SGM8608-2 [SGMICRO]

11MHz, Rail-to-Rail I/O CMOS Operational Amplifier;
SGM8608-2
型号: SGM8608-2
厂家: Shengbang Microelectronics Co, Ltd    Shengbang Microelectronics Co, Ltd
描述:

11MHz, Rail-to-Rail I/O CMOS Operational Amplifier

文件: 总21页 (文件大小:1386K)
中文:  中文翻译
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SGM8608-2  
11MHz, Rail-to-Rail I/O  
CMOS Operational Amplifier  
GENERAL DESCRIPTION  
FEATURES  
The SGM8608-2 is a low noise, low power operational  
amplifier optimized for low voltage operation. The  
device can operate from 2.1V to 5.5V single supply,  
and consumes only 1.1mA quiescent current per  
amplifier at 5V.  
Input Offset Voltage: 1.7mV (MAX)  
High Gain-Bandwidth Product: 11MHz  
High Slew Rate: 6.6V/μs  
Settling Time to 0.1% with 2V Step: 500ns  
Overload Recovery Time: 0.16μs  
Low Noise: 12nV/ Hz at 10kHz  
The SGM8608-2 features a 1.7mV maximum input  
offset voltage. The minimum input common mode  
voltage is within 0.1V below the negative rail, and the  
output swing is rail-to-rail with heavy loads. It exhibits a  
high gain-bandwidth product of 11MHz and a slew rate  
of 6.6V/μs. These specifications make the operational  
amplifier appropriate for a wide range of applications.  
Rail-to-Rail Input and Output  
Supply Voltage Range: 2.1V to 5.5V  
Input Voltage Range: -0.1V to 5.6V with VS = 5.5V  
Low Power: 1.1mA/Amplifier (TYP)  
-40to +125Operating Temperature Range  
Available in Green SOIC-8, MSOP-8, TSSOP-8 and  
UTDFN-2×2-8BL Packages  
The SGM8608-2 is available in Green SOIC-8, MSOP-8,  
TSSOP-8 and UTDFN-2×2-8BL packages. It is specified  
over the extended industrial temperature range (-40℃  
to +125).  
APPLICATIONS  
Sensors  
Audio  
Active Filters  
A/D Converters  
Communications  
Test Equipment  
Cellular and Cordless Phones  
Laptops and PDAs  
Photodiode Amplification  
Battery-Powered Instrumentation  
SG Micro Corp  
NOVEMBER 2022 – REV. A  
www.sg-micro.com  
11MHz, Rail-to-Rail I/O  
SGM8608-2  
CMOS Operational Amplifier  
PACKAGE/ORDERING INFORMATION  
SPECIFIED  
TEMPERATURE  
RANGE  
PACKAGE  
DESCRIPTION  
ORDERING  
NUMBER  
PACKAGE  
MARKING  
PACKING  
OPTION  
MODEL  
SGM  
86082XS8  
XXXXX  
SGMG3K  
XMS8  
XXXXX  
SGMG3J  
XTS8  
SOIC-8  
SGM8608-2XS8G/TR  
SGM8608-2XMS8G/TR  
SGM8608-2XTS8G/TR  
SGM8608-2XUGD8G/TR  
Tape and Reel, 4000  
Tape and Reel, 4000  
Tape and Reel, 4000  
Tape and Reel, 3000  
-40to +125℃  
-40to +125℃  
-40to +125℃  
-40to +125℃  
MSOP-8  
TSSOP-8  
SGM8608-2  
XXXXX  
MDP  
XXXX  
UTDFN-2×2-8BL  
MARKING INFORMATION  
NOTE: XXXX = Date Code, Trace Code and Vendor Code.  
SOIC-8/MSOP-8/TSSOP-8  
UTDFN-2×2-8BL  
Serial Number  
Y Y Y  
X X X X  
X X X X X  
Vendor Code  
Trace Code  
Vendor Code  
Trace Code  
Date Code - Year  
Date Code - Year  
Green (RoHS & HSF): SG Micro Corp defines "Green" to mean Pb-Free (RoHS compatible) and free of halogen substances. If  
you have additional comments or questions, please contact your SGMICRO representative directly.  
ABSOLUTE MAXIMUM RATINGS  
ESD SENSITIVITY CAUTION  
Supply Voltage, +VS to -VS ................................................6V  
This integrated circuit can be damaged if ESD protections are  
not considered carefully. SGMICRO recommends that all  
integrated circuits be handled with appropriate precautions.  
Failureto observe proper handlingand installation procedures  
can cause damage. ESD damage can range from subtle  
performance degradation tocomplete device failure. Precision  
integrated circuits may be more susceptible to damage  
because even small parametric changes could cause the  
device not to meet the published specifications.  
Input Common Mode Voltage Range  
.................................................... (-VS) - 0.3V to (+VS) + 0.3V  
Junction Temperature.................................................+150℃  
Storage Temperature Range........................-65to +150℃  
Lead Temperature (Soldering, 10s)............................+260℃  
ESD Susceptibility  
HBM.............................................................................8000V  
CDM ............................................................................1000V  
RECOMMENDED OPERATING CONDITIONS  
DISCLAIMER  
SG Micro Corp reserves the right to make any change in  
Operating Temperature Range.....................-40to +125℃  
circuit design, or specifications without prior notice.  
OVERSTRESS CAUTION  
Stresses beyond those listed in Absolute Maximum Ratings  
may cause permanent damage to the device. Exposure to  
absolute maximum rating conditions for extended periods  
may affect reliability. Functional operation of the device at any  
conditions beyond those indicated in the Recommended  
Operating Conditions section is not implied.  
SG Micro Corp  
www.sg-micro.com  
NOVEMBER 2022  
2
11MHz, Rail-to-Rail I/O  
SGM8608-2  
CMOS Operational Amplifier  
PIN CONFIGURATIONS  
(TOP VIEW)  
(TOP VIEW)  
OUTA  
-INA  
+INA  
-VS  
1
2
3
4
8
7
6
5
+VS  
OUTA  
-INA  
+INA  
-VS  
1
2
3
4
8
7
6
5
+VS  
OUTB  
-INB  
+INB  
Exposed  
Pad  
_
OUTB  
-INB  
+INB  
_
+
+
UTDFN-2×2-8BL  
SOIC-8/MSOP-8/TSSOP-8  
NOTE: For the UTDFN-2×2-8BL package, the exposed pad is not internally connected and can be set to ground or left floating.  
SG Micro Corp  
www.sg-micro.com  
NOVEMBER 2022  
3
11MHz, Rail-to-Rail I/O  
SGM8608-2  
CMOS Operational Amplifier  
ELECTRICAL CHARACTERISTICS  
(For VS (Total Supply Voltage) = (+VS) - (-VS) = 2.1V to 5.5V, VCM = VS/2, VOUT = VS/2, and RL = 600Ω connected to VS/2, Full =  
-40to +125, typical values are at TA = +25, unless otherwise noted.)  
PARAMETER  
SYMBOL  
CONDITIONS  
TEMP  
MIN  
TYP  
MAX  
UNITS  
Input Characteristics  
±0.4  
±1.7  
±1.9  
+25  
Full  
Input Offset Voltage  
Input Offset Voltage Drift  
Input Bias Current  
VOS  
VS = 5V  
mV  
μV/℃  
pA  
ΔVOS/ΔT VS = 5V  
Full  
0.9  
10  
150  
5000  
+25℃  
Full  
IB  
10  
150  
+25℃  
Full  
Input Offset Current  
IOS  
pA  
V
1500  
Input Common Mode Voltage Range  
VCM  
Full  
(-VS) - 0.1  
(+VS) + 0.1  
74  
71  
60  
57  
80  
77  
68  
65  
91  
74  
96  
82  
+25℃  
Full  
VS = 2.1V,  
(-VS) - 0.1V < VCM < (+VS) - 1.7V  
+25℃  
Full  
VS = 2.1V,  
(-VS) - 0.1V < VCM < (+VS) + 0.1V  
Common Mode Rejection Ratio  
CMRR  
dB  
+25℃  
Full  
VS = 5.5V,  
(-VS) - 0.1V < VCM < (+VS) - 1.7V  
+25℃  
Full  
VS = 5.5V,  
(-VS) - 0.1V < VCM < (+VS) + 0.1V  
Input Common Mode Capacitance  
Input Differential Capacitance  
CIC  
CID  
26  
2
pF  
pF  
+25℃  
+25℃  
+25℃  
Full  
89  
86  
90  
87  
95  
86  
98  
86  
112  
VS = 2.1V, RL = 600Ω,  
(-VS) + 0.4V < VOUT < (+VS) - 0.4V  
115  
120  
140  
+25℃  
Full  
VS = 2.1V, RL = 10kΩ,  
(-VS) + 0.2V < VOUT < (+VS) - 0.2V  
Open-Loop Voltage Gain  
AOL  
dB  
+25℃  
Full  
VS = 5.5V, RL = 600Ω,  
(-VS) + 0.4V < VOUT < (+VS) - 0.4V  
+25℃  
Full  
VS = 5.5V, RL = 10kΩ,  
(-VS) + 0.2V < VOUT < (+VS) - 0.2V  
Output Characteristics  
4
10  
20  
75  
90  
+25℃  
Full  
VS = 5.5V, RL = 10kΩ  
VS = 5.5V, RL = 600Ω  
Output Voltage Swing from Rail  
VOUT  
mV  
55  
62  
95  
+25℃  
Full  
50  
35  
+25℃  
Full  
Output Short-Circuit Current  
Open-Loop Output Impedance  
ISC  
VS = 5V  
mA  
ZOUT  
VS = 5V, f = 10MHz  
Ω
+25℃  
SG Micro Corp  
www.sg-micro.com  
NOVEMBER 2022  
4
11MHz, Rail-to-Rail I/O  
SGM8608-2  
CMOS Operational Amplifier  
ELECTRICAL CHARACTERISTICS (continued)  
(For VS (Total Supply Voltage) = (+VS) - (-VS) = 2.1V to 5.5V, VCM = VS/2, VOUT = VS/2, and RL = 600Ω connected to VS/2, Full =  
-40to +125, typical values are at TA = +25, unless otherwise noted.)  
PARAMETER  
SYMBOL  
CONDITIONS  
TEMP  
MIN  
TYP  
MAX  
UNITS  
Power Supply  
Operating Voltage Range  
VS  
Full  
+25℃  
Full  
2.1  
5.5  
25  
V
2
Power Supply Rejection Ratio  
PSRR  
VCM = (-VS) + 0.4V  
µV/V  
28  
1.1  
1.45  
1.8  
+25℃  
Full  
Quiescent Current/Amplifier  
IQ  
VS = 5V  
mA  
Dynamic Performance  
Gain-Bandwidth Product  
Phase Margin  
GBP  
PM  
VS = 5V, G = +1, RL = 600Ω, CL = 100pF  
VS = 5V, G = +1, RL = 600Ω, CL = 100pF  
11  
45  
MHz  
°
+25℃  
+25℃  
VS = 5V, G = +1, RL = 600Ω,  
VOUT = 2VP-P, VCM = 1/2VS (10%~90%)  
VS = 5V, G = +1, 2V step, RL = 600Ω,  
CL = 100pF  
Slew Rate  
SR  
6.6  
V/μs  
+25℃  
Settling Time to 0.1%  
tS  
500  
0.16  
ns  
μs  
+25℃  
+25℃  
+25℃  
+25℃  
Overload Recovery Time  
Total Harmonic Distortion + Noise  
ORT  
VS = 5V, VIN × G > VS, RL = 600Ω  
VS = 5.5V, VCM = 2.5V, VOUT = 0.5VRMS  
,
THD+N  
BWP  
0.0008  
120  
%
G = +1, f = 1kHz, BW = 10Hz to 90kHz  
Full-Power Bandwidth  
Noise  
kHz  
1% distortion  
Input Voltage Noise  
f = 0.1Hz to 10Hz  
f = 1kHz  
8
µVP-P  
nV/Hz  
fA/Hz  
+25℃  
+25℃  
+25℃  
+25℃  
30  
12  
31  
Input Voltage Noise Density  
Input Current Noise Density  
en  
in  
f = 10kHz  
f = 1kHz  
SG Micro Corp  
www.sg-micro.com  
NOVEMBER 2022  
5
11MHz, Rail-to-Rail I/O  
SGM8608-2  
CMOS Operational Amplifier  
TYPICAL PERFORMANCE CHARACTERISTICS  
At TA = +25, VS = 5.5V, unless otherwise noted.  
Quiescent Current vs. Temperature  
IB and IOS vs. Temperature  
1.4  
1.3  
1.2  
1.1  
1
2000  
1500  
1000  
500  
0
— IOS  
— IB+  
— IB-  
0.9  
-500  
-50  
-25  
0
25  
50  
75  
100 125  
-50  
-25  
0
25  
50  
75  
100 125  
100 125  
100 125  
Temperature ()  
Temperature ()  
Output Short-Circuit Current vs. Temperature  
PSRR vs. Temperature  
100  
75  
0
-0.5  
-1  
ISOURCE  
50  
25  
-1.5  
-2  
0
-25  
-50  
-75  
ISINK  
-2.5  
-3  
-50  
-25  
0
25  
50  
75  
100 125  
-50  
-25  
0
25  
50  
75  
Temperature ()  
Temperature ()  
CMRR vs. Temperature  
VCM = -0.1V to 5.6V, RL = 10kΩ  
CMRR vs. Temperature  
VCM = -0.1V to 3.8V, RL = 10kΩ  
35  
30  
25  
20  
15  
10  
4
2
0
-2  
-4  
-6  
-50  
-25  
0
25  
50  
75  
100 125  
-50  
-25  
0
25  
50  
75  
Temperature ()  
Temperature ()  
SG Micro Corp  
www.sg-micro.com  
NOVEMBER 2022  
6
11MHz, Rail-to-Rail I/O  
SGM8608-2  
CMOS Operational Amplifier  
TYPICAL PERFORMANCE CHARACTERISTICS (continued)  
At TA = +25, VS = 5.5V, unless otherwise noted.  
Open-Loop Voltage Gain vs. Temperature  
RL = 10kΩ  
Input Offset Voltage vs. Temperature  
3
2
0.8  
0.6  
0.4  
0.2  
0
VS = 5.5V  
1
0
-0.2  
-0.4  
-0.6  
-0.8  
-1  
-1  
-2  
-3  
VS = 2.1V  
-50  
-25  
0
25  
50  
75  
100 125  
-50  
-25  
0
25  
50  
75  
100 125  
Temperature ()  
Temperature ()  
Quiescent Current vs. Supply Voltage  
Input Offset Voltage vs. Supply Voltage  
1.12  
0.6  
0.4  
0.2  
0
1.10  
1.08  
1.06  
1.04  
1.02  
-0.2  
-0.4  
-0.6  
2
2.5  
3
3.5  
4
4.5  
5
5.5  
2
2.5  
3
3.5  
4
4.5  
5
5.5  
Supply Voltage (V)  
Supply Voltage (V)  
Input Offset Voltage vs. Output Voltage  
Input Offset Voltage vs. Output Voltage  
8
8
6
6
4
4
2
2
0
0
-2  
-4  
-6  
-8  
-2  
-4  
-6  
-8  
RL = 600Ω  
-2  
RL = 10kΩ  
-2  
-3  
-1  
0
1
2
3
-3  
-1  
0
1
2
3
Output Voltage (V)  
Output Voltage (V)  
SG Micro Corp  
www.sg-micro.com  
NOVEMBER 2022  
7
11MHz, Rail-to-Rail I/O  
SGM8608-2  
CMOS Operational Amplifier  
TYPICAL PERFORMANCE CHARACTERISTICS (continued)  
At TA = +25, VS = 5.5V, unless otherwise noted.  
Input Offset Voltage vs. Input Common Mode Voltage  
Output Voltage Swing vs. Output Current  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0
6
5
4
3
2
1
0
— -40℃  
— +25℃  
+85℃  
— +125℃  
0
1
2
3
4
5
6
0
20  
40  
60  
80  
100  
Input Common Mode Voltage (V)  
Output Current (mA)  
Small-Signal Overshoot vs. Capacitive Load  
Small-Signal Overshoot vs. Capacitive Load  
G = -1  
RL = 10kΩ  
VOUT = 100mVP-P  
50  
40  
30  
20  
10  
0
50  
40  
30  
20  
10  
0
G = +1  
RL = 10kΩ  
VOUT = 100mVP-P  
VS = 2.1V  
VS = 2.1V  
VS = 5.5V  
VS = 5.5V  
10  
100  
1000  
10  
100  
1000  
Load Capacitance (pF)  
Load Capacitance (pF)  
Phase Margin vs. Capacitive Load  
THD+N vs. Frequency  
100  
80  
60  
40  
20  
0
-80  
-85  
VCM = 2.5V  
OUT = 0.5VRMS  
RL = 600Ω  
RL = 10kΩ  
V
BW = 10Hz to 90kHz  
-90  
-95  
-100  
-105  
-110  
0
20  
40  
60  
80  
100  
120  
10  
100  
1000  
Frequency (Hz)  
10000  
100000  
Load Capacitance (pF)  
SG Micro Corp  
www.sg-micro.com  
NOVEMBER 2022  
8
11MHz, Rail-to-Rail I/O  
SGM8608-2  
CMOS Operational Amplifier  
TYPICAL PERFORMANCE CHARACTERISTICS (continued)  
At TA = +25, VS = 5.5V, unless otherwise noted.  
THD+N vs. Output Amplitude  
THD+N vs. Output Amplitude  
-40  
-50  
-40  
-50  
-60  
-60  
-70  
-70  
-80  
-80  
-90  
G = +1  
f = 1kHz  
G = -1  
f = 1kHz  
VCM = 2.5V  
RL = 600Ω  
-90  
-100  
-110  
-120  
V
CM = 2.5V  
-100  
RL = 600Ω  
BW = 10Hz to 90kHz  
BW = 10Hz to 90kHz  
-110  
0.001  
0.01  
0.1  
1
10  
0.001  
0.01  
0.1  
1
10  
Output Amplitude (VRMS  
)
Output Amplitude (VRMS  
)
Maximum Output Voltage vs. Frequency  
VS = 5V  
Open-Loop Output Impedance vs. Frequency  
6
5
4
3
2
1
0
120  
110  
100  
90  
VS = 2.1V  
80  
70  
0.001 0.01 0.1  
1
10  
100 1000 10000  
100  
1000  
10000  
100000  
Frequency (kHz)  
Frequency (kHz)  
Closed-Loop Gain vs. Frequency  
— G = +1  
— G = -1  
— G = +10  
Open-Loop Voltage Gain and Phase Margin vs. Frequency  
60  
40  
20  
0
120  
100  
80  
60  
40  
20  
0
180  
RL = 600Ω  
CL = 100pF  
150  
120  
90  
Phase Margin  
60  
30  
Open-Loop Voltage Gain  
-20  
0
-40  
-20  
-30  
0.1  
1
10  
100  
1000 10000 100000  
0.01 0.1  
1
10  
100 1000 10000100000  
Frequency (kHz)  
Frequency (kHz)  
SG Micro Corp  
www.sg-micro.com  
NOVEMBER 2022  
9
11MHz, Rail-to-Rail I/O  
SGM8608-2  
CMOS Operational Amplifier  
TYPICAL PERFORMANCE CHARACTERISTICS (continued)  
At TA = +25, VS = 5.5V, unless otherwise noted.  
CMRR vs. Frequency (Referred-to-Input)  
PSRR vs. Frequency (Referred-to-Input)  
-30  
-40  
-50  
-60  
-70  
-80  
-90  
0
-20  
— PSRR+  
— PSRR-  
-40  
-60  
-80  
-100  
0.1  
0.1  
10  
1
10  
100  
1000 10000 100000  
0.1  
1
10  
100  
1000 10000 100000  
Frequency (kHz)  
Frequency (kHz)  
Channel Separation vs. Frequency  
EMIRR IN+ vs. Frequency  
0
-20  
120  
100  
80  
60  
40  
20  
0
PRF = -10dBm  
-40  
-60  
-80  
-100  
-120  
1
10  
100  
1000  
10000  
10  
100  
1000  
10000  
Frequency (kHz)  
Frequency (MHz)  
Input Voltage Noise Density vs. Frequency  
0.1Hz to 10Hz Input Voltage Noise  
1000  
100  
10  
1
100  
1000  
10000  
100000  
Time (1s/div)  
Frequency (Hz)  
SG Micro Corp  
www.sg-micro.com  
NOVEMBER 2022  
10  
11MHz, Rail-to-Rail I/O  
SGM8608-2  
CMOS Operational Amplifier  
TYPICAL PERFORMANCE CHARACTERISTICS (continued)  
At TA = +25, VS = 5.5V, unless otherwise noted.  
Positive Overload Recovery  
Negative Overload Recovery  
VIN  
0V  
0V  
VIN  
VOUT  
0V  
0V  
VOUT  
Time (100ns/div)  
Time (100ns/div)  
Small-Signal Step Response  
Large-Signal Step Response  
VIN  
VIN  
VOUT  
VOUT  
Time (200ns/div)  
Time (1μs/div)  
No Phase Reversal  
Input Offset Voltage Production Distribution  
4
3
12  
10  
8
— VIN  
— VOUT  
17870 Samples  
1 Production Lot  
2
1
0
6
-1  
-2  
-3  
-4  
4
2
0
Time (100μs/div)  
Input Offset Voltage (mV)  
SG Micro Corp  
www.sg-micro.com  
NOVEMBER 2022  
11  
11MHz, Rail-to-Rail I/O  
SGM8608-2  
CMOS Operational Amplifier  
TYPICAL PERFORMANCE CHARACTERISTICS (continued)  
At TA = +25, VS = 5.5V, unless otherwise noted.  
Input Offset Voltage Drift Distribution  
35  
-40TA +125℃  
30  
25  
20  
15  
10  
5
0
0.0 0.3 0.6 0.9 1.2 1.5 1.8 2.1 2.4  
Input Offset Voltage Drift (μV/)  
SG Micro Corp  
www.sg-micro.com  
NOVEMBER 2022  
12  
11MHz, Rail-to-Rail I/O  
SGM8608-2  
CMOS Operational Amplifier  
APPLICATION INFORMATION  
+VS  
+VS  
Rail-to-Rail Output  
10μF  
10μF  
The SGM8608-2 supports rail-to-rail output operation.  
In single power supply application, for example, when  
+VS = 5.5V, -VS = GND, 10kΩ load resistor is tied from  
OUT pin to VS/2, the typical output swing range is from  
0.004V to 5.496V.  
0.1μF  
0.1μF  
_
_
VN  
VP  
VN  
VP  
VOUT  
VOUT  
Driving Capacitive Loads  
+
+
The SGM8608-2 is designed for unity-gain stable for  
capacitive load up to 2200pF. If greater capacitive load  
must be driven in application, the circuit in Figure 1 can  
be used. In this circuit, the IR drop voltage generated  
by RISO is compensated by feedback loop.  
10μF  
-VS (GND)  
0.1μF  
-VS  
RF  
CF  
Figure 2. Amplifier Power Supply Bypassing  
Grounding  
_
In low speed application, one node grounding technique  
is the simplest and most effective method to eliminate  
the noise generated by grounding. In high speed  
application, the general method to eliminate noise is to  
use a complete ground plane technique, and the whole  
ground plane will help distribute heat and reduce EMI  
noise pickup.  
RISO  
VOUT  
CL  
VIN  
+
Figure 1. Circuit to Drive Heavy Capacitive Load  
Power Supply Decoupling and Layout  
A clean and low noise power supply is very important in  
amplifier circuit design, besides of input signal noise,  
the power supply is one of important source of noise to  
the amplifier through +VS and -VS pins. Power supply  
bypassing is an effective method to clear up the noise  
at power supply, and the low impedance path to ground  
of decoupling capacitor will bypass the noise to GND.  
In application, 10μF ceramic capacitor paralleled with  
0.1μF or 0.01μF ceramic capacitor is used in Figure 2.  
The ceramic capacitors should be placed as close as  
possible to +VS and -VS power supply pins.  
Reduce Input-to-Output Coupling  
To reduce the input-to-output coupling, the input traces  
must be placed as far away from the power supply or  
output traces as possible. The sensitive trace must not  
be placed in parallel with the noisy trace in same layer.  
They must be placed perpendicularly in different layers  
to reduce the crosstalk. These PCB layout techniques  
will help to reduce unwanted positive feedback and  
noise.  
SG Micro Corp  
www.sg-micro.com  
NOVEMBER 2022  
13  
 
 
11MHz, Rail-to-Rail I/O  
SGM8608-2  
CMOS Operational Amplifier  
APPLICATION INFORMATION (continued)  
Active Low-Pass Filter  
Typical Application Circuits  
The circuit in Figure 5 is a design example of active  
low-pass filter, the DC gain is equal to -R2/R1 and the  
-3dB corner frequency is equal to 1/2πR2C. In this  
design, the filter bandwidth must be less than the  
bandwidth of the amplifier, the resistor values must be  
selected as low as possible to reduce ringing or  
oscillation generated by the parasitic parameters in  
PCB layout.  
Difference Amplifier  
The circuit in Figure 3 is a design example of classical  
difference amplifier. If R4/R3 = R2/R1, then VOUT = (VP -  
VN) × R2/R1 + VREF  
.
R2  
R1  
_
VN  
VOUT  
R3  
C
VP  
+
R2  
R4  
R1  
_
VIN  
VREF  
VOUT  
Figure 3. Difference Amplifier  
+
R3 = R1 // R2  
High Input Impedance Difference Amplifier  
The circuit in Figure 4 is a design example of high input  
impedance difference amplifier, the added amplifiers at  
the input are used to increase the input impedance and  
eliminate drawback of low input impedance in Figure 3.  
Figure 5. Active Low-Pass Filter  
_
R1  
R2  
VN  
+
_
VOUT  
+
VP  
+
R3  
_
R4  
VREF  
Figure 4. High Input Impedance Difference Amplifier  
SG Micro Corp  
www.sg-micro.com  
NOVEMBER 2022  
14  
 
 
 
11MHz, Rail-to-Rail I/O  
SGM8608-2  
CMOS Operational Amplifier  
REVISION HISTORY  
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.  
Changes from Original (NOVEMBER 2022) to REV.A  
Page  
Changed from product preview to production data.............................................................................................................................................All  
SG Micro Corp  
www.sg-micro.com  
NOVEMBER 2022  
15  
PACKAGE INFORMATION  
PACKAGE OUTLINE DIMENSIONS  
UTDFN-2×2-8BL  
D
D1  
N8  
k
E
E1  
L
N1  
PIN 1#  
e
b
DETAIL A  
BOTTOM VIEW  
TOP VIEW  
SEATING PLANE  
eee C  
1.60  
A
C
A2  
A1  
0.45  
0.75  
2.05  
SIDE VIEW  
ALTERNATE A-1 ALTERNATE A-2  
DETAIL A  
ALTERNATE TERMINAL  
CONSTRUCTION  
0.30  
0.50  
RECOMMENDED LAND PATTERN (Unit: mm)  
Dimensions In Millimeters  
Symbol  
MIN  
0.500  
0.000  
MOD  
MAX  
0.600  
0.050  
A
A1  
A2  
b
-
-
0.127 REF  
0.200  
1.900  
1.900  
1.500  
0.800  
-
0.300  
2.100  
2.100  
1.700  
1.000  
D
-
-
E
D1  
E1  
e
1.600  
0.900  
0.500 BSC  
0.250 REF  
-
k
L
0.200  
0.400  
eee  
0.050  
NOTE: This drawing is subject to change without notice.  
SG Micro Corp  
TX00305.001  
www.sg-micro.com  
PACKAGE INFORMATION  
PACKAGE OUTLINE DIMENSIONS  
SOIC-8  
0.6  
D
e
2.2  
E1  
E
5.2  
b
1.27  
RECOMMENDED LAND PATTERN (Unit: mm)  
L
A
A1  
c
θ
A2  
Dimensions  
In Millimeters  
Dimensions  
In Inches  
Symbol  
MIN  
MAX  
1.750  
0.250  
1.550  
0.510  
0.250  
5.100  
4.000  
6.200  
MIN  
MAX  
0.069  
0.010  
0.061  
0.020  
0.010  
0.200  
0.157  
0.244  
A
A1  
A2  
b
1.350  
0.100  
1.350  
0.330  
0.170  
4.700  
3.800  
5.800  
0.053  
0.004  
0.053  
0.013  
0.006  
0.185  
0.150  
0.228  
c
D
E
E1  
e
1.27 BSC  
0.050 BSC  
L
0.400  
0°  
1.270  
8°  
0.016  
0°  
0.050  
8°  
θ
NOTES:  
1. Body dimensions do not include mode flash or protrusion.  
2. This drawing is subject to change without notice.  
SG Micro Corp  
TX00010.000  
www.sg-micro.com  
PACKAGE INFORMATION  
PACKAGE OUTLINE DIMENSIONS  
MSOP-8  
b
E1  
E
4.8  
1.02  
e
0.41  
0.65  
RECOMMENDED LAND PATTERN (Unit: mm)  
D
L
A
c
A1  
θ
A2  
Dimensions  
In Millimeters  
Dimensions  
In Inches  
Symbol  
MIN  
MAX  
1.100  
0.150  
0.950  
0.380  
0.230  
3.100  
3.100  
5.050  
MIN  
MAX  
0.043  
0.006  
0.037  
0.015  
0.009  
0.122  
0.122  
0.199  
A
A1  
A2  
b
0.820  
0.020  
0.750  
0.250  
0.090  
2.900  
2.900  
4.750  
0.032  
0.001  
0.030  
0.010  
0.004  
0.114  
0.114  
0.187  
c
D
E
E1  
e
0.650 BSC  
0.026 BSC  
L
0.400  
0°  
0.800  
6°  
0.016  
0°  
0.031  
6°  
θ
NOTES:  
1. Body dimensions do not include mode flash or protrusion.  
2. This drawing is subject to change without notice.  
SG Micro Corp  
TX00014.000  
www.sg-micro.com  
PACKAGE INFORMATION  
PACKAGE OUTLINE DIMENSIONS  
TSSOP-8  
D
e
E1  
E
5.94  
1.78  
b
0.42  
0.65  
RECOMMENDED LAND PATTERN (Unit: mm)  
L
ccc C  
SEATING PLANE  
A
H
c
A2  
A1  
θ
C
Dimensions In Millimeters  
Symbol  
MIN  
-
MOD  
MAX  
1.200  
0.150  
1.050  
0.300  
0.200  
3.100  
4.500  
6.600  
A
A1  
A2  
b
-
0.050  
0.800  
0.190  
0.090  
2.900  
4.300  
6.200  
-
-
-
c
-
D
-
E
-
E1  
e
-
0.650 BSC  
L
0.450  
0°  
-
0.250 TYP  
-
0.750  
8°  
H
θ
ccc  
0.100  
NOTES:  
1. This drawing is subject to change without notice.  
2. The dimensions do not include mold flashes, protrusions or gate burrs.  
3. Reference JEDEC MO-153.  
SG Micro Corp  
TX00018.001  
www.sg-micro.com  
PACKAGE INFORMATION  
TAPE AND REEL INFORMATION  
REEL DIMENSIONS  
TAPE DIMENSIONS  
P2  
P0  
W
Q2  
Q4  
Q2  
Q4  
Q2  
Q4  
Q1  
Q3  
Q1  
Q3  
Q1  
Q3  
B0  
Reel Diameter  
P1  
A0  
K0  
Reel Width (W1)  
DIRECTION OF FEED  
NOTE: The picture is only for reference. Please make the object as the standard.  
KEY PARAMETER LIST OF TAPE AND REEL  
Reel Width  
Reel  
Diameter  
A0  
B0  
K0  
P0  
P1  
P2  
W
Pin1  
Package Type  
W1  
(mm)  
(mm) (mm) (mm) (mm) (mm) (mm) (mm) Quadrant  
UTDFN-2×2-8BL  
SOIC-8  
7″  
9.5  
2.25  
6.40  
5.20  
6.76  
2.25  
5.40  
3.30  
3.30  
0.75  
2.10  
1.50  
1.80  
4.0  
4.0  
4.0  
4.0  
4.0  
8.0  
8.0  
8.0  
2.0  
2.0  
2.0  
2.0  
8.0  
Q1  
Q1  
Q1  
Q1  
13″  
13″  
13″  
12.4  
12.4  
12.4  
12.0  
12.0  
12.0  
MSOP-8  
TSSOP-8  
SG Micro Corp  
TX10000.000  
www.sg-micro.com  
PACKAGE INFORMATION  
CARTON BOX DIMENSIONS  
NOTE: The picture is only for reference. Please make the object as the standard.  
KEY PARAMETER LIST OF CARTON BOX  
Length  
(mm)  
Width  
(mm)  
Height  
(mm)  
Reel Type  
Pizza/Carton  
7″ (Option)  
368  
442  
386  
227  
410  
280  
224  
224  
370  
8
18  
5
7″  
13″  
SG Micro Corp  
www.sg-micro.com  
TX20000.000  

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