CAWT722-S [SEOUL]
surface-mount LED; 表面贴装LED
| 型号： | CAWT722-S |
| 厂家： | 
Seoul Semiconductor |
| 描述： | surface-mount LED |
| 文件： | 总18页 (文件大小：724K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Specification
CAWT722-S
SSC
CUSTOMER
Drawn
Approval
Approval
Rev. 02
November 2008
www.ZLED.com
SSC-QP-7-07-24 (Rev.00)
CONTENTS
1. Feature & Application
2. Absolute Maximum Ratings
3. Electro Characteristics
4. Optical characteristics
5. Color & Binning
6. Rank of CAWT722-S
7. Outline Dimension
8. Packing
9. Soldering
10. Precaution for use
11. Handling of Silicone Resin LEDs
12. Reliability Test Item and Condition
Rev. 02
November 2008
www.ZLED.com
SSC-QP-7-07-24 (Rev.00)
CAWT722-S
CAWT722-S
Description
Features
This surface-mount LED comes
in PLCC standard package
dimension. It has a substrate
made up of a molded plastic
reflector sitting on top of a bent
lead frame. The die is attached
within the reflector cavity and
the cavity is encapsulated by
epoxy or silicone.
•
White colored SMT
package.
• Material : InGaN/SiC
• Encapsulating Resin :
Silicon Resin
• Suitable for all SMT
assembly methods ;
Suitable for all
The package design coupled
with careful selection of
component materials allow these
products to perform with high
reliability in a larger
soldering methods
• RoHS Compliant
temperature range -40℃ to
100℃. The high reliability
feature is crucial to Automotive
interior and Indoor ESS.
Applications
• Interior automotive
• Office Automation,
Electrical Appliances,
Industrial Equipment
Rev. 02
November 2008
www.ZLED.com
SSC-QP-7-07-24 (Rev.00)
2. Absolute maximum ratings
Parameter
Symbol
Value
342
Unit
mW
Power Dissipation
Pd
Forward Current
IF
90
mA
*2
Peak Forward Current
Reverse Voltage (per die)
Operating Temperature
Storage Temperature
IFM
100
5
mA
V
VR
Topr
Tstg
-40 ~ +85
-40 ~ +100
ºC
ºC
*1 Care is to be taken that power dissipation does not exceed the absolute maximum rating of the product.
*2 IFM was measured at TW ≤ 1msec of pulse width and D ≤ 1/10 of duty ratio.
3. Electric & Optical characteristics
Parameter
Symbol Condition
Min
2.9
Typ
3.2
Max
3.6
Unit
V
IF =60 mA
Forward Voltage (per die)
Reverse Current (per die)
VF
VR=5V
µA
mcd
lm
IR
IV
-
-
-
-
10
*1
IF =60 mA
Luminance Intensity
4500
11
5500
13.1
IF =60 mA
IF =60 mA
Luminance Flux
ΦV
Color Temperature
CCT
X
2500
-
-
-
4600
K
0.3545
0.3408
0.4970
0.4466
IF =60 mA
IF =60 mA
Color Coordinate
-
Y
*2
2θ
Viewing Angle
-
120
-
deg
½
IF =60 mA
IF =60 mA
Optical Efficiency
-
-
57
95
68
lm/W
-
ηop
Color Rendering Index
Ra
*1. The luminous intensity IV was measured at the peak of the spatial pattern which may not be aligned
with the mechanical axis of the LED package. Luminous Intensity Measurement allowance is ±10%
*2. 2θ½ is the off-axis where the luminous intensity is 1/2 of the peak intensity.
[Note] All measurements were made under the standardized environment of SSC.
Rev. 02
November 2008
www.ZLED.com
SSC-QP-7-07-24 (Rev.00)
4. Optical characteristics
Forward Current vs. Forward Voltage (per die)
(Ta=25 OC )
10
1
2.0
2.5
3.0
3.5
4.0
Forward Voltage[V]
Relative Luminous Intensity vs Forward Current
(Ta=25 OC )
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
0
15
30
45
60
75
90
105
120
Forward Current IF[mA]
Rev. 02
November 2008
www.ZLED.com
SSC-QP-7-07-24 (Rev.00)
4. Optical characteristics
Ambient Temperature vs. Allowable Forward Current (per die)
35
30
25
20
15
10
5
0
-25
0
25
50
75
100
Ambient temperature Ta(OC)
Radiation Diagram
(Ta=25 OC )
0
30
-30
60
-60
90
-90
Rev. 02
November 2008
www.ZLED.com
SSC-QP-7-07-24 (Rev.00)
4. Optical characteristics
Spectrum
(TA=25℃, IF=60mA)
1.0
0.8
0.6
0.4
0.2
0.0
400
500
600
700
800
Wavelength[nm]
Rev. 02
November 2008
www.ZLED.com
SSC-QP-7-07-24 (Rev.00)
5. Color & Binning
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
520
525
515
510
530
535
540
545
550
555
505
560
565
570
575
580
585
590
595
600
500
495
610
620
490
630
830
485
480
475
470
460
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
C I E (x)
Rev. 02
November 2008
www.ZLED.com
SSC-QP-7-07-24 (Rev.00)
5. Color & Binning
0.46
2700K
0.44
0.42
3000K
W1
V1
3500K
W0
WA
WB
T1
V0
VA
VB
4000K
0.40
0.38
0.36
0.34
T0
TA
TB
S1
S0
4500K
R1
SA
SB
R0
RA
RB
0.34
0.36
0.38
0.40
0.42
0.44
0.46
0.48
0.50
X
● COLOR RANK
<IF=20mA, Ta=25℃>
4500K
4000K
3500K
3000K
2700K
RB
RA
SA
TA
VA
WA
R0
S0
T0
R1
S1
T1
X
Y
X
Y
X
Y
X
Y
0.3515
0.35
0.3487
0.34
0.3531
0.3515
0.3676
0.3704
0.3605
0.3487
0.36
0.3546
0.3531
0.3704
0.3733
0.3717
0.3605
0.3725
0.3855
0.3562
0.3546
0.3733
0.376
0.3826
0.3717
0.3855
0.3974
0.3649
0.3676
0.3482
0.36
0.3725
SB
X
Y
X
Y
X
Y
X
Y
0.3676
0.3649
0.3866
0.391
0.36
0.3704
0.3676
0.391
0.3952
0.3725
0.36
0.3733
0.3704
0.3952
0.3997
0.3855
0.3725
0.3881
0.402
0.376
0.3733
0.3997
0.4044
0.3974
0.3855
0.402
0.416
0.3482
0.3618
0.375
0.375
0.3881
TB
X
Y
X
Y
X
Y
X
Y
0.3898
0.386
0.4106
0.4158
0.3716
0.36
0.394
0.3898
0.4158
0.4225
0.3843
0.3716
0.3841
0.3991
0.3985
0.394
0.4225
0.4283
0.3983
0.3843
0.3991
0.4127
0.4037
0.3985
0.4283
0.4356
0.414
0.3983
0.4127
0.4294
0.372
0.3841
VB
V0
V1
X
Y
X
Y
X
Y
X
Y
0.4158
0.4106
0.4307
0.4381
0.3841
0.372
0.3768
0.391
0.4225
0.4158
0.4381
0.4457
0.3991
0.3841
0.391
0.4058
0.4283
0.4225
0.4457
0.4541
0.4127
0.3991
0.4058
0.422
0.4356
0.4283
0.4541
0.4617
0.4294
0.4127
0.422
0.4371
WB
W0
W1
X
Y
X
Y
X
Y
X
Y
0.4381
0.4307
0.4588
0.467
0.391
0.3768
0.3838
0.3979
0.4457
0.4381
0.467
0.478
0.4058
0.391
0.3979
0.415
0.4541
0.4457
0.478
0.4867
0.422
0.4058
0.415
0.43
0.4617
0.4541
0.4867
0.497
0.4371
0.422
0.43
0.4466
Rev. 02
* Measurement Uncertainty of the Color Coordinates : ± 0.01
*The single bin is not acceptable in the same group of CCT.
(At least, 2 bins required to take when ordering)
November 2008
www.ZLED.com
SSC-QP-7-07-24 (Rev.00)
5. Color & Binning
0.46
2700K
0.44
0.42
3000K
W1
V1
3500K
W0
WA
WB
T1
V0
VA
VB
4000K
S1
0.40
T0
TA
TB
4500K
S0
R1
0.38
SA
SB
R0
RA
RB
0.36
0.34
0.34
0.36
0.38
0.40
0.42
0.44
0.46
0.48
0.50
X
0.46
0.44
0.42
0.40
0.38
0.36
0.34
2500K
2900K
3200K
3700K
4200K
4700K
0.34
0.36
0.38
0.40
0.42
0.44
0.46
0.48
0.50
X
Rev. 02
November 2008
www.ZLED.com
SSC-QP-7-07-24 (Rev.00)
6. Rank of CAWT722-S
▣ Rank Name Table
X1 X2
X3
IV CIE VF
▣
Intensity value[mcd]
▣ Forward Voltage[V]
Rank
Name
Color : R,S
Rank
Name
MIN
2.9
3.0
3.1
3.2
MAX
3.0
3.1
3.2
3.3
MIN
MAX
4500
5500
6800
▣ CIE (Color Rank)
Y3
L8
3800
4500
5500
Rank Name
4500K 4000K 3500K 3000K 2700K
Z1
M5
Z2
R1
S1
T1
V1
W1
N5
Z3
R0
RA
RB
S0
SA
SB
T0
TA
TB
V0
VA
VB
W0
WA
WB
A1
A2
A3
3.3
3.4
3.5
3.4
3.5
3.6
Color : T, V, W
Rank
Name
MIN
MAX
4200
5100
6300
L5
M2
N1
3500
4200
5100
Available Rank
[Note] All measurements were made under the standardized environment of SSC.
In order to ensure availability, single color rank will not be orderable.
Rev. 02
November 2008
www.ZLED.com
SSC-QP-7-07-24 (Rev.00)
7.Outline Dimension
Package Outlines
6
5
4
Package
Marking
(Cathode)
1
2
3
Front View
Right View
Rear View
( Tolerance: ±0.2, Unit: mm )
Recommended
Solder Pad
Circuit Diagram
Warm White Anode
6
5
4
3
W1
W2
W3
1
2
Warm White Cathode
* MATERIALS
PARTS
MATERIALS
Package
Encapsulating Resin
Electrodes
Heat-Resistant Polymer
Silicon Resin
Ag Plating Copper Alloy
Rev. 02
November 2008
www.ZLED.com
SSC-QP-7-07-24 (Rev.00)
8. Packing
Package
Marking
( Tolerance: ±0.2, Unit: mm )
1)Quantity : 700pcs/Reel
2)Cumulative Tolerance : Cumulative Tolerance/10 pitches to be ±0.2mm
3)Adhesion Strength of Cover Tape : Adhesion strength to be 0.1-0.7N when the cover tape is
turned off from the carrier tape at the angle of 10 to the carrier tape
4)Package : P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof
Package
Rev. 02
November 2008
www.ZLED.com
SSC-QP-7-07-24 (Rev.00)
● Reel Packing Structure
Reel
QUANTITY : XXXX
LOT NUMBER : XXXXXXXXXX
PART NUMBER :
SEOUL SEMICONDUCTOR CO., LTD.
HUMIDITY INDICATOR
DESI PAK
Aluminum Vinyl Bag
QUANTITY : XXXX
LOT NUMBER : XXXXXXXXXX
PART NUMBER :
SEOUL SEMICONDUCTOR CO., LTD.
Outer Box Structure
Material : Paper(SW3B(B))
SIZE (mm)
TYPE
a
c
b
245 220 102
7inch
245 220 142
SIDE
1
c
TUV
MADE IN KOREA
1
QUANTITY : XXXX
Acriche
Semiconductor EcoLight
LOT NUMBER : XXXXXXXXXX
RoHS
b
PART NUMBER :
a
SEOUL SEMICONDUCTOR CO., LTD.
Rev. 02
November 2008
www.ZLED.com
SSC-QP-7-07-24 (Rev.00)
9. Soldering
(1) Lead Solder
Lead Solder
Lead Solder
o
o
2.5~5 C / sec.
240 C Max.
10 sec. Max.
Pre-heat
120~150℃
120 sec. Max.
240℃ Max.
Pre-heating
Pre-heat time
Peak-Temperature
o
60sec. Max.
120~150 C
2.5~5 C / sec.
o
Above 200 C
Soldering time
Condition
120sec. Max.
10 sec. Max.
(2) Lead-Free Solder
Lead-frame Solder
o
Lead Free Solder
o
1~5 C / sec.
260 C Max.
10 sec. Max.
Pre-heat
150~200℃
Pre-heating
o
60sec. Max.
o
150~200
C
Pre-heat time
120 sec. Max.
1~5 C / sec.
o
Above 220 C
Peak-Temperature
260℃ Max.
Soldering time
Condition
120sec. Max.
10 sec. Max.
(3) Hand Soldering conditions
Do not exceed 4 seconds at maximum 315ºC under soldering iron.
(4) The encapsulated material of the LEDs is silicone.
Precautions should be taken to avoid the strong pressure on the
encapsulated part.
So when using the chip mounter, the picking up nozzle that does not
affect the silicone resign should be used.
Note : In case that the soldered products are reused in soldering process, we don’t guarantee the products.
Rev. 02
November 2008
www.ZLED.com
SSC-QP-7-07-24 (Rev.00)
10. Precaution for use
(1) Storage
In order to avoid the absorption of moisture, it is recommended to store in a dry box (or
a desiccator) with a desiccant. Otherwise, to store them in the following environment is
recommended.
Temperature : 5ºC ~30ºC Humidity : maximum 65%RH
(2) Attention after open.
LED is correspond to SMD, when LED be soldered dip, interfacial separation may affect
the light transmission efficiency, causing the light intensity to drop. Attention in followed;
a. After opened and mounted the soldering shall be quickly.
b. Keeping of a fraction
Temperature : 5 ~ 40ºC Humidity : less than 30%
(3) In the case of more than 1 week passed after opening or change color of indicator
on desiccant, components shall be dried 10-12hr. at 60±5ºC.
(4) Any mechanical force or any excess vibration shall not be accepted to apply during
cooling process to normal temperature after soldering.
(5) Quick cooling shall be avoided.
(6) Components shall not be mounted on warped direction of PCB.
(7) Anti radioactive ray design is not considered for the products.
(8) This device should not be used in any type of fluid such as water, oil, organic solvent
etc. When washing is required, IPA should be used.
(9) When the LEDs are illuminating, operating current should be decided after
considering the ambient maximum temperature.
(10) LEDs must be stored to maintain a clean atmosphere. If the LEDs are stored for 3
months or more after being shipped from SSC, a sealed container with a nitrogen
atmosphere should be used for storage.
(11) The LEDs must be soldered within seven days after opening the moisture-proof
packing.
(12) Repack unused products with anti-moisture packing, fold to close any opening and
then store in a dry place.
(13) The appearance and specifications of the product may be modified for improvement
without notice.
Rev. 02
November 2008
www.ZLED.com
SSC-QP-7-07-24 (Rev.00)
11. Handling of Silicone Resin LEDs
(1) During processing, mechanical stress on the surface should be minimized as much as
possible. Sharp objects of all types should not be used to pierce the sealing compound.
(2) In general, LEDs should only be handled from the side. By the way, this also applies
to LEDs without a silicone sealant, since the surface can also become scratched.
(3) When populating boards in SMT production, there are basically no restrictions
regarding the form of the pick and place nozzle, except that mechanical pressure on the
surface of the resin must be prevented.
This is assured by choosing a pick and place nozzle which is larger than the LED’s
reflector area.
(4) Silicone differs from materials conventionally used for the manufacturing of LEDs.
These conditions must be considered during the handling of such devices. Compared to
standard encapsulants, silicone is generally softer, and the surface is more likely to
attract dust.
As mentioned previously, the increased sensitivity to dust requires special care
during processing. In cases where a minimal level of dirt and dust particles cannot be
guaranteed, a suitable cleaning solution must be applied to the surface after the
soldering of components.
(5) SSC suggests using isopropyl alcohol for cleaning. In case other solvents are used, it
must be assured that these solvents do not dissolve the package or resin.
Ultrasonic cleaning is not recommended. Ultrasonic cleaning may cause damage to the
LED.
Rev. 02
November 2008
www.ZLED.com
SSC-QP-7-07-24 (Rev.00)
12. Reliability Test Item and Condition
Number
of
Damage
Duration
/ Cycle
Item
Reference
Test Condition
EIAJ ED-
4701
Ta =-40oC (30MIN) ~ 100oC
100
Cycle
Thermal Shock
0/22
(30MIN)
Temperature
Cycle
EIAJ ED-
4701
Ta =-40oC (30MIN) ~ 25oC (5MIN)
100
Cycle
0/22
~ 100oC (30MIN) ~ 25oC (5MIN)
High
Temperature
Storage
EIAJ ED-
4701
1000
Hours
Ta =100oC
0/22
0/22
High
Temperature
High Humidity
Storage
EIAJ ED-
4701
1000
Hours
Ta =85oC, RH=85%
Low
Temperature
Storage
EIAJ ED-
4701
1000
Hours
Ta =-40oC
0/22
0/22
Operating
Endurance Test Reference
Internal
1000
Hours
Ta =25oC, IF =20mA
High
Temperature
High Humidity
Life Test
Internal
Reference
300
Hours
Ta =85oC, RH=85%, IF =15mA
Ta =85oC, IF =20mA
0/22
0/22
High
Temperature
Life Test
Internal
Reference
500
Hours
Low
Temperature
Life Test
Internal
Reference
1000
Hours
Ta =-40oC, IF =20mA
1KV at 1.5kΩ; 100pF
0/22
0/22
MIL-STD-
883D
ESD(HBM)
3 Time
Criteria for Judging the Damage
Criteria for Judgement
Item
Symbol
Condition
MIN
-
MAX
Forward Voltage
Reverse Current
VF
IR
IF =20mA
VR=5V
USL*1 × 1.2
-
USL*1 × 2.0
Luminous
Intensity
IV
IF =20mA
LSL*2 × 0.5
-
Note : *1 USL : Upper Standard Level
*2 LSL : Lower Standard Level
Rev. 02
November 2008
www.ZLED.com
SSC-QP-7-07-24 (Rev.00)
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