GP1FMV51TK0F [SHARP]
Fiber Optic Transmitter Square connector Compact (without mounting hole) With shutter; 光端机广场连接紧凑型（不带安装孔）随着快门
| 型号： | GP1FMV51TK0F |
| 厂家： | 
SHARP ELECTRIONIC COMPONENTS |
| 描述： | Fiber Optic Transmitter Square connector Compact (without mounting hole) With shutter |
| 文件： | 总8页 (文件大小：260K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
GP1FMV51TK0F
Fiber Optic Transmitter
Square connector
Compact (without mounting hole)
With shutter
GP1FMV51TK0F
■Description
■Agency approvals/Compliance
1. Compliant with JEITA RC-5720B and CP1201
2. Compliant with RoHS directive (2002/95/EC)
GP1FMV51TK0F has a built-in LED with a
peak light emission wavelength of 660 nm and
the associated drive IC, and the input is TTL
level compatible.
■
Applications
1. AV equipment
■Features
(DVD, CD, MD players etc.)
2. FPD-TV
1. Fiber optic transmitter
(Receiver : GP1FMV51RK0F)
2. Square connector (JEITA RC-5720B)
3. Compact (without mounting hole)
4. With shutter function
5. Supply voltage : 5 V
6. Transfer rate : 13.2 Mb/s
Notice The content of data sheet is subject to change without prior notice.
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP
devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
Sheet No.: E2-A00201EN
Date Dec.01.2006
©SHARP Corporation
1
GP1FMV51TK0F
■Outline Dimensions
(Unit: mm)
[1]
Symbol Description
Material
A
B
C
D
Holder
Shutter
PBT (Color : Black)
PBT (Color : Black)
Fixing pin SPCC (Lead free plating)
Lead pin
Cu Alloy (SnCu plating)
[2]
(Lead root)
(Lead root)
Example of mounting drawing form solder side.
PCB thickness t = 1.6 mm
Internal equivalent circuit
Pin arrangement
Unspecified tolerance ±0.1
*1
Vin
LED
Vcc
Driver IC
GND
*1
Input conditions of Vin terminal are designed to conform to TTL and CMOS.
We recommend that the input fore Vin terminal uses the output of TTL and
high speed CMOS.
[2] Portion marking
Production year
1) The connector joint area complies with the square connector JEITA RC-5720B
2) [1] portion : “S” mark, [2] portion : Model No. and date code shall be indicated.
3) Unspecified tolerance shall be ± 0.3.
4) Since there are other products which has a different fixing pin shape,
please make sure to confirm reference mounting drawing for this device.
5) Dimensions in parenthesis are shown for reference.
(Last digit of production year)
Production month
Jan to Sep: 1 - 9
10 Oct: X
11 Nov: Y
12 Dec: Z
5
1
T
Model Number
Product mass : approx. 2 g
Sheet No.: E2-A00201EN
2
GP1FMV51TK0F
■Absolute Maximum Ratings
Parameter
Supply voltage
Symbol
VCC
Vin
Rating
-0.5 to +7.0
-05. to VCC+0.5
-20 to +70
-30 to +80
260
Unit
V
Remark
Input voltage
V
℃
℃
℃
Topr
Operating temperature
Storage temperature
Tstg
6 s or less/time up to 2 times.
Tsol
Soldering temperature *1
4 s or less/time up to 1 time.
Soldering by hand at each terminal. *2
℃
380
*1 Solder at a position more than 1.6 mm away from the base of the lead terminal. Reflow is not available.
*2 Do not contact top of soldering iron to lead terminal directly.
■Recommended Operating Conditions
Parameter
Supply voltage
Operating transfer rate
Symbol MIN.
TYP.
5.0
-
MAX.
5.25
Unit
V
Remark
VCC
T
4.75
-
13.2
Mb/s NRZ signal duty 50%
■Electro-optical Characteristics
(Ta = 25 °C, VCC = 5 V)
MIN. TYP. MAX. Unit
Parameter
Peak emission wavelength
Output optical power couple into fiber
Supply current
Symbol
λp
Conditions
630
660
690
nm
PC
Measurement method refer to Fig. 1
Measurement method refer to Fig. 2
-21
-18
8
-
-15 dBm
ICC
ViH
ViL
tpLH
tpHL
-
2.0
-
13
-
mA
V
High level input voltage
Low level input voltage
→
-
0.8
180
180
+15
15
V
L
H delay time
L delay time
-
-
ns
ns
ns
ns
→
H
-
-
Measurement method refer to Fig. 3, 4
Δ
tw
Pulse width distortion
Jitter
-15
-
-
Δ
tj
1
Sheet No.: E2-A00201EN
3
GP1FMV51TK0F
■Measurement Method
Fig. 1 Output Optical Power Coupled Into Fiber
Standard fiber optic cable
GP1FMV51TK0F
Device under test
Optical power meter
(Anritsu) ML93B
Vin
Vcc
GND
Vcc
The optical power meter must be
calibrated to 660 nm. (0 dBm = 1 mW)
D
Notes
1. Vcc = 5.0 V (State of operating)
2. To bundle up the standard fiber optic cable, make it into a loop with the diameter D = 10 cm or more.
(The standard fiber optic cable will be specified elsewhere.)
Fig. 2 Input Voltage and Supply Current
Standard fiber optic cable
GP1FMV51TK0F
Optical power meter
Device under test
(Anritsu) ML93B
Vin
Vcc
GND
Vcc
The optical power meter must be
calibrated to 660 nm. (0 dBm = 1 mW)
Icc
Vin
Input conditions and judgment method
No.
1
Input conditions
Judgment method
≤
≤
Vin = 2.0 V or more -21 PC -15 dBm, ICC = 13 mA or less
≤
Vin = 0.8 V or less
PC -36 dBm, ICC = 13 mA or less
2
Notes
Vcc = 5.0 V (State of operating)
Sheet No.: E2-A00201EN
4
GP1FMV51TK0F
Fig. 3 Pulse Response and Jitter
Standard fiber optic cable
Output signal
GP1FMV51TK0F
Device under test
Standard receiver
Vin
Vcc
GND
Icc
Vin
Vcc
Oscilloscope (band width: 1 GHz)
Trigger: CH1
Mode: Storage mode
CH1
CH2
Input
Oscilloscope
1
1
0
0
Input signal
6.6 Mb/s bi-phase PRBS signal
Fig. 4 Input Signal (6.6 Mb/s Bi-phase PRBS Signal)
Input signal
50%
tpLH
tpHL
Standard receiver output
50%
∆tjr
∆tjf
Notes
(1) The wave form write time shall be 4 s. But do not allow the wave form to be distorted by increasing the brightness too much.
(2) VCC = 5.0 V (State of operating)
(3) The probe for the oscilloscope must be more than 1 MΩ and less than 10 pF.
Sheet No.: E2-A00201EN
5
GP1FMV51TK0F
■Design and Production Notes
(1) Stabilization of power supply line
Please put a by-pass capacitor (0.1 μF) close to the device at least within 7 mm of the terminal.
Please also put a 4.7 μF capacitor across the power supply line nearby.
(2) Soldering condition
Solder at the condition within the absolute maximum ratings in this sheet. In case of using flow soldering, please make
sure of the conditions of process at the flow equipment. Also, do not use reflow soldering. In case of soldering by hand,
do not contact top of soldering iron to lead terminal directly. (Solder at a position more than 1.6 mm away from the base
of the lead terminal.)
(3) About getting dirt and dust in the connector coupling portion
In case dirt or dust comes into the connector coupling portion, please use a blower to take it off.
Any rigid rod-like object must not be inserted since into the coupling portion.
The internal device might be damaged, resulting deteriorated characteristics.
(4) Cleaning
Do not immerse for cleaning. The solvent would get into the connector coupling portion resulting deteriorated
characteristics. Should it be necessary to remove the flux, please use one of the following solvents only to be applied with
a brush.
Solvent : Isopropyl alcohol, Methyl alcohol
(5) Ground during assembling
The human body and the soldering iron must be grounded against the static breakdown of the device during assembling.
Please avoid touching the device terminals as much as possible before assembling.
(6) Assembly of the device
Please fix this device with soldering the metal sheet in PCB. And do not lay the PCB pattern or land for wiring where the
metal sheet contacts PCB.
(7) Input signal
This product is designed intentionally based upon the signal transmission which is defined by the digital audio interface
standard ; CP1201. When a signal out of JEITA standard CP-1201 is inputted to this device, there might be a case that this
device can not transmit a signal correctly to receiving unit.
(8) Fixing pin
Since there are other products which has a different fixing pin shape, please make sure to confirm reference mounting
drawing for this device.
(9) Damage to connector coupling portion
Please do not stress the connector coupling portion excessively since there might be a case that the shutter can’t operate
normally.
(10) About getting the flux into connector coupling portion
Please avoid getting a flux into connector coupling portion of this device, because there might be a case that the characteristics
deteriorate the shutter can’t operate normally.
Sheet No.: E2-A00201EN
6
GP1FMV51TK0F
●Presence of ODC etc.
This product shall not contain the following materials.
And they are not used in the production process for this product.
Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform)
Specific brominated flame retardants such as the PBB and PBDE are not used in this product at all.
This product shall not contain the following materials banned in the RoHS Directive (2002/95/EC).
• Lead, Mercury, Cadmium, Hexavalent chromium, Polybrominated biphenyls (PBB),
Polybrominated diphenyl ethers (PBDE).
■Packing Specifications
PRODUCT
TRAY
PRODUCT
Cross
section of tray
PACKING MATERIAL
Tray : Polystyrene
PACKING METHOD
Each tray holds 200 pieces.
Sheet No.: E2-A00201EN
7
GP1FMV51TK0F
■Important Notices
· The circuit application examples in this publication are
provided to explain representative applications of
SHARP devices and are not intended to guarantee any circuit
design or license any intellectual property rights. SHARP
takes no responsibility for any problems related to any
intellectual property right of a third party resulting from the use
of SHARP's devices.
with equipment that requires higher reliability such as:
--- Transportation control and safety equipment (i.e.,
aircraft, trains, automobiles, etc.)
--- Traffic signals
--- Gas leakage sensor breakers
--- Alarm equipment
--- Various safety devices, etc.
(iii) SHARP devices shall not be used for or in
connection with equipment that requires an extremely high
level of reliability and safety such as:
--- Space applications
--- Telecommunication equipment [trunk lines]
--- Nuclear power control equipment
--- Medical and other life support equipment (e.g.,
scuba).
· Contact SHARP in order to obtain the latest device specifi-
cation sheets before using any SHARP device. SHARP
reserves the right to make changes in the specifications,
characteristics, data, materials, structure, and other
contents described herein at any time without notice in
order to improve design or reliability. Manufacturing
locations are also subject to change without notice.
· Observe the following points when using any devices in this
publication. SHARP takes no responsibility for damage
caused by improper use of the devices which does not meet the
conditions and absolute maximum ratings to be used specified
in the relevant specification sheet nor meet the following condi-
tions:
(i) The devices in this publication are designed for use in
general electronic equipment designs such as:
--- Personal computers
· If the SHARP devices listed in this publication fall
within the scope of strategic products described in the
Foreign Exchange and Foreign Trade Law of Japan, it is
necessary to obtain approval to export such SHARP devices.
· This publication is the proprietary product of SHARP and
is copyrighted, with all rights reserved. Under the copy-
right laws, no part of this publication may be repro-
duced or transmitted in any form or by any means,
electronic or mechanical, for any purpose, in whole or in
part, without the express written permission of SHARP.
Express written permission is also required before any use
of this publication may be made by a third party.
--- Office automation equipment
--- Telecommunication equipment [terminal]
--- Test and measurement equipment
--- Industrial control
--- Audio visual equipment
--- Consumer electronics
· Contact and consult with a SHARP representative if there
are any questions about the contents of this publication.
(ii) Measures such as fail-safe function and redundant design
should be taken to ensure reliability and safety when SHARP
devices are used for or in connection
Sheet No.: E2-A00201EN
8
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