SGM2555 [SGMICRO]

Power Distribution Switch;
SGM2555
型号: SGM2555
厂家: Shengbang Microelectronics Co, Ltd    Shengbang Microelectronics Co, Ltd
描述:

Power Distribution Switch

文件: 总12页 (文件大小:742K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
SGM2555  
Power Distribution Switch  
GENERAL DESCRIPTION  
FEATURES  
The SGM2555 is a single channel power distribution  
switch. The switch operates from a wide range of  
2.2V to 5.5V supply voltage, and is controlled by the  
EN pin. It can be used in USB power distribution  
applications.  
Input Voltage Range: 2.2V to 5.5V  
On-Resistance: 95mΩ (TYP)  
Continuous Current: 1.1A  
Current Limit: 1.85A  
Quiescent Current: 19μA  
Shutdown Current: 1μA (MAX)  
Full Set of Protections  
A 95mΩ low RON N-MOSFET is integrated. The small  
size and quiescent current make the device very  
suitable for space limited, battery-powered applications.  
Soft-Start  
Under-Voltage Lockout for VIN  
No Reversed Leakage Current  
Thermal Shutdown  
A number of protection features are provided in the  
device including soft-start, current limit of 1.85A and  
thermal shutdown. The internal reverse-voltage  
function will protect devices on the input side of the  
switch.  
Evaluated to IEC 60950-1, Ed 2, Am1, Annex CC,  
Test Program 1 with CB Report  
Available in a Green TDFN-2×2-6L Package  
The SGM2555 is available in a Green TDFN-2×2-6L  
package and is rated over the -40to +85℃  
temperature range.  
APPLICATIONS  
Digital TV  
Set-Top Boxes  
Portable Medical Equipment  
Battery Powered Equipment  
Hot-Plug Power Supply  
Motherboard USB Power Switch  
USB Device Power Switch  
TYPICAL APPLICATION  
1
6
VIN  
VIN  
VIN  
VOUT  
VOUT  
CIN  
1µF  
COUT  
1µF  
2
SGM2555  
5
3
VOUT  
EN  
Chip Enable  
GND  
4
SG Micro Corp  
DECEMBER 2017 – REV. A. 3  
www.sg-micro.com  
SGM2555  
Power Distribution Switch  
PACKAGE/ORDERING INFORMATION  
SPECIFIED  
TEMPERATURE  
RANGE  
PACKAGE  
DESCRIPTION  
ORDERING  
NUMBER  
PACKAGE  
MARKING  
PACKING  
OPTION  
MODEL  
2555  
XXXX  
SGM2555  
TDFN-2×2-6L  
SGM2555YTDI6G/TR  
Tape and Reel, 3000  
-40to +85℃  
MARKING INFORMATION  
NOTE: XXXX = Date Code.  
X X X X  
Date Code - Week  
Date Code - Year  
Green (RoHS & HSF): SG Micro Corp defines "Green" to mean Pb-Free (RoHS compatible) and free of halogen substances. If  
you have additional comments or questions, please contact your SGMICRO representative directly.  
ABSOLUTE MAXIMUM RATINGS  
ESD SENSITIVITY CAUTION  
Input Supply Voltage.............................................................6V  
EN Pin.....................................................................-0.3V to 6V  
Operating Temperature Range......................... -40to +85℃  
Package Thermal Resistance  
This integrated circuit can be damaged if ESD protections are  
not considered carefully. SGMICRO recommends that all  
integrated circuits be handled with appropriate precautions.  
Failure to observe proper handling and installation procedures  
can cause damage. ESD damage can range from subtle  
performance degradation to complete device failure. Precision  
integrated circuits may be more susceptible to damage  
because even small parametric changes could cause the  
device not to meet the published specifications.  
TDFN-2×2-6L, θJA.........................................................80/W  
Junction Temperature................................................... +150℃  
Storage Temperature Range.......................... -65to +150℃  
Lead Temperature (Soldering, 10s).............................. +260℃  
ESD Susceptibility  
HBM................................................................................2000V  
MM....................................................................................300V  
DISCLAIMER  
SG Micro Corp reserves the right to make any change in circuit  
OVERSTRESS CAUTION  
design, or specifications without prior notice.  
Stresses beyond those listed in Absolute Maximum Ratings  
may cause permanent damage to the device. Exposure to  
absolute maximum rating conditions for extended periods may  
affect reliability. Functional operation of the device at any  
conditions beyond those indicated in the Recommended  
Operating Conditions section is not implied.  
SG Micro Corp  
www.sg-micro.com  
DECEMBER 2017  
2
SGM2555  
Power Distribution Switch  
PIN CONFIGURATION  
(TOP VIEW)  
1
2
6
5
VIN  
VIN  
VOUT  
GND  
VOUT  
GND  
3
4
EN  
TDFN-2×2-6L  
PIN DESCRIPTION  
PIN  
NAME  
VIN  
FUNCTION  
1, 2  
Switch Input.  
3
EN  
Chip Enable Pin. Logic high to enable the device.  
4
GND  
VOUT  
GND  
Ground.  
5, 6  
Switch Output.  
Exposed Pad  
Exposed pad should be soldered to PCB board and connected to GND.  
SG Micro Corp  
www.sg-micro.com  
DECEMBER 2017  
3
SGM2555  
Power Distribution Switch  
ELECTRICAL CHARACTERISTICS  
(At TA = +25, VIN = 5V, CIN = COUT = 1μF, unless otherwise noted.)  
PARAMETER  
SYMBOL  
CONDITIONS  
MIN  
TYP  
MAX  
5.5  
27  
30  
1
UNITS  
Input Voltage Range  
VIN  
2.2  
V
VIN = 3V, VEN = 3V  
18  
19  
Quiescent Current  
IQ  
μA  
VIN = 5V, VEN = 5V  
VEN = 0V  
Shutdown Current  
ISD  
ILEAKAGE  
VIH  
0.1  
0.1  
μA  
μA  
Output Leakage Current  
VEN = 0V, VOUT = 0V  
1
1.5  
EN Input Threshold  
V
VIL  
0.4  
Output Turn-On Delay Time  
Switch Resistance  
tON  
RL = 30Ω, COUT = 1μF  
IL = 1A  
1.1  
95  
ms  
mΩ  
A
RDS(ON)  
ILIM  
ISHORT  
VUVLO  
160  
Current Limit Threshold  
RL = 2Ω  
1.85  
1.2  
1.65  
50  
Short-Circuit Output Current  
Under-Voltage Lockout Threshold  
Under-Voltage Lockout Threshold Hysteresis  
Thermal Shutdown Threshold  
Thermal Shutdown Hysteresis  
VOUT = 0V, VIN = 3V  
VIN Rising  
A
V
mV  
TJ increasing  
125  
20  
SG Micro Corp  
www.sg-micro.com  
DECEMBER 2017  
4
SGM2555  
Power Distribution Switch  
TYPICAL PERFORMANCE CHARACTERISTICS  
At TA = +25, VIN = VEN = 5V, CIN = COUT = 1μF, unless otherwise noted.  
Turn-On Response  
Turn-Off Response  
VEN  
VEN  
IOUT  
VOUT  
VOUT  
RL = 30Ω, COUT = 1μF  
RL = 30Ω, COUT = 1μF  
Time (40μs/div)  
Time (200μs/div)  
UVLO at Rising and Falling  
Soft-Start Short Circuit Response  
VIN  
VIN  
VOUT  
IOUT  
VIN = 5V, CIN = COUT = 1μF  
Time (100μs/div)  
RL = 30Ω, COUT = 1μF  
Time (20ms/div)  
Inrush Current Response  
Current Limit Response  
COUT = 100μF  
COUT = 33μF  
VOUT  
COUT = 1μF  
IL  
IOUT  
RL = 1Ω, VIN = 5V  
Time (100μs/div)  
VIN = 5V, COUT = 0.1μF, RL = 2Ω  
Time (10μs/div)  
SG Micro Corp  
www.sg-micro.com  
DECEMBER 2017  
5
SGM2555  
Power Distribution Switch  
TYPICAL PERFORMANCE CHARACTERISTICS (continued)  
At TA = +25, VIN = VEN = 5V, CIN = COUT = 1μF, unless otherwise noted.  
Ramped Load Response  
Thermal Shutdown Response  
VOUT = 5V  
VOUT  
VEN  
VOUT = 4.9V  
Current Limit Threshold  
CH3  
CH2  
IOUT  
IOUT = 1.1A  
Thermal Shutdown  
IOUT  
IOUT  
VIN = 5V, COUT = 1μF  
Time (2ms/div)  
CH3: IOUT @ RL = 1Ω; CH2: IOUT @ Short, VIN = 5V  
Time (40ms/div)  
Turn-On Delay Time vs. Temperature  
Turn-Off Delay Time vs. Temperature  
1.4  
1.3  
1.2  
1.1  
1.0  
0.9  
0.8  
110  
100  
90  
80  
70  
60  
VIN = 5V, RL = 30Ω, COUT = 1μF  
V
IN = 5V, RL = 30Ω, COUT = 1μF  
50  
-40 -20  
0
20  
40  
60  
80  
100  
-40 -20  
0
20  
40  
60  
80  
100  
Temperature ()  
Temperature ()  
Quiescent Supply Current vs. Input Voltage  
Quiescent Supply Current vs. Temperature  
VIN = 5V  
30  
25  
20  
15  
10  
5
30  
25  
20  
15  
10  
5
TA = 25  
0
0
-40  
-20  
0
20  
40  
60  
80  
100  
2
2.5  
3
3.5  
4
4.5  
5
5.5  
Input Voltage (V)  
Temperature ()  
SG Micro Corp  
www.sg-micro.com  
DECEMBER 2017  
6
SGM2555  
Power Distribution Switch  
TYPICAL PERFORMANCE CHARACTERISTICS (continued)  
At TA = +25, VIN = VEN = 5V, CIN = COUT = 1μF, unless otherwise noted.  
Switch Resistance vs. Temperature  
VIN = 5V  
Switch Resistance vs. Input Voltage  
TA = 25  
140  
120  
100  
80  
140  
120  
100  
80  
60  
60  
40  
40  
20  
20  
-40  
-20  
0
20  
40  
60  
80  
100  
2
2.5  
3
3.5  
4
4.5  
5
5.5  
Input Voltage (V)  
Temperature ()  
EN Threshold Voltage vs. Input Voltage  
Rising  
EN Threshold Voltage vs. Temperature  
VIN = 5V  
1.2  
1
1.2  
1
Rising  
0.8  
0.6  
0.4  
0.2  
0
0.8  
0.6  
0.4  
0.2  
0
Falling  
Falling  
TA = 25  
2
2.5  
3
3.5  
4
4.5  
5
5.5  
-40 -20  
0
20  
40  
60  
80  
100  
Input Voltage (V)  
Temperature ()  
Current Limit vs. Input Voltage  
TA = 25  
Current Limit vs. Temperature  
2.5  
2.3  
2.1  
1.9  
1.7  
1.5  
1.3  
2.5  
2.3  
2.1  
1.9  
1.7  
1.5  
1.3  
RL = 1Ω  
VIN = 5V, RL = 2Ω  
2
2.5  
3
3.5  
4
4.5  
5
5.5  
-40 -20  
0
20  
40  
60  
80  
100  
Input Voltage (V)  
Temperature ()  
SG Micro Corp  
www.sg-micro.com  
DECEMBER 2017  
7
SGM2555  
Power Distribution Switch  
TYPICAL PERFORMANCE CHARACTERISTICS (continued)  
At TA = +25, VIN = VEN = 5V, CIN = COUT = 1μF, unless otherwise noted.  
Short Circuit Output Current vs. Temperature  
VIN = 5V, VOUT = 0V  
Short Circuit Output Current vs. Input Voltage  
TA = 25  
2.2  
2.0  
1.8  
1.6  
1.4  
1.2  
1.0  
0.8  
2.2  
2.0  
1.8  
1.6  
1.4  
1.2  
1.0  
0.8  
2
2.5  
3
3.5  
4
4.5  
5
5.5  
-40 -20  
0
20  
40  
60  
80  
100  
Input Voltage (V)  
Temperature ()  
Shutdown Supply Current vs. Temperature  
VIN = 5V  
Output Leakage Current vs. Temperature  
VIN = 5V, VEN = 0V, VOUT = 0V  
0.6  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0
0.5  
0.4  
0.3  
0.2  
0.1  
0
-40  
-20  
0
20  
40  
60  
80  
100  
-40 -20  
0
20  
40  
60  
80  
100  
Temperature ()  
Temperature ()  
UVLO Threshold vs. Temperature  
VIN = 5V  
3
2.5  
2
1.5  
1
0.5  
0
-40 -20  
0
20  
40  
60  
80  
100  
Temperature ()  
SG Micro Corp  
www.sg-micro.com  
DECEMBER 2017  
8
SGM2555  
Power Distribution Switch  
REVISION HISTORY  
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.  
DECEMBER 2017 ‒ REV.A.2 to REV.A.3  
Update Feature section .......................................................................................................................................................................................1  
APRIL 2016 ‒ REV.A.1 to REV.A.2  
New version.......................................................................................................................................................................................................All  
JANUARY 2014 ‒ REV.A to REV.A.1  
Changed Electrical Characteristics section ........................................................................................................................................................4  
Changes from Original (MAY 2013) to REV.A  
Changed from product preview to production data.............................................................................................................................................All  
SG Micro Corp  
www.sg-micro.com  
DECEMBER 2017  
9
PACKAGE INFORMATION  
PACKAGE OUTLINE DIMENSIONS  
TDFN-2×2-6L  
D
e
N6  
D1  
L
E1  
E
SEE DETAIL A  
k
N3  
N1  
b
BOTTOM VIEW  
TOP VIEW  
1.40  
0.65  
A
A1  
0.80  
2.60  
A2  
SIDE VIEW  
0.24  
0.65  
N2  
N1  
N2  
N1  
RECOMMENDED LAND PATTERN (Unit: mm)  
DETAIL A  
Pin #1 ID and Tie Bar Mark Options  
NOTE: The configuration of the Pin #1 identifier is optional,  
but must be located within the zone indicated.  
Dimensions  
In Millimeters  
Dimensions  
In Inches  
Symbol  
MIN  
MAX  
0.800  
0.050  
MIN  
0.028  
0.000  
MAX  
0.031  
0.002  
A
A1  
A2  
D
0.700  
0.000  
0.203 REF  
0.008 REF  
1.900  
1.100  
1.900  
0.600  
2.100  
1.450  
2.100  
0.850  
0.075  
0.043  
0.075  
0.024  
0.083  
0.057  
0.083  
0.034  
D1  
E
E1  
k
0.200 MIN  
0.650 TYP  
0.008 MIN  
0.026 TYP  
b
0.180  
0.250  
0.300  
0.450  
0.007  
0.010  
0.012  
0.018  
e
L
SG Micro Corp  
www.sg-micro.com  
TX00055.001  
PACKAGE INFORMATION  
TAPE AND REEL INFORMATION  
REEL DIMENSIONS  
TAPE DIMENSIONS  
P2  
P0  
W
Q2  
Q4  
Q2  
Q4  
Q2  
Q4  
Q1  
Q3  
Q1  
Q3  
Q1  
Q3  
B0  
Reel Diameter  
P1  
A0  
K0  
Reel Width (W1)  
DIRECTION OF FEED  
NOTE: The picture is only for reference. Please make the object as the standard.  
KEY PARAMETER LIST OF TAPE AND REEL  
Reel Width  
Reel  
Diameter  
A0  
B0  
K0  
P0  
P1  
P2  
W
Pin1  
Package Type  
W1  
(mm)  
(mm) (mm) (mm) (mm) (mm) (mm) (mm) Quadrant  
TDFN-2×2-6L  
7″  
9.5  
2.30  
2.30  
1.10  
4.0  
4.0  
2.0  
8.0  
Q1  
SG Micro Corp  
TX10000.000  
www.sg-micro.com  
PACKAGE INFORMATION  
CARTON BOX DIMENSIONS  
NOTE: The picture is only for reference. Please make the object as the standard.  
KEY PARAMETER LIST OF CARTON BOX  
Length  
(mm)  
Width  
(mm)  
Height  
(mm)  
Reel Type  
Pizza/Carton  
7″ (Option)  
7″  
368  
442  
227  
410  
224  
224  
8
18  
SG Micro Corp  
www.sg-micro.com  
TX20000.000  

相关型号:

SGM2560

Dual-Channel Power Distribution Switch
SGMICRO

SGM2564

5.5V, 4A, 16mΩ RON Load Switch with Reverse Current Protection
SGMICRO

SGM25661

3.5V, 6A, Ultra-Low On-Resistance Load Switch
SGMICRO

SGM2567A

5.5V, 4A, 15mΩ RON Load Switch with Reverse Current Protection
SGMICRO

SGM25701

Positive High-Voltage Hot Swap and Inrush Current Controller with Power-Limiting
SGMICRO

SGM2571

5.5V, 1A, 34mΩ RON Load Switch with Reverse Current Protection
SGMICRO

SGM25711B

2.5V to 18V High-Efficiency Hot Swap Controller with Power-Limiting
SGMICRO

SGM2572

5.5V, 2A, 34mΩ RON Load Switch with Reverse Current Protection
SGMICRO

SGM2574

5.5V, 1A, 34mΩ RON Load Switch with Reverse Current Protection
SGMICRO

SGM2575

5.5V, 2A, 34mΩ RON, Load Switch with Reverse Current Protection
SGMICRO

SGM2576/B

Power Distribution Switch
SGMICRO

SGM2578(EOL)

Ultra Small, Low Input Voltage, Low RON Load Switch
SGMICRO