SI8275DAD-IM1 [SILICON]
4 Amp ISOdriver with High Transient (dV/dt) Immunity;型号: | SI8275DAD-IM1 |
厂家: | SILICON |
描述: | 4 Amp ISOdriver with High Transient (dV/dt) Immunity |
文件: | 总44页 (文件大小:944K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Si827x Data Sheet
4 Amp ISOdriver with High Transient (dV/dt) Immunity
KEY FEATURES
The Si827x isolators are ideal for driving power switches used in a wide variety of power
supply, inverter, and motor control applications. The Si827x isolated gate drivers utilize
Silicon Laboratories' proprietary silicon isolation technology, supporting up to 2.5
kVRMS withstand voltage per UL1577 and VDE0884. This technology enables industry
leading common-mode transient immunity (CMTI), tight timing specifications, reduced
variation with temperature and age, better part-to-part matching, and extremely high reli-
ability. It also offers unique features such as separate pull-up/down outputs, driver shut-
down on UVLO fault, and precise dead time programmability. The Si827x series offers
longer service life and dramatically higher reliability compared to opto-coupled gate driv-
ers.
• Single, dual, or high-side/low-side drivers
• Single PWM or dual digital inputs
• High dV/dt immunity:
• 200 kV/µs CMTI
• 400 kV/µs Latch-up
• Separate pull-up/down outputs for slew
rate control
• Wide supply range:
• Input supply: 2.5–5.5 V
The Si827x drivers utilize Silicon Labs' proprietary silicon isolation technology, which
provides up to 2.5 kVRMS withstand voltage per UL1577 and fast 60 ns propagation
times. Driver outputs can be grounded to the same or separate grounds or connected to
a positive or negative voltage. The TTL level compatible inputs with >400 mV hysteresis
are available in individual control input (Si8271/2/3/5) or PWM input (Si8274) configura-
tions. High integration, low propagation delay, small installed size, flexibility, and cost-
effectiveness make the Si827x family ideal for a wide range of isolated MOSFET/IGBT
and SiC or GaN FET gate drive applications.
• Driver supply: 4.2–30 V
• Very low jitter of 200 ps p-p
• 60 ns propagation delay (max)
• Dedicated enable pin
• Silicon Labs’ high performance isolation
technology:
• Industry leading noise immunity
• High speed, low latency and skew
• Best reliability available
Automotive Grade is available for certain part numbers. These products are built using
automotive-specific flows at all steps in the manufacturing process to ensure the robust-
ness and low defectivity required for automotive applications.
• Compact packages:
• 8-pin SOIC
Automotive Applications
Industrial Applications
• 16-pin SOIC
• On-board chargers
• QFN-14 (pin to pin compatible with
LGA-14 packages)
• Switch-mode Power Supplies
• Battery management systems
• Solar Power Inverters
• Wide temperature range:
• –40 to 125 °C
• Charging stations
• Motor control and drives
• Traction inverters
• Uninterruptible Power Supplies
• AEC-Q100 Qualified
• Hybrid Electric Vehicles
• High-Power Class D Amplifiers
• Automotive-grade OPNs available
• AIAG compliant PPAP documentation
support
• Battery Electric Vehicles
Safety Regulatory Approvals
• UL 1577 recognized
• IMDS and CAMDS listing support
• Up to 2500 Vrms for 1 minute
• CSA component notice 5A approval
• IEC 60950-1 (reinforced insulation)
• VDE certification conformity
• VDE 0884 Part 10
• CQC certification approval
• GB4943.1
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Rev. 1.01
Si827x Data Sheet
Ordering Guide
1. Ordering Guide
Table 1.1. Si827x Ordering Guide
Ordering
Inputs
Driver
Output
UVLO
Integrated
Deglitcher
Dead Time
Adjustable
Range
Low
Jitter
Package
Isolation
Rating
Part Number
Configuration
Products Available Now
Si8271AB-IS
Si8271BB-IS
VI
Single
Single
Single
Single
HS/LS
HS/LS
HS/LS
HS/LS
HS/LS
HS/LS
HS/LS
HS/LS
HS/LS
HS/LS
HS/LS
HS/LS
HS/LS
HS/LS
HS/LS
HS/LS
HS/LS
HS/LS
HS/LS
HS/LS
Dual
5
8
N
N
N
N
N
Y
N
Y
N
Y
N
Y
N
Y
N
Y
N
Y
N
N
N
Y
N
Y
N
Y
N
Y
N/A
N/A
Y
Y
Y
Y
Y
N
Y
N
Y
N
Y
N
Y
N
Y
N
Y
N
Y
Y
Y
N
Y
N
Y
N
Y
N
SOIC-8 NB
SOIC-8 NB
SOIC-8 NB
SOIC-8 NB
SOIC-16 NB
SOIC-16 NB
QFN-14
2.5 kVrms
2.5 kVrms
2.5 kVrms
2.5 kVrms
2.5 kVrms
2.5 kVrms
2.5 kVrms
2.5 kVrms
2.5 kVrms
2.5 kVrms
2.5 kVrms
2.5 kVrms
2.5 kVrms
2.5 kVrms
2.5 kVrms
2.5 kVrms
2.5 kVrms
2.5 kVrms
2.5 kVrms
2.5 kVrms
2.5 kVrms
2.5 kVrms
2.5 kVrms
2.5 kVrms
2.5 kVrms
2.5 kVrms
2.5 kVrms
2.5 kVrms
VI
Si8271DB-IS
VI
12
3
N/A
Si8271GB-IS
VI
N/A
Si8273AB-IS1
Si8273ABD-IS1
Si8273AB-IM1
Si8273ABD-IM1
Si8273DB-IS1
Si8273DBD-IS1
Si8273GB-IS1
Si8273GBD-IS1
Si8273BB-IS1
Si8273BBD-IS1
Si8274AB1-IS1
Si8274AB4D-IS1
Si8274AB1-IM1
Si8274AB4D-IM1
Si8274BB1-IS1
Si8274DB1-IS1
Si8274GB1-IS1
Si8274GB4D-IS1
Si8274GB1-IM1
Si8274GB4D-IM1
Si8275GB-IS1
Si8275GBD-IS1
Si8275AB-IM1
Si8275ABD-IM1
VIA/VIB
VIA/VIB
VIA/VIB
VIA/VIB
VIA/VIB
VIA/VIB
VIA/VIB
VIA/VIB
VIA/VIB
VIA/VIB
PWM
5
N/A
5
N/A
5
N/A
5
N/A
QFN-14
12
12
3
N/A
SOIC-16 NB
SOIC-16 NB
SOIC-16 NB
SOIC-16 NB
SOIC-16 NB
SOIC-16 NB
SOIC-16 NB
SOIC-16 NB
QFN-14
N/A
N/A
3
N/A
8
N/A
8
N/A
5
10-200
20-700
10-200
20-700
10-200
10-200
10-200
20-700
10-200
20-700
N/A
PWM
5
PWM
5
PWM
5
QFN-14
PWM
8
SOIC-16 NB
SOIC-16 NB
SOIC-16 NB
SOIC-16 NB
QFN-14
PWM
12
3
PWM
PWM
3
PWM
3
PWM
3
QFN-14
VIA/VIB
VIA/VIB
VIA/VIB
VIA/VIB
3
SOIC-16 NB
SOIC-16 NB
QFN-14
Dual
3
N/A
Dual
5
N/A
Dual
5
N/A
QFN-14
Contact Silicon Labs Sales for These Options
Si8271ABD-IS
Si8271BBD-IS
VI
VI
Single
Single
5
8
Y
Y
N/A
N/A
N
N
SOIC-8 NB
SOIC-8 NB
2.5 kVrms
2.5 kVrms
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Rev. 1.01 | 2
Si827x Data Sheet
Ordering Guide
Ordering
Inputs
Driver
Output
UVLO
Integrated
Deglitcher
Dead Time
Adjustable
Range
Low
Jitter
Package
Isolation
Rating
Part Number
Configuration
Si8271DBD-IS
Si8271GBD-IS
Si8273BB-IS1
Si8273BBD-IS1
Si8274BB4D-IS1
Si8274DB4D-IS1
Si8275AB-IS1
Si8275ABD-IS1
Si8275BB-IS1
Si8275BBD-IS1
Si8275DB-IS1
Si8275DBD-IS1
Si8275BB-IM1
Si8275BBD-IM1
Si8275DB-IM1
Si8275DBD-IM1
Si8275GB-IM1
Si8275GBD-IM1
Si8275DA-IM1
Si8275DAD-IM1
VI
Single
Single
HS/LS
HS/LS
HS/LS
HS/LS
Dual
12
3
Y
Y
N
Y
Y
Y
N
Y
N
Y
N
Y
N
Y
N
Y
N
Y
N
Y
N/A
N/A
N
N
Y
N
N
N
Y
N
Y
N
Y
N
Y
N
Y
N
Y
N
Y
N
SOIC-8 NB
SOIC-8 NB
SOIC-16 NB
SOIC-16 NB
SOIC-16 NB
SOIC-16 NB
SOIC-16 NB
SOIC-16 NB
SOIC-16 NB
SOIC-16 NB
SOIC-16 NB
SOIC-16 NB
QFN-14
2.5 kVrms
2.5 kVrms
2.5 kVrms
2.5 kVrms
2.5 kVrms
2.5 kVrms
2.5 kVrms
2.5 kVrms
2.5 kVrms
2.5 kVrms
2.5 kVrms
2.5 kVrms
2.5 kVrms
2.5 kVrms
2.5 kVrms
2.5 kVrms
2.5 kVrms
2.5 kVrms
1 kVrms
VI
VIA/VIB
VIA/VIB
PWM
8
N/A
8
N/A
8
20-700
20-700
N/A
PWM
12
5
VIA/VIB
VIA/VIB
VIA/VIB
VIA/VIB
VIA/VIB
VIA/VIB
VIA/VIB
VIA/VIB
VIA/VIB
VIA/VIB
VIA/VIB
VIA/VIB
VIA/VIB
VIA/VIB
Dual
5
N/A
Dual
8
N/A
Dual
8
N/A
Dual
12
12
8
N/A
Dual
N/A
Dual
N/A
Dual
8
N/A
QFN-14
Dual
12
12
3
N/A
QFN-14
Dual
N/A
QFN-14
Dual
N/A
QFN-14
Dual
3
N/A
QFN-14
Dual
12
12
N/A
QFN-14
Dual
N/A
QFN-14
1 kVrms
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Rev. 1.01 | 3
Si827x Data Sheet
Ordering Guide
Automotive Grade OPNs
Automotive-grade devices are built using automotive-specific flows at all steps in the manufacturing process to ensure robustness and
low defectivity. These devices are supported with AIAG-compliant Production Part Approval Process (PPAP) documentation, and fea-
ture International Material Data System (IMDS) and China Automotive Material Data System (CAMDS) listing. Qualifications are compli-
ant with AEC-Q100, and a zero-defect methodology is maintained throughout definition, design, evaluation, qualification, and mass pro-
duction steps.
Table 1.2. Ordering Guide for Automotive Grade OPNs1, 2, 4, 5
Ordering Part
Numbers (OPNs)
Inputs
Driver Configu- Output
Integrated
Deglitcher
Dead Time
Adjustable
Range
Low
Jitter
Package
Isolation
Rating
ration
UVLO
Si8271AB-AS
Si8271BB-AS
Si8271DB-AS
Si8273DB-AS1
Si8274BB4D-AS1
Si8274DB1-AS1
Si8275DB-AS1
Note:
VI
VI
Single
Single
Single
HS/LS
HS/LS
HS/LS
Dual
5
8
N
N
N
N
Y
N
N
N/A
N/A
Y
Y
Y
Y
N
Y
Y
SOIC-8 NB
SOIC-8 NB
SOIC-8 NB
SOIC-16 NB
SOIC-16 NB
SOIC-16 NB
SOIC-16 NB
2.5 kVrms
2.5 kVrms
2.5 kVrms
2.5 kVrms
2.5 kVrms
2.5 kVrms
2.5 kVrms
VI
12
12
8
N/A
VIA/VIB
PWM
PWM
VIA/VIB
N/A
20-700
10-100
N/A
12
12
1. All packages are RoHS-compliant with peak reflow temperatures of 260 °C according to the JEDEC industry standard classifica-
tions.
2. “Si” and “SI” are used interchangeably.
3. An "R" at the end of the part number denotes tape and reel packaging option.
4. Automotive-Grade devices (with an "–A" suffix) are identical in construction materials, topside marking, and electrical parameters
to their Industrial-Grade (with a "–I" suffix) version counterparts. Automotive-Grade products are produced utilizing full automotive
process flows and additional statistical process controls throughout the manufacturing flow. The Automotive-Grade part number is
included on shipping labels.
5. Additional Ordering Part Numbers may be available in Automotive-Grade. Please contact your local Silicon Labs sales represen-
tative for further information.
6. Referring to Section 8 Top Marking, the Manufacturing Code represented by either “RTTTTT” or “TTTTTT” contains as its first
character a letter in the range N through Z to indicate Automotive-Grade.
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Table of Contents
1. Ordering Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
2. System Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.1 Typical Operating Characteristics. . . . . . . . . . . . . . . . . . . . . . . .10
2.2 Family Overview and Logic Operation During Startup . . . . . . . . . . . . . . . . .11
2.2.1 Products . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11
2.2.2 Device Behavior . . . . . . . . . . . . . . . . . . . . . . . . . . . .11
2.3 Power Supply Connections . . . . . . . . . . . . . . . . . . . . . . . . . .13
2.4 Power Dissipation Considerations . . . . . . . . . . . . . . . . . . . . . . .13
2.5 Layout Considerations . . . . . . . . . . . . . . . . . . . . . . . . . . .14
2.6 Undervoltage Lockout Operation . . . . . . . . . . . . . . . . . . . . . . . .15
2.6.1 Device Startup . . . . . . . . . . . . . . . . . . . . . . . . . . . .15
2.6.2 Undervoltage Lockout . . . . . . . . . . . . . . . . . . . . . . . . . .15
2.6.3 Control Inputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15
2.6.4 Enable Input . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16
2.7 Programmable Dead Time and Overlap Protection . . . . . . . . . . . . . . . . . .16
2.8 De-glitch Feature . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17
3. Applications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
3.1 High-Side/Low-Side Driver . . . . . . . . . . . . . . . . . . . . . . . . . .18
3.2 Dual Driver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19
4. Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . 20
4.1 Test Circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .23
4.2 Regulatory Information (Pending). . . . . . . . . . . . . . . . . . . . . . . .24
5. Pin Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
5.1 Si8271 Pin Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . .29
5.2 Si8273/75 Pin Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . .30
5.3 Si8274 Pin Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . .31
6. Package Outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
6.1 Package Outline: 16-Pin Narrow-Body SOIC . . . . . . . . . . . . . . . . . . . .32
6.2 Package Outline: 8-Pin Narrow Body SOIC . . . . . . . . . . . . . . . . . . . .34
6.3 Package Outline: 14 LD QFN . . . . . . . . . . . . . . . . . . . . . . . . .36
7. Land Patterns . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
7.1 Land Pattern: 16-Pin Narrow Body SOIC . . . . . . . . . . . . . . . . . . . . .37
7.2 Land Pattern: 8-Pin Narrow Body SOIC . . . . . . . . . . . . . . . . . . . . .38
7.3 Land Pattern: 14 LD QFN . . . . . . . . . . . . . . . . . . . . . . . . . .39
8. Top Markings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
8.1 Si827x Top Marking (16-Pin Narrow Body SOIC) . . . . . . . . . . . . . . . . . .40
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8.2 Si8271 Top Marking (8-Pin Narrow Body SOIC) . . . . . . . . . . . . . . . . . . .41
8.3 Si827x Top Marking (14 LD QFN) . . . . . . . . . . . . . . . . . . . . . . .42
9. Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
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Si827x Data Sheet
System Overview
2. System Overview
VDD
VI
VDDI
VDDI
VO+
VO-
VDDI
UVLO
UVLO
EN
GNDI
GNDA
Si8271
Figure 2.1. Si8271 Block Diagram
VDDI
VDDA
VIA
VOA
UVLO
GNDA
OVERLAP
PROTECTION
VDDI
VDDI
VDDB
VDDI
UVLO
VOB
UVLO
EN
GNDB
VIB
GNDI
Si8273
Figure 2.2. Si8273 Block Diagram
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Si827x Data Sheet
System Overview
VDDI
VDDA
PWM
LPWM
VOA
UVLO
GNDA
DT CONTROL
&
OVERLAP
PROTECTION
DT
VDDI
VDDI
VDDB
VDDI
UVLO
VOB
UVLO
EN
GNDB
LPWM
GNDI
Si8274
Figure 2.3. Si8274 Block Diagram
VDDI
VDDA
VIA
VOA
UVLO
GNDA
VDDI
VDDI
UVLO
VDDI
VDDB
EN
VOB
UVLO
GNDB
VIB
GNDI
Si8275
Figure 2.4. Si8275 Block Diagram
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Si827x Data Sheet
System Overview
The operation of an Si827x channel is analogous to that of an optocoupler and gate driver, except an RF carrier is modulated instead of
light. This simple architecture provides a robust isolated data path and requires no special considerations or initialization at start-up. A
simplified block diagram for a single Si827x channel is shown in the figure below.
Transmitter
Receiver
Driver
VDD
RF
OSCILLATOR
Semiconductor-
Based Isolation
Barrier
Dead
time
control
B
MODULATOR
DEMODULATOR
A
4 A peak
Gnd
Figure 2.5. Simplified Channel Diagram
A channel consists of an RF Transmitter and RF Receiver separated by a semiconductor-based isolation barrier. Referring to the
Transmitter, input A modulates the carrier provided by an RF oscillator using on/off keying. The Receiver contains a demodulator that
decodes the input state according to its RF energy content and applies the result to output B via the output driver. This RF on/off keying
scheme is superior to pulse code schemes as it provides best-in-class noise immunity, low power consumption, and better immunity to
magnetic fields. See Figure 2.6 Modulation Scheme on page 9 for more details.
Input Signal
Modulation Signal
Output Signal
Figure 2.6. Modulation Scheme
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Si827x Data Sheet
System Overview
2.1 Typical Operating Characteristics
The typical performance characteristics depicted in the figures below are for information purposes only. Refer to Table 4.1 Electrical
Characteristics on page 20 for actual specification limits.
Figure 2.7. Rise/Fall Time vs. Supply Voltage
Figure 2.8. Propagation Delay vs. Supply Voltage
Figure 2.9. Supply Current vs. Supply Voltage
Figure 2.10. Supply Current vs. Supply Voltage
Figure 2.11. Supply Current vs. Temperature
Figure 2.12. Rise/Fall Time vs. Load
Figure 2.13. Propagation Delay vs. Load
Figure 2.14. Propagation Delay vs. Temperature
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Si827x Data Sheet
System Overview
Figure 2.15. Output Sink Current vs. Temperature
Figure 2.16. Output Source Current vs. Temperature
2.2 Family Overview and Logic Operation During Startup
The Si827x family of isolated drivers consists of single, high-side/low-side, and dual driver configurations.
2.2.1 Products
The table below shows the configuration and functional overview for each product in this family.
Table 2.1. Si827x Family Overview
Part Number
Configuration
Overlap
Programmable
Inputs
Peak Output
Protection
Dead Time
Current (A)
Si8271
Si8273
Si8274
Si8275
Single Driver
High-Side/Low-Side
PWM
—
Y
—
—
Y
VI
4.0
4.0
4.0
4.0
VIA, VIB
PWM
Y
Dual Driver
—
—
VIA, VIB
2.2.2 Device Behavior
The following table consists of truth tables for the Si8273, Si8274, and Si8275 families.
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Si827x Data Sheet
System Overview
Table 2.2. Si827x Family Truth Table1
Si8271 (Single Driver) Truth Table
Output
Inputs
VDDI State
Enable
Notes
VI
L
VO+
VO–
L
Powered
Powered
H
H
X
Hi–Z
H
H
Hi–Z
L
X2
X
Unpowered
Hi–Z
Powered
L
Hi–Z
L
Si8273 (High-Side/Low-Side) Truth Table
Output
Inputs
VDDI State
Enable
Notes
VIA
VIB
L
VOA
VOB
L
L
Powered
Powered
Powered
Powered
Unpowered
H
H
H
H
X
L
L
H
L
L
L
H
L
L
L
H
H
H
L
H
Invalid state.
X2
X
X2
X
Output returns to input state within 7 µs of VDDI power restoration.
Device is disabled.
Powered
L
L
L
Si8274 (PWM Input High-Side/Low-Side) Truth Table
Enable Output
PWM Input
VDDI State
Notes
VOA
VOB
H
L
Powered
Powered
H
H
X
H
L
L
L
H
L
X2
X
Unpowered
Output returns to input state within 7 µs of VDDI power restoration.
Device is disabled.
Powered
L
L
L
Si8275 (Dual Driver) Truth Table
Output
Inputs
VDDI State
Enable
Notes
VIA
L
VIB
L
VOA
VOB
Powered
Powered
Powered
Powered
Unpowered
H
H
H
H
X
L
L
L
H
L
L
H
H
L
H
H
L
H
H
H
L
X2
X
X2
X
Output returns to input state within 7 µs of VDDI power restoration.
Device is disabled.
Powered
L
L
L
1. This truth table assumes VDDA and VDDB are powered. If VDDA and VDDB are below UVLO, see 2.6.2 Undervoltage Lockout
for more information.
2. An input can power the input die through an internal diode if its source has adequate current.
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Si827x Data Sheet
System Overview
2.3 Power Supply Connections
Isolation requirements mandate individual supplies for VDDI, VDDA, and VDDB. The decoupling caps for these supplies must be
placed as close to the VDD and GND pins of the Si827x as possible. The optimum values for these capacitors depend on load current
and the distance between the chip and the regulator that powers it. Low effective series resistance (ESR) capacitors, such as Tantalum,
are recommended.
2.4 Power Dissipation Considerations
Proper system design must assure that the Si827x operates within safe thermal limits across the entire load range.The Si827x total
power dissipation is the sum of the power dissipated by bias supply current, internal parasitic switching losses, and power dissipated by
the series gate resistor and load. The equation below shows total Si827x power dissipation.
R
R
n
p
2
P
= V
I
+ 2 I
V
+ ( f ) Q
V
+ f
Q
V
+ 2 fCintV
DD2
(
)(
)
(
)(
)
(
)
(
D
DDI DDI
DD2
DD2
G
DD2
G
DD2
)
( )(
)(
)
R + R
R + R
p
g
n g
where:
PD is the total Si827x device power dissipation (W)
IDDI is the input-side maximum bias current (10 mA)
IDD2 is the driver die maximum bias current (4 mA)
Cint is the internal parasitic capacitance (370 pF)
VDDI is the input-side VDD supply voltage (2.5 to 5.5 V)
VDD2 is the driver-side supply voltage (4.2 to 30 V)
f is the switching frequency (Hz)
QG is the gate charge of external FET
RG is the external gate resistor
RP is the RDS(ON) of the driver pull-up switch: 2.7 Ω
Rn is the RDS(ON) of the driver pull-down switch: 1 Ω
Equation 1
Power dissipation example for driver using Equation 1 with the following givens:
VDDI = 5.0 V
VDD2 = 12 V
f = 350 kHz
RG = 22 Ω
QG = 25 nC
Pd = 199 mW
From which the driver junction temperature is calculated using Equation 2, where:
Pd is the total Si827x device power dissipation (W)
θja is the thermal resistance from junction to air (105 °C/W in this example)
TA is the ambient temperature
T = P × θ + T = (0.199)(105) + 20 = 41.0 ° C
j
d
ja
A
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Rev. 1.01 | 13
Si827x Data Sheet
System Overview
The maximum power dissipation allowable for the Si827x is a function of the package thermal resistance, ambient temperature, and
maximum allowable junction temperature, as shown in Equation 2:
T
− T
A
jmax
P
≤
Dmax
θ
ja
where:
PDmax = Maximum Si827x power dissipation (W)
Tjmax = Si827x maximum junction temperature (150 °C)
TA = Ambient temperature (20 °C)
θja = Si827x junction-to-air thermal resistance (105 °C/W)
Equation 2
Substituting values for PDmax Tjmax, TA, and θja into Equation 2 results in a maximum allowable total power dissipation of 1.23 W. Maxi-
mum allowable load is found by substituting this limit and the appropriate data sheet values from Table 4.1 Electrical Characteristics on
page 20 into Equation 1 and simplifying. The result is Equation 3, which assumes VDDI = 5 V and VDDA = VDDB = 12 V.
0.596
f
−8
Q
=
− 5.81 × 10
g(max )
Equation 3
Max Load vs. Switching Frequency
12
10
8
6
4
2
0
50
150
250
350
450
550
650
750
Switching Frequency (kHz)
Figure 2.17. Max Load vs. Switching Frequency
2.5 Layout Considerations
It is most important to minimize ringing in the drive path and noise on the Si827x VDD lines. Care must be taken to minimize parasitic
inductance in these paths by locating the Si827x as close to the device it is driving as possible. In addition, the VDD supply and ground
trace paths must be kept short. For this reason, the use of power and ground planes is highly recommended. A split ground plane sys-
tem having separate ground and VDD planes for power devices and small signal components provides the best overall noise perform-
ance.
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Rev. 1.01 | 14
Si827x Data Sheet
System Overview
2.6 Undervoltage Lockout Operation
Device behavior during start-up, normal operation and shutdown is shown in the figure below, where UVLO+ and UVLO- are the posi-
tive-going and negative-going thresholds respectively.
Note: Outputs VOA and VOB default low when input side power supply (VDDI) is not present.
2.6.1 Device Startup
Outputs VOA and VOB are held low during power-up until VDD is above the UVLO threshold for time period tSTART. Following this,
the outputs follow the states of inputs VIA and VIB.
2.6.2 Undervoltage Lockout
Undervoltage Lockout (UVLO) is provided to prevent erroneous operation during device startup and shutdown or when VDD is below its
specified operating circuits range. The input (control) side, Driver A and Driver B, each have their own undervoltage lockout monitors.
The Si827x input side enters UVLO when VDDI < VDDIUV–, and exits UVLO when VDDI > VDDIUV+. The driver outputs, VOA and VOB,
remain low when the input side of the Si827x is in UVLO and their respective VDD supply (VDDA, VDDB) is within tolerance. Each
driver output can enter or exit UVLO independently. For example, VOA unconditionally enters UVLO when VDDA falls below VDDAUV–
and exits UVLO when VDDA rises above VDDAUV+
.
The UVLO circuit unconditionally drives VO low when VDD is below the lockout threshold. Upon power up, the Si827x is maintained in
UVLO until VDD rises above VDDUV+. During power down, the Si827x enters UVLO when VDD falls below the UVLO threshold plus
hysteresis (i.e., VDD < VDDUV+ – VDDHYS). Please refer to spec tables for UVLO values.
UVLO+
VDDHYS
UVLO-
VDDI
UVLO+
VDDHYS
UVLO-
VDDA
VIA
ENABLE
tSD
tRESTART
tPHL
tPLH
tSD
tSTART
tSTART
tSTART
VOA
Figure 2.18. Device Behavior during Normal Operation and Shutdown
2.6.3 Control Inputs
VIA, VIB, and PWM inputs are high-true, TTL level-compatible logic inputs. A logic high signal on VIA or VIB causes the corresponding
output to go high. For PWM input versions (Si8274), VOA is high and VOB is low when the PWM input is high, and VOA is low and
VOB is high when the PWM input is low.
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Si827x Data Sheet
System Overview
2.6.4 Enable Input
When brought low, the ENABLE input unconditionally drives VOA and VOB low regardless of the states of VIA and VIB. Device opera-
tion terminates within tSD after ENABLE = VIL and resumes within tRESTART after ENABLE = VIH. The ENABLE input has no effect if
VDDI is below its UVLO level (i.e., VOA, VOB remain low).
2.7 Programmable Dead Time and Overlap Protection
All PWM drivers (Si8274x) include programmable dead time, which adds a user-programmable delay between transitions of VOA and
VOB. When enabled, dead time is present on all transitions. The amount of dead time delay (DT) is programmed by a single resistor
(RDT) connected from the DT input to ground per the equation below.
DT = 2.02 × RDT + 7.77 (for 10-200 ns range)
DT = 6.06 × RDT + 3.84 (for 20-700 ns range)
where:
DT = dead time (ns)
and
RDT = dead time programming resistor (kΩ)
Equation 4
Input/output timing waveforms for the Si8273 two-input drivers are shown in the figure below, and dead time waveforms for the Si8274
are shown in Figure 2.20 Dead Time Waveforms for Si8274 Drivers on page 17.
VIA
VIB
VOA
VOB
A
B
C
D
E
F
G
H
I
Figure 2.19. Input / Output Waveforms for Si8273 Drivers
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Rev. 1.01 | 16
Si827x Data Sheet
System Overview
Table 2.3. Input / Output Waveforms for High-Side / Low-Side Two-Input Drivers
Ref
A
B
C
D
E
Description
Normal operation: VIA high, VIB low.
Normal operation: VIB high, VIA low.
Contention: VIA = VIB = high.
Recovery from contention: VIA transitions low.
Normal operation: VIA = VIB = low.
F
Normal operation: VIA high, VIB low.
Contention: VIA = VIB = high.
G
H
I
Recovery from contention: VIB transitions low.
Normal operation: VIB transitions high.
VOB
PWM
50%
LPWM
(internal)
DT
90%
VOA
10%
DT
90%
VOB
10%
Typical Dead Time Operation
Figure 2.20. Dead Time Waveforms for Si8274 Drivers
2.8 De-glitch Feature
A de-glitch feature is provided on some options, as defined in the 1. Ordering Guide. The internal de-glitch circuit provides an internal
time delay of 15 ns typical, during which any noise is ignored and will not pass through the IC. For these product options, the propaga-
tion delay will be extended by 15 ns, as specified in the spec table.
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Rev. 1.01 | 17
Si827x Data Sheet
Applications
3. Applications
The following examples illustrate typical circuit configurations using the Si827x.
3.1 High-Side/Low-Side Driver
In the figure below, side A shows the Si8273 controlled using the VIA and VIB input signals, and side B shows the Si8274 controlled by
a single PWM signal.
VDD2
C3
VDD2
C3
D1
D1
VDDI
VDDI
1 µF
1 µF
VDDI
GNDI
VDDI
C2
0.1 µF
C2
0.1 µF
C1
C1
1500 V max
1500 V max
1 µF
1 µF
VDDA
VDDA
GNDI
PWM
CB
CB
Q1
Q1
OUT1
OUT2
VIA
VIB
PWMOUT
CONTROLLER
I/O
VOA
VOA
GNDA
GNDA
DT
RDT
VDD2
C4
VDD2
C4
CONTROLLER
Si8273
Si8274
VDDB
VDDB
C5
10 µF
C5
0.1 µF
0.1 µF
10 µF
I/O
ENABLE
ENABLE
GNDB
VOB
GNDB
VOB
Q2
Q2
A
B
Figure 3.1. Si827x in Half-Bridge Application
For both cases, D1 and CB form a conventional bootstrap circuit that allows VOA to operate as a high-side driver for Q1, which has a
maximum drain voltage of 1500 V. VOB is connected as a conventional low-side driver. Note that the input side of the Si827x requires
VDD in the range of 2.5 to 5.5 V, while the VDDA and VDDB output side supplies must be between 4.2 and 30 V with respect to their
respective grounds. The boot-strap start up time will depend on the CB cap chosen. VDD2 is usually the same as VDDB. Also note that
the bypass capacitors on the Si827x should be located as close to the chip as possible. Moreover, it is recommended that bypass ca-
pacitors be used (as shown in the figures above for input and driver side) to reduce high frequency noise and maximize performance.
The outputs VOA and VOB can be used interchangeably as high side or low side drivers.
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Si827x Data Sheet
Applications
3.2 Dual Driver
The figure below shows the Si827x configured as a dual driver. Note that the drain voltages of Q1 and Q2 can be referenced to a com-
mon ground or to different grounds with as much as 1500 V dc between them.
VDDI
VDDI
Q1
C2
0.1 µF
C1
1 µF
VOA
GNDI
VDDA
C3
VDDA
GNDA
VIA
VIB
OUT1
OUT2
C4
10 µF
0.1 µF
CONTROLLER
Si8275
VDDB
C5
VDDB
GNDB
VOB
C6
10 µF
I/O
ENABLE
0.1 µF
Q2
Figure 3.2. Si827x in a Dual Driver Application
Because each output driver resides on its own die, the relative voltage polarities of VOA and VOB can reverse without damaging the
driver. That is, the voltage at VOA can be higher or lower than that of VOB by VDD without damaging the driver. Therefore, a dual
driver in a high-side/low-side drive application can use either VOA or VOB as the high side driver. Similarly, a dual driver can operate
as a dual low-side or dual high-side driver and is unaffected by static or dynamic voltage polarity changes.
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Rev. 1.01 | 19
Si827x Data Sheet
Electrical Specifications
4. Electrical Specifications
Table 4.1. Electrical Characteristics
VDDI = 5 V, GNDI = 0 V, VDDA/B-GNDA/B = 30 V, TA = –40 to +125 °C; typical specs at 25 °C
Parameter
DC Parameters
Symbol
Test Condition
Min
Typ
Max
Units
Input Supply Voltage
VDDI
(VDDA/B – GNDA/B)
IDDI(Q)
2.5
4.2
—
—
—
5.5
30
V
Driver Supply Voltage
V
Input Supply Quiescent Current
Input Supply Active Current
Output Supply Quiescent Current
Output Supply Active Current
Gate Driver
7.9
8.0
2.5
10.0
10.0
10.0
4.0
mA
mA
mA
mA
IDDI
f = 500 kHz
—
IDDx(Q)
—
IDDx
f = 500 kHz (no load)
—
11.0
High Output Transistor RDS (ON)
Low Output Transistor RDS (ΟΝ)
High Level Peak Output Current
ROH
ROL
IOH
—
—
—
2.7
1.0
1.8
—
—
—
Ω
Ω
A
VDDA/B = 15 V,
See Figure 4.2 IOH
Source Current Test
Circuit on page 23
for Si827xG,
V
DD = 4.2 V,
T < 250 ns
Low Level Peak Output Current
IOL
VDDA/B = 15 V,
—
4.0
—
A
See Figure 4.1 IOL
Sink Current Test Cir-
cuit on page 23
for Si827xG,
VDD = 4.2 V,
TPW_IOL < 250 ns
UVLO
VDDI UVLO Threshold +
VDDI UVLO Threshold –
VDDI Hysteresis
VDDIUV+
VDDIUV–
VDDIHYS
1.85
1.75
—
2.2
2.1
100
2.45
2.35
—
V
V
mV
UVLO Threshold + (Driver Side)
3 V Threshold
VDDXUV+
2.7
4.9
7.2
11
3.5
5.5
4.0
6.3
V
V
V
V
5 V Threshold
8 V Threshold
8.3
9.5
12 V Threshold
12.2
13.5
UVLO Threshold - (Driver Side)
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Rev. 1.01 | 20
Si827x Data Sheet
Electrical Specifications
Parameter
3 V Threshold
Symbol
Test Condition
Min
2.5
4.6
6.7
9.6
Typ
3.0
Max
3.8
Units
VDDXUV-
V
V
V
V
5 V Threshold
5.2
5.9
8 V Threshold
7.8
8.9
12 V Threshold
10.8
12.1
UVLO Lockout Hysteresis
3 V Threshold
VDDHYS
—
—
—
—
500
300
—
—
—
—
mV
mV
mV
mV
5 V Threshold
8 V Threshold
500
12 V Threshold
1400
Digital
Logic High Input Threshold
Logic Low Input Threshold
Input Hysteresis
VIH
VIL
2.0
—
—
—
—
0.8
—
V
V
VIHYST
VOH
350
400
—
mV
V
Logic High Output Voltage
IO = –1 mA
IO = 1 mA
VDDA/B –
0.04
—
Logic Low Output Voltage
AC Switching Parameters
Propagation Delay
VOL
—
20
30
20
30
30
65
—
—
—
—
—
30
45
30
45
45
85
3.6
14
38
200
0.04
60
75
60
75
75
105
8
V
tPLH, tPHL
CL = 200 pF
CL = 200 pF
CL = 200 pF
CL = 200 pF
CL = 200 pF
CL = 200 pF
|tPLH – tPHL|
|tPLH – tPHL|
|tPLH – tPHL|
ns
ns
ns
ns
ns
ns
ns
ns
ns
ps
Si8271/3/5 with low jitter
Propagation Delay
tPLH, PHL
t
Si8271/3/5 with de-glitch option
Propagation Delay
tPHL
Si8274 with low jitter
Propagation Delay
tPHL
Si8274 with de-glitch option
Propagation Delay
tPLH
Si8274 with low jitter
Propagation Delay
tPLH
Si8274 with de-glitch option
Pulse Width Distortion
Si8271/3/5 all options
Pulse Width Distortion
Si8274 with low jitter
Pulse Width Distortion
Si8274 with de-glitch option
Peak to Peak Jitter
PWD
PWD
PWD
19
47
—
Si827x with low jitter
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Rev. 1.01 | 21
Si827x Data Sheet
Electrical Specifications
Parameter
Symbol
Test Condition
RDT = 6 kΩ
Min
10
Typ
20
Max
30
Units
Programmed dead-time (DT) for
products with 10–200 ns DT range
DT
ns
RDT = 15 kΩ
RDT = 100 kΩ
RDT = 6 kΩ
26
38
50
150
23
210
40
260
57
Programmed dead-time (DT) for
products with 20–700 ns DT range
DT
ns
RDT = 15 kΩ
RDT = 100 kΩ
CL = 200 pF
CL = 200 pF
60
95
130
770
16
450
4
610
10.5
13.3
—
Rise time
Fall time
tR
tF
ns
ns
ns
5.5
—
18
Shutdown Time from
Enable False
tSD
60
Restart Time from
Enable True
tRESTART
—
—
60
ns
Device Startup Time
tSTART
—
16
30
µs
Common Mode Transient
Immunity
See Figure 4.3 Com-
mon Mode Transient
Immunity Test Circuit
on page 24.
200
350
400
kV/µs
Si827x with de-glitch option
VCM = 1500 V
Common Mode Transient
Immunity
See Figure 4.3 Com-
mon Mode Transient
Immunity Test Circuit
on page 24.
150
300
400
kV/µs
Si827x with low jitter option
VCM = 1500 V
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Rev. 1.01 | 22
Si827x Data Sheet
Electrical Specifications
4.1 Test Circuits
The figures below depict sink current, source current, and common-mode transient immunity test circuits.
VDDA = VDDB = 15 V
VDDI
VDD
10
IN
OUT
Si827x
INPUT
SCHOTTKY
+
_
8 V
GND
100 µF
1 µF
1 µF
CER
10 µF
EL
Measure
50 ns
RSNS
0.1
VDDI
GND
200 ns
INPUT WAVEFORM
Figure 4.1. IOL Sink Current Test Circuit
VDDA = VDDB = 15 V
VDDI
VDD
10
IN
OUT
Si827x
INPUT
SCHOTTKY
1 µF
+
_
5.5 V
GND
100 µF
1 µF
CER
10 µF
EL
Measure
RSNS
0.1
50 ns
VDDI
GND
200 ns
INPUT WAVEFORM
Figure 4.2. IOH Source Current Test Circuit
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Rev. 1.01 | 23
Si827x Data Sheet
Electrical Specifications
12 V
Supply
Si827x
VDDI
VDDA
Input Signal
Switch
INPUT
EN
VOA
GNDA
VDDB
VOB
5V
Isolated
Supply
DT
Oscilloscope
100k
GNDI
GNDB
Isolated
Ground
High Voltage
Differential
Probe
Output
Input
Vcm Surge
Output
High Voltage
Surge Generator
Figure 4.3. Common Mode Transient Immunity Test Circuit
4.2 Regulatory Information (Pending)
Table 4.2. Regulatory Information1,2
CSA
The Si827x is certified under CSA Component Acceptance Notice 5A. For more details, see Master Contract Number 232873.
60950-1: Up to 125 VRMS reinforced insulation working voltage; up to 600 VRMS basic insulation working voltage.
VDE
The Si827x is certified according to VDE 0884-10. For more details, see Certificate 40018443.
VDE 0884-10: Up to 630 Vpeak for basic insulation working voltage.
UL
The Si827x is certified under UL1577 component recognition program. For more details, see File E257455.
Rated up to 2500 VRMS isolation voltage for basic protection.
CQC
The Si827x is certified under GB4943.1-2011. For more details, see Certificates CQC 16001160284 and CQC 17001177887.
Rated up to 125 VRMS reinforced insulation working voltage; up to 600 VRMS basic insulation working voltage.
1. Regulatory Certifications apply to 2.5 kVRMS rated devices which are production tested to 3.0 kVRMS for 1 sec.
2. For more information, see 1. Ordering Guide.
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Rev. 1.01 | 24
Si827x Data Sheet
Electrical Specifications
Table 4.3. Insulation and Safety-Related Specifications
Parameter
Symbol
CLR
Test Condition
Value
NB SOIC-16
4.7
Unit
SOIC-8
14 LD QFN
Nominal External Air Gap
(Clearance)
4.7
3.5
mm
mm
mm
Nominal External Tracking
(Creepage)
CPG
DTI
3.9
3.9
3.5
Minimum Internal Gap
(Internal Clearance)
Tracking Resistance
Erosion Depth
0.008
0.008
0.008
PTI or CTI
ED
IEC60112
f = 1 MHz
600
600
600
V
mm
Ω
0.019
0.019
0.021
1012
0.5
1012
0.5
1012
0.5
Resistance
RIO
(Input-Output)1
Capacitance
CIO
pF
pF
(Input-Output)1
Input Capacitance2
CI
3.0
3.0
3.0
Notes:
1. To determine resistance and capacitance, the Si827x is converted into a 2-terminal device. All pins on side 1 are shorted to cre-
ate terminal 1, and all pins on side 2 are shorted to create terminal 2. The parameters are then measured between these two
terminals.
2. Measured from input pin to ground.
Table 4.4. IEC 60664-1 Ratings
Parameter
Test Condition
Specification
SOIC-8
I
NB SOIC-16
14 LD QFN
Basic Isolation Group
Material Group
I
I
Installation Classification
Rated Mains Voltages < 150 VRMS
Rated Mains Voltages < 300 VRMS
Rated Mains Voltages < 400 VRMS
Rated Mains Voltages < 600 VRMS
I-IV
I-III
I-II
I-IV
I-III
I-II
I-II
I-IV
I-III
I-II
I-II
I-II
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Rev. 1.01 | 25
Si827x Data Sheet
Electrical Specifications
Table 4.5. VDE 0884 Insulation Characteristics1
Parameter
Symbol
VIORM
VPR
Test Condition
Characteristic
Unit
Maximum Working Insulation Voltage
Input to Output Test Voltage
630
V peak
V peak
Method b1
1181
(VIORM x 1.875 = VPR, 100%
Production Test, tm = 1 sec,
Partial Discharge < 5 pC)
Transient Overvoltage
Surge Voltage
VIOTM
VIOSM
t = 60 sec
4000
3077
V peak
Vpeak
Tested per IEC 60065 with surge
voltage of 1.2 µs/50 µs
Tested with 4000 V
Pollution Degree
(DIN VDE 0110, Table 1)
Insulation Resistance at
TS, VIO = 500 V
2
>109
RS
Ω
Note:
1. Maintenance of the safety data is ensured by protective circuits. The Si827x provides a climate classification of 40/125/21.
Table 4.6. IEC Safety Limiting Values1
Parameter
Symbol
Test Condition
SOIC-8
NB SOIC-16 14 LD QFN
Unit
Safety
TS
150
150
150
°C
Temperature
Safety Input Current
ΙS
θJA = 110 °C/W
35
40
40
mA
(SOIC-8),
105 °C/W
(NB SOIC-16, 14 LD QFN),
VDDI = 5.5 V,
VDDA = VDDB = 30 V,
TJ = 150 °C,
TA = 25 °C
Device Power Dissipation
PD
1.1
1.2
1.2
W
Note:
1. Maximum value allowed in the event of a failure. Refer to the thermal derating curve in the two figures below.
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Rev. 1.01 | 26
Si827x Data Sheet
Electrical Specifications
Table 4.7. Thermal Characteristics
Parameter
Symbol
SOIC-8
NB
14 LD QFN
Unit
SOIC-16
IC Junction-to-Air
Thermal Resistance
θJA
110
105
105
°C/W
60
50
40
30
20
10
0
VDDI = 5.5 V
VDDA, VDDB = 30 V
0
50
100
Temperature (ºC)
150
200
Figure 4.4. NB SOIC-16, QFN-14 Thermal Derating Curve, Dependence of Safety Limiting Values Limiting Values per VDE
60
50
VDDI = 5.5 V
VDDA, VDDB = 30 V
40
30
20
10
0
0
60
100
140
200
Temperature (ºC)
Figure 4.5. NB SOIC-8 Thermal Derating Curve, Dependence of Safety Limiting Values
Limiting Values per VDE
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Rev. 1.01 | 27
Si827x Data Sheet
Electrical Specifications
Table 4.8. Absolute Maximum Ratings1
Parameter
Symbol
Min
–65
–40
—
Max
+150
+125
+150
6.0
Units
°C
°C
°C
V
Storage Temperature
Operating Temperature
Junction Temperature
TSTG
TA
TJ
Input-side supply voltage
Driver-side supply voltage
VDDI
–0.6
–0.6
–0.5
VDDA, VDDB
VIO
36
V
Voltage on any pin with respect to ground2
VDD + 0.5
V
Peak Output Current (tPW = 10 µs, duty cycle = 0.2%)
IOPK
—
—
—
—
—
4.0
260
A
°C
Lead Solder Temperature (10 s)
HBM Rating ESD
3.5
kV
CDM
2000
3000
V
Maximum Isolation Voltage (Input to Output) (1 sec)
VRMS
NB SOIC-16 and SOIC-8
Maximum Isolation Voltage (Input to Output) (1 sec)
—
—
—
—
3000
1500
650
VRMS
VRMS
VRMS
kV/μs
QFN-14
Maximum Isolation Voltage (Output to Output) (1 sec)
NB SOIC-16
Maximum Isolation Voltage (Output to Output) (1 sec)
QFN-14
Latch-up Immunity
Note:
400
1. Permanent device damage may occur if the absolute maximum ratings are exceeded. Functional operation should be restricted to
the conditions specified in the operational sections of this data sheet.
2. The voltage on VO+ or the voltages on VOA/VOB with respect to ground are allowed to be -1.0V (min) for 200 ns
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Si827x Data Sheet
Pin Descriptions
5. Pin Descriptions
5.1 Si8271 Pin Descriptions
VDD
VO+
VO-
VI
1
2
3
4
8
7
6
5
VDDI
Si8271
GNDI
EN
GND
Figure 5.1. Pin Assignments Si8271
Table 5.1. Si8271 Pin Descriptions
Pin
1
Name
VI
Description
Digital driver control signal
Input side power supply
Input side ground
2
VDDI
GNDI
EN
3
4
Enable
5
GND
VO–
VO+
VDD
Driver side ground
Gate drive pull low
Gate drive pull high
Driver side power supply
6
7
8
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Si827x Data Sheet
Pin Descriptions
5.2 Si8273/75 Pin Descriptions
VDDA
VOA
GNDA
NC
VIA
1
2
3
4
5
16
15
14
13
12
VIB
VDDA
VOA
GNDA
NC
1
2
3
4
5
14
13
12
VDDI
VIA
VIB
GNDI
EN
Si8273
Si8275
Si8273
Si8275
11 NC
GNDI
EN
10 VDDB
NC
NC
6
7
9
8
VOB
GNDB
NC
NC
6
7
8
11
10
9
VDDB
VOB
VDDI
GNDB
VDDI
Figure 5.2. Pin Assignments Si8273/5
Table 5.2. Si8273/5 Pin Descriptions
NB SOIC-16 Pin #
QFN-14 Pin #
Name
VIA
Description
1
2
Digital driver control signal for “A” driver
Digital driver control signal for “B” driver
Input side power supply
2
3
VIB
3,8
7
VDDI
GNDI
EN
4
4
Input side ground
5
5
1, 6, 11
8
Enable
6, 7, 12, 13
NC
No Connect
9
GNDB
VOB
VDDB
GNDA
VOA
VDDA
Driver side power supply for “B” driver
Gate drive output for “B” driver
Driver side power supply for “B” driver
Driver side power supply for “A” driver
Gate drive output for “A” driver
Driver side power supply for “A” driver
10
11
14
15
16
9
10
12
13
14
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Si827x Data Sheet
Pin Descriptions
5.3 Si8274 Pin Descriptions
VDDA
VOA
GNDA
NC
PWM
1
2
3
4
5
16
15
14
13
12
NC
VDDA
VOA
GNDA
NC
1
2
3
4
5
14
13
12
VDDI
PWM
NC
GNDI
EN
11 NC
GNDI
EN
Si8274
Si8274
10 VDDB
NC
DT
6
7
9
8
VOB
GNDB
DT
NC
6
7
8
11
10
9
VDDB
VOB
VDDI
GNDB
VDDI
Figure 5.3. Pin Assignments Si8274
Table 5.3. Si8274 Pin Descriptions
NB SOIC-16 Pin #
QFN-14 Pin #
Name
Description
1
2
PWM
NC
Pulse width modulated driver control signal
No Connect
2, 7, 12, 13
1, 3, 11
3, 8
4
7
4
VDDI
GNDI
EN
Input side power supply
Input side ground
5
5
Enable
6
6
DT
Dead time control
9
8
GNDB
VOB
VDDB
GNDA
VOA
VDDA
Driver side power supply for “B” driver
Gate drive output for “B” driver
Driver side power supply for “B” driver
Driver side power supply for “A” driver
Gate drive output for “A” driver
Driver side power supply for “A” driver
10
11
14
15
16
9
10
12
13
14
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Si827x Data Sheet
Package Outlines
6. Package Outlines
6.1 Package Outline: 16-Pin Narrow-Body SOIC
The figure below illustrates the package details for the Si827x in a 16-pin narrow-body SOIC (SO-16). The table below lists the values
for the dimensions shown in the illustration.
Figure 6.1. 16-pin Small Outline Integrated Circuit (SOIC) Package
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Si827x Data Sheet
Package Outlines
Table 6.1. Package Diagram Dimensions
Dimension
Min
—
Max
1.75
0.25
—
Dimension
Min
Max
A
A1
A2
b
L
0.40
1.27
0.10
1.25
0.31
0.17
L2
0.25 BSC
h
0.25
0°
0.50
8°
0.51
0.25
θ
c
aaa
bbb
ccc
ddd
0.10
0.20
0.10
0.25
D
9.90 BSC
6.00 BSC
3.90 BSC
1.27 BSC
E
E1
e
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. Dimensioning and Tolerancing per ANSI Y14.5M-1994.
3. This drawing conforms to the JEDEC Solid State Outline MS-012, Variation AC.
4. Recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components.
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Si827x Data Sheet
Package Outlines
6.2 Package Outline: 8-Pin Narrow Body SOIC
The figure below illustrates the package details for the Si827x in an 8-pin narrow-body SOIC package. The table below lists the values
for the dimensions shown in the illustration.
Figure 6.2. 8-Pin Narrow Body SOIC Package
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Si827x Data Sheet
Package Outlines
Table 6.2. 8-Pin Narrow Body SOIC Package Diagram Dimensions
Symbol
Millimeters
Min
1.35
Max
1.75
0.25
A
A1
A2
B
0.10
1.40 REF
0.33
1.55 REF
0.51
C
D
E
0.19
0.25
4.80
5.00
3.80
4.00
e
1.27 BSC
H
h
5.80
6.20
0.50
1.27
8°
0.25
L
0.40
0°
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Si827x Data Sheet
Package Outlines
6.3 Package Outline: 14 LD QFN
The figure below illustrates the package details for the Si827x in an QFN outline. The table below lists the values for the dimensions
shown in the illustration.
Figure 6.3. Si827x 14-pin LD QFN Outline
Table 6.3. Package Diagram Dimensions
Dimension
MIN
0.74
0
NOM
0.84
MAX
0.90
0.05
0.35
A
A1
b
0.025
0.25
0.30
D
5.00 BSC
0.65 BSC
5.00 BSC
3.60 BSC
0.60
e
E
E1
L
0.50
—
0.70
—
L1 (3)
ccc
ddd
0.10 BSC
—
—
0.08
0.10
—
—
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. Dimensioning and Tolerancing per ANSI Y14.5M-1994.
3. L1 shall not be less than 0.01 mm.
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Si827x Data Sheet
Land Patterns
7. Land Patterns
7.1 Land Pattern: 16-Pin Narrow Body SOIC
The figure below illustrates the recommended land pattern details for the Si827x in a 16-pin narrow-body SOIC. The table below lists
the values for the dimensions shown in the illustration.
Figure 7.1. 16-Pin Narrow Body SOIC PCB Land Pattern
Table 7.1. 16-Pin Narrow Body SOIC Land Pattern Dimensions
Dimension
Feature
Pad Column Spacing
Pad Row Pitch
Pad Width
(mm)
5.40
1.27
0.60
1.55
C1
E
X1
Y1
Pad Length
Notes:
1. This Land Pattern Design is based on IPC-7351 pattern SOIC127P600X165-16N for Density Level B (Median Land Protrusion).
2. All feature sizes shown are at Maximum Material Condition (MMC) and a card fabrication tolerance of 0.05 mm is assumed.
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Si827x Data Sheet
Land Patterns
7.2 Land Pattern: 8-Pin Narrow Body SOIC
The figure below illustrates the recommended land pattern details for the Si827x in an 8-pin narrow-body SOIC. The table below lists
the values for the dimensions shown in the illustration.
Figure 7.2. 8-Pin Narrow Body SOIC Land Pattern
Table 7.2. 8-Pin Narrow Body SOIC Land Pattern Dimensions
Dimension
Feature
(mm)
5.40
1.27
0.60
1.55
C1
Pad Column Spacing
Pad Row Pitch
Pad Width
E
X1
Y1
Pad Length
Notes:
1. This Land Pattern Design is based on IPC-7351 pattern SOIC127P600X173-8N for Density Level B (Median Land Protrusion).
2. All feature sizes shown are at Maximum Material Condition (MMC) and a card fabrication tolerance of 0.05 mm is assumed.
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Si827x Data Sheet
Land Patterns
7.3 Land Pattern: 14 LD QFN
The figure below illustrates the recommended land pattern details for the Si827x in a 14-pin QFN. The table below lists the values for
the dimensions shown in the illustration.
Figure 7.3. 14-Pin QFN Land Pattern
Table 7.3. 14-Pin QFN Land Pattern Dimensions
Dimension
(mm)
4.20
0.65
0.80
0.40
C1
E
X1
Y1
Notes:
1. All dimensions shown are in millimeters (mm).
2. This Land Pattern Design is based on the IPC-7351 guidelines.
3. All dimensions shown are at Maximum Material Condition (MMC). Least Material Condition (LMC) is calculated based on a Fabri-
cation Allowance of 0.05 mm.
4. All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder mask and the metal pad is to be 60 µm
minimum, all the way around the pad.
5. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure good solder paste release.
6. The stencil thickness should be 0.125 mm (5 mils).
7. The ratio of stencil aperture to land pad size should be 1:1.
8. A No-Clean, Type-3 solder paste is recommended.
9. The recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components.
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Si827x Data Sheet
Top Markings
8. Top Markings
8.1 Si827x Top Marking (16-Pin Narrow Body SOIC)
Table 8.1. Top Marking Explanation (16-Pin Narrow Body SOIC)
Line 1 Marking:
Base Part Number
Ordering Options
Si827 = ISOdriver product series
Y = Configuration
3 = High-side/Low-side (HS/LS)
4 = PWM HS/LS
5 = Dual driver
See 1. Ordering Guide for
more information.
U = UVLO level
G = 3 V
A = 5 V
B = 8 V
D = 12 V
V = Isolation rating
B = 2.5 kV
W = Dead-time setting range
1= 10-200 ns
4 = 20-700 ns
X = Integrated de-glitch circuit
D = integrated
none = not included
Line 2 Marking:
YY = Year
Assigned by the Assembly House. Corresponds to the year and workweek
of the mold date.
WW = Workweek
TTTTTT = Mfg Code
Manufacturing Code from Assembly Purchase Order form.
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Si827x Data Sheet
Top Markings
8.2 Si8271 Top Marking (8-Pin Narrow Body SOIC)
Table 8.2. Top Marking Explanation (Narrow Body SOIC)
Line 1 Marking:
Customer Part Number
Si827 = ISOdriver product series
Y = Configuration
1 = Single driver
U = UVLO level
G = 3 V
A = 5 V
B = 8 V
D = 12 V
V = Isolation rating
B = 2.5 kV
Line 2 Marking:
WX = Ordering options
W = Dead-time setting range
1= 10-200 ns
4 = 20-700 ns
X = Integrated de-glitch circuit
D = integrated
none = not included
YY = Year
Assigned by the Assembly House. Corresponds to the year and workweek
of the mold date.
WW = Work week
TTTTTT = Mfg code
Line 3 Marking:
Manufacturing Code from Assembly Purchase Order form.
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Si827x Data Sheet
Top Markings
8.3 Si827x Top Marking (14 LD QFN)
Table 8.3. Top Marking Explanation (14 LD QFN)
Line 1 Marking:
Base Part Number
Ordering Options
Si827 = ISOdriver product series
Y = configuration
1 = single driver
3 = High-side/Low-side (HS/LS)
4 = PWM HS/LS
5 = Dual driver
See 1. Ordering Guide for
more information.
Line 2 Marking:
Ordering Options
U = UVLO level
G = 3 V
A = 5 V
B = 8 V
D = 12 V
V = Isolation rating
B = 2.5 kV
W = Dead-time setting range
1= 10-200 ns
4 = 20-700 ns
X = Integrated de-glitch circuit
D = integrated
none = not included
Manufacturing Code from Assembly.
Pin 1 identifier.
Line 3 Marking:
Line 4 Marking:
TTTTTT = Mfg code
Circle = 1.5 mm diameter
YYWW
Manufacturing date code.
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Rev. 1.01 | 42
Si827x Data Sheet
Revision History
9. Revision History
Revision 1.01
April 2019
• Added Si8271AB-AS and Si8274BB4D-AS1 to Table 1.2 Ordering Guide for Automotive Grade OPNs on page 4.
Revision 1.0
May, 2018
• Replaced references and descriptions of LGA package with QFN package throughout the data sheet.
• Updated OPNs with LGA package denoted by -IM suffix to QFN packages denoted by -IM1 suffix in the Ordering Guide.
• Added Si8274DB1-AS1 OPN to Table 1.2 Ordering Guide for Automotive Grade OPNs on page 4.
• Added Note 6 to Table 1.2 Ordering Guide for Automotive Grade OPNs on page 4 referring to Top Markings for Automotive Grade
parts.
• Updated Equation 3 and the chart generated by Equation 3 in Figure 2.17 Max Load vs. Switching Frequency on page 14.
• Corrected power dissipation example calculations in Power Dissipation Considerations.
• Updated Package Outline: 14 LD QFN with new QFN package outline drawing and updated Table 6.3 Package Diagram Dimen-
sions on page 36 with QFN package dimensions.
• Updated Table 4.2 Regulatory Information on page 24 with certification information.
• Updated Table 4.3 Insulation and Safety-Related Specifications on page 25 symbols and clarified parameters.
• Added Surge Voltage specification to Table 4.5 VDE 0884 Insulation Characteristics on page 26.
• Updated description of Figure 4.4 NB SOIC-16, QFN-14 Thermal Derating Curve on page 27 and Figure 4.5 NB SOIC-8 Thermal
Derating Curve on page 27.
Revision 0.6
December, 2017
• Updated Figure 2.12 Rise/Fall Time vs. Load on page 10.
• Updated Table 4.1 Electrical Characteristics on page 20.
• Added "(no load)" under IDDx specification test condition.
• Added tSD and tRESTART specs.
Corrected storage temp and power dissipation for SOIC-8 package in Table 4.6 IEC Safety Limiting Values1 on page 26.
Added footnote about VO+ and VOA/VOB voltages with respect to ground in Table 4.8 Absolute Maximum Ratings1 on page 28 with
improvement from other pins.
•
•
• Added new table to Ordering Guide for Automotive-Grade OPN options.
Revision 0.5
February 26, 2016
• Initial release.
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Rev. 1.01 | 43
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