SGM2593D [SGMICRO]
Power Distribution Switch;
| 型号： | SGM2593D |
| 厂家： | 
Shengbang Microelectronics Co, Ltd |
| 描述： | Power Distribution Switch |
| 文件： | 总14页 (文件大小：780K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SGM2593D
Power Distribution Switch
GENERAL DESCRIPTION
FEATURES
The SGM2593D is a single channel power distribution
switch. The switch controlled by the EN pin operates
from 2.5V to 6V supply voltage. It can be used in USB
power distribution applications.
● High-side N-MOSFET
● On-Resistance: 60mΩ (TYP)
● Programmable Current Limit Range: 0.1A to 3A
1.5A at RILIM = 4.53kΩ
● Input Voltage Range: 2.5V to 6V
● Quiescent Current: 27μA (TYP)
● Shutdown Current: 0.28μA (TYP)
● Soft-Start Function
The SGM2593D integrates programmable current limit
to protect the upstream power supply from damage
during over-current or short-circuit condition.
The device has the function of over-temperature
protection. When the junction temperature exceeds
+151℃, the device will be turned off and the internal
MOSFET will remain off until the temperature drops to
+105℃. In current limit mode, the over-temperature
protection will shut down the output if the maintaining
time of over-current state is long enough to cause the
junction temperature exceeds +128℃. The internal
switch will not be turned on until the temperature drops
below +105℃.
● Over-Temperature Protection
● Under-Voltage Lockout Protection for VIN
● No Reversed Leakage Current (Reverse Blocking)
● Fault Flag (nFAULT Pin)
● Quick Output Discharge
● 1.2MΩ Pull-Down Resistor at EN Pin
● Available in a Green TDFN-2×2-6AL Package
APPLICATIONS
General Purpose Power Switching
USB Bus/Self-Powered Hub
USB Peripheral
The device is designed with soft-start circuit to cope
with inrush currents when large capacitive loads are
connected. The nFAULT output will be asserted to low
level during over-current, over-temperature or reverse
voltage condition.
ACPI Power Distribution
Smart Phone
LCD TV
The SGM2593D further reduces the total solution size
by integrating a 47Ω pull-down resistor for output
discharge when the switch is shut down by EN.
TYPICAL APPLICATION
VIN
VIN
RnFAULT
VOUT
VOUT
The SGM2593D is available in a Green TDFN-2×2-6AL
package.
CIN
10μF
SGM2593D
COUT
10μF
nFAULT
EN
ILIM
On
Off
GND
RILIM
Figure 1. Typical Application Circuit
SG Micro Corp
APRIL2023–REV. A. 1
www.sg-micro.com
SGM2593D
Power Distribution Switch
PACKAGE/ORDERING INFORMATION
SPECIFIED
TEMPERATURE
RANGE
PACKAGE
DESCRIPTION
ORDERING
NUMBER
PACKAGE
MARKING
PACKING
OPTION
MODEL
05O
XXXX
SGM2593D
TDFN-2×2-6AL
SGM2593DXTDI6G/TR
Tape and Reel, 3000
-40℃ to +125℃
MARKING INFORMATION
NOTE: XXXX = Date Code, Trace Code and Vendor Code.
TDFN-2×2-6AL
Serial Number
Y Y Y
X X X X
Vendor Code
Trace Code
Date Code - Year
Green (RoHS & HSF): SG Micro Corp defines "Green" to mean Pb-Free (RoHS compatible) and free of halogen substances. If
you have additional comments or questions, please contact your SGMICRO representative directly.
OVERSTRESS CAUTION
ABSOLUTE MAXIMUM RATINGS
Stresses beyond those listed in Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to
absolute maximum rating conditions for extended periods
may affect reliability. Functional operation of the device at any
conditions beyond those indicated in the Recommended
Operating Conditions section is not implied.
VIN..................................................................................6.5V
All Other Pins.....................................................................6V
nFAULT Current............................................................25mA
Package Thermal Resistance
TDFN-2×2-6AL, θJA ................................................ 83℃/W
Junction Temperature.................................................+150℃
Storage Temperature Range........................-65℃ to +150℃
Lead Temperature (Soldering, 10s)............................+260℃
ESD Susceptibility
ESD SENSITIVITY CAUTION
This integrated circuit can be damaged if ESD protections are
not considered carefully. SGMICRO recommends that all
integrated circuits be handled with appropriate precautions.
Failureto observe proper handlingand installation procedures
can cause damage. ESD damage can range from subtle
performance degradation tocomplete device failure. Precision
integrated circuits may be more susceptible to damage
because even small parametric changes could cause the
device not to meet the published specifications.
HBM.............................................................................2000V
CDM ............................................................................1000V
RECOMMENDED OPERATING CONDITIONS
Input Voltage Range..............................................2.5V to 6V
EN Voltage Range............................................ -0.3V to 5.5V
All Other Pins.........................................................0V to 5.5V
Operating Junction Temperature Range.......-40℃ to +125℃
DISCLAIMER
SG Micro Corp reserves the right to make any change in
circuit design, or specifications without prior notice.
SG Micro Corp
www.sg-micro.com
APRIL 2023
2
SGM2593D
Power Distribution Switch
PIN CONFIGURATION
SGM2593D (TOP VIEW)
VOUT
ILIM
1
2
3
6
5
4
VIN
GND
EN
GND
nFAULT
TDFN-2×2-6AL
PIN DESCRIPTION
PIN
NAME
FUNCTION
1
VOUT
Output Voltage.
Current Limit Programming Pin. Connect a resistor RILIM from this pin to GND to set the
overload current limit threshold:
6612
2
ILIM
ILIM
=
(A)
0.982
RILIM
If the ILIM pin is connected to GND directly, the current limit function is not available.
Active-Low Open-Drain Output. It is asserted during over-current, over-temperature or reverse
voltage condition.
Chip Enable. Active-high for SGM2593D. It has integrated a 1.2MΩ pull-down resistor at this
pin.
3
4
nFAULT
EN
5
6
GND
VIN
Ground.
Power Input Voltage.
Exposed
Pad
GND
Device Ground. The exposed pad must be connected to ground.
SG Micro Corp
www.sg-micro.com
APRIL 2023
3
SGM2593D
Power Distribution Switch
ELECTRICAL CHARACTERISTICS
(TJ = -40℃ to +125℃, typical values are at TJ = +25℃, VIN = 5V, unless otherwise noted.)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX UNITS
Input Voltage Range
VIN
2.5
6
V
V
VUVLO
VIN rising
2.23
96
2.4
Under-Voltage Lockout Threshold
VUVLO_HYS VIN falling
mV
μA
μA
Quiescent Current
Shutdown Current
IQ
Switch on, VOUT = Open
Switch off, VOUT = Open
27
55
ISD
0.28
1.6
Switch off, VOUT = 6V, VIN = 0V,
TJ = -40℃ to +125℃
Switch off, VOUT = 6V, VIN = 0V,
TJ = -40℃ to +85℃
0.21
0.21
10
Output Leakage Current
ILEAKAGE
μA
1.5
VIH
VIL
1.2
Enable Input Threshold
V
0.4
Pull-Down Resistor at EN Pin
On-Resistance
RPULL_DOWN
RDSON
tON
1.2
60
MΩ
mΩ
ms
μs
IOUT = 200mA
100
Output Turn-On Delay Time
Output Turn-Off Delay Time
Output Turn-On Rise Time
RL = 100Ω, COUT = 0.1μF
RL = 100Ω, COUT = 0.1μF
RL = 100Ω, COUT = 0.1μF
RL = 100Ω, COUT = 0.1μF
Force the chip into current limit mode
1.13
37
tOFF
tR
1.4
ms
μs
Output Turn-Off Fall Time
tF
25
Over-Current nFAULT Response Delay Time
Reverse nFAULT Response Delay Time
tD
14
ms
ms
tD_REV
3
125
135
185
185
410
410
1010
1010
1500
1500
1980
1980
2480
2480
2890
2890
23
245
235
R
ILIM = 38kΩ, TJ = -40℃ to +125℃
RILIM = 38kΩ, TJ = +25℃
345
470
RILIM = 17kΩ, TJ = -40℃ to +125℃
RILIM = 17kΩ, TJ = +25℃
356
460
915
1095
1074
1615
1588
2140
2104
2680
2637
3125
3077
RILIM = 6.8kΩ, TJ = -40℃ to +125℃
RILIM = 6.8kΩ, TJ = +25℃
940
1375
1412
1806
1857
2262
2325
2645
2712
RILIM = 4.53kΩ, TJ = -40℃ to +125℃
RILIM = 4.53kΩ, TJ = +25℃
RILIM = 3.4kΩ, TJ = -40℃ to +125℃
RILIM = 3.4kΩ, TJ = +25℃
Current Limit Threshold
ILIM
mA
RILIM = 2.7kΩ, TJ = -40℃ to +125℃
RILIM = 2.7kΩ, TJ = +25℃
RILIM = 2.3kΩ, TJ = -40℃ to +125℃
RILIM = 2.3kΩ, TJ = +25℃
Reverse Protection Threshold
Reverse Protection Threshold Hysteresis
nFAULT Output Resistance
VREV
VREV_HYS
RnFAULT
InFAULT
RDIS
VOUT-VIN rising
mV
mV
Ω
15
nFAULT is low and ISINK = 10mA
nFAULT is high
20
nFAULT Leakage Current
0.8
nA
Ω
VOUT Shutdown Discharge Resistance
Switch off, sink 2mA into OUT
TJ increasing
47
151
128
46
Thermal Shutdown Temperature
Thermal Shutdown Hysteresis
TSD
℃
℃
TJ increasing, only in the current limit mode.
THYS
Only in the current limit mode.
23
SG Micro Corp
www.sg-micro.com
APRIL 2023
4
SGM2593D
Power Distribution Switch
TYPICAL PERFORMANCE CHARACTERISTICS
Current Limit vs. Input Voltage
Current Limit vs. Temperature
4200
3500
2800
2100
1400
700
4200
3500
2800
2100
1400
700
TJ = +25℃
RILIM = 2.7kΩ RILIM = 6.8kΩ
RILIM = 3.4kΩ RILIM = 17kΩ
VIN = 5V
RILIM = 2.3kΩ RILIM = 6.8kΩ
RILIM = 2.7kΩ RILIM = 17kΩ
RILIM = 38kΩ
RILIM = 38kΩ
RILIM = 4.53kΩ
RILIM = 3.4kΩ
RILIM = 4.53kΩ
0
0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
-50
-25
0
25
50
75
100 125
Input Voltage (V)
Temperature (℃)
Output Leakage Current vs. Temperature
VIN = 2.5V
VIN = 3.3V
VIN = 5V
VIN = 6V
Quiescent Current vs. Temperature
VIN = 2.5V
VIN = 3.3V
VIN = 5V
VIN = 6V
0.6
0.5
0.4
0.3
0.2
0.1
0
44
40
36
32
28
24
20
-50
-25
0
25
50
75
100 125
-50
-25
0
25
50
75
100 125
Temperature (℃)
Temperature (℃)
Shutdown Current vs. Temperature
VIN = 2.5V
VIN = 3.3V
VIN = 5V
VIN = 6V
VOUT Shutdown Discharge Resistance vs. Temperature
76
1.2
1.0
0.8
0.6
0.4
0.2
0.0
VIN = 2.5V
VIN = 3.3V
VIN = 5V
70
64
58
52
46
40
-50
-25
0
25
50
75
100 125
-50
-25
0
25
50
75
100 125
Temperature (℃)
Temperature (℃)
SG Micro Corp
www.sg-micro.com
APRIL 2023
5
SGM2593D
Power Distribution Switch
TYPICAL PERFORMANCE CHARACTERISTICS (continued)
Reverse Protection Threshold vs. Temperature
On-Resistance vs. Temperature
30
28
26
24
22
20
18
160
140
120
100
80
VIN = 2.5V
VIN = 3.3V
VIN = 5V
VOUT-VIN rising
VIN = 2.5V
VIN = 3.3V
VIN = 5V
VIN = 6V
60
40
-50
-25
0
25
50
75
100 125
-50
-25
0
25
50
75
100 125
Temperature (℃)
Temperature (℃)
Turn-On Delay and Rise Time
Turn-Off Delay and Fall Time
VIN
VIN
VOUT
VOUT
VEN
IOUT
VEN
IOUT
CIN = 1μF, COUT = 10μF, RL = 100Ω, VIN = 5V
CIN = 1μF, COUT = 10μF, RL = 100Ω, VIN = 5V
Time (1ms/div)
Time (500μs/div)
No Load to Output Short Transient Response
Output Short to No Load Recovery Response
CIN = 1μF, COUT = 10μF, RILIM = 2.7kΩ, VIN = 5V
CIN = 1μF, COUT = 10μF, RILIM = 2.7kΩ, VIN = 5V
VIN
VIN
VOUT
VOUT
VnFAULT
VnFAULT
IOUT
IOUT
Time (10ms/div)
Time (10ms/div)
SG Micro Corp
www.sg-micro.com
APRIL 2023
6
SGM2593D
Power Distribution Switch
FUNCTIONAL BLOCK DIAGRAM
VIN
ILIM
EN
Current
Limit
RPULL-DOWN
1.2MΩ
Reverse
UVLO
Gate
Control
Charge
Pump
Oscillator
VOUT
Thermal
Fault
Shutdown
Delay
nFAULT
1.2V
Reference
SGM2593D
GND
Figure 2. SGM2593D Block Diagram
SG Micro Corp
www.sg-micro.com
APRIL 2023
7
SGM2593D
Power Distribution Switch
TIMING DIAGRAMS
50%
VEN
50%
tON
tOF F
90%
90%
tR
VOUT
10%
10%
tF
Figure 3. Switch Turn-On and Turn-Off Times
VEN
Reverse
Removed
VIN
VOUT
ILIM
Overload
Removed
Over-Current
Reverse
Current
IOUT
VnFAULT
tD
tD
tD_REV
tD_REV
Figure 4. SGM2593D Fault Timing: Output Reset by Toggling EN
SG Micro Corp
www.sg-micro.com
APRIL 2023
8
SGM2593D
Power Distribution Switch
DETAILED DESCRIPTION
If the short-circuit state persists, the device will cycle on
and off under thermal protection as a result of power
dissipation.
Input and Output
VIN should be connected to the power source that is
the power supply of the internal logic circuitry and loads.
Normally, load current flows from VIN to VOUT. The
output MOSFET and driver circuit are designed to allow
the voltage of VOUT is higher than VIN, when the
device is turned off.
Fault Flag (nFAULT)
The SGM2593D is designed to achieve delayed
response via the internal delay "deglitch" circuit for
over-current (tD = 14ms, TYP) and reverse voltage
(3ms, TYP) conditions. The nFAULT pin indicates the
device enters and leaves the following fault state:
over-current, reverse voltage after the delay time (tD).
But nFAULT will be asserted to low level as soon as the
over-temperature condition occurs.
Thermal Shutdown (TSD)
In current limit mode, the internal switch will be shut
down if the junction temperature exceeds +128℃ to
protect the device from the damage caused by
excessive power dissipation. The switch will be turned
on again once the junction temperature falls below
+105℃.
The nFAULT is the structure of N-MOSFET open-drain
that outputs low level when an over-current,
over-temperature or reverse voltage condition occurs.
Figure 4 depicts the typical timing.
If there's no over-current condition, the thermal
shutdown threshold is +151℃ with 46℃ hysteresis.
When an over-current occurs, nFAULT will not be
asserted until the over-current persists for a delay time
(tD). This ensures that nFAULT will not be asserted due
to disturbances such as current jitter, thus avoids false
fault reports.
Soft-Start
The soft-start feature is used to limit inrush current
during start-up or hot-plug events so that the device
can cope with inrush current when connected to large
capacitive loads.
Reverse Voltage Protection
Under-Voltage Lockout (UVLO)
When the output voltage exceeds the input voltage by
23mV (TYP), the device turns off the internal
N-MOSFET to avoid the reverse current from the
output to input. Its hysteresis voltage is 15mV (TYP).
If the voltage on VIN pin falls below its under-voltage
lockout threshold, the device will be disabled. The
device resumes operation when the power supply goes
back above UVLO threshold.
Output Discharge
Current Limit and Short-Circuit Protection
The current limit protection circuit is designed to protect
the upstream power supply by limiting the output
current to the current limit threshold set by the RILIM
from ILIM to GND.
The SGM2593D integrates the output discharge
feature. When the EN pin is pulled low (below VIL), a
discharge resistance with a typical value of 47Ω is
connected between the VOUT and GND. This
resistance pulls down the output and prevents it from
floating when the device is disabled.
The current limit threshold is 40% discount of ILIM in
short-circuit state and the nFAULT pin will be asserted
after the device enters short-circuit state for tD (14ms).
SG Micro Corp
www.sg-micro.com
APRIL 2023
9
SGM2593D
Power Distribution Switch
APPLICATION INFORMATION
Current Limit Programming
Supply Filter Capacitor
It is recommended to use a 10μF capacitor between
VIN and GND close to the device pins. It can limit the
voltage drop of the input supply. Larger CIN can reduce
voltage dip in high current applications. Without an
input capacitor, short-circuit at the output will cause the
input voltage to ring, which may destroy the chip's
internal circuitry when the input transient voltage
exceeds the absolute maximum supply voltage (6.5V).
An external resistor (RILIM) placed between the ILIM pin
and GND sets the switch current limit threshold (ILIM).
The ILIM pin voltage is regulated by an internal control
loop. The current limit threshold is proportional to the
current pulled from the ILIM pin by the resistor. Use
short trace routes for the RILIM on the PCB to minimize
the impact of parasitics and noise on the accuracy of
the current limit setting.
6612
ILIM
=
(1)
0.982
RILIM
Output Filter Capacitor
To reduce EMI, improve the transient performance, and
minimize negative effects of resistance and inductance
between the bypass capacitor and the downstream
connector, a low-ESR 10μF ceramic capacitor between
VOUT and GND standard bypass methods are
recommended. If the output port is connected to the load
through a long cable, the parasitic inductance of the
cable may cause voltage to ring, whose negative ringing
may damage the chip, so an anti-parallel Schottky diode
such as BAT54 is recommended to connect in parallel
with the output.
Current Limit vs. RILIM
4200
3500
2800
2100
1400
700
VIN = 5V
PCB Layout Guidelines
0
A reasonable PCB layout is critical to the stable
performance of the SGM2593D. For best results, follow
the guidelines below.
0
4
8
12
16
20
24
28
RILIM (kΩ)
Keep the power traces as short and wide as
Figure 5. Current Limit Threshold (ILIM) vs. Current Limit
Programming Resistor (RILIM
possible, and use at least 2 ounces of copper.
)
Placing a ground plane under all circuits to reduce
resistance and inductance will improve DC and
transient performances.
Power Dissipation
Assuming a given ambient temperature and an output
current, the maximum allowable power dissipation is
calculated by:
Ensure that the input decoupling capacitors on VIN
have a minimal trace length to VIN and GND.
TJ(MAX) − TA
P
=
(2)
D(MAX)
θJA
Place the output capacitors as close to the
SGM2593D as possible to minimize the affect of
PCB parasitic inductance.
where:
PD(MAX) is the maximum power dissipation.
TJ(MAX) is the maximum operating junction temperature.
TA is the operating ambient temperature.
θJA is junction to air thermal impedance.
Please note that the thermal vias are placed under the
exposed pad of the device, thus allowing for thermal
dissipation away from the device.
SG Micro Corp
www.sg-micro.com
APRIL 2023
10
SGM2593D
Power Distribution Switch
REVISION HISTORY
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
APRIL 2023 ‒ REV.A to REV.A.1
Page
Updated Supply Filter Capacitor section............................................................................................................................................................10
Changes from Original (MARCH 2023) to REV.A
Page
Changed from product preview to production data.............................................................................................................................................All
SG Micro Corp
www.sg-micro.com
APRIL 2023
11
PACKAGE INFORMATION
PACKAGE OUTLINE DIMENSIONS
TDFN-2×2-6AL
D
e
N6
L
D1
E1
E
N3
N1
b
BOTTOM VIEW
TOP VIEW
1.60
0.55
1.00
2.60
A
A1
A2
SIDE VIEW
0.30
0.65
RECOMMENDED LAND PATTERN (Unit: mm)
Dimensions
In Millimeters
Dimensions
In Inches
Symbol
MIN
MAX
0.800
0.050
MIN
MAX
0.031
0.002
A
A1
A2
D
0.700
0.000
0.028
0.000
0.203 REF
0.008 REF
1.900
1.500
1.900
0.900
0.250
2.100
1.700
2.100
1.100
0.350
0.075
0.059
0.075
0.035
0.010
0.083
0.067
0.083
0.043
0.014
D1
E
E1
b
e
0.650 BSC
0.026 BSC
L
0.174
0.326
0.007
0.013
NOTE: This drawing is subject to change without notice.
SG Micro Corp
TX00132.000
www.sg-micro.com
PACKAGE INFORMATION
TAPE AND REEL INFORMATION
REEL DIMENSIONS
TAPE DIMENSIONS
P2
P0
W
Q2
Q4
Q2
Q4
Q2
Q4
Q1
Q3
Q1
Q3
Q1
Q3
B0
Reel Diameter
P1
A0
K0
Reel Width (W1)
DIRECTION OF FEED
NOTE: The picture is only for reference. Please make the object as the standard.
KEY PARAMETER LIST OF TAPE AND REEL
Reel Width
Reel
Diameter
A0
B0
K0
P0
P1
P2
W
Pin1
Package Type
W1
(mm)
(mm) (mm) (mm) (mm) (mm) (mm) (mm) Quadrant
TDFN-2×2-6AL
7″
9.5
2.30
2.30
1.10
4.0
4.0
2.0
8.0
Q2
SG Micro Corp
TX10000.000
www.sg-micro.com
PACKAGE INFORMATION
CARTON BOX DIMENSIONS
NOTE: The picture is only for reference. Please make the object as the standard.
KEY PARAMETER LIST OF CARTON BOX
Length
(mm)
Width
(mm)
Height
(mm)
Reel Type
Pizza/Carton
7″ (Option)
7″
368
442
227
410
224
224
8
18
SG Micro Corp
www.sg-micro.com
TX20000.000
相关型号：
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