SGM4895_17 [SGMICRO]
1.3W Fully Differential Audio Power Amplifier;
| 型号： | SGM4895_17 |
| 厂家： | 
Shengbang Microelectronics Co, Ltd |
| 描述： | 1.3W Fully Differential Audio Power Amplifier |
| 文件： | 总13页 (文件大小：1206K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SGM4895
1.3W Fully Differential
Audio Power Amplifier
GENERAL DESCRIPTION
FEATURES
The SGM4895 is a fully differential audio power
amplifier that is designed for portable communication
device applications and demanding applications in
mobile phones. It is capable of delivering 1.3W of
continuous average power into an 8Ω load with typically
1% distortion (THD+N) from a 5V battery voltage. It
operates from 2.5V to 5.5V power supply.
• Fully Differential Amplifier
• Excellent PSRR: Direct Connection to Battery
• 1.3W into 8Ω Load from 5V Supply at
THD+N = 1% (TYP)
• 1.6W into 4Ω Load from 5V Supply at
THD+N = 1% (TYP, SGM4895YDB8 Only)
• 2.5V to 5.5V Operation
• Low Shutdown Current
The SGM4895 features a low power consumption
shutdown mode. To facilitate this, shutdown may be
enabled by logic low. Additionally, the SGM4895
features an internal thermal shutdown protection
mechanism.
• Improved Pop/Click Circuitry
• Support Single-Ended or Differential Input
• Thermal Overload Protection Circuitry
• No Output Coupling Capacitors, Bootstrap
Capacitors Required
The SGM4895 contains advanced pop/click circuitry,
with a minimal amount of external components. All
these features make SGM4895 ideal for wireless
handsets and other low voltage applications where
minimal power consumption is a primary requirement.
• External Gain Configuration Capability
• -40℃ to +85℃ Operating Temperature Range
• Available in Green TDFN-3×3-8L and
MSOP-8 (Exposed Pad) Packages
The SGM4895 is available in Green TDFN-3×3-8L and
MSOP-8 (Exposed Pad) packages. It operates over an
ambient temperature range of -40℃ to +85℃.
APPLICATIONS
Portable Systems
Wireless Handsets
Mobile Phone
Handheld Computers
PDAs
GPS
SG Micro Corp
MARCH 2017 –REV. C. 2
www.sg-micro.com
1.3W Fully Differential
Audio Power Amplifier
SGM4895
PACKAGE/ORDERING INFORMATION
SPECIFIED
TEMPERATURE
RANGE
PACKAGE
DESCRIPTION
ORDERING
NUMBER
PACKAGE
MARKING
PACKING
OPTION
MODEL
SGM
4895DB
XXXXX
SGM4895
YPMS8
XXXXX
TDFN-3×3-8L
SGM4895YDB8/TR
Tape and Reel, 3000
Tape and Reel, 4000
-40℃ to +85℃
-40℃ to +85℃
SGM4895
MSOP-8
(Exposed Pad)
SGM4895YPMS8/TR
NOTE: XXXXX = Date Code and Vendor Code.
Green (RoHS & HSF): SG Micro Corp defines "Green" to mean Pb-Free (RoHS compatible) and free of halogen substances. If
you have additional comments or questions, please contact your SGMICRO representative directly.
OVERSTRESS CAUTION
ABSOLUTE MAXIMUM RATINGS
Supply Voltage...................................................................6V
Input Voltage Range............................... -0.3V to (V+) + 0.3V
Junction Temperature .................................................+150℃
Storage Temperature Range.........................-65℃ to +150℃
Lead Temperature (Soldering, 10s) ............................+260℃
ESD Susceptibility
Stresses beyond those listed may cause permanent damage
to the device. Functional operation of the device at these or
any otherconditions beyond those indicated in the operational
sectionof thespecificationis not implied. Exposureto absolute
maximum rating conditions for extended periods may affect
reliability.
HBM.............................................................................2000V
MM.................................................................................400V
ESD SENSITIVITY CAUTION
This integrated circuit can be damaged by ESD if you don’t
pay attention to ESD protection. SGMICRO recommends that
all integrated circuits be handled with appropriate precautions.
Failureto observe proper handlingand installation procedures
can cause damage. ESD damage can range from subtle
performance degradation tocomplete device failure. Precision
integrated circuits may be more susceptible to damage
because very small parametric changes could cause the
device not to meet its published specifications.
RECOMMENDED OPERATING CONDITIONS
Supply Voltage Range ........................................2.5V to 5.5V
Operating Temperature Range .......................-40℃ to +85℃
DISCLAIMER
SG Micro Corp reserves the right to make any change in
circuitdesign, specificationor other related things if necessary
without notice at any time.
PIN CONFIGURATIONS
(TOP VIEW)
(TOP VIEW)
1
2
3
4
8
7
6
5
VO2
GND
V+
1
2
3
4
8
7
6
5
VO2
GND
V+
SHDN
Bypass
IN2
SHDN
Bypass
IN2
GND
GND
IN1
VO1
IN1
VO1
MSOP-8 (Exposed Pad)
TDFN-3×3-8L
SG Micro Corp
www.sg-micro.com
MARCH 2017
2
1.3W Fully Differential
Audio Power Amplifier
SGM4895
ELECTRICAL CHARACTERISTICS
(The following AC specifications apply for 8Ω load, AV = 1V/V, TA = +25℃, unless otherwise specified.)
PARAMETER
Supply Voltage
SYMBOL
CONDITIONS
MIN
TYP
MAX
5.5
1
UNITS
V
V+
2.5
Shutdown Current
ISD
VIN = 0V, VSHDN = GND
IN = 0V, VSHDN = V+ = 5.0V
0.01
2.5
μA
V
-10
-10
10
Output Offset Voltage
VOS
VIN = 0V, VSHDN = V+ = 3.3V
VIN = 0V, VSHDN = V+ = 2.6V
2.0
10
mV
2.0
V+ = 5.0V, No Load
V+ = 5.0V, 8Ω Load
V+ = 3.3V, No Load
V+ = 3.3V, 8Ω Load
V+ = 2.6V, No Load
V+ = 2.6V, 8Ω Load
4.70
4.75
3.87
3.90
3.20
3.22
7.50
8.00
5.80
6.00
VIN = 0V, IO = 0A,
Quiescent Power Supply Current
IQ
mA
V
VSHDN = V+
Shutdown Voltage Input High
Shutdown Voltage Input Low
VSDIH
VSDIL
1.2
0.4
V+ = 5.0V
V+ = 3.6V
V+ = 3.0V
V+ = 2.6V
V+ = 5.0V
V+ = 3.6V
V+ = 3.0V
V+ = 2.6V
V+ = 5.0V
V+ = 3.6V
V+ = 3.0V
V+ = 2.6V
V+ = 5.0V
V+ = 3.6V
V+ = 3.0V
V+ = 2.6V
1.30
0.65
0.45
0.34
1.60
0.82
0.55
0.42
1.60
1.00
0.65
0.50
2.20
1.25
0.85
0.60
0.015
-83
f = 1kHz
THD+N = 1%
Output Power (8Ω)
PO
W
f = 1kHz
THD+N = 10%
f = 1kHz
THD+N = 1%
SGM4895YDB8 only
Output Power (4Ω)
PO
W
%
f = 1kHz
THD+N = 10%
SGM4895YDB8 only
Total Harmonic Distortion + Noise
Power Supply Rejection Ratio (1) (2)
THD+N
PSRR
PO = 0.6Wrms, f = 1kHz, V+ = 5.0V
V+ = 5.0V
V+ = 3.6V
V+ = 3.0V
V+ = 2.6V
V+ = 5.0V
V+ = 3.6V
V+ = 3.0V
V+ = 2.6V
-80
f = 217Hz
-73
-65
dB
-83
-80
f = 1kHz
-73
-65
Common Mode Rejection Ratio (2)
Wake-Up Time
CMRR
TWU
f = 217Hz, VCM = 200mVP-P, V+ = 5.0V
V+ = 5.0V
-76
dB
ms
50
V+ = 3.6V
42
CB = 1μF
V+ = 3.0V
37
V+ = 2.6V
32
NOTES:
1. 10Ω terminated input.
2. PSRR and CMRR are affected by the matching between gain-setting resistor ratios.
SG Micro Corp
www.sg-micro.com
MARCH 2017
3
1.3W Fully Differential
Audio Power Amplifier
SGM4895
TYPICAL PERFORMANCE CHARACTERISTICS
At TA = +25℃, AV = 1, f = 1kHz, CB = 1µF, unless otherwise noted.
THD+N vs. Output Pow er
THD+N vs. Output Pow er
10
1
10
1
V+ = 5.0V
RL = 8Ω
BW < 80kHz
V+ = 3.6V
RL = 8Ω
BW < 80kHz
0.1
0.1
0.01
0.001
0.01
0.001
0.01
0.1
1
10
0.01
0.1
1
10
Output Pow er (W)
Output Pow er (W)
THD+N vs. Output Pow er
THD+N vs. Output Pow er
10
1
10
1
V+ = 3.0V
V+ = 2.6V
RL = 8Ω
BW < 80kHz
RL = 8Ω
BW < 80kHz
0.1
0.1
0.01
0.001
0.01
0.001
0.01
0.1
1
0.01
0.1
1
Output Pow er (W)
Output Pow er (W)
Pow er Dissipation vs. Output Pow er
Pow er Dissipation vs. Output Pow er
0.4
0.3
0.2
0.1
0
0.8
0.6
0.4
0.2
0
V+ = 5.0V
RL = 8Ω
V+ = 3.6V
RL = 8Ω
BW < 80kHz
THD+N ≤ 1%
BW < 80kHz
THD+N ≤ 1%
0
0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8
Output Pow er (W)
0
0.2
0.4
0.6
0.8
1
1.2
1.4
Output Pow er (W)
SG Micro Corp
MARCH 2017
www.sg-micro.com
4
1.3W Fully Differential
Audio Power Amplifier
SGM4895
TYPICAL PERFORMANCE CHARACTERISTICS (continued)
At TA = +25℃, AV = 1, f = 1kHz, CB = 1µF, unless otherwise noted.
Pow er Dissipation vs. Output Pow er
Pow er Dissipation vs. Output Pow er
0.2
0.15
0.1
0.3
0.2
0.1
0
V+ = 3.0V
RL = 8Ω
BW < 80kHz
THD+N ≤ 1%
V+ = 2.6V
RL = 8Ω
BW < 80kHz
THD+N ≤ 1%
0.05
0
0
0.1
0.2
0.3
0.4
0.5
0.6
0
0.1
0.2
0.3
0.4
0.5
Output Pow er (W)
Output Pow er (W)
Pow er Supply Rejection Ratio vs. Frequency
Pow er Supply Rejection Ratio vs. Frequency
-40
-40
-60
-60
-80
-80
V+ = 5.0V, RL = 8Ω
Input 10Ω Terminated
200mVP-P
V+ = 3.0V, RL = 8Ω
Input 10Ω Terminated
200mVP-P
-100
-120
-100
-120
0.01
0.1
1
10
100
0.01
0.1
1
10
100
Frequency (kHz)
Frequency (kHz)
THD+N vs. Frequency
Common Mode Rejection Ratio vs. Frequency
-20
-40
1
0.1
-60
-80
0.01
0.001
V+ = 5.0V, RL = 8Ω
Input 10Ω Terminated
200mVP-P
V+ = 5.0V, RL = 8Ω
-100
-120
PO = 600mW
No filters
0.01
0.1
1
10
100
0.01
0.1
1
10
100
Frequency (kHz)
Frequency (kHz)
SG Micro Corp
www.sg-micro.com
MARCH 2017
5
1.3W Fully Differential
Audio Power Amplifier
SGM4895
TYPICAL PERFORMANCE CHARACTERISTICS (continued)
At TA = +25℃, AV = 1, f = 1kHz, CB = 1µF, unless otherwise noted.
Output Pow er vs. Supply Voltage
RL = 8Ω
Clipping (Dropout) Voltage vs. Supply Voltage
2.5
2
0.5
0.4
0.3
0.2
0.1
0
RL = 8Ω
Top
1.5
1
THD+N = 10%
Bottom
THD+N = 1%
0.5
0
2.5
3
3.5
4
4.5
5
5.5
2.5
3
3.5
4
4.5
5
5.5
Supply Voltage (V)
Supply Voltage (V)
Pow er Dissipation vs. Output Pow er
Output Pow er vs. Supply Voltage
RL = 4Ω
1.6
1.4
1.2
1
2.5
2
THD+N = 10%
1.5
1
V+ = 5.0V
RL = 4Ω
BW < 80kHz
THD+N ≤ 1%
0.8
0.6
0.4
THD+N = 1%
0.5
0
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
5.5
Output Pow er (W)
Supply Voltage (V)
SG Micro Corp
www.sg-micro.com
MARCH 2017
6
1.3W Fully Differential
Audio Power Amplifier
SGM4895
TYPICAL APPLICATIONS
RF
20kΩ
To
Battery
CS
1µF
V+
CI
0.39µF
RI
20kΩ
IN1
_
To External Power
VO1
10kΩ
VIH
Supply or Control I/O
SHDN
+
Bias
Circuitry
V+ /2
VIL
Bypass
CB
_
1µF (Optional)
RL = 8Ω
VO2
+
IN2
RI
20kΩ
CI
0.39µF
GND
RF
20kΩ
NOTE: A 10kΩ resistor must be serially connected to
pin.
SHDN
Figure 1. Typical Differential Input Application Schematic
SG Micro Corp
www.sg-micro.com
MARCH 2017
7
1.3W Fully Differential
Audio Power Amplifier
SGM4895
TYPICAL APPLICATIONS (continued)
RF
20kΩ
To
Battery
CS
1µF
V+
CI
0.39µF
RI
20kΩ
IN1
_
Audio Input
To External Power
VO1
10kΩ
VIH
Supply or Control I/O
SHDN
+
Bias
Circuitry
V+ /2
VIL
Bypass
CB
_
1µF (Optional)
RL = 8Ω
VO2
+
IN2
RI
20kΩ
CI
0.39µF
GND
RF
20kΩ
NOTE: A 10kΩ resistor must be serially connected to
pin.
SHDN
Figure 2. Single-Ended Input Application Schematic
SG Micro Corp
www.sg-micro.com
MARCH 2017
8
1.3W Fully Differential
Audio Power Amplifier
SGM4895
APPLICATION NOTES
PCB Design Recommendations (Thermal Design Considerations)
With proper thermal design considerations, SGM4895YDB8 is capable of delivering 1.6W of continuous average
power into a 4Ω load at 5V power supply.
Thermal Land
The TDFN-3×3-8L thermal land is a metal (normally copper) region centrally located under the package and on top
of the PCB. It has a rectangular or square shape and should match the dimensions of the exposed pad on the
bottom of the package (1:1 ratio).
For certain high power applications, the PCB land may be modified to a "dog bone" shape that enhances thermal
performance. The packages used with the "dog bone" lands will be a dual inline configuration (see Figure 3).
Top View
Figure 3. Dog Bone
Thermal Vias
Thermal vias are necessary. They conduct heat from the exposed pad of the package to the ground plane. The
number of vias is application specific and is dependent upon electrical requirements and power dissipation.
The via diameter should be 0.2mm to 0.33mm with 1oz. copper via barrel plating. It is important to plug the via to
avoid any solder wicking inside the via during the soldering process. The thermal vias can be tented with solder
mask on the top surface of the PCB. The solder mask diameter should be at least 75microns (or 3mils) larger than
the via diameter. The solder mask thickness should be the same across the entire PCB.
A package thermal performance may be improved by increasing the number of vias.
SG Micro Corp
www.sg-micro.com
MARCH 2017
9
PACKAGE INFORMATION
PACKAGE OUTLINE DIMENSIONS
TDFN-3×3-8L
D
e
N8
D1
k
E
E1
N4
N1
L
b
BOTTOM VIEW
TOP VIEW
2.3
1.5 2.725
A
A1
A2
0.675
SIDE VIEW
0.65
0.24
RECOMMENDED LAND PATTERN (Unit: mm)
Dimensions
In Millimeters
Dimensions
In Inches
Symbol
MIN
MAX
0.800
0.050
MIN
0.028
0.000
MAX
0.031
0.002
A
A1
A2
D
0.700
0.000
0.203 REF
0.008 REF
2.900
2.200
2.900
1.400
3.100
2.400
3.100
1.600
0.114
0.087
0.114
0.055
0.122
0.094
0.122
0.063
D1
E
E1
k
0.200 MIN
0.650 TYP
0.008 MIN
0.026 TYP
b
0.180
0.375
0.300
0.575
0.007
0.015
0.012
0.023
e
L
SG Micro Corp
www.sg-micro.com
TX00058.000
PACKAGE INFORMATION
PACKAGE OUTLINE DIMENSIONS
MSOP-8 (Exposed Pad)
D1
1.80
E1
E
E2
1.55 4.8
1.02
b
e
0.65
0.41
RECOMMENDED LAND PATTERN (Unit: mm)
D
L
A
c
A1
θ
A2
Dimensions
In Millimeters
Dimensions
In Inches
Symbol
MIN
MAX
MIN
MAX
0.043
0.006
0.037
0.015
0.009
0.122
0.075
A
A1
A2
b
0.820
0.020
0.750
0.250
0.090
2.900
1.700
1.100
0.150
0.950
0.380
0.230
3.100
1.900
0.032
0.001
0.030
0.010
0.004
0.114
0.067
c
D
D1
e
0.65 BSC
0.026 BSC
E
2.900
4.750
1.450
0.400
0°
3.100
5.050
1.650
0.800
6°
0.114
0.187
0.057
0.016
0°
0.122
0.199
0.065
0.031
6°
E1
E2
L
θ
SG Micro Corp
www.sg-micro.com
TX00016.000
PACKAGE INFORMATION
TAPE AND REEL INFORMATION
REEL DIMENSIONS
TAPE DIMENSIONS
P2
P0
W
Q2
Q4
Q2
Q4
Q2
Q4
Q1
Q3
Q1
Q3
Q1
Q3
B0
Reel Diameter
P1
A0
K0
Reel Width (W1)
DIRECTION OF FEED
NOTE: The picture is only for reference. Please make the object as the standard.
KEY PARAMETER LIST OF TAPE AND REEL
Reel Width
Reel
Diameter
A0
B0
K0
P0
P1
P2
W
Pin1
Package Type
W1
(mm)
(mm) (mm) (mm) (mm) (mm) (mm) (mm) Quadrant
TDFN-3×3-8L
13″
13″
12.4
12.4
3.35
5.20
3.35
3.30
1.13
1.50
4.0
4.0
8.0
8.0
2.0
2.0
12.0
12.0
Q1
Q1
MSOP-8
(Exposed Pad)
SG Micro Corp
www.sg-micro.com
TX10000.000
PACKAGE INFORMATION
CARTON BOX DIMENSIONS
NOTE: The picture is only for reference. Please make the object as the standard.
KEY PARAMETER LIST OF CARTON BOX
Length
(mm)
Width
(mm)
Height
(mm)
Reel Type
Pizza/Carton
13″
386
280
370
5
SG Micro Corp
www.sg-micro.com
TX20000.000
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