74AHCT244 [SGMICRO]
Octal Buffer/Line Driver with 3-State Outputs;
| 型号： | 74AHCT244 |
| 厂家： | 
Shengbang Microelectronics Co, Ltd |
| 描述： | Octal Buffer/Line Driver with 3-State Outputs |
| 文件： | 总6页 (文件大小：493K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
74AHCT244
Octal Buffer/Line Driver
with 3-State Outputs
GENERAL DESCRIPTION
FEATURES
The 74AHCT244 is an octal buffer/line driver with non-
inverting 3-state outputs, and it is designed for 4.5V to
5.5V VCC operation.
● Supply Voltage Range: 4.5V to 5.5V
● Input Accept Voltages Higher than the Supply
Voltage
● +8mA/-8mA Output Current
The device can be used as two 4-bit buffers or one 8-bit
● 3-State Buffers
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buffer. The 1OE and 2OE are two output enable inputs,
and each controls four of the 3-state outputs. When
● -40℃ to +125℃ Operating Temperature Range
● Available in a Green SOIC-20 Package
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nOE is set high, the outputs are in high-impedance
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state. When nOE is set low, data transmits from the
nAn inputs to the nYn outputs.
FUNCTION TABLE
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nOE should be connected to VCC by using a pull-up
CONTROL INPUT
INPUT
OUTPUT
resistor to ensure the high-impedance state in the
period of power-up or power-down, and the minimum
resistance depends on the current-sinking capability of
the driver.
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nOE
nAn
H
nYn
H
L
L
L
L
H
X
Z
H = High Voltage Level
L = Low Voltage Level
Z = High-Impedance State
X = Don’t Care
LOGIC DIAGRAM
2
4
6
18
16
14
11
13
15
9
7
5
1A0
2A0
1Y0
1Y1
1Y2
2Y0
2Y1
2Y2
1A1
1A2
2A1
2A2
8
1
12
17
19
3
1A3
2A3
1Y3
2Y3
1OE
2OE
SG Micro Corp
www.sg-micro.com
OCTOBER2022–REV. A
Octal Buffer/Line Driver
with 3-State Outputs
74AHCT244
PACKAGE/ORDERING INFORMATION
SPECIFIED
TEMPERATURE
RANGE
PACKAGE
DESCRIPTION
ORDERING
NUMBER
PACKAGE
MARKING
PACKING
OPTION
MODEL
74AHCT244XS20
XXXXX
74AHCT244
SOIC-20
74AHCT244XS20G/TR
Tape and Reel, 1500
-40℃ to +125℃
MARKING INFORMATION
NOTE: XXXXX = Date Code, Trace Code and Vendor Code.
X X X X X
Vendor Code
Trace Code
Date Code - Year
Green (RoHS & HSF): SG Micro Corp defines "Green" to mean Pb-Free (RoHS compatible) and free of halogen substances. If
you have additional comments or questions, please contact your SGMICRO representative directly.
ABSOLUTE MAXIMUM RATINGS (1)
OVERSTRESS CAUTION
1. Stresses beyond those listed in Absolute Maximum
Ratings may cause permanent damage to the device.
Exposure to absolute maximum rating conditions for
extended periods may affect reliability. Functional operation
of the device at any conditions beyond those indicated in the
Recommended Operating Conditions section is not implied.
Supply Voltage, VCC............................................. -0.5V to 7V
Input Voltage, VI (2) ............................................... -0.5V to 7V
(2)
Output Voltage, VO
High-Impedance State ....................................... -0.5V to 7V
High-State or Low-State........ -0.5V to MIN (7V, VCC + 0.5V)
Input Clamping Current, IIK (VI < 0V)............................-20mA
Output Clamping Current, IOK (VO > VCC or VO < 0V)
....................................................................................±20mA
Output Current, IO
2. The input and output negative voltage ratings may be
exceeded if the input and output clamp current ratings are
observed.
High-State ................................................................-25mA
Low-State....................................................................25mA
Supply Current, ICC .......................................................75mA
Ground Current, IGND....................................................-75mA
Junction Temperature (3) .............................................+150℃
Storage Temperature Range.......................-65℃ to +150℃
Lead Temperature (Soldering, 10s)............................+260℃
ESD Susceptibility
3. The performance capability of a high-performance integrated
circuit in conjunction with its thermal environment can create
junction temperatures which are detrimental to reliability.
ESD SENSITIVITY CAUTION
This integrated circuit can be damaged if ESD protections are
not considered carefully. SGMICRO recommends that all
integrated circuits be handled with appropriate precautions.
Failureto observe proper handlingand installation procedures
can cause damage. ESD damage can range from subtle
performance degradation tocomplete device failure. Precision
integrated circuits may be more susceptible to damage
because even small parametric changes could cause the
device not to meet the published specifications.
HBM.............................................................................4000V
CDM ............................................................................1000V
RECOMMENDED OPERATING CONDITIONS
Function Supply Voltage, VCC .............................4.5V to 5.5V
Output Voltage, VO
High-Impedance State .........................................0V to 5.5V
High-State or Low-State........................................ 0V to VCC
High-Level Output Current, IOH ......................................-8mA
Low-Level Output Current, IOL.........................................8mA
Input Transition Rise and Fall Rate, Δt/ΔV
DISCLAIMER
SG Micro Corp reserves the right to make any change in
circuit design, or specifications without prior notice.
VCC = 4.5V to 5.5V .........................................10ns/V (MAX)
Operating Temperature Range....................-40℃ to +125℃
SG Micro Corp
www.sg-micro.com
OCTOBER 2022
2
Octal Buffer/Line Driver
with 3-State Outputs
74AHCT244
PIN CONFIGURATION
(TOP VIEW)
1OE
1A0
2Y3
1A1
2Y2
1A2
2Y1
1A3
2Y0
GND
1
2
20 VCC
19 2OE
18 1Y0
17 2A3
16 1Y1
3
4
5
6
15
14
13
12
11
2A2
1Y2
2A1
1Y3
2A0
7
8
9
10
SOIC-20
PIN DESCRIPTION
PINS
NAME
FUNCTION
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1, 19
Output Enable Inputs (Active Low).
Data Inputs.
1OE, 2OE
2, 4, 6, 8
18, 16, 14, 12
10
1A0, 1A1, 1A2, 1A3
1Y0, 1Y1, 1Y2, 1Y3
GND
Data Outputs.
Ground.
11, 13, 15, 17
9, 7, 5, 3
20
2A0, 2A1, 2A2, 2A3
2Y0, 2Y1, 2Y2, 2Y3
VCC
Data Inputs.
Data Outputs.
Supply Voltage.
SG Micro Corp
www.sg-micro.com
OCTOBER 2022
3
PACKAGE INFORMATION
PACKAGE OUTLINE DIMENSIONS
SOIC-20
D
e
2.20
9.61
E1
E
1.27
0.60
RECOMMENDED LAND PATTERN (Unit: mm)
A
L
c
θ
b
A1
A2
Dimensions
In Millimeters
Dimensions
In Inches
Symbol
MIN
2.350
0.100
2.100
0.330
0.204
12.520
7.400
10.210
MAX
2.650
0.300
2.500
0.510
0.330
13.000
7.600
10.610
MIN
MAX
0.104
0.012
0.098
0.020
0.013
0.512
0.299
0.418
A
A1
A2
b
0.093
0.004
0.083
0.013
0.008
0.493
0.291
0.402
c
D
E
E1
e
1.27 BSC
0.050 BSC
L
0.400
0°
1.270
8°
0.016
0°
0.050
8°
θ
NOTES:
1. Body dimensions do not include mode flash or protrusion.
2. This drawing is subject to change without notice.
SG Micro Corp
TX00181.000
www.sg-micro.com
PACKAGE INFORMATION
TAPE AND REEL INFORMATION
REEL DIMENSIONS
TAPE DIMENSIONS
P2
P0
W
Q2
Q4
Q2
Q4
Q2
Q4
Q1
Q3
Q1
Q3
Q1
Q3
B0
Reel Diameter
P1
A0
K0
Reel Width (W1)
DIRECTION OF FEED
NOTE: The picture is only for reference. Please make the object as the standard.
KEY PARAMETER LIST OF TAPE AND REEL
Reel Width
Reel
Diameter
A0
B0
K0
P0
P1
P2
W
Pin1
Package Type
W1
(mm)
(mm) (mm) (mm) (mm) (mm) (mm) (mm) Quadrant
SOIC-20
13"
24.4
10.90 13.30
3.00
4.0
12.0
2.0
24.0
Q1
SG Micro Corp
TX10000.000
www.sg-micro.com
PACKAGE INFORMATION
CARTON BOX DIMENSIONS
NOTE: The picture is only for reference. Please make the object as the standard.
KEY PARAMETER LIST OF CARTON BOX
Length
(mm)
Width
(mm)
Height
(mm)
Reel Type
Pizza/Carton
13″
386
280
370
5
SG Micro Corp
www.sg-micro.com
TX20000.000
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NXP
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