SGM4546 [SGMICRO]

Dual-Channel, High Speed, High SPL Piezo-Sounder Driver;
SGM4546
型号: SGM4546
厂家: Shengbang Microelectronics Co, Ltd    Shengbang Microelectronics Co, Ltd
描述:

Dual-Channel, High Speed, High SPL Piezo-Sounder Driver

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中文:  中文翻译
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SGM4546  
Dual-Channel, High Speed,  
High SPL Piezo-Sounder Driver  
GENERAL DESCRIPTION  
FEATURES  
The SGM4546 is matched dual-channel high speed,  
high sound pressure level (SPL) piezo-sounder driver  
which is integrated boost DC/DC to achieve high driven  
voltage. The unique circuit design provides excellent  
performance for delivering 2A peak current to highly  
capacitive loads.  
Integrated Boost DC/DC to Achieve 26V (MAX)  
Driven Voltage  
2A Peak Driven Current to Drive Capacitive Loads  
Power Supply Voltage Range: 1.8V to 5.5V  
High Speed Driver  
Very Short Rise Time and Fall Time  
Improved Response Times  
To reduce problems with time and clock skew,  
SGM4546 is a good choice, with matching delays and  
maintaining integrity of input to output pulse-widths.  
Matching rise/fall delay times improve the drive  
capability and speed. Non-overlapping drive technology  
is used to minimize the dynamic switching loss.  
Matched Rise Time and Fall Time  
Independent Enable Control for Each Channel  
Reduced Clock Skew between Dual Channels  
Output is at Low under UVLO Protection,  
Enable Pin Floating or Disable Status  
High Noise Immunity  
In order to get higher volume sound from piezo-  
Sounder, boost DC/DC is integrated to provide high  
driven voltage. The tiny packages make the device very  
suitable for space limited applications.  
Improved Clocking Rate  
Low Supply Current and Output Impedance  
-40to +85Operating Temperature Range  
Available in Green TSSOP-16 (Exposed Pad)  
and TDFN-3×3-14L Packages  
The SGM4546 is available in Green TDFN-3×3-14L  
and TSSOP-16 (Exposed Pad) packages. It operates  
over an ambient temperature range of -40to +85.  
APPLICATION  
Piezo-Sounder Driver  
LOGIC SYMBOL  
FUNCTION TABLE  
ENA  
ENB  
INA  
L
INB  
L
nOUTA nOUTB  
ENA  
H
H
H
H
L
L
L
L
H
L
H
L
L
L
INA  
nOUTA  
nOUTB  
H
H
L
H
H
H
H
L
ENB  
INB  
H
L
H
L
H
H
H/L  
H/L  
H/L  
H/L  
Floating  
Floating  
SG Micro Corp  
FEBRUARY 2023 – REV. A. 2  
www.sg-micro.com  
Dual-Channel, High Speed,  
SGM4546  
High SPL Piezo-Sounder Driver  
PACKAGE/ORDERING INFORMATION  
SPECIFIED  
TEMPERATURE  
RANGE  
PACKAGE  
DESCRIPTION  
ORDERING  
NUMBER  
PACKAGE  
MARKING  
PACKING  
OPTION  
MODEL  
SGM  
4546DK  
XXXXX  
SGM4546  
YPTS16  
XXXXX  
TDFN-3×3-14L  
SGM4546YTDK14G/TR  
Tape and Reel, 4000  
Tape and Reel, 4000  
-40to +85℃  
-40to +85℃  
SGM4546  
TSSOP-16  
(Exposed Pad)  
SGM4546YPTS16G/TR  
MARKING INFORMATION  
NOTE: XXXXX = Date Code and Vendor Code.  
X X X X X  
Vendor Code  
Date Code - Week  
Date Code - Year  
Green (RoHS & HSF): SG Micro Corp defines "Green" to mean Pb-Free (RoHS compatible) and free of halogen substances. If  
you have additional comments or questions, please contact your SGMICRO representative directly.  
OVERSTRESS CAUTION  
ABSOLUTE MAXIMUM RATINGS  
Input Supply Voltage (Boost DC/DC)................... -0.3V to 6V  
EN and FB Pin Voltages......................................-0.3V to VIN  
SW Switch Voltage ..........................................................40V  
VCC to GND ...................................................... -0.3V to 28V  
ENA, ENB to GND............................................... -0.3V to 6V  
INA, INB to GND......................................-0.3V to VCC + 0.3V  
Combined Peak Output Current.........................................4A  
Package Thermal Resistance  
Stresses beyond those listed in Absolute Maximum Ratings  
may cause permanent damage to the device. Exposure to  
absolute maximum rating conditions for extended periods  
may affect reliability. Functional operation of the device at any  
conditions beyond those indicated in the Recommended  
Operating Conditions section is not implied.  
ESD SENSITIVITY CAUTION  
TDFN-3×3-14L, θJA ................................................ 80/W  
TSSOP-16 (Exposed Pad), θJA .............................. 50/W  
Junction Temperature.................................................+150℃  
Storage Temperature Range.......................-65to +150℃  
Lead Temperature (Soldering, 10s)............................+260℃  
ESD Susceptibility  
This integrated circuit can be damaged if ESD protections are  
not considered carefully. SGMICRO recommends that all  
integrated circuits be handled with appropriate precautions.  
Failureto observe proper handlingand installation procedures  
can cause damage. ESD damage can range from subtle  
performance degradation tocomplete device failure. Precision  
integrated circuits may be more susceptible to damage  
because even small parametric changes could cause the  
device not to meet the published specifications.  
HBM.............................................................................4000V  
MM.................................................................................200V  
CDM ............................................................................1000V  
RECOMMENDED OPERATING CONDITIONS  
Operating Temperature Range......................-40to +85℃  
Operating Junction Temperature Range......-40to +125℃  
Input Voltage Range...........................................1.8V to 5.5V  
DISCLAIMER  
SG Micro Corp reserves the right to make any change in  
circuit design, or specifications without prior notice.  
SG Micro Corp  
www.sg-micro.com  
FEBRUARY 2023  
2
Dual-Channel, High Speed,  
SGM4546  
High SPL Piezo-Sounder Driver  
PIN CONFIGURATIONS  
(TOP VIEW)  
(TOP VIEW)  
ENA  
INA  
ENB  
1
2
3
4
5
6
7
8
16  
15  
14  
13  
12  
11  
ENA  
INA  
1
2
3
4
5
6
7
14 ENB  
nOUTA  
13 nOUTA  
12 VCC  
11 nOUTB  
10 INB  
GND  
VCC  
GND  
NC  
nOUTB  
INB  
NC  
SW  
GND  
GND  
SW  
FB  
EN  
NC  
GND  
VIN  
NC  
GND  
VIN  
9
8
FB  
10  
9
EN  
TDFN-3×3-14L  
TSSOP-16 (Exposed Pad)  
PIN DESCRIPTION  
PIN  
NAME  
FUNCTION  
TSSOP-16  
(Exposed Pad)  
TDFN-3×3-14L  
Enable Input for Channel A. A high signal on this pin will enable the channel  
A output. Logic low or floating will disable the output of channel A, regardless  
of the INA logic is high or low.  
1
1
ENA  
2
3, 6  
4
2
3, 6  
4, 8, 9  
5
INA  
GND  
NC  
Input for Channel A. Inverting channel input.  
Ground.  
No Connection.  
Switch Node. Drain connection of internal power MOSFET. Connect it to the  
inductor and Schottky diode.  
5
SW  
VIN  
EN  
7
7
Power Supply. Must be closely decoupled to GND with a capacitor.  
Enable Pin. When the EN pin is pulled to ground, the device will be shut  
down, and the supply current will be less than 1μA. Do not leave it floating.  
8
10  
9
11  
FB  
Feedback Pin. An external resistor divider programs the output voltage.  
Input for Channel B. Inverting channel input.  
10  
11  
12  
13  
12  
INB  
13  
nOUTB Output of Channel B.  
VCC Supply Input of Driver.  
14  
15  
nOUTA Output of Channel A.  
Enable Input for Channel B. A high signal on this pin will enable the channel  
14  
16  
ENB  
B output. Logic low or floating will disable the output of channel B,  
regardless of the INB logic is high or low.  
Exposed  
Pad  
Exposed  
Pad  
GND  
Ground.  
SG Micro Corp  
www.sg-micro.com  
FEBRUARY 2023  
3
PACKAGE INFORMATION  
PACKAGE OUTLINE DIMENSIONS  
TSSOP-16 (Exposed Pad)  
3.0  
D
D1  
2.3  
E1  
E
E2  
5.94  
1.78  
0.42  
e
b
0.65  
RECOMMENDED LAND PATTERN (Unit: mm)  
L
A
A1  
θ
A2  
H
c
Dimensions  
In Millimeters  
Dimensions  
In Inches  
Symbol  
MIN  
MAX  
MIN  
MAX  
0.043  
0.006  
0.039  
0.012  
0.008  
0.201  
0.122  
0.177  
0.258  
0.094  
A
A1  
A2  
b
1.100  
0.150  
1.000  
0.300  
0.200  
5.100  
3.100  
4.500  
6.550  
2.400  
0.050  
0.800  
0.190  
0.090  
4.900  
2.900  
4.300  
6.250  
2.200  
0.002  
0.031  
0.007  
0.004  
0.193  
0.114  
0.169  
0.246  
0.087  
c
D
D1  
E
E1  
E2  
e
0.650 BSC  
0.25 TYP  
0.026 BSC  
0.01 TYP  
L
0.500  
1°  
0.700  
7°  
0.02  
1°  
0.028  
7°  
H
θ
NOTES:  
1. Body dimensions do not include mode flash or protrusion.  
2. This drawing is subject to change without notice.  
SG Micro Corp  
TX00024.000  
www.sg-micro.com  
PACKAGE INFORMATION  
PACKAGE OUTLINE DIMENSIONS  
TDFN-3×3-14L  
NOTES:  
1. All linear dimensions are in millimeters.  
2. This drawing is subject to change without notice.  
SG Micro Corp  
TX00064.000  
www.sg-micro.com  
PACKAGE INFORMATION  
TAPE AND REEL INFORMATION  
REEL DIMENSIONS  
TAPE DIMENSIONS  
P2  
P0  
W
Q2  
Q4  
Q2  
Q4  
Q2  
Q4  
Q1  
Q3  
Q1  
Q3  
Q1  
Q3  
B0  
Reel Diameter  
P1  
A0  
K0  
Reel Width (W1)  
DIRECTION OF FEED  
NOTE: The picture is only for reference. Please make the object as the standard.  
KEY PARAMETER LIST OF TAPE AND REEL  
Reel Width  
Reel  
Diameter  
A0  
B0  
K0  
P0  
P1  
P2  
W
Pin1  
Package Type  
W1  
(mm)  
(mm) (mm) (mm) (mm) (mm) (mm) (mm) Quadrant  
TSSOP-16  
(Exposed Pad)  
13″  
13″  
12.4  
12.4  
6.80  
3.35  
5.40  
3.35  
1.50  
1.13  
4.0  
4.0  
8.0  
8.0  
2.0  
2.0  
12.0  
12.0  
Q1  
Q1  
TDFN-3×3-14L  
SG Micro Corp  
TX10000.000  
www.sg-micro.com  
PACKAGE INFORMATION  
CARTON BOX DIMENSIONS  
NOTE: The picture is only for reference. Please make the object as the standard.  
KEY PARAMETER LIST OF CARTON BOX  
Length  
(mm)  
Width  
(mm)  
Height  
(mm)  
Reel Type  
Pizza/Carton  
13″  
386  
280  
370  
5
SG Micro Corp  
www.sg-micro.com  
TX20000.000  

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