PR36MF12NIPF [SHARP]
Trigger Output SSR, 1-Channel, 4000V Isolation, LEAD FREE, PLASTIC, SMT, DIP-8;
| 型号： | PR36MF12NIPF |
| 厂家： | 
SHARP ELECTRIONIC COMPONENTS |
| 描述： | Trigger Output SSR, 1-Channel, 4000V Isolation, LEAD FREE, PLASTIC, SMT, DIP-8 输出元件 光电 |
| 文件： | 总15页 (文件大小：790K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
PR26MF1xNSZ Series
PR36MF1xNSZ Series
IT(rms)≤0.6A, Non-Zero Cross type
DIP 8pin
Triac output SSR
PR26MF1xNSZ Series
PR36MF1xNSZ Series
∗Zero cross type is also available. (PR26MF21NSZ Series/
PR36MF2xNSZ Series)
■ Description
■ Agency approvals/Compliance
1. Recognized by UL508, file No. E94758 (as model No.
R26MF1/R36MF1)
2. Approved by CSA 22.2 No.14, file No. LR63705 (as
model No. R26MF1/R36MF1)
3. Optionary available VDE approved (∗)
(DIN EN 60747-5-
PR26MF1xNSZ Series and PR36MF1xNSZ Series
Solid State Relays (SSR) are an integration of an
infrared emitting diode (IRED), a Phototriac Detector
and a main output Triac. These devices are ideally
suited for controlling high voltage AC loads with solid
state reliability while providing 4.0kV isolation
(Viso(rms)) from input to output.
2), file No. 40008898 (only for PR36MF1xNSZ Series
as model No. R36MF1)
4. Package resin : UL flammability grade (94V-0)
(∗)
DIN EN60747-5-2 : successor standard of DIN VDE0884.
■ Features
1. Output current, IT(rms)≤0.6A
2. Non-zero crossing functionary
Up to Date code "RD" (December 2003), approval of DIN
VDE0884.
From Date code "S1" (January 2004), approval of DIN
EN60747-5-2.
3. 8 pin DIP package (SMT gullwing also available)
4. High repetitive peak off-state voltage
(VDRM : 600V, PR36MF1xNSZ Series)
(VDRM : 400V, PR26MF1xNSZ Series)
5. IFT ranks available (see Model Line-up in this
datasheet)
6. Superior noise immunity (dV/dt : MIN. 100V/µs)
7. Response time, ton : MAX. 100µs
8. High isolation voltage between input and output
(Viso(rms) : 4.0kV)
■ Applications
1. Isolated interface between high voltage AC devices
and lower voltage DC control circuitry.
2. Switching motors, fans, heaters, solenoids, and
valves.
3. Phase or power control in applications such as
lighting and temperature control equipment.
Notice The content of data sheet is subject to change without prior notice.
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP
devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
Sheet No.: D4-A00401FEN
1
Date Mar. 31. 2004
© SHARP Corporation
PR26MF1xNSZ Series
PR36MF1xNSZ Series
■ Internal Connection Diagram
5
8
6
1
2
3
4
5
6
8
Cathode
Anode
Cathode
Cathode
Gate
Output (T1)
Output (T2)
1
2
3
4
(Unit : mm)
■ Outline Dimensions
1. Through-Hole [ex. PR26MF11NSZF]
2. SMT Gullwing Lead-Form [ex. PR26MF11NIPF]
1.2±0.3
1.2±0.3
1.05±0.2
1.05±0.2
8
6
5
SHARP
mark
"S"
Model No.
SHARP
mark
"S"
Model No.
8
6
5
R 2 6 M F 1
R 2 6 M F 1
Rank mark
Rank mark
CSA mark
CSA mark
1
2
3
4
Date code (2 digit)
Factory identification mark
Anode
mark
1
2
3
4
Date code (2 digit)
Factory identification mark
Anode
mark
9.66±0.5
7.62±0.3
9.66±0.5
7.62±0.3
Epoxy resin
0.26±0.1
Epoxy resin
+0.4
+0.4
1.0
−0
2.54±0.25
−0
2.54±0.25
1.0
0.5±0.1
+0
10.0
−0.5
θ
θ
θ:0 to 13˚
Product mass : approx. 0.56g
Product mass : approx. 0.54g
3. Through-Hole [ex. PR36MF11NSZF]
4. SMT Gullwing Lead-Form [ex. PR36MF11NIPF]
1.2±0.3
1.2±0.3
1.05±0.2
1.05±0.2
8
6
5
SHARP
mark
"S"
Model No.
SHARP
mark
"S"
Model No.
8
6
5
R 3 6 M F 1
R 3 6 M F 1
Rank mark
Rank mark
CSA mark
CSA mark
1
2
3
4
Date code (2 digit)
Anode
mark
1
2
3
4
Factory identification mark
Date code (2 digit)
Anode
mark
Factory identification mark
9.66±0.5
7.62±0.3
9.66±0.5
7.62±0.3
Epoxy resin
0.26±0.1
Epoxy resin
+0.4
+0.4
1.0
−0
2.54±0.25
−0
2.54±0.25
1.0
0.5±0.1
+0
10.0
−0.5
θ
θ
θ:0 to 13˚
Product mass : approx. 0.56g
Product mass : approx. 0.54g
Sheet No.: D4-A00401FEN
2
PR26MF1xNSZ Series
PR36MF1xNSZ Series
(Unit : mm)
■ Outline Dimensions
5. Through-Hole VDE option [ex. PR36MF11YSZF]
6. SMT Gullwing Lead-Form VDE option [ex. PR36MF11YIPF]
1.2±0.3
1.2±0.3
1.05±0.2
1.05±0.2
8
6
5
SHARP
mark
"S"
Model No.
SHARP
mark
"S"
8
6
5
Model No.
R 3 6 M F 1
R 3 6 M F 1
4
4
Rank mark
VDE identification mark
Date code (2 digit)
Factory identification mark
7.62±0.3
Rank mark
VDE identification mark
CSA mark
CSA mark
1
2
3
4
Anode
mark
1
2
3
4
Date code (2 digit)
Factory identification mark
Anode
mark
9.66±0.5
9.66±0.5
7.62±0.3
Epoxy resin
0.26±0.1
Epoxy resin
+0.4
+0.4
2.54±0.25
−0
2.54±0.25
1.0
1.0
−0
0.5±0.1
+0
10.0
−0.5
θ
θ
θ:0 to 13˚
Product mass : approx. 0.56g
Product mass : approx. 0.54g
Sheet No.: D4-A00401FEN
3
PR26MF1xNSZ Series
PR36MF1xNSZ Series
Date code (2 digit)
1st digit
2nd digit
Year of production
Month of production
A.D
2002
2003
2004
2005
2006
2007
2008
2009
2010
2011
2012
Mark
P
Month
Mark
1
A.D.
1990
1991
1992
1993
1994
1995
1996
1997
1998
1999
2000
2001
Mark
A
B
January
February
March
R
2
S
3
C
T
April
4
D
E
U
May
5
V
June
6
F
July
H
J
W
X
7
August
September
October
November
December
8
K
L
A
9
B
O
N
D
M
N
C
·
·
·
·
·
·
repeats in a 20 year cycle
Factory identification mark
Factory identification Mark
Country of origin
no mark
Japan
* This factory marking is for identification purpose only.
Please contact the local SHARP sales representative to see the actural status of the
production.
Rank mark
Please refer to the Model Line-up table.
Sheet No.: D4-A00401FEN
4
PR26MF1xNSZ Series
PR36MF1xNSZ Series
■ Absolute Maximum Ratings
(Ta=25˚C)
Parameter
Symbol Rating
Unit
mA
V
*3
IF
VR
50
6
Forward current
Input
Reverse voltage
*3
*4
IT(rms)
Isurge
0.6
6
A
RMS ON-state current
A
Peak one cycle surge current
Output
PR26MF1xNSZ
PR36MF1xNSZ
400
600
4.0
Repetitive
VDRM
V
peak OFF-state voltage
*1Isolation voltage
Viso(rms)
Topr
kV
˚C
˚C
˚C
−25 to +85
−40 to +125
270 *5
Soldering area
Operating temperature
Tstg
Storage temperature
*2Soldering temperature
Tsol
*1 40 to 60%RH, AC for 1minute, f=60Hz
*2 For 10s
*3 Refer to Fig.1, Fig.2
*4 f=50Hz sine wave
*5 Lead solder plating models: 260˚C
■ Electro-optical Characteristics
(Ta=25˚C)
Parameter
Symbol
Conditions
MIN. TYP. MAX. Unit
−
−
1.2
−
1.4
10
100
3.0
25
−
V
µA
µA
V
VF
IR
IF=20mA
VR=3V
Forward voltage
Input
Reverse current
IDRM
VT
VD=VDRM
IT=0.6A
VD=6V
−
−
Repetitive peak OFF-state current
−
−
ON-state voltage
Output
IH
mA
V/µs
−
−
Holding current
−
dV/dt
VD=1/√2 ·VDRM
Critical rate of rise of OFF-state voltage
100
−
−
−
10
5
Rank 1
IFT
RISO
ton
VD=6V, RL=100Ω
mA
Ω
Minimum trigger current
−
−
Rank 2
Transfer
charac-
teristics
DC500V,40 to 60%RH
Isolation resistance
Turn-on time
5
×
1010 1011
−
VD
=
=
6V, RL
=
=
100Ω, IF
=
20mA
10mA
Rank 1
Rank 2
µs
−
−
100
VD
6V, RL
100Ω, IF
=
Sheet No.: D4-A00401FEN
5
PR26MF1xNSZ Series
PR36MF1xNSZ Series
Model Line-up
Lead Form
Through-Hole
Sleeve
SMT Gullwing
Taping
I [mA]
(VD=6V,
RL=100Ω )
FT
Shipping Package
VDRM
[V]
50pcs/sleeve
1 000pcs/reel
Rank mark
DIN
Approved
Approved
EN60747-5-2
MAX.10
MAX.5
PR36MF11NIPF
PR36MF12NIPF
PR26MF11NIPF
PR26MF12NIPF
PR36MF11NSZF
PR36MF11YSZF
PR36MF12YSZF
PR36MF11YIPF
PR36MF12YIPF
1
2
1
2
600
400
PR36MF12NSZF
PR26MF11NSZF
PR26MF12NSZF
Model No.
MAX.10
MAX.5
Please contact a local SHARP sales representative to see the actual status of the production.
Sheet No.: D4-A00401FEN
6
PR26MF1xNSZ Series
PR36MF1xNSZ Series
Fig.1 Forward Current vs. Ambient
Fig.2 RMS ON-state Current vs.
Temperature
Ambient Temperature
70
0.7
60
50
40
30
20
0.6
0.5
0.4
0.3
0.2
10
0
0.1
0
−25
0
50
100
−25
0
50
100
Ambient temperature Ta (˚C)
Ambient temperature Ta (˚C)
Fig.3-a Forward Current vs.
Forward Voltage (Rank 1)
Fig.3-b Forward Current vs.
Forward Voltage (Rank 2)
25˚C
0˚C
100
100
50
Ta=75˚C
Ta=75˚C
50
50˚C
−25˚C
50˚C
25˚C
0˚C
10
5
10
5
−25˚C
1
1
0.9
0
0.5
1
1.5
2
2.5
3
1
1.1
1.2
1.3
1.4
1.5
Forward voltage VF (V)
Forward voltage VF (V)
Fig.4-a Minimum Trigger Current vs.
Fig.4-b Minimum Trigger Current vs.
Ambient Temperature (Rank 1)
Ambient Temperature (Rank 2)
12
6
VD=6V
VD=6V
RL=100Ω
RL=100Ω
10
5
PR26MF11NSZ
8
4
3
2
6
PR36MF11NSZ
4
2
0
1
0
−40 −20
0
20
40
60
80
100
−30
0
50
100
Ambient temperature Ta (˚C)
Ambient temperature Ta (˚C)
Sheet No.: D4-A00401FEN
7
PR26MF1xNSZ Series
PR36MF1xNSZ Series
Fig.5 ON-state Voltage vs.
Fig.6 Relative Holding Current vs.
Ambient Temperature
Ambient Temperature
1 000
1.6
VD=6V
IT=0.6A
1.5
1.4
1.3
1.2
100
1.1
1
10
−30
−40 −20
0
20
40
60
80 100 120
0
20
40
60
80
100
Ambient temperature Ta (˚C)
Ambient temperature Ta (˚C)
Fig.7 ON-state Current vs. ON-state Voltage
Fig.8-a Turn-on Time vs. Forward Current
(Rank 1)
1.2
1 000
VD=6V
RL=100Ω
Ta=25˚C
IF=20mA
Ta=25˚C
1
0.8
0.6
0.4
100
PR36MF11NSZ
PR26MF11NSZ
10
0.2
0
1
0
0.5
1
1.5
2
10
20
30
40 50
100
ON-state voltage VT (V)
Forward current IF (mA)
Fig.8-b Turn-on Time vs. Forward Current
(Rank 2)
1 000
VD=6V
RL=100Ω
Ta=25˚C
100
10
1
Remarks : Please be aware that all data in the graph
are just for reference.
1
10
100
Forward current IF (mA)
Sheet No.: D4-A00401FEN
8
PR26MF1xNSZ Series
PR36MF1xNSZ Series
■ Design Considerations
● Recommended Operating Conditions
Parameter
Input signal current
at ON state
Symbol
Conditions
MIN.
20
MAX.
25
Unit
mA
mA
V
Rank 1
Rank 2
IF(ON)
−
−
−
10
15
Input
Input signal current at OFF state
IF(OFF)
VOUT(rms)
0
0.1
PR26MF1xNSZ
Load supply voltage
120
240
−
−
PR36MF1xNSZ
Output
Locate snubber circuit between output terminals
IT(rms)×80%(∗) mA
Load supply current
IOUT(rms)
(Cs=0.022µF, Rs=47Ω)
Frequency
f
−
−
50
60
80
Hz
˚C
Operating temperature
(∗) See Fig.2 about derating curve (IT(rms) vs. ambient temperature).
Topr
−20
● Design guide
In order for the SSR to turn off, the triggering current (IF) must be 0.1mA or less.
In phase control applications or where the SSR is being by a pulse signal, please ensure that the pulse width
is a minimum of 1ms.
When the input current (IF) is below 0.1mA, the output Triac will be in the open circuit mode. However, if the
voltage across the Triac, VD, increases faster than rated dV/dt, the Triac may turn on. To avoid this situation,
please incorporate a snubber circuit. Due to the many different types of load that can be driven, we can
merely recommend some circuit values to start with : Cs=0.022µF and Rs=47Ω. The operation of the SSR
and snubber circuit should be tested and if unintentional switching occurs, please adjust the snubber circuit
component values accordingly.
When making the transition from On to Off state, a snubber circuit should be used ensure that sudden drops
in current are not accompanied by large instantaneous changes in voltage across the Triac.
This fast change in voltage is brought about by the phase difference between current and voltage.
Primarily, this is experienced in driving loads which are inductive such as motors and solenods.
Following the procedure outlined above should provide sufficient results.
Any snubber or Varistor used for the above mentioned scenarios should be located as close to the main
output triac as possible.
All pins shall be used by soldering on the board. (Socket and others shall not be used.)
● Degradation
In general, the emission of the IRED used in SSR will degrade over time.
In the case where long term operation and / or constant extreme temperature fluctuations will be applied to
the devices, please allow for a worst case scenario of 50% degradation over 5years.
Therefore in order to maintain proper operation, a design implementing these SSRs should provide at least
twice the minimum required triggering current from initial operation.
Sheet No.: D4-A00401FEN
9
PR26MF1xNSZ Series
PR36MF1xNSZ Series
● Recommended Foot Print (reference)
SMT Gullwing Lead-form
8.2
2.2
(Unit : mm)
● Standard Circuit
R1
2
3
8
6
+VCC
Load
SSR
ZS
D1
AC Line
V1
Tr1
ZS : Surge absorption circuit (Snubber circuit)
✩
For additional design assistance, please review our corresponding Optoelectronic Application Notes.
Sheet No.: D4-A00401FEN
10
PR26MF1xNSZ Series
PR36MF1xNSZ Series
■ Manufacturing Guidelines
● Soldering Method
Reflow Soldering:
Reflow soldering should follow the temperature profile shown below.
Soldering should not exceed the curve of temperature profile and time.
Please don't solder more than twice.
(˚C)
300
Terminal : 260˚C peak
( package surface : 250˚C peak)
200
Reflow
220˚C or more, 60s or less
Preheat
100
150 to 180˚C, 120s or less
0
0
1
2
3
4
(min)
Flow Soldering :
Flow soldering should be completed below 270˚C and within 10s.
Preheating is within the bounds of 100 to 150˚C and 30 to 80s.
Please don't solder more than twice.
Hand soldering
Hand soldering should be completed within 3s when the point of solder iron is below 400˚C.
Please don't solder more than twice.
Other notices
Please test the soldering method in actual condition and make sure the soldering works fine, since the impact
on the junction between the device and PCB varies depending on the tooling and soldering conditions.
Sheet No.: D4-A00401FEN
11
PR26MF1xNSZ Series
PR36MF1xNSZ Series
● Cleaning instructions
Solvent cleaning :
Solvent temperature should be 45˚C or below. Immersion time should be 3minutes or less.
Ultrasonic cleaning :
The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time,
size of PCB and mounting method of the device.
Therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of
mass production.
Recommended solvent materials :
Ethyl alcohol, Methyl alcohol and Isopropyl alcohol.
In case the other type of solvent materials are intended to be used, please make sure they work fine in
actual using conditions since some materials may erode the packaging resin.
● Presence of ODC
This product shall not contain the following materials.
And they are not used in the production process for this device.
Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform)
Specific brominated flame retardants such as the PBBOs and PBBs are not used in this product at all.
Sheet No.: D4-A00401FEN
12
PR26MF1xNSZ Series
PR36MF1xNSZ Series
■ Package specification
● Sleeve package
Through-Hole
Package materials
Sleeve : HIPS (with anti-static material)
Stopper : Styrene-Elastomer
Package method
MAX. 50pcs of products shall be packaged in a sleeve.
Both ends shall be closed by tabbed and tabless stoppers.
The product shall be arranged in the sleeve with its anode mark on the tabless stopper side.
MAX. 20 sleeves in one case.
Sleeve outline dimensions
12.0
6.7
(Unit : mm)
Sheet No.: D4-A00401FEN
13
PR26MF1xNSZ Series
PR36MF1xNSZ Series
● Tape and Reel package
SMT Gullwing
Package materials
Carrier tape : A-PET (with anti-static material)
Cover tape : PET (three layer system)
Reel : PS
Carrier tape structure and Dimensions
F
J
D
E
G
I
K
Dimensions List
(Unit : mm)
A
B
C
D
E
F
G
+0.1
16.0±0.3
7.5±0.1
1.75±0.1
12.0±0.1
2.0±0.1
4.0±0.1
φ1.5
−0
H
I
J
K
10.4±0.1
0.4±0.05
4.2±0.1
10.2±0.1
Reel structure and Dimensions
e
d
g
Dimensions List
(Unit : mm)
a
b
c
d
330
e
23±1.0
17.5±1.5
100±1.0
13±0.5
f
f
g
b
2.0±0.5
2.0±0.5
a
Direction of product insertion
Pull-out direction
[Packing : 1 000pcs/reel]
Sheet No.: D4-A00401FEN
14
PR26MF1xNSZ Series
PR36MF1xNSZ Series
■ Important Notices
· The circuit application examples in this publication are
provided to explain representative applications of
SHARP devices and are not intended to guarantee any
circuit design or license any intellectual property rights.
SHARP takes no responsibility for any problems rela-
ted to any intellectual property right of a third party re-
sulting from the use of SHARP's devices.
with equipment that requires higher reliability such as:
--- Transportation control and safety equipment (i.e.,
aircraft, trains, automobiles, etc.)
--- Traffic signals
--- Gas leakage sensor breakers
--- Alarm equipment
--- Various safety devices, etc.
(iii) SHARP devices shall not be used for or in connec-
tion with equipment that requires an extremely high lev-
el of reliability and safety such as:
--- Space applications
--- Telecommunication equipment [trunk lines]
--- Nuclear power control equipment
--- Medical and other life support equipment (e.g.,
scuba).
· Contact SHARP in order to obtain the latest device
specification sheets before using any SHARP device.
SHARP reserves the right to make changes in the spec-
ifications, characteristics, data, materials, structure,
and other contents described herein at any time without
notice in order to improve design or reliability. Manufac-
turing locations are also subject to change without no-
tice.
· If the SHARP devices listed in this publication fall with-
in the scope of strategic products described in the For-
eign Exchange and Foreign Trade Law of Japan, it is
necessary to obtain approval to export such SHARP de-
vices.
· Observe the following points when using any devices
in this publication. SHARP takes no responsibility for
damage caused by improper use of the devices which
does not meet the conditions and absolute maximum
ratings to be used specified in the relevant specification
sheet nor meet the following conditions:
(i) The devices in this publication are designed for use
in general electronic equipment designs such as:
--- Personal computers
· This publication is the proprietary product of SHARP
and is copyrighted, with all rights reserved. Under the
copyright laws, no part of this publication may be repro-
duced or transmitted in any form or by any means, elec-
tronic or mechanical, for any purpose, in whole or in
part, without the express written permission of SHARP.
Express written permission is also required before any
use of this publication may be made by a third party.
--- Office automation equipment
--- Telecommunication equipment [terminal]
--- Test and measurement equipment
--- Industrial control
--- Audio visual equipment
--- Consumer electronics
· Contact and consult with a SHARP representative if
there are any questions about the contents of this pub-
lication.
(ii) Measures such as fail-safe function and redundant
design should be taken to ensure reliability and safety
when SHARP devices are used for or in connection
Sheet No.: D4-A00401FEN
15
相关型号：
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