PC3Q66QJ000F [SHARP]

Transistor Output Optocoupler, 4-Element, 2500V Isolation, MINI-FLAT, 16 PIN;


型号：	PC3Q66QJ000F
厂家：	SHARP ELECTRIONIC COMPONENTS
描述：	Transistor Output Optocoupler, 4-Element, 2500V Isolation, MINI-FLAT, 16 PIN 输出元件光电
文件：	总5页 (文件大小：63K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

PC3Q66Q

Mini-flat Package, High

Collector-Emitter Voltage

Type Half Pitch Photocoupler

PC3Q66Q

( )

Unit : mm

■ Features

■ Outline Dimensions

1. High collector-emitter voltage

10.3^{± 0.3}

(

)

_CEO: 80V

1.27^{± 0.25}

(

)

2. Half pitch type lead pitch : 1.27mm

Model No.

3. Isolation voltage between input and output

(

)

_iso: 2 500V _rms

Primary

side

mark

4. Applicable to infrared ray reflow

(

)

230˚C for MAX. 30seconds

5. High reliability

0.4 ^{± 0.1}

C0.4

5.3^{± 0.3}

Epoxy resin

■ Applications

1. Programmable controllers

+ 0.4

- 0.2

0.5

+ 0.2

- 0.7

7.0

■ Package Specifications

6 ˚

Model No.

Package specifications

Internal connection diagram

3 5 7

Anode

( )

Taping reel diameter 330mm 1 000pcs.

PC3Q66Q

6 8

Cathode

13 15

Emitter

Collector

(

)

■ Absolute Maximum Ratings

Ta= 25˚C

Parameter

Symbol

I_F

Rating

Unit

Forward current

^*1Peak forward current

I_FM

Input

Reverse voltage

V_R

Power dissipation

Collector-emitter voltage

V _CEO

V _ECO

I_C

Emitter-collector voltage

Output

Collector current

kV _rms

˚C

Collector power dissipation

Total power dissipation

^*2Isolation voltage

P_C

150

170

2.5

P _tot

V _iso

T _opr

T _stg

T _sol

Operating temperature

Storage temperature

^*3Soldering temperature

- 30 to + 100

- 40 to+ 125

260

Soldering area

˚C

*1 Pulse width<=100µs, Duty ratio : 0.001

*2 AC for 1 min., 40 to 60% RH, f= 60Hz

*3 For 10seconds

“ In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that occur in equipment using any of SHARP's devices, shown in catalogs,

data books, etc. Contact SHARP in order to obtain the latest version of the device specification sheets before using any SHARP's device.”

PC3Q66Q

(

)

Ta= 25˚C

■Electro-optical Characteristics

Parameter

Symbol

V_F

Conditions

I_F= 20mA

MIN.

TYP.

MAX.

Unit

Forward current

1.2

1.4

250

100

Input

Reverse current

I_R

V_R= 4V

µ A

Terminal capacitance

Collector dark current

Collector-emitter breakdown voltage

Emitter-collector breakdown voltage

Collector current

C_t

V= 0, f= 1kH _Z

I_CEO

BV_CEO

BV_ECO

I_C

V_CE= 20V, I _F= 0

I_C= 0.1mA, I _F= 0

I_E= 10 µ A, I_F= 0

I_F= 1mA, V _CE= 5V

I_F= 20mA, I _C= 1mA

DC500V 40 to 60% RH

V= 0, f= 1 MH _Z

V_CE= 2V, I _C= 2mA

R_L= 100Ω

Output

Collector-emitter saturation voltage

Isolation resistance

V_CE

(

)

0.1

10¹¹

0.6

0.2

sat

Transfer

charac-

teristics

R_ISO

C_f

5 x 10¹⁰

Ω

Floating capacitance

1.0

µ s

Rise time

Fall time

t_r

Response time

t_f

Fig. 1 Forward Current vs.

Fig. 2 Diode Power Dissipation vs.

Ambient Temperature

100

- 30

5055

100

125

- 30

5055

100

(

)

(

)

Ambient temperature T ˚C

Ambient temperature T _a˚C

Fig. 3 Collector Power Dissipation vs.

Fig. 4 Power Dissipation vs.

Ambient Temperature

200

Ambient Temperature

300

250

200

150

170

150

100

- 30

100

)

125

- 30

)

Ambient temperature T _a˚C

100

(

Ambient temperature T ˚C

PC3Q66Q

Fig. 5 Peak Forward Current vs. Duty Ratio

Fig. 6 Forward Current vs.

Forward Voltage

100

10000

Pulse width <=100µ s

5000

T_a= 25˚C

25˚C

2000

1000

50˚C

0˚C

500

200

100

- 25˚C

75˚C

^{- 3}2

^{- 2}2

^{- 1}2

0.0

0.5

1.0

1.5

2.0

2.5

3.0

(

)

Duty ratio

Forward voltage V _F

Fig. 8 Collector Current vs. Collector

-emitter Voltage

Fig. 7 Current Tranfer Ratio vs.

Forward Current

500

T_a= 25˚C

Pc (max)

_CE= 5V

_F= 30mA

20mA

T_a= 25˚C

400

300

200

10mA

5mA

100

1mA

100

(

)

( )

Collector-emitter voltage V _CEV

Forward current I

Fig. 9 Relative Current Transfer Ratio vs.

Fig.10 Collector-emitter Saturation Voltage vs.

Ambient Temperature

150

0.16

_F= 1mA

_CE= 5V

_F= 20mA

_C= 1mA

0.14

0.12

0.10

0.08

0.06

0.04

100

0.02

0.00

- 30

100

- 30

100

(

)

(

)

Ambient temperature T_a˚C

Ambient temperature T ˚C

PC3Q66Q

Fig.11 Collector Dark Current vs.

Ambient Temperature

Fig.12 Response Time vs. Load Resistance

- 5

1000

500

V_CE= 2V

I_C= 2mA

T_a= 25˚C

V_CE= 20V

- 6

200

100

- 7

t _f

t_r

- 8

t_d

- 9

t_s

- 10

0.5

0.2

0.1

0.01

- 11

0.1

)

Load resistance RL k Ω

- 30

100

(

)

(

Ambient temperature T

˚C

Fig.13 Collector-emitter Saturation Voltage

vs. Forward Current

T_a= 25˚C

_C= 0.5mA

1mA

3mA

5mA

7mA

(

)

Forward current I

Please refer to the chapter “ Precautions for Use ”

●

Application Circuits

NOTICE

●The circuit application examples in this publication are provided to explain representative applications of

SHARP devices and are not intended to guarantee any circuit design or license any intellectual property

rights. SHARP takes no responsibility for any problems related to any intellectual property right of a

third party resulting from the use of SHARP's devices.

●Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.

SHARP reserves the right to make changes in the specifications, characteristics, data, materials,

structure, and other contents described herein at any time without notice in order to improve design or

reliability. Manufacturing locations are also subject to change without notice.

●Observe the following points when using any devices in this publication. SHARP takes no responsibility

for damage caused by improper use of the devices which does not meet the conditions and absolute

maximum ratings to be used specified in the relevant specification sheet nor meet the following

conditions:

(i) The devices in this publication are designed for use in general electronic equipment designs such as:

--- Personal computers

--- Office automation equipment

--- Telecommunication equipment [terminal]

--- Test and measurement equipment

--- Industrial control

--- Audio visual equipment

--- Consumer electronics

(ii)Measures such as fail-safe function and redundant design should be taken to ensure reliability and

safety when SHARP devices are used for or in connection with equipment that requires higher

reliability such as:

--- Transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.)

--- Traffic signals

--- Gas leakage sensor breakers

--- Alarm equipment

--- Various safety devices, etc.

(iii)SHARP devices shall not be used for or in connection with equipment that requires an extremely

high level of reliability and safety such as:

--- Space applications

--- Telecommunication equipment [trunk lines]

--- Nuclear power control equipment

--- Medical and other life support equipment (e.g., scuba).

●Contact a SHARP representative in advance when intending to use SHARP devices for any "specific"

applications other than those recommended by SHARP or when it is unclear which category mentioned

above controls the intended use.

●If the SHARP devices listed in this publication fall within the scope of strategic products described in the

Foreign Exchange and Foreign Trade Control Law of Japan, it is necessary to obtain approval to export

such SHARP devices.

the copyright laws, no part of this publication may be reproduced or transmitted in any form or by any

means, electronic or mechanical, for any purpose, in whole or in part, without the express written

permission of SHARP. Express written permission is also required before any use of this publication

may be made by a third party.

●Contact and consult with a SHARP representative if there are any questions about the contents of this

publication.

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