74AHC541 [SGMICRO]
Octal Buffer/Line Driver with 3-State Outputs;
| 型号： | 74AHC541 |
| 厂家： | 
Shengbang Microelectronics Co, Ltd |
| 描述： | Octal Buffer/Line Driver with 3-State Outputs |
| 文件： | 总7页 (文件大小：493K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
74AHC541
Octal Buffer/Line Driver
with 3-State Outputs
GENERAL DESCRIPTION
FEATURES
The 74AHC541 is an octal buffer/line driver with 3-state
outputs, which can accept supply voltage range from
2.0V to 5.5V.
● Wide Supply Voltage Range: 2.0V to 5.5V
● +8mA/-8mA Output Current
● 3-State Buffers
● -40℃ to +125℃ Operating Temperature Range
● Available in Green SOIC-20 and TSSOP-20
Packages
The 3-state control gate is a two-input AND gate with
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active low inputs. OE1 and OE2 are two output enable
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inputs. When OE1 and OE2 are low, data transmits
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from An inputs to the Yn outputs. When OE1 or OE2 is
high, all outputs are in high-impedance state.
APPLICATIONS
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OE1 and OE2 should be connected to VCC by using a
pull-up resistor to ensure the high-impedance state in
the period of power-up or power-down, and the
minimum of the resistor depends on the current-sinking
capability of the driver.
Mother Board for Server, PC and Notebook Pad
Telecom Equipment
LED Display
Industrial/Medical Equipment
LOGIC DIAGRAM
FUNCTION TABLE
1
INPUT
OUTPUT
OE1
19
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OE1
OE2
An
L
Yn
L
OE2
L
L
L
L
H
X
H
Z
2
18
A0
Y0
H
X
X
H
X
Z
H = High Voltage Level
L = Low Voltage Level
Z = High-Impedance State
X = Don’t Care
8
9
12
11
A6
A7
Y6
Y7
SG Micro Corp
MARCH 2023 – REV. A
www.sg-micro.com
Octal Buffer/Line Driver
with 3-State Outputs
74AHC541
PACKAGE/ORDERING INFORMATION
SPECIFIED
TEMPERATURE
RANGE
PACKAGE
DESCRIPTION
ORDERING
NUMBER
PACKAGE
MARKING
PACKING
OPTION
MODEL
74AHC541XS20
XXXXX
SOIC-20
74AHC541XS20G/TR
74AHC541XTS20G/TR
Tape and Reel, 1500
Tape and Reel, 4000
-40℃ to +125℃
-40℃ to +125℃
74AHC541
05RXTS20
XXXXX
TSSOP-20
MARKING INFORMATION
NOTE: XXXXX = Date Code, Trace Code and Vendor Code.
X X X X X
Vendor Code
Trace Code
Date Code - Year
Green (RoHS & HSF): SG Micro Corp defines "Green" to mean Pb-Free (RoHS compatible) and free of halogen substances. If
you have additional comments or questions, please contact your SGMICRO representative directly.
ABSOLUTE MAXIMUM RATINGS (1)
OVERSTRESS CAUTION
Supply Voltage, VCC.......................................... -0.5V to 7.0V
Input Voltage, VI (2) ............................................ -0.5V to 7.0V
Output Voltage, VO (2) ........... -0.5V to MIN (7.0V, VCC + 0.5V)
Input Clamping Current, IIK (VI < 0V)............................-20mA
Output Clamping Current, IOK (VO < 0V or VO > VCC)...±20mA
Output Current, IO (VO < 0V to VCC).............................±25mA
Supply Current, ICC .......................................................75mA
Ground Current, IGND....................................................-75mA
Junction Temperature (3) .............................................+150℃
Storage Temperature Range.......................-65℃ to +150℃
Lead Temperature (Soldering, 10s)............................+260℃
ESD Susceptibility
1. Stresses beyond those listed in Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to
absolute maximum rating conditions for extended periods may
affect reliability. Functional operation of the device at any
conditions beyond those indicated in the Recommended
Operating Conditions sectionis not implied.
2. The input and output voltage ratings may be exceeded if the
input and output clamp current ratings are observed.
3. The performance capability of a high-performance integrated
circuit in conjunction with its thermal environment can create
junction temperatures which are detrimental to reliability.
HBM.............................................................................4000V
CDM ............................................................................1000V
ESD SENSITIVITY CAUTION
This integrated circuit can be damaged if ESD protections are
not considered carefully. SGMICRO recommends that all
integrated circuits be handled with appropriate precautions.
Failureto observe proper handlingand installation procedures
can cause damage. ESD damage can range from subtle
performance degradation tocomplete device failure. Precision
integrated circuits may be more susceptible to damage
because even small parametric changes could cause the
device not to meet the published specifications.
RECOMMENDED OPERATING CONDITIONS
Supply Voltage, VCC............................................2.0V to 5.5V
Input Voltage, VI.....................................................0V to 5.5V
Output Voltage, VO.................................................. 0V to VCC
Output Current, IO .........................................................±8mA
Input Transition Rise and Fall Rate, Δt/ΔV
V
CC = 3.3V ± 0.3V ........................................100ns/V (MAX)
VCC = 5.0V ± 0.5V ..........................................20ns/V (MAX)
Operating Temperature Range....................-40℃ to +125℃
DISCLAIMER
SG Micro Corp reserves the right to make any change in
circuit design, or specifications without prior notice.
SG Micro Corp
www.sg-micro.com
MARCH 2023
2
Octal Buffer/Line Driver
with 3-State Outputs
74AHC541
PIN CONFIGURATION
(TOP VIEW)
OE1
1
2
20
19
18
17
16
15
14
13
12
11
VCC
OE2
Y0
Y1
Y2
Y3
Y4
Y5
Y6
Y7
A0
A1
3
A2
4
A3
5
A4
6
A5
7
A6
8
A7
9
GND
10
SOIC-20/TSSOP-20
PIN DESCRIPTION
PIN
NAME
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FUNCTION
1, 19
Output Enable Inputs (Active Low).
Data Inputs.
OE1, OE2
A0, A1, A2, A3, A4, A5, A6, A7
2, 3, 4, 5, 6, 7, 8, 9
18, 17, 16, 15, 14, 13, 12, 11
Y0, Y1, Y2, Y3, Y4, Y5, Y6, Y7 Data Outputs.
10
20
GND
VCC
Ground.
Supply Voltage.
SG Micro Corp
www.sg-micro.com
MARCH 2023
3
PACKAGE INFORMATION
PACKAGE OUTLINE DIMENSIONS
SOIC-20
D
e
2.20
9.61
E1
E
1.27
0.60
RECOMMENDED LAND PATTERN (Unit: mm)
A
L
c
θ
b
A1
A2
Dimensions
In Millimeters
Dimensions
In Inches
Symbol
MIN
2.350
0.100
2.100
0.330
0.204
12.520
7.400
10.210
MAX
2.650
0.300
2.500
0.510
0.330
13.000
7.600
10.610
MIN
MAX
0.104
0.012
0.098
0.020
0.013
0.512
0.299
0.418
A
A1
A2
b
0.093
0.004
0.083
0.013
0.008
0.493
0.291
0.402
c
D
E
E1
e
1.27 BSC
0.050 BSC
L
0.400
0°
1.270
8°
0.016
0°
0.050
8°
θ
NOTES:
1. Body dimensions do not include mode flash or protrusion.
2. This drawing is subject to change without notice.
SG Micro Corp
TX00181.000
www.sg-micro.com
PACKAGE INFORMATION
PACKAGE OUTLINE DIMENSIONS
TSSOP-20
D
E1
E
5.94
1.78
0.42
b
e
0.65
RECOMMENDED LAND PATTERN (Unit: mm)
L
ccc C
A
SEATING PLANE
A2
c
θ
H
A1
C
Dimensions In Millimeters
Symbol
MIN
-
MOD
MAX
1.200
0.150
1.050
0.300
0.200
6.600
4.500
6.600
A
A1
A2
b
-
0.050
0.800
0.190
0.090
6.400
4.300
6.200
-
-
-
c
-
D
-
E
-
E1
e
-
0.650 BSC
L
0.450
0°
-
0.250 TYP
-
0.750
8°
H
θ
ccc
0.100
NOTES:
1. Body dimensions do not include mode flash or protrusion.
2. This drawing is subject to change without notice.
3. Reference JEDEC MO-153.
SG Micro Corp
TX00021.002
www.sg-micro.com
PACKAGE INFORMATION
TAPE AND REEL INFORMATION
REEL DIMENSIONS
TAPE DIMENSIONS
P2
P0
W
Q2
Q4
Q2
Q4
Q2
Q4
Q1
Q3
Q1
Q3
Q1
Q3
B0
Reel Diameter
P1
A0
K0
Reel Width (W1)
DIRECTION OF FEED
NOTE: The picture is only for reference. Please make the object as the standard.
KEY PARAMETER LIST OF TAPE AND REEL
Reel Width
Reel
Diameter
A0
B0
K0
P0
P1
P2
W
Pin1
Package Type
W1
(mm)
(mm) (mm) (mm) (mm) (mm) (mm) (mm) Quadrant
SOIC-20
13″
13″
24.4
16.4
10.90 13.30
6.80 6.90
3.00
1.50
4.0
4.0
12.0
8.0
2.0
2.0
24.0
16.0
Q1
Q1
TSSOP-20
SG Micro Corp
TX10000.000
www.sg-micro.com
PACKAGE INFORMATION
CARTON BOX DIMENSIONS
NOTE: The picture is only for reference. Please make the object as the standard.
KEY PARAMETER LIST OF CARTON BOX
Length
(mm)
Width
(mm)
Height
(mm)
Reel Type
Pizza/Carton
13″
386
280
370
5
SG Micro Corp
www.sg-micro.com
TX20000.000
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