ne peut
pas être utilisé sur le produit final. Dans ces circonstances, l'intégrateur OEM sera chargé de réévaluer le produit final (y compris
l'émetteur) et l'obtention d'une autorisation distincte au Canada.
End Product Labeling
This transmitter module is authorized only for use in device where the antenna may be installed h that 20 cm may be
maintained between the antenna and users. The final end product must be labeled in a visible area wifollowing: “Contains
IC:
”.
Plaque signalétique du produit final
Ce module émetteur est autorisé uniquement pour une utilisation dans un dispositif où l'antenne peut être installée de telle
sorte qu'une distance de 20cm peut être maintenue entre l'antenne et les utilisateurs. Le produit final doit être étiqueté dans un
endroit visible avec l'inscription suivante: "Contient des IC:
".
Manual Information To the End User
The OEM integrator has to be aware not to provide informatithe end user regarding how to install or remove this RF
module in the user’s manual of the end product which integes this module.
The end user manual shall include all required regulatoormation/warning as show in this manual.
Manuel d'information à l'utilisateur final
L'intégrateur OEM doit être conscient de ne pas fournir des informations à l'utilisateur final quant à la façon d'installer ou de
supprimer ce module RF dans le manuel de l'utilisateur du produit final qui intègre ce module.
Le manuel de l'utilisateur final doit inclure toutes les informations réglementaires requises et avertissements comme indiqué
dans ce manuel.
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Datasheet: ZM5304
11 ABBREVIATIONS
Abbreviation
2FSK
2GFSK
ACM
ACMA
ADC
AES
API
APM
AV
Description
2-key Frequency Shift Keying
2-key Gaussian Frequency Shift Keying
Abstract Control Model
Australian Communications and Media Authority
Analog-to-Digital Converter
Advanced Encryption Standard
Application Programming Interface
Auto Programming Mode
Audio Video
BOD
CBC
CDC
CE
COM
CPU
CRC
D
Brown-Out Detector
Cipher-Block Chaining
Communications Device Class
Conformité Européenne
Communication
Central Processing Unit
Cyclic Redundancy Check
Differential
D-
Differential Minus
D+
Differential Plus
DC
Direct Current
Direct Memory Access
Electronic CodeBook
Electronic Manufacturing Servic
Federal Communications Commission
Frame Error Rate
DMA
ECB
EMS
FCC
FER
FLiRS
FSK
GFSK
GPIO
I
Frequently Listening Routing Slave
Frequency Shift Keying
Gaussian Frequeny Shift Keying
General Purpose Input Output
Input
I/O
IC
Input / Output
Integrated Circuit
IF
IPC
IRAM
ISM
ISP
ITU
JEDEC
Lsb
Intermediate Frequency
rconnecting and Packaging Circuits
Indirectly addressable Random Access Memory
Industrial, Scientific, and Medical
In-System Programming
International Telecommunications Union
Joint Electron Device Engineering Council
Least Significant Bit
LSB
Least Significant Byte
MC
MIC
Msb
MSB
NRZ
NVM
NVR
O
Micro-Controller Unit
Ministry of Internal affairs and Communications, Japan
Most Significant Bit
Most Significant Byte
Non-Return-to-Zero
Non-Volatile Memory
Non-Volatile Registers
Output
OEM
Original Equipment Manufacturer
OFB
Output FeedBack
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Datasheet: ZM5304
Abbreviation
Description
Pb
Lead
PCB
POR
RAM
RF
RoHS
ROM
RS-232
RX
Printed Circuit Board
Power-On Reset
Random Access Memory
Radio Frequency
Restriction of Hazardous Substances
Read Only Memory
Recommended Standard 232
Receive
S
Supply
SAW
SFR
SOM
SRAM
TX
Surface Acoustic Wave
Special Function Register
System-in-Module
Static Random Access Memory
Transmit
UART
USB
XRAM
XTAL
Universal Asynchronous Receiver Transmitter
Universal Serial Bus
External Random Access Memory
Crystal
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Datasheet: ZM5304
12 REVISION HISTORY
Date
Version
Affected
§6, Table 6.1
§5.9.3
Table 5.5
Table 5.11
$2.1.4
Revision
2018/02/19
2017/05/02
2016/12/21
14
13
12
Updated Korea frequency
Added Giteki mark
Cleaned up “TBD” values
Removed “tPGM_FULL_USB
”
2016/04/29
2015/11/25
11
10
Updated wording in section 2.1.4 Crystal driver and system
clock
Figure 9.1
Footprint updated to Landing Solder Pad Tand Heel
0.4mm. All pads on footprint are nogned to center of
pads on module. Drill hole diametetated in mm.
Updated to align with SD3503 recommndation.
Removed – information included in updated Figure 9.1
Added section Process Specification
Added orientation of coponent in tape
Updated picture on covr
Figure 9.3
Table 9.2
§8
§10.1
§Cover
2015/02/17
9
§8.4
§7.2
Added section “VISUAINFORMATION”
Added tolerances
2014/12/19
2014/12/14
2014/04/11
9
9
7
§9.2
§Cover, §7,1
§2.3.1
Adding full Canada IC statement
Updated with Canada IC number
Mandamounting holes added to the PCB mounting
pattern. Drawing and text is updated.
Increased RESET_N low period
dated with measurement values
Changed to a battery monitor implementation
Added resistor values
Removed size of application area
Added UART0 and RESET_N as test points
Updated test conditions
2013/12/12
2013/11/13
6A
5A
§2.3.1
§Cover,
§2.1.2,
Figure 2.4,
Figure 2.5,
Figure 3.2,
§5.1,
§5.4,
Table 5.13,
Removed graph and updated current consumption values
Added NVM performance data
§5.9.1,
§5.9.2,
§5.9.3
Replaced transmitter and receiver with a reference to SD3503
Added radiated measurements of the antennas
Updated the standards list
2013/08/28
2013/08/26
4B
4A
§5.9, §12
Added transmitter and receiver bandwidth to Tables 5.19 and
5.21
Updated 4A revision description
Clarified cover page summary to reflect controller based
applications
§Cover, §2, §3, §4, §5.2, §5.8,
§6, §7, §11
Added FCC ID to cover page
Changed TXD and RXD to UART0 TX and UART0 RX in Figure
2.1, Figure 3.1, and Figure 4.1
Renamed ‘pad’ to ‘pin’ throughout document except §9.3
Added pin dimensions to Figure 4.1
Fixed Korea Z-Wave frequency
Changed the location of the FCC ID label in Figure 7.1 and
Figure 7.2
Updated Figure 7.3 to thru-hole antenna
Added table of abbreviations
2013/07/02
2013/07/02
3A
2B
§1, §2, §5
§2.1.8, §11
Removed remnants of WUT
Removed invalid references to the WUT and added the date
to the references
Added dimensions of shield
2013/07/01
36
2A
§2.1, §2.3, §7.2, §6
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Datasheet: ZM5304
Date
Version
Affected
Revision
Changed the low operating voltage from 2.5V to 2.3V
Added AES, ADC, XTAL driver, BOD, RST controller, WUT,
Watchdog, and RF transceiver sections to the peripheral
descriptions
Changed “Firmware Upgrade” to “Module Programming” and
added default programming mode
Changed the module width to 15.05mm
Removed the frequency from the module marking anded
region data to the frequency table
2013/06/03
2013/05/31
1F
1E
§5.5
§All
Added transition time values
Removed empty page
Updated IO characteristics and added USB ermination
resistor values
2013/05/30
2013/05/27
1D
1C
§All
§All
Added missing receiver graphs and psed changes
Updated layout with feedback from the technical writer, and
data from the latest corner tests
2013/02/22
2013/02/18
1A
1A
§All
§All
Preliminary draft released
Initial draft
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37
Datasheet: ZM5304
13 REFERENCES
[1]
[2]
[3]
[4]
[5]
[6]
[7]
INS12350, Instruction, “Serial API Host Application Programming Guide”
INS12308, Instruction, “Z-Wave 500 Series Application Programmers Guide”
INS11681, Instruction, “500 Series Z-Wave Single Chip Programming Mode”
DSH12468, Datasheet, “ZDB5304 Z-Wave Development Board”
DSH12469, Datasheet, “SD3503”
INS12213, Instruction, “500 Series Hardware Integration Guide”
DSH11243, Datasheet, “ZDP03A, Z-Wave Development Platform”
38
DSH12461-14 | 3/2018
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