XB33 [SGMICRO]
300mA , Low Power, Low Dropout, Linear Regulators; 300mA，低功耗，低压差，线性稳压器
| 型号： | XB33 |
| 厂家： | 
Shengbang Microelectronics Co, Ltd |
| 描述： | 300mA , Low Power, Low Dropout, Linear Regulators |
| 文件： | 总10页 (文件大小：544K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
300mA , Low Power, Low
Dropout, Linear Regulators
SG2011
GENERAL DESCRIPTION
FEATURES
- Ultra-Low Dropout Voltage:
210mV at 300mA output
- Low 80µA No-Load Supply Current
- Low 110µA Operating Supply Current
at 300mA Output
- Thermal-Overload Protection
- Output Current Limit
- Preset Output Voltages (±1.8% Accuracy)
- Output Voltage:
The SG2011 low-power, low-dropout, CMOS linear voltage
regulators operate from a 2.5V to 5.5V input and deliver up
to 300mA. They are perfect choice for low voltage, low
power applications. An ultra low ground current (110µA at
300mA output) makes them attractive for battery operated
power systems. The SG2011 series also offer ultra low
dropout voltage (210mV at 300mA output) to prolong
battery life in portable electronics.
The output voltage is preset to voltages in the range of 1.5V
to 5.0V. Other features include foldback current limit and
thermal shut-down protection.
Available in Fixed Outputs of 1.5V, 1.8V, 2.5V, 2.8V,
3.0V, 3.3V, and 3.6V
SG2011 comes in 3-pin SOT23 and 3-pin SOT89 packages.
PIN CONFIGURATIONS（TOP VIEW）
APPLICATIONS
Cellular Telephones
Digital Cameras
MP3、MP4
USB 2.0
Modems
1
2
GND
OUT
3
IN
PC Cameras
SOT23-3
Hand-Held Instruments
Electronic Dictionarys
Portable/Battery-Powered Equipment
GND
IN
TYPICAL OPERATION CIRCUIT
1
2
3
1
2
3
OUT GND
SOT89-3
IN
GND
IN
OUT
INPUT
OUTPUT
SOT89-3(L-Type)
IN
OUT
CIN
1μF
COUT
1μF
GND
REV. B
SG Microelectronics Co, Ltd
Tel: 86/451/84348461
www.sg-micro.com
ORDERING INFORMATION
SPECIFIED
TEMPERATURE
RANGE
VOUT
(V)
PIN-
PACKAGE
ORDERING
NUMBER
PACKAGE
MARKING
PACKAGE
OPTION
MODEL
SOT23-3
SOT89-3
SOT89-3(L-Type)
SOT23-3
SOT89-3
SOT89-3(L-Type)
SOT23-3
SOT89-3
SOT89-3(L-Type)
SOT23-3
SOT89-3
SOT89-3(L-Type)
SOT23-3
SOT89-3
SOT89-3(L-Type)
SOT23-3
SOT89-3
SOT89-3(L-Type)
SOT23-3
SG2011-1.5XN3/TR
SG2011-1.5XK3/TR
SG2011-1.5XK3L/TR SG2011-1.5XK3L Tape and Reel, 1000
SG2011-1.8XN3/TR
SG2011-1.8XK3/TR
SG2011-1.8XK3L/TR SG2011-1.8XK3L Tape and Reel, 1000
SG2011-2.5XN3/TR
SG2011-2.5XK3/TR
SG2011-2.5XK3L/TR SG2011-2.5XK3L Tape and Reel, 1000
SG2011-2.8XN3/TR
SG2011-2.8XK3/TR
SG2011-2.8XK3L/TR SG2011-2.8XK3L Tape and Reel, 1000
SG2011-3.0XN3/TR
SG2011-3.0XK3/TR
SG2011-3.0XK3L/TR SG2011-3.0XK3L Tape and Reel, 1000
SG2011-3.3XN3/TR
SG2011-3.3XK3/TR
SG2011-3.3XK3L/TR SG2011-3.3XK3L Tape and Reel, 1000
XB15
SG2011-1.5XK3
Tape and Reel, 3000
Tape and Reel, 1000
SG2011-1.5 1.5V
SG2011-1.8 1.8V
SG2011-2.5 2.5V
SG2011-2.8 2.8V
SG2011-3.0 3.0V
SG2011-3.3 3.3V
SG2011-3.6 3.6V
- 40°C to +125°C
- 40°C to +125°C
- 40°C to +125°C
- 40°C to +125°C
- 40°C to +125°C
- 40°C to +125°C
- 40°C to +125°C
XB18
SG2011-1.8XK3
Tape and Reel, 3000
Tape and Reel, 1000
XB25
SG2011-2.5XK3
Tape and Reel, 3000
Tape and Reel, 1000
XB28
SG2011-2.8XK3
Tape and Reel, 3000
Tape and Reel, 1000
XB30
SG2011-3.0XK3
Tape and Reel, 3000
Tape and Reel, 1000
XB33
SG2011-3.3XK3
Tape and Reel, 3000
Tape and Reel, 1000
SG2011-3.6XN3/TR
SG2011-3.6XK3/TR
XB36
SG2011-3.6XK3
Tape and Reel, 3000
Tape and Reel, 1000
SOT89-3
SOT89-3(L-Type)
SG2011-3.6XK3L/TR SG2011-3.6XK3L Tape and Reel, 1000
ABSOLUTE MAXIMUM RATINGS
IN to GND.....................................................................- 0.3V to +6V
Output Short-Circuit Duration............................................Infinite
OUT to GND...................................................- 0.3V to (VIN + 0.3V)
Power Dissipation, PD @ TA = 25℃
SOT23-3 .....................................................................................0.4W
SOT89-3 ................................................................................0.571W
Package Thermal Resistance
SOT89-3, θJA.........................................................................175°C/W
Operating Temperature Range............................- 40°C to +125°C
Junction Temperature...........................................................+150°C
Storage Temperature.............................................- 65°C to +150°C
Lead Temperature (soldering, 10s).......................................260°C
ESD Susceptibility
HBM..........................................................................................7000V
MM..............................................................................................400V
SOT23-3, θJA....................................................................... 250℃/W
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These
are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in
the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for
extended periods may affect device reliability.
PIN DESCRIPTION
NAME
IN
FUNCTION
Regulator Input.
Supply voltage can range from 2.5V to 5.5V.
Ground.
Regulator Output.
GND
OUT
２
SG2011
ELECTRICAL CHARACTERISTICS
(VIN = VOUT (NOMINAL) + 0.5V or 2.5V (whichever is greater), TA = - 40°C to +125°C, unless otherwise noted. Typical values are at TA = + 25°C.)
PARAMETER
Input Voltage
SYMBOL
CONDITIONS
MIN
2.5
TYP
MAX
5.5
UNITS
VIN
V
IOUT = 0.1mA, TA = +25°C
IOUT = 0.1mA to 300mA,
TA = 0°C to +70°C
-1.8
1.8
2.5
2.9
Output Voltage Accuracy
%
IOUT = 0.1mA to 300mA,
TA = - 40°C to +125°C
300
310
Output Current
Current Limit
mA
mA
ILIM
IQ
750
80
No load
140
Ground Pin Current
Dropout Voltage(Note1)
Line Regulation
µA
mV
%/V
IOUT = 300mA
110
0.8
210
IOUT = 1mA
IOUT = 300mA
340
0.15
VIN = 2.5V or (VOUT + 0.1V) to 5.5V,
IOUT = 1mA
ΔVLNR
0.004
Load Regulation
ΔVLDR
IOUT = 0.1mA to 300mA, COUT = 1µF
f = 10Hz to 100KHz, COUT = 10µF
0.0005
120
74
0.002
%/mA
µVRMS
dB
Output Voltage Noise
en
f = 100Hz,
f = 1KHz,
Power Supply Rejection Rate
PSRR
ILOAD = 50mA, COUT = 1µF
54
dB
THERMAL PROTECTION
Thermal Shutdown Temperature
Thermal Shutdown Hysteresis
TSHDN
160
15
℃
℃
ΔTSHDN
Specifications subject to change without notice.
Note 1: The dropout voltage is defined as VIN - VOUT, when VOUT is 100mV below the value of VOUT for VIN = VOUT + 0.5V.
(Only applicable for VOUT = +2.5V to +5.0V)
３
SG2011
TYPICAL OPERATING CHARACTERISTICS
VIN = VOUT (NOMINAL) + 0.5V or 2.5V (whichever is greater), CIN = 1µF, COUT = 1µF, TA = +25℃, unless otherwise noted.
Ground Pin Current vs.Input Voltage
Ground Pin Current vs.Input Voltage
100
80
60
40
20
0
200
150
100
50
I
=50mA
load
I
=50mA
load
No Load
No Load
VOUT =2.5V
VOUT =3.3V
5
0
0
1
2
3
4
Input Voltage(V)
5
6
0
1
2
3
Input Voltage(V)
4
6
Output Voltage vs.Input Voltage
No Load
Ground Pin Current vs.Load Current
6
160
150
140
130
120
110
100
90
5
4
3
2
1
0
VOUT =3.3V
VOUT =3.3V
VOUT =2.5V
VOUT =2.5V
80
70
60
0
50
100
150
Load Current(mA)
200
250
300
0
1
2
3
4
Input Voltage(V)
5
6
Output Voltage vs.Load Current
Output Vlotage vs.Load Current
3.35
3.325
3.3
2.6
2.55
2.5
3.275
3.25
2.45
2.4
VOUT =3.3V
VOUT =2.5V
0
100
Load Current(mA)
200
300
0
100
200
300
Load Current(mA)
４
SG2011
TYPICAL OPERATING CHARACTERISTICS
VIN = VOUT (NOMINAL) + 0.5V or 2.5V (whichever is greater), CIN = 1µF, COUT = 1µF, TA = +25℃, unless otherwise noted.
Line-Transient Response
Load-Transient Response
VIN = VOUT + 0.5V
ILOAD = 0mA to 50mA
CIN = 1
4.5V
3.5V
VIN
3.05V
μF
VOUT
3V
2.95V
ILOAD = 150mA
3.1V
3V
VOUT
2.9V
50mA
0mA
ILOAD
VOUT =3V
VOUT =3V
40µS/div
100µS/div
Power-Supply Rejection Ratio
vs.Frequency
Load-Transient Response Near Dropout
VOUT =3V
80
ILOAD =50mA
70
60
50
40
30
20
10
0
3.05V
3V
VOUT
2.95V
COUT =10μF
50mA
0mA
ILOAD
CIN = 1μF
VIN = VOUT + 0.1V
COUT =1μF
ILOAD = 0mA to 50mA
0.01
0.1
1
10
100
1000
40µS/div
Frequency(kHz)
Current limit vs.Temperature
Region of Stable COUT ESR vs.Load Current
1200
1100
1000
900
800
700
600
500
400
300
100
VOUT =3.3V
C
= 10μF
10
1
OUT
C
= 1μF
OUT
Stable Region
0.1
0.02
0.01
0
50
100
150
200
250
300
-40 -20
0
20 40 60 80 100 120 140
Temperature(℃)
Load Current(mA)
５
SG2011
TYPICAL OPERATING CHARACTERISTICS
VIN = VOUT (NOMINAL) + 0.5V or 2.5V (whichever is greater), CIN = 1µF, COUT = 1µF, TA = +25℃, unless otherwise noted.
Output Voltage vs.Temperature
Output Voltage vs.Temperature
3.4
2.6
ILOAD =300mA
ILOAD =300mA
3.35
3.3
2.55
2.5
3.25
3.2
2.45
2.4
VOUT =3.3V
VOUT =2.5V
-40 -20
0
20 40 60 80 100 120 140
Temperature(℃)
-40 -20
0
20 40 60 80 100 120 140
Temperature(℃)
Ground Pin Current vs.Temperature
Dropout Voltage vs.Load Current
200
360
320
280
240
200
160
120
80
180
160
140
120
100
80
VOUT =3.3V
TA = +125℃
TA = +85℃
TA = +25℃
TA = -40℃
VOUT =2.5V
40
60
ILOAD =300mA
VOUT =2.5V
0
40
0
30 60 90 120 150 180 210 240 270 300
Load Current(mA)
-40 -20
0
20 40 60 80 100 120 140
Temperature(℃)
Start Up
Dropout Voltage vs.Load Current
350
300
250
200
150
100
50
VOUT = 2.5V
ILOAD = 1mA
6
TA = +125℃
TA = +85℃
4
2
0
2
1
0
TA = +25℃
TA = -40℃
VOUT =3.3V
250 300
0
0
50
100
150
200
Load Current(mA)
Time(10µs/div)
６
SG2011
Application Notes
When LDO is used in handheld products, Attention must be paid to voltage spike which would damage
SG2011. In such applications, voltage spike will be generated at changer interface and VBUS pin of USB
interface when changer adapters and USB equipments are hot-inserted. Besides this, handheld products will
be tested on the production line on the condition of no battery. Test Engineer will apply power from the
connector pin which connects with positive pole of the battery. When external power supply is turned on
suddenly, the voltage spike will be generated at the battery connector. The voltage spike will be very high, it
always exceeds the absolute maximum input voltage (6.0V) of LDO. In order to get robust design. Design
Engineer needs to clear up this voltage spike. Zener diode is a cheap and effective solution to eliminate such
voltage spike. For example, BZM55B5V6 is a 5.6V small package Zener diode which can be used to remove
voltage spike in cell phone design. The schematic is shown in below:
Vcc
IN
VOUT
VOUT
Input
SG2011
1uF
C1
C2
4.7uF
BZM55B5V6
GND
７
SG2011
PACKAGE OUTLINE DIMENSIONS
SOT23-3
D
θ
Dimensions
Dimensions
In Inches
0.20
0
b
Symbol In Millimeters
Min
1.050
0.000
1.050
0.300
Max
1.250
0.100
1.150
0.400
Min
0.041
0.000
0.041
0.012
Max
0.049
0.004
0.045
0.016
A
A1
A2
b
c
D
E
E1
e
0.100
2.820
1.500
2.650
0.200
3.020
1.700
2.950
0.004
0.111
0.059
0.104
0.008
0.119
0.067
0.116
e
C
e1
0.950TYP
0.037TYP
e1
L
1.800
0.700REF
2.000
0.071
0.028REF
0.079
L1
θ
0.300
0°
0.600
8°
0.012
0°
0.024
8°
８
SG2011
PACKAGE OUTLINE DIMENSIONS
SOT89-3
D
D1
Dimensions
Dimensions
In Inches
A
Symbol
In Millimeters
Min
1.400
0.320
0.360
0.350
4.400
1.400
2.300
3.940
Max
1.600
0.520
0.560
0.440
4.600
1.800
2.600
4.250
Min
0.055
0.013
0.014
0.014
0.173
0.055
0.091
0.155
Max
0.063
0.020
0.022
0.017
0.181
0.071
0.102
0.167
A
b
b1
c
D
D1
E
E1
e
e
1.500TYP
0.060TYP
b
e1
L
2.900
0.900
3.100
1.100
0.114
0.035
0.122
0.043
c
e1
９
SG2011
REVISION HISTORY
Location
Page
9/05— Data Sheet changed from preliminary to REV. A
12/06— Data Sheet changed from REV. A to REV. B
Changed to ABSOLUTE MAXIMUM RATINGS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Added Application Notes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7
Shengbang Microelectronics Co, Ltd
Unit 3, ChuangYe Plaza
No.5, TaiHu Northern Street, YingBin Road Centralized Industrial Park
Harbin Development Zone
Harbin, HeiLongJiang 150078
P.R. China
Tel.: 86-451-84348461
Fax: 86-451-84308461
www.sg-micro.com
１０
SG2011
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