SGM8956XTDE8G [SGMICRO]

High Precision, Low Power, Rail-to-Rail I/O, CMOS Operational Amplifier;
SGM8956XTDE8G
型号: SGM8956XTDE8G
厂家: Shengbang Microelectronics Co, Ltd    Shengbang Microelectronics Co, Ltd
描述:

High Precision, Low Power, Rail-to-Rail I/O, CMOS Operational Amplifier

文件: 总12页 (文件大小:787K)
中文:  中文翻译
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SGM8956XTDE8G  
High Precision, Low Power, Rail-to-Rail I/O,  
CMOS Operational Amplifier  
GENERAL DESCRIPTION  
FEATURES  
The SGM8956XTDE8G is a dual, low power and high  
precision CMOS operational amplifier, which can  
operate from 1.8V to 5.5V single supply or from ±0.9V  
to ±2.75V dual power supplies, while consuming only  
20μA quiescent current per amplifier. The device  
supports rail-to-rail input and output operation. The  
input common mode voltage range is from (-VS) - 0.1V  
to (+VS) + 0.1V, and the output range is from (-VS) +  
0.014V to (+VS) - 0.014V.  
Low Input Offset Voltage: 50μV (MAX)  
Low Noise: 2μVP-P at 0.1Hz to 10Hz  
Integrated RFI Filter  
Rail-to-Rail Input and Output  
Support Single or Dual Power Supplies:  
1.8V to 5.5V or ±0.9V to ±2.75V  
Quiescent Current: 20μA/Amplifier (TYP)  
-40to +125Operating Temperature Range  
Available in a Green TDFN-2×2-8L Package  
The SGM8956XTDE8G is designed to provide optimal  
performance in low voltage and low power systems. It  
has high impedance inputs and zero-drift 50μV (MAX)  
offset voltage. These specifications make the device  
appropriate for a wide range of applications requiring  
high precision, such as high linearity driver of high  
precision ADC.  
APPLICATIONS  
Industrial Equipment  
Battery-Powered Equipment  
Sensor Signal Conditioning  
The SGM8956XTDE8G is available in a Green  
TDFN-2×2-8L package. It operates over an ambient  
temperature range of -40to +125.  
SG Micro Corp  
OCTOBER 2020 - REV. A. 1  
www.sg-micro.com  
High Precision, Low Power, Rail-to-Rail I/O,  
CMOS Operational Amplifier  
SGM8956XTDE8G  
PACKAGE/ORDERING INFORMATION  
SPECIFIED  
TEMPERATURE  
RANGE  
PACKAGE  
DESCRIPTION  
ORDERING  
NUMBER  
PACKAGE  
MARKING  
PACKING  
OPTION  
MODEL  
8956  
XXXX  
SGM8956XTDE8G  
TDFN-2×2-8L  
SGM8956XTDE8G/TR  
Tape and Reel, 3000  
-40to +125℃  
MARKING INFORMATION  
NOTE: XXXX = Date Code.  
X X X X  
Date Code - Week  
Date Code - Year  
Green (RoHS & HSF): SG Micro Corp defines "Green" to mean Pb-Free (RoHS compatible) and free of halogen substances. If  
you have additional comments or questions, please contact your SGMICRO representative directly.  
ABSOLUTE MAXIMUM RATINGS  
Supply Voltage...................................................................6V  
Failureto observe proper handlingand installation procedures  
can cause damage. ESD damage can range from subtle  
performance degradation tocomplete device failure. Precision  
integrated circuits may be more susceptible to damage  
because even small parametric changes could cause the  
device not to meet the published specifications.  
Input Common Mode Voltage Range  
.................................................... (-VS) - 0.3V to (+VS) + 0.3V  
Junction Temperature .................................................+150℃  
Storage Temperature Range.........................-65to +150℃  
Lead Temperature (Soldering, 10s) ............................+260℃  
ESD Susceptibility  
DISCLAIMER  
HBM.............................................................................4000V  
MM.................................................................................400V  
CDM ............................................................................1000V  
SG Micro Corp reserves the right to make any change in  
circuit design, or specifications without prior notice.  
RECOMMENDED OPERATING CONDITIONS  
Specified Voltage Range ....................................1.8V to 5.5V  
Operating Temperature Range .....................-40to +125℃  
PIN CONFIGURATION  
(TOP VIEW)  
OVERSTRESS CAUTION  
OUTA  
-INA  
+INA  
-VS  
1
2
3
4
8
7
6
5
+VS  
Stresses beyond those listed in Absolute Maximum Ratings  
may cause permanent damage to the device. Exposure to  
absolute maximum rating conditions for extended periods  
may affect reliability. Functional operation of the device at any  
conditions beyond those indicated in the Recommended  
Operating Conditions section is not implied.  
OUTB  
-INB  
+INB  
Exposed  
Pad  
ESD SENSITIVITY CAUTION  
TDFN-2×2-8L  
This integrated circuit can be damaged if ESD protections are  
not considered carefully. SGMICRO recommends that all  
integrated circuits be handled with appropriate precautions.  
NOTE: Exposed pad can be connected to -VS or left floating.  
SG Micro Corp  
www.sg-micro.com  
OCTOBER 2020  
2
High Precision, Low Power, Rail-to-Rail I/O,  
CMOS Operational Amplifier  
SGM8956XTDE8G  
ELECTRICAL CHARACTERISTICS  
(At TA = +25, VS = 1.8V to 5.5V, VCM = +VS/2, VOUT = +VS/2 and RL = 10kΩ to +VS/2, Full = -40to +125, unless otherwise  
noted.)  
PARAMETER  
SYMBOL  
CONDITIONS  
TEMP  
MIN  
TYP  
MAX  
UNITS  
Input Characteristics  
22  
50  
83  
+25  
Full  
Input Offset Voltage  
VOS  
VS = 5V  
μV  
Input Offset Voltage Drift  
Input Bias Current  
ΔVOS/ΔT  
IB  
Full  
0.08  
130  
μV/℃  
pA  
+25℃  
+25℃  
+25℃  
Full  
Input Common Mode Voltage Range  
VCM  
(-VS) - 0.1  
(+VS) + 0.1  
V
89  
85  
95  
94  
100  
121  
Common Mode Rejection Ratio  
Open-Loop Voltage Gain  
CMRR  
(-VS) - 0.1V < VCM < (+VS) + 0.1V  
dB  
dB  
+25℃  
Full  
(-VS) + 0.1V < VOUT < (+VS) - 0.1V,  
RL = 10kΩ  
AOL  
Input Impedance  
Differential  
109  
109  
Ω
Ω
+25℃  
+25℃  
Common Mode  
Output Characteristics  
14  
25  
27  
+25℃  
Full  
Output Voltage Swing from Rail  
Output Short-Circuit Current  
RL = 10kΩ  
mV  
VS = 1.8V  
6
60  
1
+25℃  
+25℃  
+25℃  
ISC  
mA  
kΩ  
VS = 5V  
Open-Loop Output Impedance  
Power Supply  
f = 350kHz, IOUT = 0  
Specified Voltage Range  
VS  
Full  
+25℃  
Full  
1.8  
5.5  
20  
25  
37  
48  
V
4
Power Supply Rejection Ratio  
PSRR  
VS = 1.8V to 5.5V  
μV/V  
20  
+25℃  
Full  
Quiescent Current/Amplifier  
IQ  
IOUT = 0  
VS = 5V  
μA  
μs  
Turn-On Time  
220  
+25℃  
Dynamic Performance  
Gain-Bandwidth Product  
Slew Rate  
GBP  
SR  
CL = 100pF  
G = +1  
350  
kHz  
+25℃  
+25℃  
0.18  
V/μs  
Noise  
Input Voltage Noise  
f = 0.1Hz to 10Hz  
2
μVP-P  
+25℃  
SG Micro Corp  
www.sg-micro.com  
OCTOBER 2020  
3
High Precision, Low Power, Rail-to-Rail I/O,  
CMOS Operational Amplifier  
SGM8956XTDE8G  
TYPICAL PERFORMANCE CHARACTERISTICS  
At TA = +25, VS = 5V and CL = 0pF, unless otherwise noted.  
Common Mode Rejection Ratio vs. Frequency  
VS = 5V  
Power Supply Rejection Ratio vs. Frequency  
VS = 5V  
120  
100  
80  
60  
40  
20  
0
120  
100  
80  
60  
40  
20  
0
PSRR+  
PSRR-  
1
10  
100  
1000  
0.1  
1
10  
100  
1000  
Frequency (kHz)  
Frequency (kHz)  
Output Voltage Swing vs. Output Current  
VS = 1.8V  
Output Voltage Swing vs. Output Current  
VS = 5.5V  
6
2.5  
2
5
4
3
2
1
0
-40  
1.5  
1
+125  
-40℃  
+25℃  
+125℃  
+25℃  
0.5  
0
0
10  
20  
30  
40  
50  
60  
0
2
4
6
8
10  
12  
Output Current (mA)  
Output Current (mA)  
Quiescent Current vs. Temperature  
Settling Time vs. Closed-Loop Gain  
50  
40  
30  
20  
10  
0
120  
100  
80  
60  
40  
20  
0
VS = 1.8V  
VS = 5V  
-50  
-25  
0
25  
50  
75  
100  
125  
1
10  
100  
Gain (dB)  
Temperature ()  
SG Micro Corp  
www.sg-micro.com  
OCTOBER 2020  
4
High Precision, Low Power, Rail-to-Rail I/O,  
CMOS Operational Amplifier  
SGM8956XTDE8G  
TYPICAL PERFORMANCE CHARACTERISTICS (continued)  
At TA = +25, VS = 5V and CL = 0pF, unless otherwise noted.  
Large-Signal Step Response  
Small-Signal Step Response  
G = 1  
RL = 10kΩ  
G = 1  
RL = 10kΩ  
Time (50μs/div)  
Time (5μs/div)  
Positive Over-Voltage Recovery  
Negative Over-Voltage Recovery  
0V  
VIN  
VIN  
0V  
G = -10  
RL = 10kΩ  
0V  
G = -10  
RL = 10kΩ  
VOUT  
VOUT  
0V  
Time (50µs/div)  
Time (50µs/div)  
Small-Signal Overshoot vs. Load Capacitance  
0.1Hz to 10Hz Noise  
30  
25  
20  
15  
10  
5
0
10  
100  
1000  
Time (2s/div)  
Load Capacitance (pF)  
SG Micro Corp  
www.sg-micro.com  
OCTOBER 2020  
5
High Precision, Low Power, Rail-to-Rail I/O,  
CMOS Operational Amplifier  
SGM8956XTDE8G  
TYPICAL PERFORMANCE CHARACTERISTICS (continued)  
At TA = +25, VS = 5V and CL = 0pF, unless otherwise noted.  
Voltage Noise Spectral Density vs. Frequency  
Offset Voltage Production Distribution  
1000  
100  
10  
50  
45  
40  
35  
30  
25  
20  
15  
10  
5
21000 Samples  
1 Production Lot  
VS = 5V  
Continues with no 1/f (flicker) noise.  
1
0
100  
1000  
10000  
Frequency (Hz)  
Offset Voltage (μV)  
SG Micro Corp  
www.sg-micro.com  
OCTOBER 2020  
6
High Precision, Low Power, Rail-to-Rail I/O,  
CMOS Operational Amplifier  
SGM8956XTDE8G  
APPLICATION INFORMATION  
Rail-to-Rail Input  
Driving Capacitive Loads  
When SGM8956XTDE8G works at the power supply  
between 1.8V and 5.5V, the input common mode  
voltage range is from (-VS) - 0.1V to (+VS) + 0.1V. In  
Figure 1, the ESD diodes between the inputs and the  
power supply rails will clamp the input voltage not to  
exceed the rails.  
The SGM8956XTDE8G is unity-gain stable with heavy  
capacitive load. If greater capacitive load must be  
driven in application, the circuit in Figure 3 can be used.  
In this circuit, the IR drop voltage generated by RISO is  
compensated by feedback loop.  
RF  
CF  
+VS  
VP  
+
_
RISO  
VOUT  
_
VN  
CL  
VIN  
+
-VS  
Figure 3. Circuit to Drive Heavy Capacitive Load  
Figure 1. Input Equivalent Circuit  
Power Supply Decoupling and Layout  
Input Current-Limit Protection  
A clean and low noise power supply is very important in  
amplifier circuit design, besides of input signal noise,  
the power supply is one of important source of noise to  
the amplifier through +VS and -VS pins. Power supply  
bypassing is an effective method to clear up the noise  
at power supply, and the low impedance path to ground  
of decoupling capacitor will bypass the noise to GND.  
In application, 10μF ceramic capacitor paralleled with  
0.1μF or 0.01μF ceramic capacitor is used in Figure 4.  
The ceramic capacitors should be placed as close as  
possible to +VS and -VS power supply pins.  
For ESD diode clamping protection, when the current  
flowing through ESD diode exceeds the maximum  
rating value, the ESD diode and amplifier will be  
damaged, so current-limit protection will be added in  
some applications. One resistor is selected to limit the  
current not to exceed the maximum rating value. In  
Figure 2, a series input resistor is used to limit the input  
current to less than 10mA, but the drawback of this  
current-limit resistor is that it contributes thermal noise  
at the amplifier input. If this resistor must be added, its  
value must be selected as small as possible.  
+VS  
+VS  
10μF  
10μF  
+VS  
_
0.1μF  
0.1μF  
IOVERLOAD  
10mA MAX  
VOUT  
_
_
VN  
VP  
VN  
VP  
VIN  
+
VOUT  
VOUT  
+
+
10μF  
Figure 2. Input Current-Limit Protection  
-VS (GND)  
Rail-to-Rail Output  
0.1μF  
The SGM8956XTDE8G supports rail-to-rail output  
operation. In single power supply application, for  
example, when +VS = 5.5V, -VS = GND, 10kΩ load  
resistor is tied from OUT pin to VS/2, the typical output  
swing range is from 0.014V to 5.486V.  
-VS  
Figure 4. Amplifier Power Supply Bypassing  
SG Micro Corp  
www.sg-micro.com  
OCTOBER 2020  
7
 
 
High Precision, Low Power, Rail-to-Rail I/O,  
CMOS Operational Amplifier  
SGM8956XTDE8G  
APPLICATION INFORMATION (continued)  
the input are used to increase the input impedance and  
eliminate drawback of low input impedance in Figure 5.  
Grounding  
In low speed application, one node grounding technique  
is the simplest and most effective method to eliminate  
the noise generated by grounding. In high speed  
application, the general method to eliminate noise is to  
use a complete ground plane technique, and the whole  
ground plane will help distribute heat and reduce EMI  
noise pickup.  
_
R1  
R2  
VN  
+
_
VOUT  
+
VP  
+
Reduce Input-to-Output Coupling  
R3  
To reduce the input-to-output coupling, the input traces  
must be placed as far away from the power supply or  
output traces as possible. The sensitive trace must not  
be placed in parallel with the noisy trace in same layer.  
They must be placed perpendicularly in different layers  
to reduce the crosstalk. These PCB layout techniques  
will help to reduce unwanted positive feedback and  
noise.  
_
R4  
VREF  
Figure 6. High Input Impedance Difference Amplifier  
Active Low-Pass Filter  
The circuit in Figure 7 is a design example of active  
low-pass filter, the DC gain is equal to -R2/R1 and the  
-3dB corner frequency is equal to 1/2πR2C. In this  
design, the filter bandwidth must be less than the  
bandwidth of the amplifier, the resistor values must be  
selected as low as possible to reduce ringing or  
oscillation generated by the parasitic parameters in  
PCB layout.  
Typical Application Circuits  
Difference Amplifier  
The circuit in Figure 5 is a design example of classical  
difference amplifier. If R4/R3 = R2/R1, then VOUT = (VP -  
VN) × R2/R1 + VREF  
.
R2  
C
R1  
_
R2  
VN  
VOUT  
R1  
R3  
_
VIN  
VP  
+
VOUT  
R4  
+
VREF  
R3 = R1 // R2  
Figure 5. Difference Amplifier  
High Input Impedance Difference Amplifier  
The circuit in Figure 6 is a design example of high input  
impedance difference amplifier, the added amplifiers at  
Figure 7. Active Low-Pass Filter  
SG Micro Corp  
www.sg-micro.com  
OCTOBER 2020  
8
 
High Precision, Low Power, Rail-to-Rail I/O,  
CMOS Operational Amplifier  
SGM8956XTDE8G  
REVISION HISTORY  
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.  
OCTOBER 2020 ‒ REV.A to REV.A.1  
Page  
Updated Typical Performance Characteristics section.........................................................................................................................................5  
Changes from Original (MARCH 2018) to REV.A  
Page  
Changed from product preview to production data.............................................................................................................................................All  
SG Micro Corp  
www.sg-micro.com  
OCTOBER 2020  
9
PACKAGE INFORMATION  
PACKAGE OUTLINE DIMENSIONS  
TDFN-2×2-8L  
D
e
N8  
E1  
D1  
L
E
k
N4  
N1  
b
BOTTOM VIEW  
TOP VIEW  
1.20  
0.65  
0.60 1.95  
A
A1  
A2  
SIDE VIEW  
0.24  
0.50  
RECOMMENDED LAND PATTERN (Unit: mm)  
Dimensions  
In Millimeters  
Dimensions  
In Inches  
Symbol  
MIN  
MAX  
0.800  
0.050  
MIN  
0.028  
0.000  
MAX  
0.031  
0.002  
A
A1  
A2  
D
0.700  
0.000  
0.203 REF  
0.008 REF  
1.900  
1.100  
1.900  
0.500  
2.100  
1.300  
2.100  
0.700  
0.075  
0.043  
0.075  
0.020  
0.083  
0.051  
0.083  
0.028  
D1  
E
E1  
k
0.200 MIN  
0.500 TYP  
0.008 MIN  
0.020 TYP  
b
0.180  
0.250  
0.300  
0.450  
0.007  
0.010  
0.012  
0.018  
e
L
SG Micro Corp  
www.sg-micro.com  
TX00056.000  
PACKAGE INFORMATION  
TAPE AND REEL INFORMATION  
REEL DIMENSIONS  
TAPE DIMENSIONS  
P2  
P0  
W
Q2  
Q4  
Q2  
Q4  
Q2  
Q4  
Q1  
Q3  
Q1  
Q3  
Q1  
Q3  
B0  
Reel Diameter  
P1  
A0  
K0  
Reel Width (W1)  
DIRECTION OF FEED  
NOTE: The picture is only for reference. Please make the object as the standard.  
KEY PARAMETER LIST OF TAPE AND REEL  
Reel Width  
Reel  
Diameter  
A0  
B0  
K0  
P0  
P1  
P2  
W
Pin1  
Package Type  
W1  
(mm)  
(mm) (mm) (mm) (mm) (mm) (mm) (mm) Quadrant  
TDFN-2×2-8L  
7″  
9.5  
2.30  
2.30  
1.10  
4.0  
4.0  
2.0  
8.0  
Q1  
SG Micro Corp  
TX10000.000  
www.sg-micro.com  
PACKAGE INFORMATION  
CARTON BOX DIMENSIONS  
NOTE: The picture is only for reference. Please make the object as the standard.  
KEY PARAMETER LIST OF CARTON BOX  
Length  
(mm)  
Width  
(mm)  
Height  
(mm)  
Reel Type  
Pizza/Carton  
7″ (Option)  
7″  
368  
442  
227  
410  
224  
224  
8
18  
SG Micro Corp  
www.sg-micro.com  
TX20000.000  

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