SGM65231 [SGMICRO]
8-Bit, Low Voltage, High Bandwidth Bus Switch;
| 型号： | SGM65231 |
| 厂家： | 
Shengbang Microelectronics Co, Ltd |
| 描述： | 8-Bit, Low Voltage, High Bandwidth Bus Switch |
| 文件： | 总7页 (文件大小：451K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SGM65231
8-Bit, Low Voltage,
High Bandwidth Bus Switch
GENERAL DESCRIPTION
FEATURES
The SGM65231 is an 8-Bit, low voltage and high
bandwidth bus switch. It supports rail-to-rail switching
on data I/O ports and the power supply range is
designed from 2.3V to 3.6V.
● Operating Voltage Range (VCC): 2.3V to 3.6V
● Data I/Os Support 0V to 5V Signaling Levels:
0.8V, 1.2V, 1.5V, 1.8V, 2.5V, 3.3V, 5V
● Rail-to-Rail Switching on Data I/O Ports
0V to 5V Signal Passing, VCC = 3.3V
0V to 3.3V Signal Passing, VCC = 2.5V
● High Bandwidth Data Path
The SGM65231 has low on-resistance (RON) and low
data I/O capacitance. These features make the device
allow for minimal propagation delay and minimize
signal distortion on the data bus.
● Low On-Resistance (RON): 4.5Ω (TYP)
● Low Power Consumption (ICC): = 0.5mA (TYP)
● 5V Tolerant I/Os with Device Powered Up or
Powered Down
It is recommended to connect a pull-up resistor
between the
pin and V
pin to ensure high
OE
CC
impedance during power-on or power-off. The ability of
the driver to absorb current can determine the minimum
value of the resistor.
● Bidirectional Data Flow
● Low Input/Output Capacitance Minimizes Loading
and Signal Distortion
● Data and Control Inputs Provide Undershoot
Clamp Diodes
The SGM65231 is designed with an IOFF circuitry. When
the device is powered down, the IOFF circuitry can
effectively prevent the destructive current backflow,
and the SGM65231 has an isolation function in the
state of power-off. This feature is widely used in
partial-power-down applications.
● Control Input Can Be Driven by TTL or 5V/3.3V
CMOS Outputs
● Support Partial-Power-Down Mode Operation
● Available in Green TQFN-4.5×3.5-20L and
TSSOP-20 Packages
The SGM65231 is suitable in a variety of applications
such as high bandwidth equipment, broadband
communications and data-intensive computing systems.
APPLICATIONS
Differential Signal Interface
PCI Interface
The SGM65231 is available in Green TQFN-4.5×3.5-20L
and TSSOP-20 packages. It operates over an operating
temperature range of -40℃ to +125℃.
Low Distortion Signal Gating
Memory Interleaving, Bus Isolation
SG Micro Corp
SEPTEMBER 2020 – REV.A.1
www.sg-micro.com
8-Bit, Low Voltage,
SGM65231
High Bandwidth Bus Switch
PACKAGE/ORDERING INFORMATION
SPECIFIED
TEMPERATURE
RANGE
PACKAGE
DESCRIPTION
ORDERING
NUMBER
PACKAGE
MARKING
PACKING
OPTION
MODEL
SGM65231
XTQS20
XXXXX
TQFN-4.5×3.5-20L
TSSOP-20
SGM65231XTQS20G/TR
Tape and Reel, 4000
Tape and Reel, 4000
-40℃ to +125℃
-40℃ to +125℃
SGM65231
SGM65231XTS20
XXXXX
SGM65231XTS20G/TR
MARKING INFORMATION
NOTE: XXXXX = Date Code, Trace Code and Vendor Code.
X X X X X
Vendor Code
Trace Code
Date Code - Year
Green (RoHS & HSF): SG Micro Corp defines "Green" to mean Pb-Free (RoHS compatible) and free of halogen substances. If
you have additional comments or questions, please contact your SGMICRO representative directly.
OVERSTRESS CAUTION
ABSOLUTE MAXIMUM RATINGS
Supply Voltage Range, VCC .............................. -0.3V to 4.6V
Control Input Voltage Range (1), VIN..................... -0.3V to 7V
Switch I/O Voltage Range (1) (2), VI/O..................... -0.3V to 7V
Junction Temperature.................................................+150℃
Storage Temperature Range.......................-65℃ to +150℃
Lead Temperature (Soldering, 10s)............................+260℃
ESD Susceptibility
Stresses beyond those listed in Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to
absolute maximum rating conditions for extended periods
may affect reliability. Functional operation of the device at any
conditions beyond those indicated in the Recommended
Operating Conditions section is not implied.
ESD SENSITIVITY CAUTION
HBM.............................................................................7000V
CDM ............................................................................1000V
This integrated circuit can be damaged if ESD protections are
not considered carefully. SGMICRO recommends that all
integrated circuits be handled with appropriate precautions.
Failureto observe proper handlingand installation procedures
can cause damage. ESD damage can range from subtle
performance degradation tocomplete device failure. Precision
integrated circuits may be more susceptible to damage
because even small parametric changes could cause the
device not to meet the published specifications.
RECOMMENDED OPERATING CONDITIONS
Supply Voltage Range, VCC ................................2.3V to 3.6V
High-Level Control Input Voltage, VIH
V
CC = 2.3V to 2.7V ..........................................1.7V to 5.5V
CC = 2.7V to 3.6V .............................................2V to 5.5V
V
Low-Level Control Input Voltage, VIL
CC = 2.3V to 2.7V .............................................0V to 0.7V
V
VCC = 2.7V to 3.6V .............................................0V to 0.8V
Data Input/Output Voltage, VI/O..............................0V to 5.5V
Operating Temperature Range ....................-40℃ to +125℃
DISCLAIMER
SG Micro Corp reserves the right to make any change in
circuit design, or specifications without prior notice.
NOTES:
1. All voltages are respected to GND, unless otherwise
noted.
2. VI and VO are respectively used to represent VI/O under
specific conditions.
SG Micro Corp
www.sg-micro.com
SEPTEMBER 2020
2
8-Bit, Low Voltage,
SGM65231
High Bandwidth Bus Switch
PIN CONFIGURATIONS
(TOP VIEW)
(TOP VIEW)
NC
A1
A2
A3
A4
A5
A6
A7
A8
1
2
3
4
5
6
7
8
9
20 VCC
19
NC
1
VCC
20
OE
A1
A2
A3
A4
A5
A6
A7
A8
2
3
4
5
6
7
8
9
19
18
17
16
15
14
13
12
OE
B1
B2
B3
B4
B5
B6
B7
18 B1
17 B2
16 B3
15 B4
14 B5
13 B6
12 B7
11 B8
10
11
B8
GND
GND 10
TQFN-4.5×3.5-20L
TSSOP-20
PIN DESCRIPTION
PIN
NAME
I/O
FUNCTION
TQFN-4.5×3.5-20L/TSSOP-20
1
2
NC
A1
A2
A3
A4
A5
A6
A7
A8
GND
B8
B7
B6
B5
B4
B3
B2
B1
—
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
—
No Internal Connection.
Bidirectional Analog Input/Output A1.
Bidirectional Analog Input/Output A2.
Bidirectional Analog Input/Output A3.
Bidirectional Analog Input/Output A4.
Bidirectional Analog Input/Output A5.
Bidirectional Analog Input/Output A6.
Bidirectional Analog Input/Output A7.
Bidirectional Analog Input/Output A8.
Ground.
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I
Bidirectional Analog Input/Output B8.
Bidirectional Analog Input/Output B7.
Bidirectional Analog Input/Output B6.
Bidirectional Analog Input/Output B5.
Bidirectional Analog Input/Output B4.
Bidirectional Analog Input/Output B3.
Bidirectional Analog Input/Output B2.
Bidirectional Analog Input/Output B1.
Enable Control Input (Active Low).
Positive Power Supply.
OE
VCC
—
SG Micro Corp
www.sg-micro.com
SEPTEMBER 2020
3
PACKAGE INFORMATION
PACKAGE OUTLINE DIMENSIONS
TQFN-4.5×3.5-20L
C0.300
N1
k
e1
D
N20
N19
N2
D1
E1
E
e
N11
N10
b
L1
L
D3
D2
TOP VIEW
BOTTOM VIEW
4.1
2.7
0.70
2.05
3.05
3.7
5.1
A
A1
0.5
A2
SIDE VIEW
0.25
0.20
1.5
RECOMMENDED LAND PATTERN (Unit: mm)
Dimensions
In Millimeters
Dimensions
In Inches
Symbol
MIN
MAX
0.800
0.050
MIN
0.028
0.000
MAX
0.031
0.002
A
A1
A2
D
0.700
0.000
0.203 REF
0.008 REF
3.400
1.950
0.650
0.250
4.400
2.950
3.600
2.150
0.850
0.450
4.600
3.150
0.134
0.077
0.026
0.010
0.173
0.116
0.142
0.085
0.033
0.018
0.181
0.124
D1
D2
D3
E
E1
k
0.325 REF
0.013 REF
b
0.200
0.300
0.224
0.300
0.500
0.376
0.008
0.012
0.009
0.012
0.020
0.015
L
L1
e
0.500 BSC
1.500 BSC
0.020 BSC
0.060 BSC
e1
SG Micro Corp
www.sg-micro.com
TX00138.000
PACKAGE INFORMATION
PACKAGE OUTLINE DIMENSIONS
TSSOP-20
D
E1
E
5.94
1.78
0.42
b
e
0.65
RECOMMENDED LAND PATTERN (Unit: mm)
L
A
A1
c
θ
A2
H
Dimensions In Millimeters
Symbol
MIN
MOD
MAX
1.200
0.150
1.050
0.300
0.200
6.600
4.500
6.550
A
A1
A2
b
-
0.050
0.800
0.190
0.090
6.400
4.300
6.250
-
-
-
c
-
D
E
-
-
E1
e
-
0.650 BSC
L
0.450
0°
-
0.750
8°
H
θ
0.250 TYP
-
NOTES:
1. Body dimensions do not include mode flash or protrusion.
2. This drawing is subject to change without notice.
SG Micro Corp
TX00021.001
www.sg-micro.com
PACKAGE INFORMATION
TAPE AND REEL INFORMATION
REEL DIMENSIONS
TAPE DIMENSIONS
P2
P0
W
Q2
Q4
Q2
Q4
Q2
Q4
Q1
Q3
Q1
Q3
Q1
Q3
B0
Reel Diameter
P1
A0
K0
Reel Width (W1)
DIRECTION OF FEED
NOTE: The picture is only for reference. Please make the object as the standard.
KEY PARAMETER LIST OF TAPE AND REEL
Reel Width
Reel
Diameter
A0
B0
K0
P0
P1
P2
W
Pin1
Package Type
W1
(mm)
(mm) (mm) (mm) (mm) (mm) (mm) (mm) Quadrant
TQFN-4.5×3.5-20L
TSSOP-20
13″
13″
12.4
16.4
3.75
6.90
4.75
7.00
0.95
1.50
4.0
4.0
8.0
8.0
2.0
2.0
12.0
16.0
Q1
Q1
SG Micro Corp
TX10000.000
www.sg-micro.com
PACKAGE INFORMATION
CARTON BOX DIMENSIONS
NOTE: The picture is only for reference. Please make the object as the standard.
KEY PARAMETER LIST OF CARTON BOX
Length
(mm)
Width
(mm)
Height
(mm)
Reel Type
Pizza/Carton
13″
386
280
370
5
SG Micro Corp
www.sg-micro.com
TX20000.000
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