UCLAMP3311Z [SEMTECH]
Ultra Small μClamp® 1-Line, 3.3V ESD Protection;
| 型号： | UCLAMP3311Z |
| 厂家： | 
SEMTECH CORPORATION |
| 描述： | Ultra Small μClamp® 1-Line, 3.3V ESD Protection |
| 文件： | 总8页 (文件大小：205K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
uClamp3311Z
Ultra Small μClamp®
1-Line, 3.3V ESD Protection
PROTECTION PRODUCTS - Z-PakTM
Features
Description
μClamp® TVS diodes are designed to protect sensitive
electronics from damage or latch-up due to ESD. They
are designed to replace 0201 size multilayer varistors
(MLVs) in portable applications such as cell phones, note-
book computers, and other portable electronics. They
features large cross-sectional area junctions for conduct-
ing high transient currents. These devices offer desir-
able characteristics for board level protection including
fast response time, low operating and clamping voltage,
and no device degradation.
High ESD withstand Voltage: +/-14kV (Contact) and
+/- 16kV (Air) per IEC 61000-4-2
Able to withstand over 1000 ESD strikes per IEC
61000-4-2 Level 4
Ultra-small 0201 package
Protects one data line
Low reverse current: <10nA typical (VR=5V)
Working voltage: +/- 3.3V
Low capacitance: 6pF typical
Extremely low dynamic resistance: 0.21 Ohms (Typ)
Solid-state silicon-avalanche technology
μClamp®3311Z is constructed using Semtech’s propri-
etary EPD process technology. The EPD process provides
low standoff voltages with significant reductions in leak-
age currents and capacitance over silicon-avalanche di-
ode processes. They feature a true operating voltage of
3.3 volts for superior protection when compared to tra-
ditional pn junction devices.
Mechanical Characteristics
SLP0603P2X3A package
Pb-Free, Halogen Free, RoHS/WEEE Compliant
Nominal Dimensions: 0.6 x 0.3 x 0.25 mm
Lead Finish: NiAu
μClamp3311Z is in a 2-pin SLP0603P2X3A package.
It measures 0.6 x 0.3 mm with a nominal height of only
0.25mm. Leads are finished with lead-free NiAu. Each
device will protect one line operating at 3.3 volts. It
gives the designer the flexibility to protect single lines in
applications where arrays are not practical. The
combination of small size and high ESD surge capability
makes them ideal for use in portable applications such
as cellular phones, digital cameras, and MP3 players.
Marking : Marking code
Packaging : Tape and Reel
Applications
Cellular Handsets & Accessories
Keypads, Side Keys, Audio Ports
Portable Instrumentation
Digital Lines
Tablet PC
Nominal Dimensions
Schematic
0.62
0.22
0.32
1
0.16
0.355 BSC
2
0.25
SLP0603P2X3A (Bottom View)
Nominal Dimensions (mm)
www.semtech.com
2/6/2015
1
uClamp3311Z
PROTECTION PRODUCTS
Absolute Maximum Rating
Rating
Symbol
Ppk
Value
Units
Watts
Amps
kV
Peak Pulse Power (tp = 8/20μs)
30
4
Maximum Peak Pulse Current (tp = 8/20μs)
Ipp
ESD per IEC 61000-4-2 (Air)1
VESD
+/- 16
+/- 14
ESD per IEC 61000-4-2 (Contact)1
Operating Temperature
Storage Temperature
TJ
-40 to +85
°C
°C
TSTG
-55 to +150
Electrical Characteristics (T=25oC)
Parameter
Reverse Stand-Off Voltage
Punch-Through Voltage
Snap-Back Voltage
Symbol
VRWM
VPT
Conditions
Minimum
Typical
4
Maximum
3.3
Units
V
V
IPT = 50μA
ISB = 50mA
3.65
2.8
4.4
VSB
IR
V
Reverse Leakage Current
Clamping Voltage
VRWM = 3.3V
0.001
0.05
5.5
6.5
7.5
μA
V
VC
IPP = 1A, tp = 8/20μs
IPP = 3A, tp = 8/20μs
IPP = 4A, tp = 8/20μs
tp = 100ns
Clamping Voltage
VC
V
Clamping Voltage
VC
V
Dynamic Resistance2, 3
RD
0.21
6
Ohms
pF
I/O pin to Gnd
9
Junction Capacitance
Notes
Cj
VR = 0V, f = 1MHz
1)ESD gun return path connected to ESD ground reference plane.
2)Transmission Line Pulse Test (TLP) Settings: tp = 100ns, tr = 0.2ns, ITLP and VTLP averaging window: t1 = 70ns to t2 = 90ns.
3) Dynamic resistance calculated from ITLP = 4A to ITLP = 16A
www.semtech.com
© 2015 Semtech Corporation
2
uClamp3311Z
PROTECTION PRODUCTS
Typical Characteristics
Non-Repetitive Peak Pulse Power vs. Pulse Time
Clamping Voltage vs. Peak Pulse Current (tp=8/20us)
7
6
5
4
3
1000
TA = 25OC
100
10
2
Waveform
Parameters:
tr = 8μs
td = 20μs
DR040412-40
1
0
1
0.1
1
10
100
0
1
2
3
4
5
Pulse Duration - tp (µs)
Peak Pulse Current - IPP (A)
Normalized Junction Capacitance vs. Reverse Voltage
TLP Characteristic
1.6
1.4
1.2
1
25
Transmission Line Pulse Test (TLP)
Settings:
tp = 100ns, tr = 0.2ns,
ITLP and VTLP averaging window:
t1 = 70ns to t2 = 90ns
20
15
10
5
0.8
0.6
0.4
0.2
f = 1 MHz
3.5
0
0
0
0.5
1
1.5
2
2.5
3
0
2
4
6
8
10
12
14
16
Reverse Voltage - VR (V)
TLP Voltage (V)
ESD Clamping (+8kV Contact per IEC 61000-4-2)
Typical Insertion Loss (S21)
30KHz to 3GhZ
35
5
Measured with 50 Ohm scope input
impedance, 2GHz bandwidth. Corrected for
50 Ohm, 20dB attenuator. ESD gun return
30
path connected to ESD ground plane
0
-5
25
-3dB
977MHz
20
15
10
5
-10
-15
-20
0
-10
0
10
20
30
40
50
60
70
80
1.00E+04
1.00E+05
1.00E+06
1.00E+07
1.00E+08
1.00E+09
1.00E+10
Time (ns)
www.semtech.com
© 2015 Semtech Corporation
3
uClamp3311Z
PROTECTION PRODUCTS
Applications Information
Device Connection Options
Circuit Diagram
The μClamp3311Z is designed to protect one data line
operating up to 3.3 volts. It will present a high
impedance to the protected line up to 3.3 volts. It will
“turn on” when the line voltage exceeds 3.5 volts. The
device is bidirectional and may be used on lines where
the signal polarity is above and below ground. These
devices are not recommended for use on DC power
supply lines due to their snap-back voltage
characteristic.
Assembly Guidelines
The small size of this device means that some care
must be taken during the mounting process to insure
reliable solder joint. The table below provides
Semtech's recommended assembly guidelines for
mounting this device. The figure at the right details
Semtech’s recommended aperture based on the
below recommendations. Note that these are only
recommendations and should serve only as a starting
point for design since there are many factors that
affect the assembly process. The exact manufactur-
ing parameters will require some experimentation to
get the desired solder application.
Stencil Aperture
Mounting Pad
Package
0.175
Assembly Parameter
Recommendation
0.250
0.272
Solder Stencil Design
Laser cut, Electro-polished
Rectangular with rounded
corners
Aperture shape
0.298
0.270
Solder Stencil Thickness
Solder Paste Type
0.100 mm (0.004")
Type 4 size sphere or smaller
Per JEDEC J-STD-020
Non-Solder mask defined
OSP OR NiAu
Recommended Mounting Pattern
Solder Reflow Profile
PCB Solder Pad Design
PCB Pad Finish
www.semtech.com
© 2015 Semtech Corporation
4
uClamp3311Z
PROTECTION PRODUCTS
Outline Drawing - SLP0603P2X3A
B
E
A
D
DIMENSIONS
MILLIMETERS
MIN NOM MAX
0.235 0.25 0.265
0.000 0.02 0.025
DIM
A
A1
b
0.20
0.22 0.24
D
E
0.62
0.32
0.585
0.285
0.655
0.355
e
0.355 BSC
TOP VIEW
L
0.14
0.16 0.18
2
0.08
0.10
N
aaa
bbb
A
SEATING
PLANE
aaa
C
C
A1
e/2
bxN
A
bbb
C
B
Pin 1 ID
R 0.060mm
2xL
e
BOTTOM VIEW
NOTES:
1.
CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
Land Pattern - SLP0603P2X3A
DIMENSIONS
DIM MILLIMETERS
(0.425)
0.175
0.270
0.250
0.675
C
G
X
Y
Z
Z
(C)
G
Y
X
NOTES:
1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
2. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY.
CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR
COMPANY'S MANUFACTURING GUIDELINES ARE MET.
www.semtech.com
© 2015 Semtech Corporation
5
uClamp3311Z
PROTECTION PRODUCTS
Marking Code
H
Notes:
1)Dots represent date code matrix and Pin 1 location
Ordering Information
Qty per
Reel
Carrier
Tape
Reel
Size
Ordering Number
Comments
Not Recommended
for New Designs
uClamp3311Z.TNT
10,000
Plastic
7 Inch
uClamp3311Z.TFT
uClamp3311Z.TVT
Notes:
15,000
50,000
Paper
Paper
7 Inch
13 Inch
1) MicroClamp, uClamp and μClamp are trademarks of
Semtech Corporation
Device Orientation in Tape
Date Code Location
(Towards Sprocket Holes)
www.semtech.com
© 2015 Semtech Corporation
6
uClamp3311Z
PROTECTION PRODUCTS
Carrier Tape Specification
Plastic Tape
Bo
Ko
Ao
Paper Tape
Note: All dimensions in mm unless otherwise specified
www.semtech.com
© 2015 Semtech Corporation
7
uClamp3311Z
PROTECTION PRODUCTS
Contact Information
Semtech Corporation
Protection Products Division
200 Flynn Rd., Camarillo, CA 93012
Phone: (805)498-2111 FAX (805)498-3804
www.semtech.com
© 2015 Semtech Corporation
8
相关型号：
UCLAMP3312T.TCT
Trans Voltage Suppressor Diode, 100W, 3.3V V(RWM), Bidirectional, 2 Element, Silicon, 2 X 1 MM, 0.40 MM HEIGHT, HALOGEN FREE AND ROHS COMPLIANT, PLASTIC, SLP2010N8T, 8 PIN
SEMTECH
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